CN113169157B - 存储器通道长度减小的双面安装式大mcm封装件 - Google Patents

存储器通道长度减小的双面安装式大mcm封装件 Download PDF

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Publication number
CN113169157B
CN113169157B CN201980079413.4A CN201980079413A CN113169157B CN 113169157 B CN113169157 B CN 113169157B CN 201980079413 A CN201980079413 A CN 201980079413A CN 113169157 B CN113169157 B CN 113169157B
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substrate
wiring
module substrate
bottom side
module
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CN113169157A (zh
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仲崇华
翟军
胡坤忠
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Apple Inc
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Apple Inc
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Abstract

描述了双面安装式封装件结构和包括此类双面安装式封装件结构的存储器模块，其中存储器封装件安装在模块基板的两侧面上。布线基板被安装到模块基板的底侧以提供通用输入/输出布线和电源布线，而从逻辑管芯到双面安装式存储器封装件的信号布线被提供在模块布线中。在一个实施方案中，模块基板是无芯模块基板，并且可以比布线基板薄。

Description

存储器通道长度减小的双面安装式大MCM封装件
技术领域
本文所描述的实施方案涉及多芯片模块封装，并且更具体地涉及存储器封装。
背景技术
对便携式和移动电子设备诸如移动电话、个人数字助理(PDA)、数字相机、便携式播放器、游戏设备和其他移动设备的当前市场需求要求将更多性能和特征集成到越来越小的空间中。然而，操作这些设备所需的存储器的量显著增加。
长期以来，低功率双倍数据速率(LPDDR)标准已在各种市场(包括移动电子器件)中被采用以满足性能和容量要求。LPDDR平台和下一代(LPDDR-x)平台通常包括围绕逻辑管芯(诸如，片上系统(SOC))的存储器芯片或封装件的布置，该逻辑管芯可包括中央处理单元(CPU)和/或图形处理单元(GPU)。为了满足对增加带宽的需求，已提出各种3D解决方案，包括堆叠式动态随机存取存储器(DRAM)管芯，诸如高带宽存储器(HBM)和混合存储器立方体(HMC)。
发明内容
描述了双面安装式封装件结构和包含此类双面安装式封装件结构的存储器模块。
在一个实施方案中，双面安装式封装件结构包括：模块基板，安装在该模块基板的顶侧上的第一逻辑管芯，安装在该模块基板的顶侧上的第一多个存储器封装件，安装在该模块基板的底侧上的第二多个存储器封装件，以及布线基板，该布线基板安装到该模块基板的底侧并位于该第一逻辑管芯的正下方。多个接触件位于该布线基板的底侧上。穿过布线基板和模块基板提供通用输入/输出布线和电源布线，以连接该第一逻辑管芯和该布线基板的底侧上的多个接触件。在模块基板内提供信号布线以将第一逻辑管芯与第一多个存储器封装件和第二多个存储器封装件两者连接。
在一个实施方案中，双面安装式封装件结构包括无芯模块基板、安装在该无芯模块基板的顶侧上的第一逻辑管芯、安装在该无芯模块基板的顶侧上的第一多个存储器封装件，安装在该无芯模块基板的底侧上的第二多个存储器封装件，以及层压布线基板，该层压布线基板安装到该无芯模块基板的底侧并位于该第一逻辑管芯的正下方。多个接触件位于该层压布线基板的底侧上。穿过层压布线基板和无芯模块基板提供第一布线，以连接该第一逻辑管芯和层压布线基板的底侧上的多个接触件。在无芯模块基板内提供第二布线以将第一逻辑管芯与第一多个存储器封装件和第二多个存储器封装件两者连接。
附图说明
图1是根据实施方案的沿图2的线A-A截取的包括双面安装式封装件结构的存储器模块的截面侧视图图示。
图2是根据实施方案的双面安装式封装件结构的示意性顶视图图示。
图3是根据实施方案的布线基板内的开口的示意性顶视图图示。
图4是根据实施方案的沿图2的线A-A截取的包括双面安装式封装件结构的存储器模块的截面侧视图图示。
图5是根据实施方案的包括多行存储器封装件的双面安装式封装件结构的示意性顶视图图示。
具体实施方式
实施方案描述了双面安装式封装件结构和结合了此类双面安装式封装件结构的存储器模块，其中存储器封装件被安装在模块基板的两侧面上以减小总体封装件尺寸和存储器通道长度。
在一个方面，已观察到，随着存储器要求增加，存储器封装件对总体多芯片模块(MCM)封装件尺寸具有显著影响。较大的MCM封装件可导致存储器通道长度增加以及性能劣化。此外，由于层计数和先进的设计规则，基板产量和循环时间可能是大MCM倒装芯片球栅阵列(FCBGA)封装件的挑战。
根据实施方案，模块基板被竖直地集成以减小存储器通道长度、减小总体MCM封装件尺寸并减小MCM封装件高度。此外，堆叠式集成方案可降低模块基板设计复杂性、缩短基板循环时间并提高基板产量。这可以通过分离模块基板内的高密度、复杂的细间距信号布线以及该堆叠式布线基板内的不太关键的粗间距板布线来实现。例如，与更传统的MCM有芯基板相比，该模块基板可为无芯或薄芯基板，更传统的MCM有芯基板可具有二十个以上的层以适应所有所需的通用输入/输出布线、电源布线和信号布线。根据实施方案的分离基板设计可另外允许MCM封装件高度减小。
在各种实施方案中，参照附图来进行描述。然而，某些实施方案可在不存在这些具体细节中的一个或多个具体细节或者不与其他已知的方法和构型相结合的情况下被实施。在以下的描述中，示出许多具体细节诸如特定构型、尺寸和工艺等，以提供对实施方案的透彻理解。在其他情况下，未对熟知的半导体工艺和制造技术进行特别详细地描述，以免不必要地模糊实施方案。整个说明书中所提到的“一个实施方案”是指结合实施方案所描述的特定特征、结构、构型或特性被包括在至少一个实施方案中。因此，整个说明书中多处出现短语“在一个实施方案中”不一定是指相同的实施方案。此外，特定特征、结构、构型或特性可以任何适当的方式组合在一个或多个实施方案中。
本文所使用的术语“顶”、“底”、“在...之下”、“至”、“在...之间”和“在...上”可指一层相对于其他层的相对位置。一层在另一层“顶部”、“之下”或“上”或者键合“至”另一层或者与另一层“接触”可为直接与其他层接触或可具有一个或多个居间层。一层在多层“之间”可为直接与该多层接触或可具有一个或多个居间层。
现在参见图1至图2，图1提供了根据实施方案的沿图2的线A-A截取的包括双面安装式封装件结构100的存储器模块的截面侧视图图示。图2是根据实施方案的双面安装式封装件结构100的示意性顶视图图示。如图所示，存储器模块可包括电路板200和安装在电路板200上的双面安装式封装件结构100。这可通过使用倒装芯片结合技术和焊料凸块(solder bump)134来实现。
根据实施方案的双面安装式封装件结构100可包括模块基板102，以及安装在模块基板102的顶侧103上的第一逻辑管芯110。虽然示出了单个逻辑管芯110，但可存在多个逻辑管芯110。例如，多个逻辑管芯110可占据由图2中的第一逻辑管芯110所示的相同周边。第一多个存储器封装件120安装在模块基板102的顶侧103上。如图2所示，第一多个存储器封装件120可任选地包括安装在一个或多个逻辑管芯110的相反侧面上的第一组121A和第二组121B。第二多个存储器封装件120同样安装在模块基板102的底侧105上。第二多个存储器封装件120可安装在第一多个存储器封装件120的正下方，并且同样可布置成第一组和第二组。
所示的示例性存储器封装件120包括堆叠在基板129上、与焊线126连接并且包封在模塑材料128中的多个存储器管芯124。应当理解，这是示例性实施方式，并且实施方案不限于该特定存储器封装件配置。根据实施方案，存储器封装件120可以是包括一个或多个DRAM管芯的DRAM封装件。此外，双面安装式封装件结构100可利用包括LPDDR、LPDDR-x、HBM、HMC等的各种存储器技术来实现。
再次参见图1，布线基板130被安装到模块基板102的底侧105并且位于第一逻辑管芯110(或多个逻辑管芯110)的正下方。多个接触件135存在于布线基板130的底侧133上。焊料凸块134可放置在接触件135上以用于连接到电路板200。
穿过布线基板和无芯模块基板提供第一布线，以连接该第一逻辑管芯和布线基板的底侧上的多个接触件。在一个实施方案中，通用输入/输出布线和电源布线106A延伸穿过布线基板。另外，通用输入/输出布线和电源布线106B延伸穿过模块基板102。通用输入/输出布线和电源布线106A/B一起连接一个或多个逻辑管芯110和布线基板130的底侧133上的多个接触件135。
在模块基板内提供第二布线以将第一逻辑管芯与第一多个存储器封装件和第二多个存储器封装件两者连接。在一个实施方案中，信号布线104位于模块基板102内，以将逻辑管芯110与模块基板102的相反侧上的第一多个存储器封装件120和第二多个存储器封装件120两者连接。到每个存储器封装件120的信号布线104的长度可例如对应于存储器通道长度。因此，可通过将存储器封装件120安装在模块基板102的相反侧上来减小存储器通道长度，而不是将存储器封装件以多个行或更长的行安装在基板的相同侧上。此外，可通过减小模块基板102的厚度来减小信号布线104的长度。在一些实施方案中，模块基板102是无芯模块基板。这可避免需要形成穿过基板芯的通孔。相反，细线路图案化技术可用于模块基板102内的所有布线线路。
根据实施方案的布线基板130可以比模块基板102厚。在一些实施方案中，布线基板130可以是层压布线基板，并且可以是有芯层压布线基板。这可以允许降低成本，从而对布线基板130利用不太昂贵的处理，该布线基板可以另外包括比模块基板102更粗的间距和更宽的线路宽。这可以实现，因为在模块基板102中包含位于逻辑管芯110与存储器封装件120之间的信号布线104。因此，模块基板102内的信号布线104的特征在于具有比穿过布线基板130的通用输入/输出布线和电源布线106A更细的间距和更窄的线路宽。较厚的布线基板130可另外提供用于安装在电路板200上以及用于放置分立的集成无源器件(IPD)140(诸如电容器阵列)的间隙，这可提供多种功能，包括到逻辑管芯110的通用输入/输出布线和电源布线的电压调节。一个或多个分立IPD 140可安装在诸如以下的位置：布线基板130的底侧133与多个焊料凸块134侧向相邻，以及模块基板102的底侧105。分立的IPD 140也可位于布线基板130内。
根据实施方案的双面安装式封装件结构100可由于薄模块基板102而包括用于机械平衡的各种支撑结构。例如，模块基板102可能缺乏原本由厚芯提供的一些机械稳健性。可使用布线基板130、加强环160和任选的基板条状物150中的任一者或它们的组合来实现机械平衡。在图1至图2所示的实施方案中，顶侧加强环160安装到模块基板102的顶侧103。顶侧加强环160可侧向地围绕第一多个存储器封装件120和逻辑管芯110。
在图1所示的实施方案中，一个或多个基板条状物150安装到模块基板102的底侧105。一个或多个基板条状物150可侧向地围绕第二多个存储器封装件120和布线基板130。在实施方案中，基板条状物150由与布线基板130相同的基板材料形成，但这不是必需的。基底条状物150可任选地位于顶侧加强环160的正下方。在实施方案中，基板条状物150可包含附加的电布线。因此，类似于布线基板130，可使用焊料凸块132将基板条状物150任选地安装在接触件155上以用于电布线。焊料凸块132可以是小于焊料凸块134的微凸块。
根据实施方案的双面安装式封装件结构可包括使用焊料凸块112安装在模块基板102的顶侧103上的一个或多个逻辑管芯110。如图所示，焊料凸块112可被施加到接触件114。安装的逻辑管芯110可用底填料材料118来固定。如图所示，逻辑管芯110与通用输入/输出布线和电源布线106B以及信号布线104电连接。第一和第二多个存储器封装件120还可使用焊料凸块122来安装在模块基板的顶侧和底侧上，并且布线基板可使用焊料凸块132来安装到模块基板102的底侧105。类似地，可使用焊料凸块132来安装基板条状物150。根据实施方案的焊料凸块112、122、132可全部为微凸块并且具有比焊料凸块134更小的体积/面积以用于安装到电路板200。此外，分立IPD 140也可使用焊料凸块142来安装，该焊料凸块142可为体积/面积比焊料凸块112、122、132小的微凸块。
在诸如图2所示的实施方案中，一个或多个逻辑管芯110安装在双面安装式封装件结构100的中心或模块基板102中。例如，逻辑管芯110的侧向边缘111可沿着一个或多个x轴(由线X-X示出)或y轴(由线Y-Y示出)与双面安装式封装件结构100的对应边缘101(其可对应于模块基板102的边缘)等距。逻辑管芯110可另外关于x轴和/或y轴对称。在另一个实施方案中，一个或多个逻辑管芯110未安装在双面安装式封装件结构100的中心或模块基板102中。
现在参见图3，提供了根据实施方案的布线基板130内的开口131的示意性顶视图图示。开口131可完全延伸穿过布线基板130。在此类变型中，第二多个存储器封装件120安装在模块基板102的底侧105上，位于布线基板130中的一对开口131内，并且与布线基板130侧向相邻。这样，布线基板130可以提供薄模块基板102的附加机械平衡和支撑。因此，单一布线基板130可取消包括附加基板条状物150。
图4为附加的变型。在所提供的特定横截面侧视图图示中，底侧加强环170安装到模块基板102的底侧105。底侧加强环170侧向地围绕第二多个存储器封装件120和布线基板130。底侧加强环170可与顶侧加强环160相同。可使用包括粘合剂、焊料等的合适技术来附接顶侧加强环160和底侧加强环170。
直到现在，已经描述了各种结构配置，其中可通过将存储器封装件120安装在模块基板102的相反侧上来减小存储器通道长度，而不是将存储器封装件以多个行或更长的行安装在基板的相同侧上。然而，双面安装式MCM封装件结构另外与此类构型兼容，特别是对于较大的存储器扩展。图5是根据实施方案的包括多行存储器封装件的双面安装式封装件结构的示意性顶视图图示。实施方案不限于仅包括安装在一个或多个逻辑管芯110的相反侧面上的存储器封装件120的第一组121A和第二组121B的配置。如图所示，存储器封装件120可放置在逻辑管芯110的多于两个侧面上，并且可围绕一个或多个逻辑管芯110。此外，多行存储器封装件120可围绕逻辑管芯110的一个或多个侧面布置，并且多行存储器封装件120可完全围绕逻辑管芯110布置。在所示的实施方案中，存储器封装件120的外侧行或组可与存储器封装件120的内侧行或组偏移以允许布线。类似于图1和3所示的实施方案，多行存储器封装件120可安装到模块基板102的两侧。此外，如前所述，底侧存储器封装件可位于顶侧存储器封装件的正下方。
在利用实施方案的各个方面时，对本领域的技术人员将变得显而易见的是，对于形成双面安装式MCM封装件而言，以上实施方案的组合或变型是可能的。尽管以特定于结构特征和/或方法行为的语言对实施方案进行了描述，但应当理解，所附权利要求并不一定限于所描述的特定特征或行为。所公开的特定特征和行为相反应当被理解为用于进行例示的权利要求的实施方案。

Claims (20)

1.一种双面安装式封装件结构，包括：
模块基板；
第一逻辑管芯，所述第一逻辑管芯安装在所述模块基板的顶侧上；
第一多个存储器封装件，所述第一多个存储器封装件安装在所述模块基板的顶侧上；
第二多个存储器封装件，所述第二多个存储器封装件安装在所述模块基板的底侧上；
布线基板，所述布线基板安装到所述模块基板的底侧并且位于所述第一逻辑管芯的正下方；
多个接触件，所述多个接触件位于所述布线基板的底侧上；
通用输入/输出布线和电源布线，所述通用输入/输出布线和电源布线穿过所述布线基板和所述模块基板以连接所述第一逻辑管芯和所述布线基板的底侧上的所述多个接触件；和
所述模块基板内的信号布线，所述信号布线用于将所述第一逻辑管芯与所述第一多个存储器封装件和所述第二多个存储器封装件两者连接；
其中所述模块基板内的所述信号布线的特征在于比穿过所述布线基板的所述通用输入/输出布线和所述电源布线更细的间距和更窄的线路宽度。
2.根据权利要求1所述的双面安装式封装件结构，还包括安装到所述模块基板的顶侧的顶侧加强环，其中所述顶侧加强环侧向地围绕所述第一多个存储器封装件和所述第一逻辑管芯。
3.根据权利要求2所述的双面安装式封装件结构，还包括安装到所述模块基板的底侧的底侧加强环，其中所述底侧加强环侧向地围绕所述第二多个存储器封装件和所述布线基板。
4.根据权利要求2所述的双面安装式封装件结构，还包括安装到所述模块基板的底侧的一个或多个基板条状物，其中所述一个或多个基板条状物侧向地围绕所述第二多个存储器封装件和所述布线基板。
5.根据权利要求1所述的双面安装式封装件结构，还包括位于所述布线基板中的一对开口，其中所述第二多个存储器封装件被安装在所述模块基板的底侧上位于所述布线基板中的所述一对开口内。
6.根据权利要求5所述的双面安装式封装件结构，其中所述第二多个存储器封装件位于所述第一多个存储器封装件的正下方。
7.根据权利要求1所述的双面安装式封装件结构，还包括位于所述布线基板的底侧上的多个焊料凸块。
8.根据权利要求7所述的双面安装式封装件结构，其中：
利用焊料凸块将所述第一逻辑管芯安装在所述模块基板的顶侧上；
利用焊料凸块将所述第一多个存储器封装件安装在所述模块基板的顶侧上；
利用焊料凸块将所述第二多个存储器封装件安装在所述模块基板的底侧上；并且
利用焊料凸块将所述布线基板安装到所述模块基板的底侧。
9.根据权利要求8所述的双面安装式封装件结构，还包括分立的集成无源器件部件，所述分立的集成无源器件部件安装在选自由以下项组成的组的位置处：所述布线基板的底侧与所述多个焊料凸块侧向相邻、所述模块基板的底侧、以及所述布线基板内。
10.一种双面安装式封装件结构，包括：
无芯模块基板；
第一逻辑管芯，所述第一逻辑管芯安装在所述无芯模块基板的顶侧上；
第一多个存储器封装件，所述第一多个存储器封装件安装在所述无芯模块基板的顶侧上；
第二多个存储器封装件，所述第二多个存储器封装件安装在所述无芯模块基板的底侧上；
层压布线基板，所述层压布线基板安装到所述无芯模块基板的底侧并且位于所述第一逻辑管芯的正下方，其中所述层压布线基板比所述无芯模块基板厚；
多个接触件，所述多个接触件位于所述层压布线基板的底侧上；
第一布线，所述第一布线穿过所述层压布线基板和所述无芯模块基板以连接所述层压布线基板的底侧上的所述多个接触件和所述第一逻辑管芯；和
所述无芯模块基板内的第二布线，所述第二布线用于将所述第一逻辑管芯与所述第一多个存储器封装件和所述第二多个存储器封装件两者连接，
其中所述无芯模块基板内的所述第二布线的特征在于比穿过所述层压布线基板的所述第一布线更细的间距和更窄的线路宽度。
11.根据权利要求10所述的双面安装式封装件结构，其中所述层压布线基板是有芯基板。
12.根据权利要求10所述的双面安装式封装件结构，还包括安装到所述无芯模块基板的顶侧的顶侧加强环，其中所述顶侧加强环侧向地围绕所述第一多个存储器封装件和所述第一逻辑管芯。
13.根据权利要求12所述的双面安装式封装件结构，还包括安装到所述无芯模块基板的底侧的底侧加强环，其中所述底侧加强环侧向地围绕所述第二多个存储器封装件和所述层压布线基板。
14.根据权利要求10所述的双面安装式封装件结构，还包括位于所述层压布线基板中的一对开口，其中所述第二多个存储器封装件被安装在所述无芯模块基板的底侧上位于所述层压布线基板中的所述一对开口内。
15.根据权利要求14所述的双面安装式封装件结构，其中所述第二多个存储器封装件位于所述第一多个存储器封装件的正下方。
16.根据权利要求10所述的双面安装式封装件结构，还包括位于所述层压布线基板的底侧上的多个焊料凸块。
17.根据权利要求16所述的双面安装式封装件结构，还包括分立的集成无源器件部件，所述分立的集成无源器件部件安装在选自由以下项组成的组的位置处：所述层压布线基板的底侧与所述多个焊料凸块侧向相邻、所述无芯模块基板的底侧、以及所述层压布线基板内。
18.一种存储器模块，包括：
电路板；
安装在所述电路板上的双面安装式封装件结构，所述双面安装式封装件结构包括：
模块基板；
第一逻辑管芯，所述第一逻辑管芯安装在所述模块基板的顶侧上；
第一多个存储器封装件，所述第一多个存储器封装件安装在所述模块基板的顶侧上；
第二多个存储器封装件，所述第二多个存储器封装件安装在所述模块基板的底侧上；和
布线基板，所述布线基板安装到所述模块基板的底侧并且位于所述第一逻辑管芯的正下方，其中所述布线基板比所述模块基板厚；
多个接触件，所述多个接触件位于所述布线基板的底侧上；
通用输入/输出布线和电源布线，所述通用输入/输出布线和电源布线穿过所述布线基板和所述模块基板以连接所述第一逻辑管芯和所述布线基板的底侧上的所述多个接触件；和
所述模块基板内的信号布线，所述信号布线用于将所述第一逻辑管芯与所述第一多个存储器封装件和所述第二多个存储器封装件两者连接，
其中所述模块基板内的所述信号布线的特征在于比穿过所述布线基板的所述通用输入/输出布线和所述电源布线更细的间距和更窄的线路宽度。
19.根据权利要求18所述的存储器模块，其中所述模块基板是无芯模块基板。
20.根据权利要求19所述的存储器模块，其中所述布线基板是有芯层压基板。
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