CN220730481U

CN220730481U - Miniature optical module

Info

Publication number: CN220730481U
Application number: CN202322544845.4U
Authority: CN
Inventors: 王目喜; 王芳; 董红星; 李银杰; 王永才
Original assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Current assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Priority date: 2023-09-19
Filing date: 2023-09-19
Publication date: 2024-04-05
Anticipated expiration: 2033-09-19

Abstract

The utility model discloses a miniature optical module, comprising: a housing having an accommodation cavity therein, the housing having an optical interface and an electrical interface thereon; a bracket fixedly arranged in the accommodating cavity; an LC adapter secured to the bracket; the circuit board assembly comprises a PCB circuit board and a flexible circuit board, wherein the PCB circuit board is supported and fixed on the LC adapter, an optical chip is arranged on the PCB circuit board and faces to the lens of the LC adapter, the first end of the flexible circuit board is connected with the PCB circuit board and then bends for 90 degrees to extend downwards, and the second end of the flexible circuit board is provided with communication pins. According to the miniature optical module, the optical component is fixed in the shell, the circuit board component is bent for 90 degrees and is horizontally arranged in the L shape, and the space below the circuit board component is used for assembling the optical component, so that high-density distribution of components can be realized, small-size packaging of the optical module is realized, and the environment adaptability is enhanced.

Description

Miniature optical module

Technical Field

The utility model belongs to the technical field of optical fiber communication equipment, and particularly relates to a miniature optical module.

Background

With the development of optical communication technology, various packaged optical modules, such as SFF, SFP, QSFP, are widely used to adapt to different application scenarios. Some packaging forms are designed to realize certain specific functions of the packaging forms, and often the packaging size is large, and most of the packaging forms are large in occupied size due to the internal circuit structure construction and are not reasonable in structural design among all components. The main board structure of the system commonly used in packaging is usually a rigid circuit board, which cannot be bent correspondingly, and if bent, the corresponding components on the circuit board can be damaged.

These packaged optical modules have low environmental flexibility due to their large package size, may be damaged or not operate properly due to their low vibration resistance performance if operated in a relatively harsh environment, and their corresponding reliability is far from meeting the high reliability system requirements when operated in a high reliability system. In addition, the large package size of the LED lamp is large in weight, power consumption and size, so that the LED lamp is inconvenient to apply and cannot meet the application requirement of a narrow space area.

The above information disclosed in this background section is only for enhancement of understanding of the background section of the application and therefore it may not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

Aiming at the problems that the optical module in the prior art has large packaging size and cannot meet the use requirement of a narrow space and has poor environmental adaptability, the utility model provides a miniature optical module which can solve the problems.

In order to achieve the aim of the utility model, the utility model is realized by adopting the following technical scheme:

a miniature optical module comprising:

a housing having a receiving cavity therein, the housing having an optical interface and an electrical interface thereon;

a bracket fixedly arranged in the accommodating cavity;

an LC adapter fixed to the bracket, a front end of the LC adapter penetrating into the optical interface;

the circuit board assembly comprises a PCB circuit board and a flexible circuit board, wherein the PCB circuit board is supported and fixed on the LC adapter, an optical chip is arranged on the PCB circuit board, the optical chip faces to the lens of the LC adapter, the first end of the flexible circuit board is connected with the PCB circuit board and then bends for 90 degrees to extend downwards, the second end of the flexible circuit board extends to the electric interface and protrudes from the electric interface to the outer side of the shell, and the second end of the flexible circuit board is provided with communication pins.

In some embodiments, the housing comprises:

the lower shell comprises a shell bottom, and the optical interface is fixed at one end of the shell bottom;

the upper shell is matched with the lower shell, the upper shell and the lower shell enclose to form the accommodating cavity, and the electric interface is arranged at the connecting joint of the upper shell and the lower shell.

In some embodiments, the optical chip includes an optical emission chip and/or an optical receiving chip, the support is formed with a support bin corresponding to the LC adapters one by one, a positioning groove is formed on one side of the support bin, which is close to the optical interface, the opening of the positioning groove faces upwards, the neck of the LC adapter is clamped into the positioning groove, and the main body of the LC adapter is supported in the support bin.

In some embodiments, a plurality of support columns are formed on the side wall of the support bin, support holes corresponding to the support columns one by one are formed on the PCB, and the support columns are inserted into the support holes to be connected with the PCB.

In some embodiments, one or more positioning pins are formed on the lower surface of the bracket in a protruding manner, positioning holes corresponding to the positioning pins one by one are formed on the bottom of the shell, and the positioning pins are inserted into the corresponding positioning holes.

In some embodiments, the lower surface of the bracket is further provided with a screw hole, the shell bottom is provided with a through hole coaxial with the screw hole, and the shell bottom is fixed with the screw hole through a screw.

In some embodiments, a guide plate is formed on a side of the support bin opposite to the positioning groove, and an upper end surface of the guide plate is a cambered surface.

In some embodiments, the guide plate is connected to the bottom wall of the supporting bin through a transition plate, the transition plate extends from the bottom wall of the supporting bin to the lower end of the guide plate in an inclined manner, the transition plate is in arc transition connection with the guide plate, the flexible circuit board extends downwards along the guide plate and the transition plate, turns over 180 degrees when extending to the bottom of the transition plate, and protrudes from the electrical interface to the outer side of the shell.

In some embodiments, the micro optical module further includes a shielding plate, an assembly hole corresponding to the LC adapter is formed in the shielding plate, the front end of the LC adapter passes through the assembly hole and is fixed to the shielding plate, and the shielding plate is used for isolating the accommodating cavity from the optical interface.

In some embodiments, a grounding spring is sleeved on the outer peripheral side of the optical interface.

In some embodiments, the receiving cavity is filled with thermally conductive silicone.

Compared with the prior art, the utility model has the advantages and positive effects that:

according to the miniature optical module, the optical component is fixed in the shell, the circuit board component is bent for 90 degrees and is horizontally arranged in the L shape, and the space below the circuit board component is used for assembling the optical component, so that high-density distribution of components can be realized, small-size packaging of the optical module is realized, and the environment adaptability is enhanced.

Other features and advantages of the present utility model will become apparent upon review of the detailed description of the utility model in conjunction with the drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a miniature optical module according to an embodiment of the present utility model when placed in a forward direction;

FIG. 2 is a schematic diagram of an inverted micro optical module according to an embodiment of the present utility model;

FIG. 3 is an exploded view of one embodiment of a miniature optical module according to the present utility model;

FIG. 4 is a partially exploded view of an embodiment of a miniature optical module according to the present utility model;

FIG. 5 is a schematic view of a structure of a micro optical module according to an embodiment of the present utility model when a support is placed in a forward direction;

FIG. 6 is a schematic view of a structure of a micro optical module according to an embodiment of the present utility model when the stand is inverted;

fig. 7 is a schematic structural diagram of a micro optical module according to another embodiment of the present utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, in the description of the present utility model, terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Example 1

The present embodiment proposes a micro optical module, as shown in fig. 1-3, comprising a housing 11, a bracket 12, a circuit board assembly 13 and an LC adapter 14, wherein the housing 11 has a housing cavity 110, and the housing 11 has an optical interface 111 and an electrical interface 112. The circuit board assembly 13 and the bracket 12 are disposed in the accommodation chamber 110, the LC adapter 14 is fixed to the bracket 12, and the front end of the LC adapter 14 is inserted into the optical interface 111.

In some embodiments, to improve the compactness of the circuit board assembly 13, the circuit board assembly 13 includes a PCB board 131 and a flexible circuit board 132, as shown in fig. 3-5. The PCB 131 is supported and fixed on the LC adapter 14, the PCB 131 is provided with an optical chip 133, the optical chip 133 is arranged towards the lens of the LC adapter 14, the first end of the flexible circuit 132 is connected with the PCB 131 and then bends for 90 degrees to extend downwards, the second end of the flexible circuit 132 extends to the electric interface 112 and protrudes out of the electric interface 112 to the outer side of the shell 11, and the second end of the flexible circuit 132 is provided with communication pins 134.

The circuit board assembly comprises two parts, the L-shaped circuit board assembly is bent for 90 degrees to be transversely arranged, the space below the circuit board assembly 13 is used for assembling the LC adapter 14, high-density distribution of components can be achieved, and small-size packaging of the optical module is achieved.

In some embodiments, the housing 11 includes a lower housing 113 and an upper housing 114, wherein the lower housing 113 includes a housing bottom 1131, and the optical interface 111 is fixed at one end of the housing bottom 1131.

The upper shell 114 and the lower shell 113 are matched, the upper shell 114 is buckled on the lower shell 113, the upper shell 114 and the lower shell 113 enclose to form a containing cavity 110, and the electric interface 112 is arranged at a connecting joint of the upper shell 114 and the lower shell 113.

In some embodiments, the optical interface 111 and the electrical interface 112 are located at opposite ends of the bottom 1131, which is favorable for more compactly arranging components in a limited space between the two, reducing wiring of the circuit board assembly 13, and the optical interface 111 and the electrical interface 112 are not adjacently arranged, so that the optical module can be more conveniently connected with external devices, and different connected external devices are prevented from interfering with each other due to too close distance.

In some embodiments, the optical chip includes an optical transmitting chip for transmitting the laser signal and/or an optical receiving chip for receiving the laser signal.

The LC adapter 14 is provided with optical devices such as lenses and reflection mirrors for emitting laser light emitted from the light emitting chip or converging laser light emitted from the outside onto the light receiving chip.

The LC adapters 14 are arranged in one-to-one correspondence with the optical chips, that is, when the optical chips include only either one of the light emitting chips or the light receiving chips, only one LC adapter 14 is required. When the optical chip includes both the light emitting chip and the light receiving chip, two LC adapters 14 are provided for receiving or emitting laser light, respectively, for the two optical chips.

The optical chip of the present embodiment is described taking an example of including both the light emitting chip and the light receiving chip, and two LC adapters 14 are provided accordingly.

As shown in fig. 4 and 5, the support 12 is formed with a support bin 121 corresponding to the LC adapters 14 one by one, one side of the support bin 121 near the optical interface 111 is formed with a positioning groove 122, the opening of the positioning groove 122 is upward, the neck of the LC adapter 14 is clamped into the positioning groove 122, and the main body of the LC adapter 14 is supported in the support bin 121, so that the LC adapter 14 is supported and positioned.

The LC adapters 14 in this embodiment have two, and the corresponding support bins 121 are provided.

The neck portion of the LC adapter 14 is formed with a ring groove 142 matching the positioning groove 122, the LC adapter 14 is inserted into the positioning groove 122, and the groove bottom of the positioning groove 122 is snapped into the ring groove 142, thereby achieving the tight fixation of the LC adapter 14 and the lower housing 113.

In some embodiments, a plurality of support columns 123 are formed on the side wall of the support bin 121, and support holes 135 corresponding to the support columns 123 one by one are formed on the PCB circuit board 131, and the support columns 123 are inserted into the support holes 135 to be connected with the PCB circuit board 131.

Screw holes can be formed in the support columns 123, and the PCB 131 is fixedly connected with the support columns 123 through screws.

In some embodiments, as shown in fig. 3 and 6, one or more positioning pins 124 are formed on the lower surface of the support 12 in a protruding manner, positioning holes 1132 corresponding to the positioning pins 124 one by one are formed on the bottom 1131, and the positioning pins 124 are inserted into the corresponding positioning holes 1132, so as to realize positioning when the support 12 is assembled on the bottom 1131.

In some embodiments, as shown in fig. 3 and 6, the lower surface of the bracket 12 is further provided with a screw hole 125, a through hole 1133 coaxial with the screw hole 125 is provided on the bottom 1131, and the bottom 1131 is fixed with the screw hole 125 by a screw, that is, the screw passes through the through hole 1133 to be fixed with the screw hole 125, so as to realize the fixed connection between the bracket 12 and the lower housing 113.

In some embodiments, the bottom of the lower case 113 is formed with a mounting post 115 protruding outward.

In some embodiments, a guide plate 126 is formed on a side of the support compartment 121 opposite to the positioning groove 122, the guide plate 126 is used to guide the flexible circuit board 132, and the flexible circuit board 132 may be bent along the direction of the guide plate 126. In order to place the guide plate 126 and break the communication line or the like in the flexible circuit board 132, the upper end surface of the guide plate 126 is preferably a cambered surface. The flexible circuit board 132 can realize bending and reversing along the arc surface in a smooth transition manner.

In some embodiments, the guide plate 126 is connected to the bottom wall of the support compartment 121 by a transition plate 127, the transition plate 127 extends obliquely from the bottom wall of the support compartment 121 to the lower end of the guide plate 126, the transition plate 127 is connected to the guide plate 126 in a circular arc transition manner, and the flexible circuit board 132 extends downward along the guide plate 126 and the transition plate 127, turns over 180 ° when extending to the bottom of the transition plate 127, and protrudes from the electrical interface 112 to the outside of the housing 11.

In some embodiments, the micro optical module further includes a shielding plate 15, where the shielding plate 15 is provided with an assembly hole 151 corresponding to the LC adapter 14, and the front end of the LC adapter 14 is fixed to the shielding plate 15 through the assembly hole 151, where the shielding plate 15 is used to isolate the accommodating cavity 110 from the optical interface 111 and form an independent area, so that electromagnetic signals generated by the circuit board assembly 13 can be isolated, and the influence of the laser transmitted and received by the optical assembly 12 is prevented.

In some embodiments, the grounding spring 16 is sleeved on the outer peripheral side of the optical interface 111.

Because the shielding plate 15 separates the optical interface 111 from the accommodating cavity 110, in some embodiments, the accommodating cavity 110 is filled with a thermal conductive silica gel, and the thermal conductive silica gel can be filled between the circuit board assembly 13, the LC adapter 14, the lower housing 113 and the upper housing 114, and is used for auxiliary fixation of each device after being cured, and the thermal conductive performance is beneficial to heat dissipation of each device.

The optical module of the embodiment is compact and miniaturized, is shorter than standard SFF, has a certain reinforcing design, and is applied to scenes with smaller space and higher density and vibration and impact environments under certain conditions.

The optical module adopts COB packaging technology, is integrally designed on a printed circuit board (a flexible area is used as a lead, a rigid area is used as a main circuit area and a COB packaging supporting area), has shorter high-speed signal path, higher communication speed, better photoelectric performance index and more surplus, better photoelectric performance, is more beneficial to high-speed optical communication, and is beneficial to the improvement of loss budget and transmission distance of an optical fiber link.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. A miniature optical module, comprising:

a bracket fixedly arranged in the accommodating cavity;

2. The miniature light module according to claim 1, wherein the housing comprises:

3. The miniature optical module according to claim 2, wherein the optical chip comprises a light emitting chip and/or a light receiving chip, the support is provided with support bins corresponding to the LC adapters one by one, one side of the support bins, which is close to the optical interface, is provided with a positioning groove, the opening of the positioning groove faces upwards, the neck of the LC adapter is clamped into the positioning groove, and the main body of the LC adapter is supported in the support bins.

4. A miniature optical module according to claim 3, wherein a plurality of support columns are formed on the side wall of the support bin, support holes corresponding to the support columns one by one are formed on the PCB, and the support columns are inserted into the support holes to be connected with the PCB.

5. The micro light module as set forth in claim 2, wherein one or more positioning pins are formed to protrude from a lower surface of the bracket, positioning holes are formed on the bottom of the case in one-to-one correspondence with the positioning pins, and the positioning pins are inserted into the corresponding positioning holes.

6. The miniature optical module according to claim 2, wherein the lower surface of the bracket is further provided with a screw hole, the bottom of the housing is provided with a through hole coaxial with the screw hole, and the bottom of the housing is fixed with the screw hole by a screw.

7. A micro optical module according to claim 3, wherein a guide plate is formed on a side of the support bin opposite to the positioning groove, and an upper end surface of the guide plate is a cambered surface.

8. The miniature optical module according to claim 7, wherein the guide plate is connected to the bottom wall of the support compartment by a transition plate, the transition plate extends obliquely from the bottom wall of the support compartment to the lower end of the guide plate, the transition plate is in circular arc transition connection with the guide plate, the flexible circuit board extends downwards along the guide plate and the transition plate, turns over 180 ° when extending to the bottom of the transition plate, and protrudes from the electrical interface to the outside of the housing.

9. The miniature optical module according to any one of claims 1-8, further comprising a shielding plate, wherein the shielding plate is provided with a fitting hole corresponding to the LC adapter, the front end of the LC adapter passes through the fitting hole to be fixed with the shielding plate, and the shielding plate is used for isolating the accommodating cavity from the optical interface.

10. The miniature optical module according to any one of claims 1-8, wherein a grounding spring is sleeved on the peripheral side of the optical interface.