CN113174580B - 一种基于湿度的薄膜褶皱形貌调控方法 - Google Patents
一种基于湿度的薄膜褶皱形貌调控方法 Download PDFInfo
- Publication number
- CN113174580B CN113174580B CN202110406947.2A CN202110406947A CN113174580B CN 113174580 B CN113174580 B CN 113174580B CN 202110406947 A CN202110406947 A CN 202110406947A CN 113174580 B CN113174580 B CN 113174580B
- Authority
- CN
- China
- Prior art keywords
- film
- substrate
- wrinkle
- humidity
- appearance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0623—Sulfides, selenides or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/305—Sulfides, selenides, or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
本发明公开了属于薄膜材料技术领域的一种基于湿度的薄膜褶皱形貌调控方法。所述方法具体步骤为:高温下在基底表面制备薄膜材料,冷却到室温得到基底‑薄膜材料;然后将基底‑薄膜材料置于湿度氛围中,薄膜开始形成褶皱形貌,保持后取出;得到具有褶皱形貌的薄膜材料。所述湿度氛围为40%~90%相对湿度,所述褶皱形貌包括六边形网络状褶皱形貌、平行电话线褶皱阵列形貌和分叉电话线褶皱网络形貌。本发明薄膜褶皱的形貌能通过调节基底种类、薄膜厚度和环境湿度进行调控;适用于更广泛的材料体系,且操作简便、可控性好;制备方法简单、环保,不需要使用有毒的有机溶剂;对于薄膜材料的基础研究和器件研发具有重要意义。
Description
技术领域
本发明属于薄膜材料技术领域,尤其涉及一种基于湿度的薄膜褶皱形貌调控方法。
背景技术
形成褶皱是薄膜材料释放自身应力的一种有效手段,这些褶皱可以形成具有一定空间分布规律的微纳结构,如人字形、棋盘形、迷宫形和网络状褶皱,可以用于构筑压力传感器、光栅结构和柔性器件等;此外,褶皱结构内部周期变化的应力场也会调控材料的电学、光学、磁学等多种性质,为基础研究和开发功能化器件提供了新的思路。但是目前常用的褶皱制备方法,如预应变法、溶胀法和液相收缩法等,主要是基于聚合物薄膜或聚合物基底,并不适用于需要经高温制备的薄膜材料体系。因此需要更为通用的方法制备并调控褶皱形貌,以推动基础研究和功能化器件开发。
发明内容
为了解决上述问题,本发明提出了一种基于湿度的薄膜褶皱形貌调控方法,具体步骤如下:
1)在300~1100℃下,在基底表面制备10~500nm厚的薄膜材料,冷却到室温得到基底-薄膜材料,薄膜和基底的热膨胀失配导致薄膜中具有残余压应力,但由于薄膜和基底结合力较强,此时薄膜保持平坦状态;
2)将步骤1)得到的基底-薄膜材料置于湿度氛围中,薄膜开始形成褶皱形貌,保持后取出;得到具有褶皱形貌的薄膜材料;所述湿度氛围为40%~90%相对湿度;所述形貌包括六边形网络状褶皱形貌、平行电话线褶皱阵列形貌或分叉电话线褶皱网络形貌。
当湿度氛围为40%~90%相对湿度,得到的褶皱形貌包括六边形网络状褶皱形貌、平行电话线褶皱阵列形貌和分叉电话线褶皱网络形貌;
当湿度氛围为40%~90%相对湿度,基底为蓝宝石,薄膜厚度为50~500nm,得到的褶皱形貌为六边形网络状褶皱形貌;
当湿度氛围为40%~90%相对湿度,基底为x切向的石英,薄膜厚度为50~150nm,得到的褶皱形貌包括平行电话线褶皱阵列形貌和分叉电话线褶皱网络形貌;
当湿度氛围为40%~60%相对湿度,基底为x切向的石英,薄膜厚度为50~150nm,得到的褶皱形貌为平行电话线阵列形貌;
当湿度氛围为60%~90%相对湿度,基底为x切向的石英,薄膜厚度为50~150nm,得到的褶皱形貌为分叉电话线褶皱网络形貌。
所述基底为亲水性基底或经处理后具有亲水性的基底,
所述处理过程采用食人鱼溶液(piranha溶液),处理进行表面亲水处理;其中食人鱼溶液中,浓硫酸和双氧水的体积比3:1;
所述基底具体包括蓝宝石、石英、云母、玻璃、硅片或含氧化层的硅片。
所述基底表面制备薄膜的方法包括聚合物辅助沉积法、化学气相沉积法、溅射法或蒸镀法。
所述薄膜材料包括金属、金属氧化物、金属硫属元素化合物、金属碳化物、金属氮化物或金属碳氮化物。
在所述步骤2)中保持时间为1分钟~1小时。
所述步骤1),基底在制备薄膜之前需要经过清洗,具体步骤为,依次用丙酮、异丙醇、去离子水清洗。
一种基于湿度的MoS2薄膜褶皱形貌调控方法,具体包含以下步骤:
1)依次用丙酮、异丙醇、去离子水清洗蓝宝石基底,并用浓硫酸和双氧水体积比3:1混合后的piranha溶液进行表面亲水处理;
2)在步骤1)获得的基底表面,旋涂聚合物辅助沉积法所需的含Mo元素的前驱体溶液,得到基底-前驱体薄膜;
3)在管式炉内加热到850℃硫化步骤2)得到的基底-前驱体薄膜,得到基底-MoS2薄膜;
4)将基底-MoS2薄膜置于相对湿度50%~80%的环境中,使MoS2薄膜与基底脱层,形成褶皱。
本发明的有益效果在于:
1.本发明与现有技术相比,适用于更广泛的材料体系,且操作简便、可控性好;制备方法简单、环保,不需要使用有毒的有机溶剂;对于薄膜材料的基础研究和器件研发具有重要意义。
2.薄膜褶皱的形貌能通过调节基底种类、薄膜厚度和环境湿度进行调控。
附图说明
图1为蓝宝石基底上~300nm厚的MoS2薄膜在80%相对湿度下得到的相邻节点之间距离为30μm的六边形网络状褶皱的光学照片。
图2为石英基底上~100nm厚的MoS2薄膜在50%相对湿度下得到的波长为10μm的平行电话线褶皱阵列的光学照片。
图3为石英基底上~100nm厚的MoS2薄膜在80%相对湿度下得到的波长为20μm的分叉电话线褶皱网络的光学照片。
图4为对比例1中在石英基底上~100nm厚的MoS2薄膜在干燥环境下保持平坦状态的光学照片。
具体实施方式
以下结合附图和具体实施例对本发明作进一步的详细说明:
实施例1
本实施例提供了一种在薄膜中获得网络状褶皱的方法,包括如下步骤:
将1g乙二胺四乙酸(EDTA)和2g钼酸铵加入20mL去离子水中,再加入2g聚乙烯亚胺(PEI,MW=10000),搅拌至溶液澄清后用截留量为10000的超滤离心管离心数次,得到含Mo的前驱体溶液。
依次用丙酮、异丙醇、去离子水清洗蓝宝石基底,并用piranha溶液(浓硫酸、双氧水体积比3:1混合)处理进行表面亲水处理;
1)在亲水处理后获得的基底表面,旋涂聚合物辅助沉积法所需的含Mo元素的前驱体溶液,得到基底-前驱体薄膜;
在管式炉内加热到850℃硫化基底-前驱体薄膜,得到基底-MoS2薄膜,其中MoS2薄膜厚度~300nm;
2)将基底-MoS2薄膜置于相对湿度50%~80%的环境中,使MoS2薄膜与基底脱层,形成如图1所示的相邻节点之间距离为30μm的六边形网络状褶皱形貌。
实施例2
本实施例提供了一种在薄膜中获得平行电话线褶皱阵列的方法,包括如下步骤:
将0.5g乙二胺四乙酸(EDTA)和1g钼酸铵加入20mL去离子水中,再加入1g聚乙烯亚胺(PEI,MW=10000),搅拌至溶液澄清后用截留量为10000的超滤离心管离心数次,得到含Mo的前驱体溶液。
依次用丙酮、异丙醇、去离子水清洗x切向的石英基底,并用piranha溶液(浓硫酸、双氧水体积比3:1混合)处理进行表面亲水处理;
1)在亲水处理获得的基底表面,旋涂聚合物辅助沉积法所需的含Mo元素的前驱体溶液,得到基底-前驱体薄膜;
在管式炉内加热到850℃硫化基底-前驱体薄膜,得到基底-MoS2薄膜,其中MoS2薄膜厚度~100nm;
2)将基底-MoS2薄膜置于相对湿度40%~50%的环境中,使MoS2薄膜与基底脱层,形成如图2所示的波长为10μm的平行电话线褶皱阵列形貌。
实施例3
本实施例提供了一种在薄膜中获得分叉电话线褶皱网络的方法,包括如下步骤:
将0.5g乙二胺四乙酸(EDTA)和1g钼酸铵加入20mL去离子水中,再加入1g聚乙烯亚胺(PEI,MW=10000),搅拌至溶液澄清后用截留量为10000的超滤离心管离心数次,得到含Mo的前驱体溶液。
依次用丙酮、异丙醇、去离子水清洗x切向的石英基底,并用piranha溶液(浓硫酸、双氧水体积比3:1混合)处理进行表面亲水处理;
1)在亲水处理获得的基底表面,旋涂聚合物辅助沉积法所需的含Mo元素的前驱体溶液,得到基底-前驱体薄膜;
在管式炉内加热到850℃硫化得到的基底-前驱体薄膜,得到基底-MoS2薄膜,其中MoS2薄膜厚度~100nm;
2)将基底-MoS2薄膜置于相对湿度80%~90%的环境中,使MoS2薄膜与基底脱层,形成如图3所示的波长为20μm的分叉电话线褶皱网络形貌。
对比例1
本对比例用于说明薄膜在未接触湿度前的形貌,包括如下步骤:
将0.5g乙二胺四乙酸(EDTA)和1g钼酸铵加入20mL去离子水中,再加入1g聚乙烯亚胺(PEI,MW=10000),搅拌至溶液澄清后用截留量为10000的超滤离心管离心数次,得到含Mo的前驱体溶液。
依次用丙酮、异丙醇、去离子水清洗x切向的石英基底,并用piranha溶液(浓硫酸、双氧水体积比3:1混合)处理进行表面亲水处理;
1)在亲水处理获得的基底表面,旋涂聚合物辅助沉积法所需的含Mo元素的前驱体溶液,得到基底-前驱体薄膜;
在管式炉内加热到850℃硫化得到的基底-前驱体薄膜,得到基底-MoS2薄膜,仍保持如图4所示的平坦无褶皱形貌,其中MoS2薄膜厚度~100nm。
Claims (6)
1.一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,具体步骤如下:
1)在基底表面利用聚合物辅助沉积法处理含Mo元素的前驱体溶液,在300~1100 ℃下,制备10~500 nm厚的MoS2薄膜材料,冷却到室温得到基底-薄膜材料,薄膜和基底的热膨胀失配导致薄膜中具有残余压应力,但由于薄膜和基底结合力较强,此时薄膜保持平坦状态;
所述基底为蓝宝石或石英;使用前用体积比3:1的浓硫酸和双氧水混合后的食人鱼溶液进行表面亲水处理;
2)将步骤1)得到的基底-薄膜材料置于湿度氛围中,薄膜开始形成褶皱形貌,保持后取出;得到具有褶皱形貌的薄膜材料;
所述湿度氛围为40 %~ 90 %相对湿度;所述褶皱形貌包括六边形网络状褶皱形貌、平行电话线褶皱阵列形貌和分叉电话线褶皱网络形貌。
2.根据权利要求1所述一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,所述湿度氛围为40 %~ 90 %相对湿度,基底为蓝宝石,薄膜厚度为50 ~ 500 nm,得到的褶皱形貌为六边形网络状褶皱形貌。
3.根据权利要求1所述一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,所述湿度氛围为40 %~90 %相对湿度,基底为x切向的石英,薄膜厚度为50 ~ 150 nm,得到的褶皱形貌包括平行电话线褶皱阵列形貌或分叉电话线褶皱网络形貌。
4.根据权利要求3所述一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,所述湿度氛围为40 %~60 %相对湿度,基底为x切向的石英,薄膜厚度为50 ~ 150 nm,得到的褶皱形貌为平行电话线阵列形貌。
5.根据权利要求3所述一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,所述湿度氛围为60 %~90 %相对湿度,基底为x切向的石英,薄膜厚度为50 ~ 150 nm,得到的褶皱形貌为分叉电话线褶皱网络形貌。
6.根据权利要求1所述一种基于湿度的薄膜褶皱形貌调控方法,其特征在于,在所述步骤2)中保持时间为1分钟~1小时。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110406947.2A CN113174580B (zh) | 2021-04-15 | 2021-04-15 | 一种基于湿度的薄膜褶皱形貌调控方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110406947.2A CN113174580B (zh) | 2021-04-15 | 2021-04-15 | 一种基于湿度的薄膜褶皱形貌调控方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113174580A CN113174580A (zh) | 2021-07-27 |
CN113174580B true CN113174580B (zh) | 2022-09-09 |
Family
ID=76925053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110406947.2A Active CN113174580B (zh) | 2021-04-15 | 2021-04-15 | 一种基于湿度的薄膜褶皱形貌调控方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113174580B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115231530B (zh) * | 2022-06-09 | 2023-10-10 | 四川大学 | 一种室温铁磁性MoSe2薄膜材料及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000026632A (ja) * | 1998-07-13 | 2000-01-25 | Sekisui Chem Co Ltd | 常圧プラズマを用いたフィルム基材への薄膜形成方法 |
KR101299133B1 (ko) * | 2011-12-05 | 2013-08-22 | 한국과학기술연구원 | 나노 구조물을 갖는 압력 센서 및 그 제조 방법 |
CN106756777B (zh) * | 2016-11-28 | 2019-07-16 | 山东大学 | 一种通过应变调控褶皱表面亲疏水性可逆转变的方法及应用 |
CN106883438B (zh) * | 2017-02-24 | 2020-05-19 | 天津大学 | 一种光响应型的表面皱纹微结构的可控制备方法 |
US20190003064A1 (en) * | 2017-06-29 | 2019-01-03 | National Technology & Engineering Solutions Of Sandia, Llc | Crumpled Transition Metal Dichalcogenide Sheets |
US10640622B2 (en) * | 2018-01-03 | 2020-05-05 | Eastman Kodak Company | Method for providing textured, porous polymeric films |
CN108424543B (zh) * | 2018-03-15 | 2020-08-11 | 山东大学 | 可调控透光率的力响应型表面褶皱的制备方法 |
CN110155961B (zh) * | 2018-06-25 | 2020-11-10 | 中国科学院物理研究所 | 一种制备层状材料褶皱的方法 |
KR102176525B1 (ko) * | 2018-11-07 | 2020-11-10 | 한국과학기술원 | 희생층을 이용한 계층적 주름 구조체의 제조방법 및 이로부터 제조된 계층적 주름 구조체 |
CN110527127A (zh) * | 2019-08-29 | 2019-12-03 | 天津大学 | 一种通过激光移动调控光响应膜基体系皱纹形貌的方法 |
-
2021
- 2021-04-15 CN CN202110406947.2A patent/CN113174580B/zh active Active
Non-Patent Citations (2)
Title |
---|
Watching Dynamic Self-Assembly of Web Buckles in Strained MoS2 Thin Films;Hongtao Ren 等;《ACS Nano》;20190218;第13卷;3106-3116 * |
化学气相沉积制备二硫化钼及三氧化钼纳米片;王轩;《中国优秀博硕士学位论文全文数据库(硕士)工程科技Ⅰ辑》;20170215(第2期);正文第15-22页 * |
Also Published As
Publication number | Publication date |
---|---|
CN113174580A (zh) | 2021-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100524782C (zh) | 一种具有金属硅化物纳米结构的材料及其制作方法 | |
CN108517555B (zh) | 基于范德华外延获得大面积高质量柔性自支撑单晶氧化物薄膜的方法 | |
CN109052377B (zh) | 一种大面积石墨烯的制备方法 | |
CN110854013B (zh) | 一种大面积连续超薄二维Ga2O3非晶薄膜的制备方法与应用 | |
CN113174580B (zh) | 一种基于湿度的薄膜褶皱形貌调控方法 | |
CN101148254A (zh) | 控制转移单壁碳纳米管阵列结构的方法 | |
CN109279597B (zh) | 一种透明石墨烯薄膜的制备方法 | |
TW201637870A (zh) | 石墨烯及用於將cvd生長石墨烯轉移至疏水性基材之無聚 合物方法 | |
CN101499406A (zh) | 一种在绝缘衬底上制作硅化物纳米结构的方法 | |
US10889914B2 (en) | Location-specific growth and transfer of single crystalline TMD monolayer arrays | |
CN110777366B (zh) | 一种纳米晶氧化硅薄膜及其制备的类光刻胶氧化硅材料 | |
KR102024463B1 (ko) | 전이금속칼코겐 화합물의 대면적 전사 방법 | |
CN112820831A (zh) | 一种基于溶剂汽相退火工艺调控阈值电压制备的低压有机薄膜晶体管及其方法 | |
CN111916524A (zh) | 一种仿视网膜成像的硫化钼光探测器及其制备方法 | |
CN111430221A (zh) | 锡自催化生长的锗锡合金硅基材料及定向异质外延方法 | |
CN104651777A (zh) | 二维硫族晶体的印刷式定点生长方法 | |
CN115449776A (zh) | 一种二维氮化镓材料及其制备方法 | |
WO2011068884A2 (en) | A system for producing patterned silicon carbide structures | |
CN108640091A (zh) | 一种化学气相沉积法制备二硒化钽纳米片的方法 | |
CN115768230A (zh) | 一种异质结、其制备方法及应用 | |
CN111689519A (zh) | 一种采用前驱体热分解制备二维过渡金属硫族化合物的方法 | |
CN115676773B (zh) | 一种利用热探针对二维过渡金属硫属化物/丝素蛋白柔性衬底进行微纳结构加工的方法 | |
CN114920239B (zh) | 一种基于水蒸气的二维材料转移或堆垛方法 | |
CN114195142B (zh) | 一种基于醇类溶剂剥离聚合物支撑材料的石墨烯转移方法 | |
CN118522632A (zh) | 一种晶圆级碳薄膜的可控制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |