CN113217828A - LED luminous tube with mirror image luminous structure - Google Patents

LED luminous tube with mirror image luminous structure Download PDF

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Publication number
CN113217828A
CN113217828A CN202110472658.2A CN202110472658A CN113217828A CN 113217828 A CN113217828 A CN 113217828A CN 202110472658 A CN202110472658 A CN 202110472658A CN 113217828 A CN113217828 A CN 113217828A
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CN
China
Prior art keywords
led
base
led chip
mirror image
heat dissipation
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Pending
Application number
CN202110472658.2A
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Chinese (zh)
Inventor
张永兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yongyu Photoelectric Co ltd
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Shenzhen Yongyu Photoelectric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen Yongyu Photoelectric Co ltd filed Critical Shenzhen Yongyu Photoelectric Co ltd
Priority to CN202110472658.2A priority Critical patent/CN113217828A/en
Publication of CN113217828A publication Critical patent/CN113217828A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention discloses an LED (light emitting diode) luminous tube with a mirror image luminous structure, which comprises a base, wherein a first packaging outer cover is fixedly arranged on the upper part of the base, an anode bonding pad is embedded and arranged on one side of the base, a cathode bonding pad is embedded and arranged on the other side of the base, an anode patch is fixedly connected to the outside of the anode bonding pad, a cathode patch is fixedly connected to the outside of the cathode bonding pad, a first LED chip is fixedly arranged at the center position of the upper part of the base, and a heat dissipation structure is arranged at the front part of the base. The LED luminous tube with the mirror image luminous structure can form the mirror image luminous effect, can be normally used in a scene needing double-sided light emission, improves the functionality and the application range, also increases the heat dissipation effect, prolongs the service life of the LED luminous tube, is convenient for checking damaged devices when the LED luminous tube cannot emit bright light, and is beneficial to convenience of later maintenance.

Description

LED luminous tube with mirror image luminous structure
Technical Field
The invention relates to the field of LED (light emitting diode) luminous tubes, in particular to an LED luminous tube with a mirror image luminous structure.
Background
The LED luminous tube is a luminous tube taking an LED chip as a core, and generally has a pin type and a patch type, wherein the patch type is mainly connected with a PCB (printed Circuit Board) in a welding mode, can generate bright light after being electrified, and belongs to common lighting elements in various electronic devices;
the existing LED has certain defects to be improved when in use, firstly, the existing LED does not have a mirror-image light-emitting structure and only can emit light on a single surface, but needs double-surface light emission in many use occasions, and can not emit light on double surfaces, so that the LED can not be used in many places, and the application range is greatly reduced; secondly, the existing LED has poor heat dissipation effect, a large amount of heat can be generated in the long-term operation process, the contact with air is poor, and poor heat dissipation is caused, so that the service life of the LED is seriously influenced; in addition, the existing LED luminotrons are inconvenient to observe the state, the LED luminotrons are small in structure, the phenomenon that the LED chips inside the LED luminotrons are slightly blackened when the LED luminotrons are damaged occurs, and the internal structures of the LED luminotrons cannot be seen clearly due to the small structure, so that the reason that the LED luminotrons cannot emit light is inconvenient to find out, and the LED luminotrons are not beneficial to practical use.
Disclosure of Invention
The invention mainly aims to provide an LED luminous tube with a mirror image luminous structure, which can effectively solve the problems in the background technology that: the existing LED luminous tube does not have a mirror-image luminous structure and only can emit light on a single surface, but needs double-surface light emission in many use occasions, and the LED luminous tube cannot be used in many places due to the fact that double-surface light emission cannot be carried out, so that the application range is greatly reduced; secondly, the existing LED has poor heat dissipation effect, a large amount of heat can be generated in the long-term operation process, the contact with air is poor, and poor heat dissipation is caused, so that the service life of the LED is seriously influenced; in addition, the existing LED luminotrons are inconvenient to observe the state, the LED luminotrons are small in structure, the phenomenon of slight blackening can occur to the LED chips inside the LED luminotrons when the LED luminotrons are damaged, and the internal structures of the LED luminotrons cannot be seen clearly due to the small structure, so that the technical problem of the practical use is not facilitated due to the fact that the LED luminotrons cannot emit light is inconvenient to investigate.
In order to achieve the purpose, the invention adopts the technical scheme that:
a LED luminous tube with a mirror image luminous structure comprises a base, wherein a first packaging outer cover is fixedly mounted on the upper portion of the base, an anode bonding pad is mounted on one side of the base in an embedded mode, a cathode bonding pad is mounted on the other side of the base in an embedded mode, an anode paster is fixedly connected to the outer portion of the anode bonding pad, a cathode paster is fixedly connected to the outer portion of the cathode bonding pad, a first LED chip is fixedly mounted at the center of the upper portion of the base, a heat dissipation structure is arranged on the front portion of the base, a first anode lead is arranged between the first LED chip and the anode paster, a first cathode lead is arranged between the first LED chip and the cathode paster, a second packaging outer cover is fixedly mounted at the bottom of the base, a second LED chip is fixedly mounted at the inner side of the second packaging outer cover at the center of the bottom of the base, and a second anode lead is arranged between the second LED chip and the anode paster, and a second cathode lead is arranged between the second LED chip and the cathode patch.
As a further aspect of the present invention, the heat dissipation structure includes a heat dissipation through hole, a horizontal fin and a longitudinal fin, the heat dissipation through hole is formed on the front surface of the base, the horizontal fin is horizontally installed at the center of the interior of the heat dissipation through hole, and the longitudinal fin is vertically installed at the center of the heat dissipation through hole.
As a further aspect of the present invention, the number of the heat dissipation through holes is ten, and the transverse fins and the longitudinal fins are arranged in a crisscross manner.
As a further aspect of the present invention, the first notch and the second notch are both trapezoidal in shape, and the number of the first notch and the number of the second notch are both four.
As a further aspect of the present invention, the first package housing and the second package housing are arranged in a mirror image of the base, and both the first package housing and the second package housing have a trapezoidal shape.
As a further aspect of the present invention, an outer convex surface is disposed on a top surface of the first package housing, and an inner convex surface is disposed on a top bottom surface of the first package housing.
As a further aspect of the present invention, a triangular index is disposed at a position of the upper portion of the base, which is located in front of the first package housing, and a tip of the triangular index points to the negative electrode pad.
As a further scheme of the present invention, the LED with a mirror image light emitting structure specifically includes the following steps when in use:
the method comprises the following steps: placing the base at the position of a reserved mounting point of an external PCB, determining the directions of the positive bonding pad and the negative bonding pad according to a triangular pointer at the upper part of the base, wherein the pointed direction of the triangular pointer is the direction of the negative bonding pad;
step two: after the placement, welding the positive bonding pad and the negative bonding pad with an external PCB by using an external welding machine, and putting into use after the welding is finished;
step three: during welding, the welding liquid flows into the first notches and the second notches, so that the welding surface is increased;
step four: during use, the external PCB supplies power to the positive electrode patch and the negative electrode patch through the positive electrode bonding pad and the negative electrode bonding pad, so that the first positive electrode lead and the first negative electrode lead transmit electric energy to the first LED chip, the first LED chip works to emit bright light, meanwhile, the second positive electrode lead and the second negative electrode lead transmit electric energy to the second LED chip, and the second LED chip works to emit bright light;
step five: air blown out by a cooling fan arranged on the external PCB or air in natural ventilation circulates through the ten cooling through holes, and heat exchange is carried out between the interior of each cooling through hole and the inner wall of each cooling through hole as well as the transverse fins and the longitudinal fins, so that the cooling effect is achieved;
step six: when the first LED chip and the second LED chip stop emitting bright light, people can observe whether the first LED chip and the second LED chip are blackish or not through the outer convex surface and the inner convex surface, if so, the first LED chip and the second LED chip are damaged, and if not, other related electrical components are damaged.
Compared with the prior art, the invention has the following beneficial effects:
by arranging the first packaging outer cover, the second packaging outer cover and the first LED chip matched with the second LED chip, during use, the external PCB supplies power to the positive electrode patch and the negative electrode patch through the positive electrode bonding pad and the negative electrode bonding pad, so that the first positive electrode lead and the first negative electrode lead transmit electric energy to the first LED chip, the first LED chip emits bright light when working, meanwhile, the second positive electrode lead and the second negative electrode lead transmit electric energy to the second LED chip, the second LED chip emits bright light when working, the two LED chips share one positive electrode patch and one negative electrode patch, and during working, the mirror image luminous efficacy can be formed, so that the LED chip can be normally used in a scene needing double-sided light emission, and the functionality and the application range are improved;
through the arrangement of the heat dissipation structure, air blown out by a heat dissipation fan arranged on an external PCB or air naturally ventilated flows through ten heat dissipation through holes, and heat exchange is carried out between the interior of each heat dissipation through hole and the inner wall of each heat dissipation through hole as well as between the transverse fins and the longitudinal fins, so that the heat dissipation effect is achieved, the heat dissipation effect of the LED luminous tube is effectively improved, the phenomenon that the LED luminous tube is damaged due to poor heat dissipation is avoided, and the service life of the LED luminous tube is prolonged;
by arranging the outer convex surface to be matched with the inner convex surface, when the first LED chip and the second LED chip stop emitting bright light, people can observe whether the first LED chip and the second LED chip are slightly black or not through the outer convex surface and the inner convex surface, if so, the first LED chip and the second LED chip are damaged, and if not, other associated electrical components are damaged, so that people can conveniently observe the states of the first LED chip and the second LED chip, the damaged devices can be conveniently checked when the LED luminous tube cannot emit bright light, and convenience in later maintenance is facilitated;
through setting up first breach cooperation second breach, in the welded, the welding liquid flows into the inside of each first breach and second breach for the face of weld obtains increasing, the effectual contact nature that improves the face of weld and the stability after the welding.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an LED with a mirror-image light-emitting structure according to the present invention;
FIG. 2 is a disassembled view of the first packaging outer cover and the base of the LED with mirror image light-emitting structure of the present invention;
FIG. 3 is an enlarged view of A in FIG. 1 of an LED with a mirror image light emitting structure according to the present invention;
FIG. 4 is a side view of the internal structures of a first packaging outer cover and a second packaging outer cover of an LED with a mirror image light-emitting structure according to the present invention;
fig. 5 is a view showing the light emitting lines of an LED with a mirror-image light emitting structure according to the present invention.
In the figure: 1. a base; 2. a first package housing; 3. a positive electrode pad; 4. a negative electrode pad; 5. a first notch; 6. a second notch; 7. a positive electrode patch; 8. negative electrode paster; 9. a first LED chip; 10. a heat dissipation structure; 11. a heat dissipating through hole; 12. transverse fins; 13. longitudinal fins; 14. a first positive electrode lead; 15. a first negative electrode lead; 16. an outer convex surface; 17. an inner convex surface; 18. a second package housing; 19. a second LED chip; 20. a second positive electrode lead; 21. a second negative electrode lead.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-5, an LED lighting tube with a mirror image light emitting structure comprises a base 1, a first packaging housing 2 is fixedly mounted on the upper portion of the base 1, an anode pad 3 is embedded and mounted on one side of the base 1, a cathode pad 4 is embedded and mounted on the other side of the base 1, an anode patch 7 is fixedly connected to the outside of the anode pad 3, a cathode patch 8 is fixedly connected to the outside of the cathode pad 4, a first LED chip 9 is fixedly mounted on the center of the upper portion of the base 1, a heat dissipating structure 10 is arranged on the front portion of the base 1, a first anode lead 14 is arranged between the first LED chip 9 and the anode patch 7, a first cathode lead 15 is arranged between the first LED chip 9 and the cathode patch 8, a second packaging housing 18 is fixedly mounted on the bottom of the base 1, a second LED chip 19 is fixedly mounted on the inner side of the second packaging housing 18 on the center of the bottom of the base 1, a second positive lead 20 is arranged between the second LED chip 19 and the positive patch 7, and a second negative lead 21 is arranged between the second LED chip 19 and the negative patch 8;
the heat dissipation structure 10 comprises a heat dissipation through hole 11, a transverse fin 12 and a longitudinal fin 13, wherein the heat dissipation through hole 11 is formed in the front surface of the base 1, the transverse fin 12 is horizontally arranged in the center of the interior of the heat dissipation through hole 11, and the longitudinal fin 13 is vertically arranged in the center of the heat dissipation through hole 11; the number of the heat dissipation through holes 11 is ten, and the transverse fins 12 and the longitudinal fins 13 are arranged in a cross manner; the first notches 5 and the second notches 6 are trapezoidal in shape, and the number of the first notches 5 and the number of the second notches 6 are four; the first packaging outer cover 2 and the second packaging outer cover 18 are arranged in a mirror image mode through the base 1, and the first packaging outer cover 2 and the second packaging outer cover 18 are both trapezoidal in shape; the top surface of the first packaging outer cover 2 is provided with an outer convex surface 16, and the bottom surface of the top of the first packaging outer cover 2 is provided with an inner convex surface 17; a triangular index is arranged at the position, located in front of the first packaging outer cover 2, of the upper portion of the base 1, and the tip of the triangular index points to the negative electrode bonding pad 4.
It should be noted that, a method for using an LED with a mirror-image light-emitting structure, when in use, a base 1 is placed at a position of a reserved mounting point of an external PCB, and simultaneously, the directions of an anode pad 3 and a cathode pad 4 are determined according to a triangular pointer on the upper portion of the base 1, the pointed end of the triangular pointer points to the direction of the cathode pad 4, after placement, the anode pad 3 and the cathode pad 4 are both welded with the external PCB by using an external welding machine, and can be put into use after welding is completed, when in welding, a welding liquid flows into the first gap 5 and the second gap 6, so that the welding surface is increased, during use, the external PCB supplies power to an anode patch 7 and a cathode patch 8 through the anode pad 3 and the cathode pad 4, so that a first anode lead 14 and a first cathode lead 15 transmit electric energy to a first LED chip 9, and the first LED chip 9 works to emit light, meanwhile, the second anode lead 20 and the second cathode lead 21 transmit electric energy to the second LED chip 19, the second LED chip 19 works to emit light, air blown out by a cooling fan installed on an external PCB or naturally ventilated air circulates through the ten cooling through holes 11, heat exchange is carried out between the inner wall of the cooling through hole 11, the transverse fins 12 and the longitudinal fins 13 inside the cooling through hole 11, the cooling effect is achieved, when the first LED chip 9 and the second LED chip 19 stop emitting light, people can see through the outer convex surface 16 and the inner convex surface 17 to observe whether the first LED chip 9 and the second LED chip 19 are blackish or not, if yes, the first LED chip is damaged, and if not, other associated electric appliance elements are damaged.
According to the invention, by arranging the first packaging outer cover 2, the second packaging outer cover 18 and the first LED chip 9 to be matched with the second LED chip 19, during use, an external PCB supplies power to the anode patch 7 and the cathode patch 8 through the anode bonding pad 3 and the cathode bonding pad 4, so that the first anode lead 14 and the first cathode lead 15 transmit electric energy to the first LED chip 9, the first LED chip 9 emits bright light when working, meanwhile, the second anode lead 20 and the second cathode lead 21 transmit electric energy to the second LED chip 19, the second LED chip 19 emits bright light when working, and the two LED chips share one anode patch 7 and one cathode patch 8, so that the mirror image luminous efficacy can be formed when working, the LED can be normally used in a scene needing double-sided light emission, and the functionality and the application range are improved; by arranging the heat dissipation structure 10, air blown by a heat dissipation fan arranged on an external PCB or air naturally ventilated circulates through ten heat dissipation through holes 11, and heat exchange is carried out between the interior of each heat dissipation through hole 11 and the inner wall of each heat dissipation through hole 11 as well as between the transverse fins 12 and the longitudinal fins 13, so that the heat dissipation effect of the LED is achieved, the heat dissipation effect of the LED is effectively improved, the phenomenon that the LED is damaged due to poor heat dissipation is avoided, and the service life of the LED is prolonged; by arranging the outer convex surface 16 to be matched with the inner convex surface 17, when the first LED chip 9 and the second LED chip 19 stop emitting bright light, people can observe whether the first LED chip 9 and the second LED chip 19 are blackish or not through the outer convex surface 16 and the inner convex surface 17, if so, the first LED chip 9 and the second LED chip 19 are damaged, and if not, other associated electrical components are damaged, so that people can conveniently observe the states of the first LED chip 9 and the second LED chip 19, the damaged devices can be conveniently checked when the LED luminous tubes cannot emit bright light, and convenience in later maintenance is facilitated; through setting up first breach 5 cooperation second breach 6, in the welded time, the welding liquid flows into the inside of each first breach 5 and second breach 6 for the face of weld obtains increasing, the effectual contact nature that has improved the face of weld and the stability after the welding.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (8)

1. The utility model provides a LED luminotron with mirror image light emitting structure which characterized in that: the LED packaging structure comprises a base (1), wherein a first packaging outer cover (2) is fixedly arranged on the upper portion of the base (1), an anode pad (3) is embedded into one side of the base (1), a cathode pad (4) is embedded into the other side of the base (1), an anode patch (7) is fixedly connected with the outside of the anode pad (3), a cathode patch (8) is fixedly connected with the outside of the cathode pad (4), a first LED chip (9) is fixedly arranged at the center of the upper portion of the base (1), a heat dissipation structure (10) is arranged on the front portion of the base (1), a first anode lead (14) is arranged between the first LED chip (9) and the anode patch (7), a first cathode lead (15) is arranged between the first LED chip (9) and the cathode patch (8), and a second packaging outer cover (18) is fixedly arranged on the bottom of the base (1), the bottom center position of base (1) is located the inboard fixed mounting of second encapsulation dustcoat (18) and is had second LED chip (19), be equipped with second anodal lead (20) between second LED chip (19) and anodal paster (7), be equipped with second negative pole lead (21) between second LED chip (19) and negative pole paster (8).
2. The LED luminous tube with the mirror image luminous structure as claimed in claim 1, wherein: the heat dissipation structure (10) comprises heat dissipation through holes (11), transverse fins (12) and longitudinal fins (13), wherein the heat dissipation through holes (11) are formed in the front surface of the base (1), the transverse fins (12) are horizontally arranged in the center of the interior of the heat dissipation through holes (11), and the longitudinal fins (13) are vertically arranged in the center of the heat dissipation through holes (11).
3. The LED luminous tube with the mirror image luminous structure as claimed in claim 2, wherein: the number of the heat dissipation through holes (11) is ten, and the transverse fins (12) and the longitudinal fins (13) are arranged in a cross manner.
4. The LED luminous tube with the mirror image luminous structure as claimed in claim 1, wherein: the shapes of the first notches (5) and the second notches (6) are both trapezoidal, and the number of the first notches (5) and the number of the second notches (6) are four.
5. The LED luminous tube with the mirror image luminous structure as claimed in claim 1, wherein: the first packaging outer cover (2) and the second packaging outer cover (18) are arranged in a mirror image mode through the base (1), and the first packaging outer cover (2) and the second packaging outer cover (18) are both trapezoidal in shape.
6. The LED luminous tube with the mirror image luminous structure as claimed in claim 1, wherein: the top surface of first encapsulation dustcoat (2) is equipped with outer convex surface (16), the top bottom surface of first encapsulation dustcoat (2) is equipped with interior convex surface (17).
7. The LED luminous tube with the mirror image luminous structure as claimed in claim 1, wherein: the upper portion of base (1) is located the place ahead of first encapsulation dustcoat (2) and is equipped with the triangle index, and the pointed end of triangle index points to negative pole pad (4).
8. An LED tube with a mirror image light-emitting structure according to any one of claims 1-7, characterized in that: the LED luminous tube with the mirror image luminous structure comprises the following steps when in use:
the method comprises the following steps: the method comprises the steps that a base (1) is placed at the position of a reserved mounting point of an external PCB, the directions of a positive bonding pad (3) and a negative bonding pad (4) are determined according to a triangular pointer on the upper portion of the base (1), and the pointed direction of the triangular pointer is the direction of the negative bonding pad (4);
step two: after the placement, an external welding machine is used for welding the positive electrode bonding pad (3) and the negative electrode bonding pad (4) with an external PCB, and the PCB can be put into use after the welding is finished;
step three: during welding, the welding liquid flows into the first notch (5) and the second notch (6) so that the welding surface is increased;
step four: during use, the external PCB supplies power to the positive patch (7) and the negative patch (8) through the positive pad (3) and the negative pad (4), so that the first positive lead (14) and the first negative lead (15) transmit power to the first LED chip (9), the first LED chip (9) works to emit bright light, meanwhile, the second positive lead (20) and the second negative lead (21) transmit power to the second LED chip (19), and the second LED chip (19) works to emit bright light;
step five: air blown out by a cooling fan arranged on an external PCB or naturally ventilated air circulates through ten cooling through holes (11), and heat exchange is carried out between the interior of each cooling through hole (11) and the inner wall of each cooling through hole (11) as well as between the transverse fins (12) and the longitudinal fins (13) so as to achieve the cooling effect;
step six: when the first LED chip (9) and the second LED chip (19) stop emitting bright light, people can observe whether the first LED chip (9) and the second LED chip (19) are blackish or not through the outer convex surface (16) and the inner convex surface (17), if so, the first LED chip is damaged, and if not, other related electrical components are damaged.
CN202110472658.2A 2021-04-29 2021-04-29 LED luminous tube with mirror image luminous structure Pending CN113217828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110472658.2A CN113217828A (en) 2021-04-29 2021-04-29 LED luminous tube with mirror image luminous structure

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Application Number Priority Date Filing Date Title
CN202110472658.2A CN113217828A (en) 2021-04-29 2021-04-29 LED luminous tube with mirror image luminous structure

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CN113217828A true CN113217828A (en) 2021-08-06

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CN208331816U (en) * 2018-06-04 2019-01-04 深圳市胜天光电技术有限公司 A kind of LED patch indicator light
CN209505441U (en) * 2018-12-26 2019-10-18 天津市庆浦散热器科技有限公司 A kind of anti-deformation automobile radiators

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CN106891102A (en) * 2015-12-17 2017-06-27 青岛海尔洗碗机有限公司 A kind of welding procedure and welding structure
CN208331816U (en) * 2018-06-04 2019-01-04 深圳市胜天光电技术有限公司 A kind of LED patch indicator light
CN209505441U (en) * 2018-12-26 2019-10-18 天津市庆浦散热器科技有限公司 A kind of anti-deformation automobile radiators

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Application publication date: 20210806