CN113219601A - Optical module and optical module shell of device shell and module shell integration - Google Patents

Optical module and optical module shell of device shell and module shell integration Download PDF

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Publication number
CN113219601A
CN113219601A CN202110442744.9A CN202110442744A CN113219601A CN 113219601 A CN113219601 A CN 113219601A CN 202110442744 A CN202110442744 A CN 202110442744A CN 113219601 A CN113219601 A CN 113219601A
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CN
China
Prior art keywords
cavity
optical
adapter
base
module
Prior art date
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Pending
Application number
CN202110442744.9A
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Chinese (zh)
Inventor
徐强
李波
潘双收
唐永正
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Wuhan Inphilight Technology Co Ltd
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Wuhan Inphilight Technology Co Ltd
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Publication date
Application filed by Wuhan Inphilight Technology Co Ltd filed Critical Wuhan Inphilight Technology Co Ltd
Priority to CN202110442744.9A priority Critical patent/CN113219601A/en
Publication of CN113219601A publication Critical patent/CN113219601A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to an optical module and an optical module shell integrating a device shell and the module shell, wherein the optical module shell comprises a base, a concave cavity is arranged at the upper end of the base, a cover plate is fixed at the upper end cavity opening of the concave cavity to form a device installation cavity for installing a light emitting assembly, an adapter installation hole for enabling the head end of an adapter at a transmitting end to extend into is formed in the side wall of one side of the device installation cavity, and a PCB (printed circuit board) installation hole for enabling a circuit board to extend into is formed in the side wall of the other side of the device installation cavity. The optical module comprises a circuit board, a light emitting assembly, a light receiving assembly and an optical module shell, wherein the light emitting assembly is fixed in a device mounting cavity of the base, the circuit board extends into the concave cavity from a PCB mounting hole in the side wall of the device mounting cavity, and the head end of the transmitting end adapter is matched in an adapter mounting hole in the side wall of the device mounting cavity. The invention reduces the cost of the optical module, greatly improves the heat dissipation effect, saves the space, has larger and more convenient layout space of the optical and electric components and reduces the process difficulty.

Description

Optical module and optical module shell of device shell and module shell integration
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to an optical module with an integrated device shell and a module shell and an optical module shell.
Background
With the gradual update of 5G communication technology, the market demands for high-speed modules such as 25G, 100G, 200G, 400G and the like are increased, the market competition is intensified, and the requirements on cost control and reliability of the high-speed modules are increased;
as shown in fig. 1, a conventional optical module includes a module housing, a PCB, a device housing, and an optoelectronic device attached to the device housing. The module shell and the device shell are mutually independent elements, the photoelectric element is attached in the device shell, and then the device shell is sealed in a parallel sealing welding mode or by glue.
The traditional optical module shell and the device shell are independent elements, and have the following defects:
the module shell and the device shell are mutually independent elements, a device shell is additionally needed besides the module shell, and the additional device shell increases the cost of the product, so the cost is relatively high;
the elements in the device shell can generate heat, and the heat generated by the device is dissipated through the heat conducting pad between the device shell and the module shell, so that the heat dissipation effect is poor;
because an additional device shell needs to be used, the space inside the module can be occupied, so that the space for arranging circuit elements in the module and arranging photoelectric elements in the device shell is insufficient, and the product design and the process difficulty are increased.
In recent years, COB (direct attachment of components to PCB boards) and non-hermetic packaging technologies have been rapidly developed. The application environment of the optical module in the data center is greatly improved, the requirement on the air tightness of the device is greatly reduced, and much more, lower packaging cost is pursued. Many optical module manufacturers have therefore made many attempts to lower the cost of packaging, such as replacing the conventional hermetically sealed housing with a powder metallurgy device housing to further reduce the cost.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides an optical module with a device shell and a module shell integrated and an optical module shell, reduces the cost of the optical module, greatly improves the heat dissipation effect, saves the space, has larger and more convenient space for the layout of optical and electric components, and reduces the process difficulty.
The technical scheme of the invention is realized as follows: the invention discloses an optical module shell integrating a device shell and a module shell, which comprises a base, wherein a concave cavity is arranged at the upper end of the base, a cover plate is fixed at an upper end cavity opening of the concave cavity to form a device installation cavity for installing a light emitting assembly, an adapter installation hole for enabling the head end of an adapter at a transmitting end to extend into is formed in the side wall of one side of the device installation cavity, and a PCB (printed circuit board) installation hole for enabling a circuit board to extend into is formed in the side wall of the other side of the device installation cavity.
Furthermore, the optical module shell also comprises an upper cover, the upper cover is fixed at the upper end of the base, and an inner cavity for installing the circuit board and the light receiving assembly is formed between the base and the upper cover; the upper end of the base is provided with a clamping groove for installing a receiving end adapter.
The invention discloses an optical module integrating a device shell and a module shell, which comprises a circuit board, a light emitting assembly, a light receiving assembly and an optical module shell, wherein the light emitting assembly is fixed in a device mounting cavity of a base, one end of the circuit board extends into the device mounting cavity from a PCB (printed circuit board) mounting hole on the side wall of the device mounting cavity and is electrically connected with the light emitting assembly, and the head end of a transmitting end adapter is matched in an adapter mounting hole on the side wall of the device mounting cavity.
Further, glue is used for sealing between the circuit board and the PCB mounting hole on the side wall of the device mounting cavity, glue is used for sealing between the transmitting end adapter and the adapter mounting hole on the side wall of the device mounting cavity, and glue is used for sealing between the cover plate and the upper end cavity opening of the cavity to form a closed cavity; the concave cavity of the base comprises a bottom surface and four side walls, and the light emitting assembly is fixed on the bottom surface of the concave cavity of the base.
Further, the light emitting assembly comprises at least one laser, and when the laser is one, the laser is used for outputting laser light into the optical fiber of the transmitting end adapter; when a plurality of lasers are arranged, an optical multiplexer is arranged between the plurality of lasers and the transmitting end adapter, and the optical multiplexer is used for multiplexing the lasers output by the plurality of lasers and outputting the multiplexed laser to an optical fiber of the transmitting end adapter; the optical receiving component comprises at least one PD, and when one PD is adopted, the receiving end adapter is used for receiving an optical signal and outputting the optical signal to the PD; when there are multiple PDs, a demultiplexer is disposed between the multiple PDs and the receiving end adapter, the receiving end adapter is configured to receive an optical signal and transmit the optical signal to the demultiplexer, and the demultiplexer is configured to separate multiple wavelengths and output the separated wavelengths to the multiple PDs respectively.
Furthermore, a plurality of first lenses are arranged between the optical multiplexer and the plurality of lasers, and the plurality of first lenses correspond to the plurality of lasers one by one.
Further, the laser is fixed at the upper end of the TEC; the TEC is fixed on the bottom surface of the concave cavity of the base.
Further, a second lens is arranged between the transmitting end adapter and the optical multiplexer, corresponds to the head end of the transmitting end adapter, and is used for light beam transmission between the transmitting end adapter and the optical multiplexer; a prism is arranged between the transmitting end adapter and the optical multiplexer; the prism is located between the second lens and the optical multiplexer.
Furthermore, the head end of the receiving-end adapter is connected with the demultiplexer through the optical fiber assembly, and the input optical signal of the receiving-end adapter enters the corresponding PD after being split by the demultiplexer through the optical fiber assembly.
Furthermore, the demultiplexer is fixed on a demultiplexer mounting boss arranged at the upper end of the base or the demultiplexer is fixed on the circuit board; the light receiving assembly and the circuit board are respectively fixed outside the device mounting cavity and are positioned in an inner cavity formed between the base and the upper cover of the optical module shell, and the light receiving assembly is electrically connected with the circuit board; the receiving end adapter is clamped in a clamping groove formed in the base.
The invention has at least the following beneficial effects:
the invention provides a structural scheme for integrating a module shell and a device shell, wherein a concave cavity is arranged at the upper end of a base, a cover plate is fixed at the upper end cavity opening of the concave cavity to form a device installation cavity for installing a light emitting assembly, and the device shell is directly arranged on the module shell, so that an additional device shell is omitted, and the cost of an optical module is reduced.
The PCB is inserted into the device mounting cavity through the rectangular hole reserved in the inner cavity wall and is fixed by glue; inserting the transmitting end adapter into the inner cavity through a circular hole reserved on the wall of the device mounting cavity and fixing the transmitting end adapter by using glue; covering the cover plate on the device installation cavity and sealing the device installation cavity by using glue to form a closed cavity; the laser, the TEC, the photoelectric element and the like are directly attached to the device mounting cavity of the module shell, and heat generated by the laser and the TEC is directly conducted to the module shell, so that the problem of heat dissipation of the traditional optical module is solved.
The device shell is directly arranged on the module shell, so that an additional device shell is omitted, and the problem of insufficient space layout of the traditional scheme is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an overall view of an optical module according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a base and an upper cover of an optical module according to an embodiment of the present invention being disassembled;
fig. 3 is an exploded view of an optical module according to an embodiment of the present invention;
fig. 4 is a schematic installation diagram of a light emitting module and a light receiving module of an optical module according to an embodiment of the present invention;
fig. 5 is a partially enlarged view of fig. 4.
In the drawing, 1 is a base, 1-1 is a cavity, 1-2 is a cover plate, 1-3 is a card slot, 2 is an upper cover, 3 is a circuit board, 4 is a laser, 5 is a first lens, 6 is a TEC, 7 is an optical multiplexer, 8 is a prism, 9 is a second lens, 10 is an emission end adapter, 11 is a receiving end adapter, 12 is an optical fiber assembly, 13 is a demultiplexer, and 14 is a PD.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, the meaning of "plurality" or "a plurality" is two or more unless otherwise specified.
Example one
Referring to fig. 1 to 5, an optical module housing with an integrated device housing and module housing provided by the embodiments of the present invention includes a base 1 and an upper cover 2, where a cavity 1-1 is formed at an upper end of the base 1, a cover plate 1-2 is fixed to an upper end opening of the cavity 1-1 to form a sealed device mounting cavity for mounting a light emitting assembly, an adapter mounting hole for allowing a head end of an emitter adapter 10 to extend into is formed in a side wall of one side of the device mounting cavity, and a PCB board mounting hole for allowing a circuit board 3 to extend into is formed in a side wall of the other side of the device mounting cavity.
Further, the optical module housing further comprises an upper cover 2, the upper cover 2 is fixed at the upper end of the base 1, and an inner cavity for mounting the circuit board 3 and the light receiving assembly is formed between the base 1 and the upper cover 2; the upper end of the base 1 is provided with a clamping groove 1-3 for installing a receiving end adapter 11.
And a groove is formed at the upper end of the base 1 beside the concave cavity 1-1, is communicated with the clamping groove 1-3 and is used for mounting a light receiving component.
The base 1 is fixedly connected with the upper cover 2 through screws.
Of course, the invention can also form a closed first device installation cavity for installing the light emitting component and a closed second device installation cavity for installing the light receiving component between the base and the cover plate 1-2, namely, the light emitting component can be installed in the first device installation cavity on the base, the light receiving component is installed in the second device installation cavity on the base, one cavity wall of the first device installation cavity is provided with an adapter installation hole for the head end of the transmitting end adapter to extend into, and the other cavity wall of the first device installation cavity is provided with a PCB board installation hole for the circuit board to extend into. One cavity wall of the second device installation cavity is provided with an adapter installation hole for the head end of the receiving end adapter to stretch into, and the other cavity wall of the second device installation cavity is provided with a PCB installation hole for the circuit board to stretch into. At the moment, the circuit board respectively extends into the first device mounting cavity and the second device mounting cavity and is respectively and electrically connected with the light emitting assembly and the light receiving assembly.
Example two
Referring to fig. 1 to 5, an optical module with an integrated device housing and module housing is disclosed in an embodiment of the present invention, and includes a circuit board 3, a light emitting module, a light receiving module, and an optical module housing according to the first embodiment, where the light emitting module is fixed in a device mounting cavity 1-1 of a base 1, one end of the circuit board 3 extends into the device mounting cavity from a PCB board mounting hole on a side wall of the device mounting cavity, and is electrically connected to a laser 4 of the light emitting module, and another end of the circuit board 3 is provided with a gold finger. The head end of the emitter end adapter 10 fits into an adapter mounting hole on the side wall of the device mounting cavity.
Further, the circuit board 3 and the PCB mounting hole on the side wall of the cavity 1-1 are sealed by glue, the transmitting end adapter 10 and the adapter mounting hole on the side wall of the cavity 1-1 are sealed by glue, and the cover plate 1-2 and the upper end cavity opening of the cavity 1-1 are sealed by glue to form a closed cavity; the cavity 1-1 of the base 1 comprises a bottom surface and four side walls, and the light emitting assembly is fixed on the bottom surface of the cavity 1-1 of the base 1.
Further, the light emitting assembly comprises at least one laser 4, when there is one laser, the laser is used for outputting laser light into the optical fiber of the transmitting end adapter, and a lens or/and a prism can be arranged between the laser and the transmitting end adapter according to requirements.
When the number of the lasers is multiple, an optical multiplexer 7 is arranged between the lasers 4 and the transmitting end adapter 10, and the optical Multiplexer (MUX) is used for multiplexing the lasers output by the lasers 4 and then outputting the multiplexed laser to the optical fiber of the transmitting end adapter 10.
The optical multiplexer 7 is fixed on the bottom surface of the cavity 1-1 of the base 1; a plurality of first lenses 5 are arranged between the optical multiplexer 7 and the plurality of lasers 4, and the plurality of first lenses 5 correspond to the plurality of lasers 4 one by one; the first lens 5 is fixed on the upper end of the TEC 6.
Further, a second lens 9 is arranged between the transmitting end adapter 10 and the optical multiplexer 7, and the second lens 9 is directly fixed on the bottom surface of the cavity 1-1 of the base 1, corresponds to the head end of the transmitting end adapter 10, and is used for transmitting light beams between the transmitting end adapter 10 and the optical multiplexer 7; a prism 8 is arranged between the transmitting end adapter 10 and the optical multiplexer 7, the prism 8 is directly fixed on the bottom surface of the cavity 1-1 of the base 1, and the light rays are subjected to lateral displacement after entering the prism 8 without changing the propagation direction; the prism 8 is located between the lens and the optical multiplexer 7. The prism of the present invention can also change the propagation direction of light as desired.
Further, the laser 4 is fixed on the upper end of the TEC6, and the TEC6 is fixed on the bottom surface of the cavity 1-1 of the base 1.
Further, the optical receiving module includes at least one PD (i.e., photodiode), and when there is one PD, the receiving-end adapter is configured to receive an optical signal and output the optical signal to the PD, and a lens or/and a prism may be further disposed between the receiving-end adapter and the PD as needed, and the prism is configured to change a propagation direction of light.
When there are multiple PDs, a demultiplexer 13 is disposed between the multiple PDs 14 and the receiving end adapter 11, the receiving end adapter 11 is configured to receive an optical signal from an optical fiber and transmit the optical signal into the demultiplexer 13, and the Demultiplexer (DEMUX) is configured to separate multiple wavelengths and output the separated multiple wavelengths to the multiple PDs 14.
Further, the head end of the receiving end adapter 11 is connected to the demultiplexer 13 through the optical fiber assembly 12, and the input optical signal of the receiving end adapter 11 enters the corresponding PD14 after being split by the demultiplexer through the optical fiber assembly 12; the receiving end adapter 11 is clamped in the card slots 1-3 arranged on the base 1.
Further, the demultiplexer 13 is fixed on a mounting boss of the demultiplexer 13 arranged at the upper end of the base 1. The circuit board 3 is provided with a yielding notch for yielding a boss for mounting the demultiplexer 13. Of course, it is also possible to fix the demultiplexer 13 on the circuit board 3.
Further, the transmitting end adapter 10 is arranged side by side with the receiving end adapter 11.
The light receiving assembly and the circuit board of the embodiment are respectively fixed outside the device mounting cavity and are positioned in an inner cavity formed between the base and the upper cover of the optical module shell, and the light receiving assembly is electrically connected with the circuit board; the receiving end adapter is clamped in a clamping groove formed in the base. The PD (photodiode) is electrically connected to TIA (transimpedance amplifier) on the circuit board.
In the embodiment, elements such as a laser 4, a TEC (semiconductor cooler) 6, a MUX, and a lens are directly attached to a device mounting cavity formed on a module base 1 by glue; the adapter is directly stuck in a round hole formed on the module shell by glue; the PCB board stretches into the cavity through a rectangular hole formed in the module shell and is fixed by glue. The lens is fixed at the corresponding position in the inner cavity in an active coupling mode and is fixed by glue.
The invention adopts the structure that the module shell and the device shell are integrated, the device shell is directly processed on the module shell, and an independent device shell is not needed any more, so that an additional device shell is saved, and the cost of the optical module is reduced; heating elements such as the laser 4, the TEC6 and the like are directly adhered and fixed on the module shell, and the generated heat is directly conducted to the module shell, so that the heat dissipation effect is greatly improved; because no extra device shell is needed, the space is saved, the space for the layout of the optical and electric components is larger and more convenient, and the process difficulty is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (10)

1. The utility model provides a device casing and optical module shell of module casing integration, includes the base, its characterized in that: the upper end of base is equipped with the cavity, the upper end accent of cavity is fixed with the apron, forms the device installation cavity that is used for installing light emission subassembly, one side lateral wall of device installation cavity is equipped with the adapter mounting hole that is used for supplying the transmission end adapter head end to stretch into, the opposite side lateral wall of device installation cavity is equipped with the PCB board mounting hole that is used for the circuit board to stretch into.
2. The light module housing of claim 1, wherein: the upper cover is fixed at the upper end of the base, and an inner cavity for mounting the circuit board and the light receiving assembly is formed between the base and the upper cover; the upper end of the base is provided with a clamping groove for installing a receiving end adapter.
3. The utility model provides an optical module of device casing and module casing integration, includes circuit board, light-emitting component, light-receiving component, its characterized in that: the optical module shell as claimed in claim 1 or 2, wherein the light emitting module is fixed in the device mounting cavity of the base, one end of the circuit board extends into the device mounting cavity from the PCB board mounting hole on the side wall of the device mounting cavity and is electrically connected with the light emitting module, and the head end of the emitting end adapter is fitted in the adapter mounting hole on the side wall of the device mounting cavity.
4. A light module as claimed in claim 3, characterized in that: the circuit board and the PCB mounting hole on the side wall of the device mounting cavity are sealed by glue, the transmitting end adapter and the adapter mounting hole on the side wall of the device mounting cavity are sealed by glue, and the cover plate and the upper end cavity opening of the concave cavity are sealed by glue to form a sealed cavity; the concave cavity of the base comprises a bottom surface and four side walls, and the light emitting assembly is fixed on the bottom surface of the concave cavity of the base.
5. A light module as claimed in claim 3, characterized in that: the light emitting assembly comprises at least one laser, and when the number of the lasers is one, the lasers are used for outputting laser light to the optical fiber of the transmitting end adapter; when a plurality of lasers are arranged, an optical multiplexer is arranged between the plurality of lasers and the transmitting end adapter, and the optical multiplexer is used for multiplexing the lasers output by the plurality of lasers and outputting the multiplexed laser to an optical fiber of the transmitting end adapter; the optical receiving component comprises at least one PD, and when one PD is adopted, the receiving end adapter is used for receiving an optical signal and outputting the optical signal to the PD; when there are multiple PDs, a demultiplexer is disposed between the multiple PDs and the receiving end adapter, the receiving end adapter is configured to receive an optical signal and transmit the optical signal to the demultiplexer, and the demultiplexer is configured to separate multiple wavelengths and output the separated wavelengths to the multiple PDs respectively.
6. The optical module of claim 5, wherein: a plurality of first lenses are arranged between the optical multiplexer and the plurality of lasers, and the plurality of first lenses correspond to the plurality of lasers one by one.
7. The optical module of claim 5, wherein: the laser is fixed at the upper end of the TEC; the TEC is fixed on the bottom surface of the concave cavity of the base.
8. The optical module of claim 5, wherein: a second lens is arranged between the transmitting end adapter and the optical multiplexer, corresponds to the head end of the transmitting end adapter and is used for transmitting light beams between the transmitting end adapter and the optical multiplexer; a prism is arranged between the transmitting end adapter and the optical multiplexer; the prism is located between the second lens and the optical multiplexer.
9. The optical module of claim 5, wherein: the head end of the receiving end adapter is connected with the demultiplexer through the optical fiber assembly, and an input optical signal of the receiving end adapter enters the corresponding PD after being split by the demultiplexer through the optical fiber assembly.
10. The optical module of claim 5, wherein: the demultiplexer is fixed on a demultiplexer mounting boss arranged at the upper end of the base or the demultiplexer is fixed on the circuit board; the light receiving assembly and the circuit board are respectively fixed outside the device mounting cavity and are positioned in an inner cavity formed between the base and the upper cover of the optical module shell, and the light receiving assembly is electrically connected with the circuit board; the receiving end adapter is clamped in a clamping groove formed in the base.
CN202110442744.9A 2021-04-23 2021-04-23 Optical module and optical module shell of device shell and module shell integration Pending CN113219601A (en)

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Application publication date: 20210806