CN113220157A - Touch panel, preparation method and display device - Google Patents
Touch panel, preparation method and display device Download PDFInfo
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- CN113220157A CN113220157A CN202110482782.7A CN202110482782A CN113220157A CN 113220157 A CN113220157 A CN 113220157A CN 202110482782 A CN202110482782 A CN 202110482782A CN 113220157 A CN113220157 A CN 113220157A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a touch panel, a preparation method and a display device, wherein the preparation method of the touch panel comprises the following steps: forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structural layer and the second structural layer are provided with a first channel opening, a middle channel and a second channel opening which are communicated in sequence; the first structural layer is provided with a middle channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening; and depositing a conductive layer on the second structure layer to form a first electrode and a second electrode which are mutually insulated on the conductive layer, wherein the conductive layer positioned on one side of the bridge-shaped structure, which is far away from the substrate, forms a first connecting part, the adjacent first electrodes are electrically connected through the first connecting part, and the adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer penetrating into the middle channel. The technical scheme provided by the invention can realize the touch panel with simple process and high production efficiency.
Description
Technical Field
The invention relates to the technical field of display, in particular to a touch panel, a preparation method and a display device.
Background
In recent years, touch technology is more and more widely applied to display devices of various sizes, and as a display panel of a novel human-computer interaction input mode, a touch screen is simpler, more direct and more convenient to input compared with the traditional modes of a display, a keyboard and a mouse.
In order to realize the touch function of the display device, touch electrodes are usually required to be introduced into the display device, different touch electrodes are insulated from each other, and adjacent touch electrodes need to be connected by a bridge, so that the touch function is limited by the process.
Therefore, a new method for manufacturing a touch panel, a touch panel and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a touch panel, a preparation method and a display device, and aims to realize the touch panel with simple process and high production efficiency.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a touch panel, including:
providing a substrate;
forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structural layer and the second structural layer form an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are sequentially communicated; the first structural layer is formed with a middle channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening;
depositing a conductive layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening;
and patterning the conductive layers to form a first electrode and a second electrode which are insulated from each other, wherein the conductive layers on the sides of the bridge structures, which are far away from the substrate, form first connecting parts, adjacent first electrodes are electrically connected through the first connecting parts, and adjacent second electrodes are electrically connected through second connecting parts formed by the conductive layers in the middle channel.
In a second aspect, an embodiment of the present invention further provides a touch panel, where the touch panel is prepared by using the touch panel manufacturing method provided in any embodiment of the present invention.
In a third aspect, an embodiment of the present invention further provides a display device, including: the touch panel is provided by any embodiment of the invention.
The touch panel preparation method comprises the steps of arranging a first structural layer and a second structural layer which are sequentially far away from a substrate on the substrate, forming an underground passage structure through the first structural layer and the second structural layer, forming a middle passage in the underground passage structure through the first structural layer, forming a first passage opening and a second passage opening in the underground passage structure through the second structural layer, forming a bridge-shaped structure between the first passage opening and the second passage opening, communicating the first passage opening, the middle passage and the second passage opening, forming the bridge-shaped structure on the middle passage, depositing a conductive layer on the second structural layer to form a first electrode and a second electrode which are insulated, simultaneously depositing the conductive layer on the bridge-shaped structure and in the middle passage, realizing the insulation of the conductive layers on the upper layer and the lower layer of the passage, forming a first connecting part on the bridge-shaped structure, and forming a second connecting part in the middle passage, the adjacent first electrodes are connected by a first connecting portion, and the adjacent second electrodes are connected by a second connecting portion. In the preparation process of the touch panel, the horizontal-vertical cross mutual capacitance touch electrode structure can be formed only by carrying out the deposition and patterning process of the conductive layer once, the times of deposition molding and patterning treatment of the conductive layer required by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
Drawings
Fig. 1 is a schematic flowchart of a method for manufacturing a touch panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a first structural layer and a second structural layer formed on a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view taken along line a-a' of FIG. 2;
FIG. 4 is a schematic structural view of the first structural layer of FIG. 2;
FIG. 5 is a cross-sectional view of a conductive layer deposited on a second structural layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a touch panel according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of the touch panel of FIG. 6 along line b-b';
fig. 8 is a schematic structural diagram of another touch panel according to an embodiment of the invention;
FIG. 9 is a schematic cross-sectional view of the touch panel along the line c-c' in FIG. 8;
fig. 10 is a schematic structural diagram of another touch panel according to an embodiment of the invention;
fig. 11 is a schematic flowchart of another method for manufacturing a touch panel according to an embodiment of the invention;
FIG. 12 is a schematic diagram of a structure for forming a first layer of a first photoresist on a substrate according to an embodiment of the present invention;
FIG. 13 is a schematic diagram of a structure for forming a second layer of a first photoresist on a substrate according to an embodiment of the present invention;
FIG. 14 is a schematic diagram of a structure in which a second photoresist is formed on a conductive layer according to an embodiment of the present invention;
FIG. 15 is a schematic diagram of a patterned conductive layer according to an embodiment of the present invention;
FIG. 16 is a schematic diagram of a structure for forming a planarization layer on a second photoresist according to an embodiment of the present invention;
FIG. 17 is a schematic cross-sectional view of the touch panel along the line b-b' in FIG. 6;
fig. 18 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
An embodiment of the present invention provides a method for manufacturing a touch panel, and fig. 1 is a schematic flow chart of the method for manufacturing a touch panel according to the embodiment of the present invention, as shown in fig. 1, the method for manufacturing a touch panel according to the embodiment of the present invention includes the following steps:
s101, providing a substrate.
S102, forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structural layer and the second structural layer form an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are sequentially communicated; the first structural layer is provided with a middle channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-like structure is formed between the first channel opening and the second channel opening.
Fig. 2 is a schematic structural diagram of a first structural layer and a second structural layer formed on a substrate according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of a cross-section of fig. 2 along a line a-a', referring to fig. 2 and fig. 3, a substrate 11 is first provided, and a subterranean passageway structure 14 is formed on the substrate 11 through a first structural layer 12 and a second structural layer 13. The underground passage 14 includes a first passage opening 131, an intermediate passage 121, and a second passage opening 132 that communicate in this order. As shown in fig. 4 and fig. 4 is a schematic structural diagram of the first structural layer in fig. 2, in this embodiment, the middle channel 121 is disposed on the first structural layer 12, as shown in fig. 2, the first channel opening 131 and the second channel opening 132 are both disposed on the second structural layer 13, a bridge-like structure 133 is formed between the first channel opening 131 and the second channel opening 132 of the second structural layer 13, and as shown in fig. 2, in a plane parallel to the substrate 11, the bridge-like structure 133 is located above the middle channel 121 and spans two sides of the middle channel 121 in the width direction.
S103, depositing a conductive layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening.
A conductive layer is deposited on the first structural layer 12 and the second structural layer 13 shown in fig. 2 and 3, as shown in fig. 5, fig. 5 is a schematic cross-sectional view of a conductive layer deposited on the second structural layer according to an embodiment of the present invention. The conductive layer 15 is formed on the substrate 11, the first structure layer 12 and the second structure layer 13, and the conductive layer 15 may be metal such as aluminum, titanium, or the like, or conductive oxide such as Indium Tin Oxide (ITO), as long as the conductive property satisfies the touch requirement. In this embodiment, the conductive layer 15 may be formed by deposition through sputtering, and for the underground passage structure 14 formed by the first structural layer 12 and the second structural layer 13, sputtering atoms of a conductive target forming the conductive layer 15 may be deposited on the upper surface of the bridge-shaped structure 133 and the lower side of the underground passage structure 14. The principle of deposition of the conductive layer 15 within the underground passage structure 14 is the shadow effect, and there are a variety of ways in which sputtered atoms reach the underground passage structure 14. For example, the first: collisions between sputtered atoms or magnetic field induced ion collisions cause portions of the sputtered atoms to be obliquely incident on the central channel 121 under the bridge structure 133 and to be deposited; and the second method comprises the following steps: the sputtered atoms that impinge on the side wall 13a of the first channel opening 131 or the second channel opening 132 and the side wall 12a of the intermediate channel 121 may bounce off and fall into the intermediate channel 121 below the bridge structure 133.
And S104, patterning the conductive layer to form a first electrode and a second electrode which are insulated from each other, wherein the conductive layer on the side, away from the substrate, of the bridge-shaped structure forms a first connecting part, adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer in the middle channel.
Fig. 6 is a schematic structural diagram of a touch panel according to an embodiment of the invention, and fig. 7 is a schematic sectional structure of the touch panel shown in fig. 6 along a line b-b'. The conductive layer 15 is patterned to form a first electrode 151 and a second electrode 152 that are insulated from each other, one of the first electrode 151 and the second electrode 152 is a touch driving electrode, and the other is a touch sensing electrode, and the two electrodes cooperate to realize mutual capacitance touch of the touch panel and determine a touch position.
The conductive layer on the side of the bridge-like structure 133 facing away from the substrate 11 may be etched to form a first connection 153, the conductive layer penetrating into the intermediate channel 121 forms a second connection 154, adjacent first electrodes 151 may be connected by the first connection 153 on the bridge-like structure 133, and adjacent second electrodes 152 may be connected by the second connection 154 in the intermediate channel 121. The first connection portion 153 and the second connection portion 154 are respectively disposed on two sides of the bridge-shaped structure 133 that are away from each other, and are electrically insulated from each other, so that the influence of mutual interference is avoided, and the problems of short circuit or signal interference between the first electrode 151 and the second electrode 152 are effectively avoided. In addition, in the embodiment, the first electrode 151, the second electrode 152, the first connection portion 153, and the second connection portion 154 can be formed by deposition forming and patterning of the first conductive layer 15, that is, the touch panel using the mutual capacitance touch electrode, whereas the touch panel using the mutual capacitance touch electrode in the prior art needs to perform deposition and patterning of the conductive layer twice, where the deposition and patterning of the first conductive layer is used to form the touch electrode, and the deposition and patterning of the other conductive layer is used to form a cross-line layer connecting the touch electrode, compared with the prior art, in the embodiment, by deposition and patterning of the first conductive layer, insulation of metal on the upper layer and the lower layer of the bridge-shaped structure 133 can be formed to prepare a cross-capacitance touch electrode structure crossing in the horizontal and vertical directions, so as to effectively simplify the process flow, and reduce the required times of deposition forming and patterning of the conductive layer 15, saving the manufacturing process and material consumption.
Optionally, the extending direction of the second connecting portion 154 intersects the extending direction of the bridge-like structure 133, and specifically, the extending direction of the second connecting portion 154 is perpendicular to the extending direction of the bridge-like structure 133, so as to connect with the adjacent second electrode 152 and avoid interference with the first electrode 151.
The touch panel preparation method comprises the steps of arranging a first structural layer and a second structural layer which are sequentially far away from a substrate on the substrate, forming an underground passage structure through the first structural layer and the second structural layer, forming a middle passage in the underground passage structure through the first structural layer, forming a first passage opening and a second passage opening in the underground passage structure through the second structural layer, forming a bridge-shaped structure between the first passage opening and the second passage opening, communicating the first passage opening, the middle passage and the second passage opening, forming the bridge-shaped structure on the middle passage, depositing a conductive layer on the second structural layer to form a first electrode and a second electrode which are insulated, simultaneously depositing the conductive layer on the bridge-shaped structure and in the middle passage, realizing the insulation of the conductive layers on the upper layer and the lower layer of the passage, forming a first connecting part on the bridge-shaped structure, and forming a second connecting part in the middle passage, the adjacent first electrodes are connected by a first connecting portion, and the adjacent second electrodes are connected by a second connecting portion. In the preparation process of the touch panel, the horizontal-vertical cross mutual capacitance touch electrode structure can be formed only by carrying out the deposition and patterning process of the conductive layer once, the times of deposition molding and patterning treatment of the conductive layer required by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 8 is a schematic structural diagram of another touch panel provided in an embodiment of the invention, and fig. 9 is a schematic sectional structure of the touch panel in fig. 8 along a line c-c'. Alternatively, in the extending direction X of the middle channel 121, a plurality of bridge structures 133 may be sequentially disposed; second structural layer 13 is formed with third channel openings 134 between two adjacent bridge-like structures 133; the third passage opening 134 communicates with the intermediate passage 121 so that the conductive layer 15 penetrates into the intermediate passage 121 through the third passage opening 134.
In this embodiment, the middle channel 121 extends along the extending direction X, and when the second structural layer 13 is formed, a plurality of bridge-shaped structures 133 may be sequentially formed between the first channel opening 131 and the second channel opening 132 along the extending direction X of the middle channel 121, the extending direction Y of the bridge-shaped structures 133 intersects with the extending direction X of the middle channel 121, and the bridge-shaped structures 133 cross the middle channel 121 along the extending direction Y. Meanwhile, a third channel opening 134 is formed between two adjacent bridge-shaped structures 133, as shown in fig. 8, in a plane parallel to the substrate 11, the middle channel 121 increases the deposition area of the conductive material due to the arrangement of the third channel opening 134, so that the conductive layer 15 can permeate into the middle channel 121 through the third channel opening 134, and the problem that the conductive layer deposited in the middle channel 121 is thin and even broken is effectively avoided, so that the finally formed second connection portion 154 has good conductive performance, the connection yield of the second electrode 152 is improved, the breakage of the second electrode 152 is effectively avoided, the touch performance of the touch panel is improved, and the quality of the touch panel is improved.
With continued reference to fig. 8 and 9, optionally, the conductive layers 15 of each bridge structure 133 on the side facing away from the substrate 11 may form a first connection 153; the adjacent first electrodes 151 are electrically connected by a plurality of first connection portions 153.
In the process of patterning the conductive layer 15, the conductive layer 15 on the side of each bridge-like structure 133 away from the substrate 11 may be etched to form the first connection portions 153, and then a plurality of first connection portions 153 are disposed across the middle channel 121, so that the adjacent first electrodes 151 may be electrically connected by the plurality of first connection portions 153, which is equivalent to increasing the arrangement width of the first connection portions 153 between the adjacent first electrodes 151, reducing the resistance of the first connection portions 153, and increasing the connection yield of the adjacent first electrodes 151. In addition, when one first connection portion 153 is broken among the plurality of first connection portions 153 connecting the adjacent first electrodes 151, the adjacent first electrodes 151 may also be communicated through the other first connection portions 153, so as to complete transmission of the touch signal, thereby effectively enhancing reliability of the touch panel and improving production yield of the touch panel.
It should be noted that the first connection portions 153 on each bridge-like structure 133 may be used to connect the adjacent first electrodes 151, as shown in fig. 8, when two bridge-like structures 133 are provided, the first connection portions 153 on two bridge-like structures 133 may be used as connection lines between the adjacent first electrodes 151, and of course, a plurality of first connection portions 153 in all the first connection portions 153 on the middle channel 121 may be selected to realize the electrical connection between the adjacent first electrodes 151. As shown in fig. 10, fig. 10 is a schematic structural diagram of another touch panel according to an embodiment of the present invention, when three bridge structures 133 are provided, each bridge structure 133 is formed with a first connection portion 153, two of the first connection portions 153 may be selected to connect to adjacent first electrodes 151, and the remaining first connection portions 153 may be disposed in a floating manner.
In this embodiment, the first structural layer 12 and the second structural layer 13 provided with a plurality of underground passage structures 14 may be formed by a plurality of methods, and in some alternative embodiments, as shown in fig. 11, fig. 11 is a schematic flow chart of another method for manufacturing a touch panel provided in this embodiment of the present invention, where the method for manufacturing a touch panel of this embodiment may include the following steps:
s201, providing a substrate.
Optionally, before forming the first structural layer and the second structural layer sequentially far away from the substrate on the substrate, the method may further include: forming a buffer layer on a substrate; the buffer layer is made of organic materials. In the prior art, the buffer layer is generally made of inorganic materials, and the buffer layer made of organic materials is formed on the substrate in the embodiment, so that the buffer layer is not easy to break when being applied to a flexible product, and the reliability is higher.
S202, coating a first layer of first photoresist on the substrate, and exposing the middle channel region.
In this embodiment, the underground passage structure is formed by two exposures and one development, and the materials of the first structural layer and the second structural layer may be both photoresists, specifically, as shown in fig. 12, fig. 12 is a schematic structural diagram of forming a first layer of a first photoresist on a substrate according to an embodiment of the present invention, and the first layer of the first photoresist 122 may be coated on the substrate 11 and the intermediate passage region 121a is exposed.
S203, coating a second layer of first photoresist on the substrate, and exposing a first channel opening area and a second channel opening area.
After the first photoresist 122 is exposed, as shown in fig. 13, fig. 13 is a schematic structural diagram of forming a second layer of first photoresist on the substrate according to an embodiment of the present invention, where a second layer of first photoresist 135 is formed on a side of the first layer of first photoresist 122 away from the substrate 11, and the second layer of first photoresist 135 is exposed to expose a first channel opening area 131a and a second channel opening area 132 a.
S204, developing the two layers of the first photoresist at the same time; the middle channel region forms a middle channel, and the first layer of first photoresist forms a first structural layer; the second channel opening area forms a second channel opening, the first channel opening area forms a first channel opening, and the second layer of the first photoresist forms a second structural layer.
Meanwhile, the first layer of the first photoresist 122 and the second layer of the first photoresist 135 are developed, so that the photoresist material of the middle channel region 121a of the first layer of the first photoresist 122 is removed to form the middle channel 121, the photoresist material of the first channel opening region 131a of the second layer of the first photoresist 135 is removed to form the first channel opening region 131, and similarly, the second channel opening region 132a forms the second channel opening 132, and the first channel opening region 131, the middle channel 121 and the second channel opening 132 are sequentially communicated to form the underground channel structure 14 shown in fig. 3. Referring to fig. 3, at this point, the first layer of developed first photoresist 122 forms the first structural layer 12, and the second layer of developed first photoresist 135 forms the second structural layer 13. In this embodiment, the upper and lower isolation channels bounded by the bridge structure 133 are directly formed by using the photoresist, and the residual photoresist is used as the film layer of the touch panel without removing the photoresist, so that the manufacturing material of the touch panel is saved, and the manufacturing process of the touch panel is greatly saved.
The above steps S202 to S204 are "step S102: one implementation of forming a first structural layer and a second structural layer "on a substrate, sequentially remote from the substrate. In another example of this embodiment, with reference to fig. 3, the first structural layer 12 and the second structural layer 13 may be formed by other organic or inorganic materials, the first passage opening 131 and the second passage opening 132 may be formed in the second structural layer 13 by dry etching, and then the first structural layer 12 is wet etched through the first passage opening 131 and the second passage opening 132 to form the intermediate passage 121. In addition, the first structural layer 12 and the second structural layer 13 may also be formed by other dry etching or wet etching processes, and the specific forming process of the underground passage structure is not particularly limited in this embodiment.
S205, depositing a conducting layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening.
And S206, coating a patterned second photoresist on the side, away from the substrate, of the conductive layer.
And S207, etching the conducting layer uncovered by the second photoresist to form a first electrode, a second electrode, a first connecting part and a second connecting part.
The above steps S206 to S207 are "step S104: patterning the conductive layer. As shown in fig. 14, fig. 14 is a schematic structural diagram of forming a second photoresist on a conductive layer according to an embodiment of the present invention, a whole layer of the second photoresist 16 is coated on a side of the conductive layer 15 away from the substrate 11, and the portion to be patterned 161 is exposed and removed after development, so as to facilitate subsequent etching of the conductive layer 15 according to the patterned second photoresist 16, thereby forming the structure shown in fig. 15, fig. 15 is a schematic structural diagram of patterning the conductive layer according to an embodiment of the present invention, and a first connection portion 153, and the first electrode 151, the second electrode 152, and the second connection portion 154 shown in fig. 6 are formed.
It is understood that the photoresist is also called a photoresist, and refers to a resist material for etching a thin film, the solubility of which changes by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, or the like. The photosensitive mixed liquid consists of three main components, including photosensitive resin, sensitizer and solvent. Used as a corrosion-resistant coating material during a photolithography process. In this embodiment, the second photoresist 16 can protect the conductive layer 15 from being etched, so that the pattern shape of the second photoresist 16 coated on the conductive layer 15 corresponds to the shape of the first electrode 151, the second electrode 152, and the first connection portion 153, after the conductive layer 15 not covered by the second photoresist 16 is etched, the remaining second photoresist 16 can be stripped off to reduce the thickness of the touch panel, and the remaining second photoresist 16 can be retained to protect the first electrode 151, the second electrode 152, and the first connection portion 153, which is schematically described in this embodiment with a scheme of retaining the remaining second photoresist 16.
As shown in fig. 14 and 15, optionally, etching the conductive layer 15 not covered by the second photoresist 16 may include: the conductive layer 16 deposited on the sidewalls of the bridge-like structures 133 is etched. After exposing and developing the second photoresist 16 located on the sidewall of the bridge structure 133, the conductive layer 16 deposited on the sidewall of the bridge structure 133 is exposed, and after etching away the conductive layer 16 on the sidewall of the bridge structure 133, the first connection portion 153 shown in fig. 15 is formed.
Optionally, when the second photoresist 16 is formed, the coating direction of the second photoresist 16 is parallel to the extending direction of the bridge-shaped structure 133, so that the second photoresist 16 can conveniently flow into the underground passage structure 14, the second photoresist 16 can conveniently enter the underground passage structure 14, and especially can enter a gap region between the bridge-shaped structure 133 and the conductive layer 15, thereby preventing the second photoresist 16 from breaking during the coating process, facilitating the accurate etching of the subsequent conductive layer, and improving the quality of the touch panel.
And S208, forming a planarization layer on the side, away from the substrate, of the second photoresist.
Fig. 16 is a schematic structural diagram of forming a planarization layer on the second photoresist according to an embodiment of the present invention, and optionally, after performing patterning processing on the conductive layer 15, the method may further include: a planarization layer 17 is formed on the second photoresist 16 on the side away from the substrate 11. In this embodiment, the second photoresist 16 is used as a part of the touch panel, which not only can effectively save the material cost of the touch panel, protect the patterned conductive layer 15, but also can save a process for removing the second photoresist 16, thereby speeding up the manufacturing process of the touch panel. Optionally, in this embodiment, the material of the second photoresist 16 may be the same as or different from the material of the first photoresist, and this embodiment is not particularly limited.
According to the preparation method of the touch panel, the underground channel structure is formed by adopting the double-layer first photoresist, the upper and lower layers of isolated channels can be formed by adopting the two-time exposure and one-time developing process, the manufacturing process is simplified, and the first photoresist is used as the film layer structure of the touch panel, so that the material cost of the touch panel is effectively saved. In addition, the second photoresist used for patterning the conductive layer can also be used as a film layer structure of the touch panel, so that the consumables of the touch panel are further saved.
In another specific example of this embodiment, the second photoresist may be removed, specifically, referring to fig. 14, fig. 15 and fig. 7 in sequence, the patterning process may be performed on the conductive layer 15, and the method may further include: as shown in fig. 14, a patterned second photoresist 16 is coated on the side of the conductive layer 15 away from the substrate 11; as shown in fig. 15, the conductive layer 15 not covered by the second photoresist 16 is etched to form a first electrode, a second electrode, a first connection portion 153, and a second connection portion; the second photoresist 16 is stripped by a stripping solution to form the structure shown in fig. 7, so as to reduce the overall thickness of the touch panel. Thereafter, a planarization layer or the like may be formed on the side of the conductive layer 15 away from the substrate 11, thereby forming a touch panel. It should be noted that the patterned conductive layer 15 may expose a partial region of the second layer of the first photoresist 135, and it is required to ensure that the second layer of the first photoresist 135 is not removed when the second photoresist 16 is removed, in this embodiment, the first photoresist is defined as a negative photoresist, and the second photoresist 16 is defined as a positive photoresist, so that the first photoresist cannot be stripped by the stripping liquid used for stripping the second photoresist 16, and thus the second layer of the first photoresist 135 is protected, the second layer of the first photoresist 135 is prevented from being damaged, and the underground passage structure 14 is protected.
With continued reference to fig. 7, optionally, the extending direction X of the intermediate passage is set to the first direction; in the first direction X, a distance between a boundary L1 marking a side of the first channel opening 131 away from the second channel opening 132 and a boundary L2 marking a side of the second channel opening 132 away from the first channel opening 131 is a first spacing d 1; the distance between the boundaries (the boundary L3 and the boundary L4) in the first direction X of the mark intermediate passage 121 is the second distance d 2; the first spacing d1 is greater than the second spacing d 2.
The boundary L1 of the first channel opening 131 in this embodiment refers to the position on the side wall 13a of the first channel opening 131 farthest from the second channel opening 132, and similarly, the boundary L2 of the second channel opening 132 refers to the position on the side wall 13a of the second channel opening 132 farthest from the first channel opening 131, the distance between the boundary L1 of the first channel opening 131 and the boundary L2 of the second channel opening 132 is the first distance d1, and the first distance d1 is the total width spanned between the first channel opening 131 and the second channel opening 132. The second spacing d2 between the boundary L3 and the boundary L4 of the intermediate channel 121 is the maximum distance between the sidewalls 12a of the intermediate channel 121 in the first direction X, and the second spacing d2 is the total width spanned by the intermediate channel 121. In this embodiment, the total width spanned between the first channel opening 131 and the second channel opening 132 is greater than the total width spanned by the middle channel 121, so that sputtered atoms can conveniently enter the middle channel 121 through the first channel opening 131 and the second channel opening 132, the conductive layer 15 deposited in the middle channel 121 is prevented from being broken, and the conductive layer 15 can be conveniently deposited on the side wall 13a of the channel opening and the side wall 12a of the middle channel 121 along the gradient between the channel opening and the middle channel 121, thereby avoiding the problem of discontinuous film formation of the conductive layer 15 in the deposition process, and improving the touch performance and the manufacturing yield of the touch panel.
With continued reference to fig. 4 and 7, the intermediate channel 121 may, alternatively, include a bottom surface 12b parallel to the substrate 11 and sidewalls 12a disposed around the bottom surface 12 b; the cross-sectional state of the intermediate channel 121 in a direction perpendicular to the plane of the substrate 11 is an inverted trapezoid or an inverted trapezoid-like; in a first plane P1 perpendicular to the substrate 11 and parallel to the extension direction X of the intermediate channel 121, the angle θ between the bottom 12b and the sidewall 12a of the intermediate channel 121 is in the range of 110 ° to 180 °.
The middle channel 121 may include a bottom surface 12b parallel to the substrate 11 and a sidewall 12a disposed around the bottom surface 12b, and the cross-sectional state of the middle channel 121 in a plane perpendicular to the substrate 11 is an inverted trapezoid or an inverted trapezoid-like, for example, as shown in fig. 7, fig. 7 is a cross-sectional structure of the touch panel in a plane perpendicular to the substrate 11, and it is known that the cross-sectional state of the middle channel 121 in the plane is an inverted trapezoid T or an inverted trapezoid-like. In addition, fig. 7 is a cross-sectional view taken along line a-a 'of fig. 6, where the extending direction of the line a-a' is parallel to the extending direction X of the middle channel 121, and fig. 7 is a cross-sectional structure of the touch panel in the first plane P1, an included angle θ between the bottom surface 12b of the middle channel 121 and the side wall 12a may be 110 ° to 180 °, and a large slope angle is formed between the bottom surface 12b and the side wall 12a, so that sputtered atoms can enter the middle channel 121 through the first channel opening 131 and the second channel opening 132, and the problem of discontinuous film formation between the bottom surface 12b and the side wall 12a of the conductive layer 15 is effectively prevented, thereby improving the yield of the touch panel. Optionally, the range of the included angle between the sidewall 13a of the first channel opening 131 and the second channel opening 132 and the substrate 11 is consistent with θ, so that the sidewall 13a of the channel opening and the sidewall 12a of the middle channel 121 have the same gradient, and the continuity of the film formation of the conductive layer is further ensured.
FIG. 17 is a schematic cross-sectional view of the touch panel along the line b-b' in FIG. 6. Alternatively, the distance d3 between the surface 133a of the bridge-like structure 133 on the side close to the substrate 11 and the bottom surface 12b of the intermediate channel 121 on the side close to the substrate 11 may be in the range of 3 μm to 15 μm. In this embodiment, the distance d3 between the surface 133a of the bridge structure 133 near the substrate 11 and the bottom 12b of the middle channel 121 near the substrate 11 ranges from 3 μm to 15 μm, i.e., the height of the middle channel 121 ranges from 3 μm to 15 μm in the direction perpendicular to the plane of the substrate 11. It should be noted that the height of the middle channel 121 should not be too large, which may affect the structural strength of the bridge-like structure 133, and the bridge-like structure 133 is easily damaged when being stressed, and the height of the middle channel 121 should not be too small, which may cause the conductive layer 15 in the subsequent process not to completely penetrate into the middle channel 121, and thus the conductive layer 15 in the middle channel 121 is broken, and the second connection portion 154 cannot be formed to connect the adjacent second electrode 152, and optionally, the distance d3 between the surface 133a of the bridge-like structure 133 close to the substrate 11 side and the bottom 12b of the middle channel 121 close to the substrate 11 side may be equal to 15 μm.
With continued reference to fig. 17, optionally, the thickness d4 of the first connection portion 153 may be greater than the thickness d5 of the second connection portion 154. Referring to fig. 17, in particular, the conductive layer 15 is usually deposited by sputtering, and the sputtered atoms of the material of the conductive layer 15 reach the underground passage structure 14 in various ways, for example, some of the sputtered atoms are obliquely incident on the underground passage structure 14 and deposited due to collision or magnetic field between the sputtered atoms, or the sputtered atoms of the material of the conductive layer 15 collide with the side wall 12a of the middle passage 121 and bounce back into the middle passage 121. Thus, the thickness d5 of the second connection portion 154 is generally smaller than the thickness d4 of the first connection portion 153 formed by normal deposition on the bridge-like structure 133. In the present embodiment, the thickness d4 of the first connection portion 153 may be an average thickness of the first connection portion 153, and the thickness d5 of the second connection portion 154 may be an average thickness of the second connection portion 154.
With continued reference to fig. 16, alternatively, the thickness d51 of the second connection part 154 near the second electrode 151 may be greater than the thickness d52 of the second connection part 154 near the center of the second connection part.
It should be noted that, due to the limitation of the forming process, the thickness of each portion of the second connecting portion 154 may be inconsistent, and the portion has a smaller thickness as the portion is closer to the center of the middle channel 121 and the portion has a smaller thickness as the portion is closer to the second electrode 152 and the portion has a larger thickness as the portion is more infiltrated as the portion is closer to the conductive layer 15. That is, the thickness d51 of the second connection part 154 near the second electrode 152 is greater than the thickness d52 of the second connection part 154 at the central position, as long as the second connection part 154 can effectively connect the adjacent second electrodes 152.
Based on the same concept, embodiments of the present invention further provide a touch panel, as shown in fig. 6 to 10, and fig. 6 to 10 show structural schematic diagrams of several touch panels, where a touch panel is a touch panel prepared by using a method for preparing a touch panel provided by any embodiment of the present invention.
The touch panel comprises a first structural layer and a second structural layer which are sequentially far away from a substrate and are arranged on the substrate, an underground passage structure is formed by the first structural layer and the second structural layer, a middle passage in the underground passage structure is formed by the first structural layer, a first passage opening and a second passage opening in the underground passage structure are formed by the second structural layer, a bridge-shaped structure between the first passage opening and the second passage opening is formed, the first passage opening, the middle passage and the second passage opening are communicated, the bridge-shaped structure is formed on the middle passage, and when a conductive layer is deposited on the second structural layer to form an insulated first electrode and an insulated second electrode, the conductive layer can be simultaneously deposited on the bridge-shaped structure and in the middle passage, the insulation of the conductive layers on the upper layer and the lower layer of the passage is realized, a first connecting part can be formed on the bridge-shaped structure, and a second connecting part is formed in the middle passage, the adjacent first electrodes are connected by a first connecting portion, and the adjacent second electrodes are connected by a second connecting portion. In the preparation process of the touch panel, the horizontal-vertical cross mutual capacitance touch electrode structure can be formed only by carrying out the deposition and patterning process of the conductive layer once, the times of deposition molding and patterning treatment of the conductive layer required by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
An embodiment of the present invention further provides a display device, as shown in fig. 18, fig. 18 is a schematic structural diagram of the display device provided in the embodiment of the present invention, and includes: the touch panel 1, the touch panel 1 is the touch panel in any of the above embodiments. The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the touch panel in any of the above embodiments, and the structures and terms identical to or corresponding to those in the above embodiments are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (16)
1. A method for manufacturing a touch panel includes:
providing a substrate;
forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structural layer and the second structural layer form an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are sequentially communicated; the first structural layer is formed with a middle channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening;
depositing a conductive layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening;
and patterning the conductive layers to form a first electrode and a second electrode which are insulated from each other, wherein the conductive layers on the sides of the bridge structures, which are far away from the substrate, form first connecting parts, adjacent first electrodes are electrically connected through the first connecting parts, and adjacent second electrodes are electrically connected through second connecting parts formed by the conductive layers in the middle channel.
2. The method of manufacturing a touch panel according to claim 1, wherein a plurality of bridge structures are sequentially provided in an extending direction of the middle channel;
the second structural layer is provided with a third channel opening between two adjacent bridge-shaped structures; the third channel opening is communicated with the middle channel so that the conducting layer penetrates into the middle channel through the third channel opening.
3. The method of manufacturing a touch panel according to claim 2,
the conductive layer on the side, facing away from the substrate, of each bridge-like structure forms a first connection;
the adjacent first electrodes are electrically connected by a plurality of the first connection portions.
4. The method of claim 1, wherein forming a first structural layer and a second structural layer on the substrate sequentially away from the substrate comprises:
coating a first layer of first photoresist on the substrate, and exposing a middle channel region;
coating a second layer of first photoresist on the substrate, and exposing a first channel opening area and a second channel opening area;
developing the two layers of the first photoresist at the same time; the intermediate channel region forms the intermediate channel, and the first layer of the first photoresist forms a first structural layer; the second channel opening area forms a second channel opening, the first channel opening area forms a first channel opening, and the second layer of the first photoresist forms a second structural layer.
5. The method for manufacturing a touch panel according to claim 4, wherein the patterning of the conductive layer further comprises:
coating a patterned second photoresist on one side of the conductive layer away from the substrate;
etching the conductive layer uncovered by the second photoresist to form the first electrode, the second electrode, the first connection portion and the second connection portion;
stripping the second photoresist by a stripping liquid; the first photoresist is a negative photoresist, and the second photoresist is a positive photoresist.
6. The method of manufacturing a touch panel according to claim 1, wherein the intermediate channel extends in a first direction;
marking the boundary of one side, away from the second channel opening, of the first channel opening along the first direction, wherein the distance between the boundary of one side, away from the first channel opening, of the second channel opening is a first distance; marking a distance between boundaries of the intermediate channel along the first direction as a second pitch;
the first pitch is greater than the second pitch.
7. The method of manufacturing a touch panel according to claim 1, wherein the intermediate channel includes a bottom surface parallel to the substrate and a side wall provided around the bottom surface; in the direction vertical to the plane of the substrate, the section state of the middle channel is an inverted trapezoid or an inverted trapezoid-like;
in a first plane perpendicular to the substrate and parallel to the extending direction of the middle channel, an included angle between the bottom surface and the side wall of the middle channel ranges from 110 degrees to 180 degrees.
8. The method of claim 1, wherein a distance between a surface of the bridge structure near the substrate and a bottom surface of the middle channel near the substrate is in a range from 3 μm to 15 μm.
9. The method of claim 1, wherein patterning the conductive layer comprises:
coating a patterned second photoresist on one side of the conductive layer away from the substrate;
and etching the conducting layer which is not covered by the second photoresist to form the first electrode, the second electrode, the first connecting part and the second connecting part.
10. The method of manufacturing a touch panel according to claim 9, wherein the patterning the conductive layer further comprises:
and forming a planarization layer on one side of the second photoresist far away from the substrate.
11. The method of claim 9, wherein a coating direction of the second photoresist is parallel to an extending direction of the bridge structure.
12. The method for manufacturing a touch panel according to claim 9, wherein etching the conductive layer not covered by the second photoresist comprises:
and etching the conductive layer deposited on the side wall of the bridge-shaped structure.
13. The method of claim 1, wherein the first connecting portion has a thickness greater than a thickness of the second connecting portion.
14. The method of claim 1, wherein a thickness of the second connecting portion near the second electrode is greater than a thickness of the second connecting portion near a center of the second connecting portion.
15. A touch panel prepared by the method according to any one of claims 1 to 14.
16. A display device, comprising: a touch panel as defined in claim 15.
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