CN113136625A - Solar silicon square rod splicing method - Google Patents
Solar silicon square rod splicing method Download PDFInfo
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- CN113136625A CN113136625A CN202010047798.0A CN202010047798A CN113136625A CN 113136625 A CN113136625 A CN 113136625A CN 202010047798 A CN202010047798 A CN 202010047798A CN 113136625 A CN113136625 A CN 113136625A
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- silicon square
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- square rod
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/06—Joining of crystals
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention provides a solar silicon square rod splicing method, which comprises the following steps: gluing: coating glue solution on the end face of one of the silicon square rods in a full-size manner; butt joint: horizontally placing the two silicon square rods on a positioning device, and butting and fixing the two silicon square rods; and (3) curing: and curing the bonded silicon square rod on the positioning device for a certain time. The splicing method has uniform gluing and good bonding effect, can improve the sheet yield of the single crystal square rod, prevent the cutting line from breaking, has high production efficiency and good silicon wafer quality, has high silicon wafer quality yield close to the splicing seam position, improves the silicon wafer quality and reduces the production cost.
Description
Technical Field
The invention belongs to the technical field of splicing of czochralski silicon single crystal rods, and particularly relates to a method for splicing solar silicon square rods.
Background
In the future, in order to reduce the cutting cost in the photovoltaic market, the full load of single-blade cutting is one direction for the development of each photovoltaic slice manufacturer, so that the single-blade cutting rod of the wire cutting equipment has higher requirements on length; in the case of a directional scribe rounding bar, a plurality of short bars inevitably occur. The length of the spliced short rods is consistent with that of the whole short rods, so that the full capacity of equipment can be further improved, and the short rod inventory of enterprises is reduced.
In the process of splicing single crystals, in the prior art, usually, in order to ensure the uniformity of the size of a spliced silicon rod, two sections of silicon round rods are spliced into a whole, then the edges of the silicon round rods are removed together, and then silicon square rods with the same size are obtained, but in the process of splicing the silicon round rods, a gluing mode is mainly a five-point gluing method, namely glue is coated on a central original point and four edges to be cut, so that when the edges are removed, the glue is adhered to a grinding wheel, the surface roughness and the flatness of the silicon square rods can be influenced, the grinding precision of the grinding wheel can be weakened, the grinding wheel needs to be frequently trimmed, the processing quality and the production time are prolonged, and the production cost is increased; meanwhile, only the center point of the silicon square rod is coated with glue, namely, the joints are not filled up, so that the size of the silicon rod with a certain width is reserved to avoid the position of the silicon rod during subsequent on-line cutting, and people are required to rearrange the cutting lines at the position, so that the yield of the silicon wafer is reduced, and when the positions near the joints are cut, the probability of wire breakage is increased due to uneven tension of diamond wires, and the production progress and the product quality are seriously affected.
Disclosure of Invention
The invention provides a solar silicon square bar splicing method, which solves the technical problems of high wire breakage rate and high rejection rate of cutting wires due to unreasonable gluing design in the prior art.
In order to solve the technical problems, the invention adopts the technical scheme that:
a solar silicon square rod splicing method comprises the following steps:
gluing: coating glue solution on the end face of one of the silicon square rods in a full-size manner;
butt joint: horizontally placing the two silicon square rods on a positioning device, and butting and fixing the two silicon square rods;
and (3) curing: and curing the bonded silicon square rod on the positioning device for a certain time.
Furthermore, in the gluing process, the glue solution is thrown onto the end face at one time, and then the glue solution is coated from the edge of the end face of the silicon square rod to the center of the end face of the silicon square rod in the forward direction.
Further, the glue solution comprises glue A and glue B, wherein the glue A and the glue B are prepared according to a weight ratio of 2: 1, the time from glue taking to completion of preparation is 2-10 min.
Further, the glue A and the glue B are weighed by an electronic balance, and the weight error is less than or equal to 0.5 g.
Further, before the glue solution is coated, the end face of the silicon square rod is cleaned by alcohol.
Furthermore, after the glue solution is prepared, the glue solution needs to be used within 10-15 min.
Furthermore, in the butt joint process, the positioning device comprises a bottom plate and a support plate which are vertically crossed, the bottom plate and the support plate are both rectangular structures and have the same size, and the width of the bottom plate is 5-10mm larger than the side length of the silicon square rod.
Further, the two sections of silicon square rods are horizontally placed on the positioning device, so that planes on two sides of the two sections of silicon square rods are respectively in contact with the bottom plate and the support plate, and the butt joint planes are placed in a contraposition mode.
Further, the silicon square rod with glue solution on the positioning device is fixed, and the other section of the silicon square rod is pushed to move towards one side of the silicon square rod with glue solution along the length direction of the bottom plate for butt joint, so that the butt joint seam width is 0.5-3 mm; and after the butt joint is finished, standing the silicon square rod on the positioning device.
Further, the curing time is not less than 4 h.
Compared with the prior art, the splicing method provided by the invention has the advantages that the gluing is uniform, the bonding effect is good, the sheet yield of the single crystal square rod can be improved, the cutting line breakage can be prevented, the production efficiency is high, the quality of the silicon wafer is good, the quality yield of the silicon wafer close to the splicing seam is high, the quality of the silicon wafer is improved, and the production cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the silicon square rod splicing of the present invention.
In the figure:
10. silicon square rod 20, silicon square rod 30, positioner
31. Bottom plate 32, support plate 40 and balancing weight
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
The invention provides a solar silicon square rod splicing method, which comprises the following specific steps of:
s1: gluing: coating glue solution on one end face of the silicon square rod 10 in a full-size mode, which comprises the following specific steps:
firstly, preparing glue solution:
the glue solution comprises glue A and glue B, a certain amount of glue A and glue B are weighed by an electronic balance, the glue A and the glue B are placed by a plastic plate, and the weight ratio of the glue A to the glue B is 2: 1, ensuring that the weight error of the glue A and the glue B is less than or equal to 0.5 g.
Mixing the glue A and the glue B together, fully stirring, wherein the stirring mode is not limited, the time from glue taking to preparation completion is ensured to be 2-10min, and the glue solution is prevented from being placed for too long, so that the glue preparation is not uniform, and the subsequent bonding effect is influenced.
After the glue solution is prepared every time, the glue solution is required to be used within 10-15min, namely the glue solution is smeared on the end face of the silicon square rod, so that the problem that the silicon square rod is poor in bonding effect or cannot be bonded due to viscosity failure of the glue solution is avoided.
Wiping the end face of the silicon square rod to be glued:
selecting a silicon square rod 10 and a silicon square rod 20, enabling the sum of the lengths of the silicon square rod 10 and the silicon square rod 20 to be not less than the standard length of the silicon square rod, enabling the side lengths of the silicon square rod 10 and the silicon square rod 20 to be the same, and ensuring that the side length deviation of the silicon square rod 10 and the silicon square rod 20 is within the range of +/-0.1 mm of the standard side length.
Then, the silicon square rod 10 is vertically placed, and the upper end face of the silicon square rod 10 is cleaned by dipping alcohol with dust-free paper.
Gluing the end face of the silicon rod:
in the gluing process, the glue solution is put on one side of the upper end face of the silicon square rod 10 at one time, and then the glue solution is sequentially coated from the edge of the end face of the silicon square rod 10 to the center position of the silicon square rod in the forward direction, so that the glue layer is uniform and controllable, the coating time can be saved, and meanwhile, the gluing effect can be easily traced in the later period.
S2: butt joint: horizontally placing the silicon square rod 10 and the silicon square rod 20 on the positioning device 30 and enabling the silicon square rod 10 and the silicon square rod 20 to be in butt joint and fixed, wherein the method comprises the following specific steps:
in the invention, the positioning device 30 comprises a bottom plate 31 and a support plate 32 which are vertically intersected, the bottom plate 31 and the support plate 32 are both rectangular structures and have the same size, the width of the bottom plate 31 is 5-10mm larger than the side length of the silicon square rod 10, and the length of the bottom plate 31 is 50-100mm larger than the standard length of the silicon square rod.
The silicon square rod 10 and the silicon square rod 20 are respectively horizontally placed on the positioning device 30, two adjacent side surfaces of the silicon square rod 10 and the silicon square rod 20 are tightly attached to the bottom plate 31 and the support plate 32, and the butted planes are aligned.
In the butt joint process, on the positioning device 30, the silicon square rod 10 with the glue solution is fixed, the silicon square rod 20 is pushed to move towards one side of the silicon square rod 10 along the length direction of the bottom plate 31 for butt joint, and the butt joint seam width of the silicon square rod 10 and the silicon square rod 20 is 0.5-3 mm.
After the butt joint is completed, a balancing weight 40 is horizontally placed on the upper end surfaces of the silicon square rod 10 and the silicon square rod 20 respectively, the contact surface of the balancing weight 40 with the silicon square rod 10 and the silicon square rod 20 is a horizontal flat surface, each balancing weight 40 is 10kg, and the silicon square rod 10 with the balancing weight 40 and the silicon square rod 20 are placed on the positioning device 30 in a standing mode. The arrangement of the balancing weight 40 ensures that the silicon square rod 10 and the silicon square rod 20 are stable in position and do not move, and the bonding effect is ensured.
S3: and (3) curing: and curing the bonded silicon square rod 10 and the bonded silicon square rod 20 on the positioning device 30 for a certain time, wherein the curing time is not less than 4h, and the next process can be carried out after 4 h.
In the prior art, the preparation weight ratio of the glue solution is 1: 1 and the curing time is 2h, if the prior art is used for preparing the proportion, the obtained numerical value is shown in table 1 compared with the bonding hardness and the shearing strength obtained after 4h of curing and 4h of preparing the proportion provided by the invention. Wherein the hardness is tested by a common Shore hardness tester, and the model is LX-A; the shear strength was tested according to GB/T7124-2008. As can be seen from Table 1, the Shore hardness obtained by the glue solution preparation method provided by the invention can reach 90-94D, while the hardness obtained by the prior art is 80-84D, which is much lower than the bonding strength of the glue solution provided by the invention. The shearing strength obtained by the glue solution prepared by the method is 6-8MPa and is lower than that of the glue solution in the prior art, which shows that the glue solution is more brittle after curing, is easier for subsequent wire cutting of diamond wires, can quickly cut the abutted seams, is not easy to attach to the diamond wires, and can reduce the wire breakage probability of the diamond wires. The data in the table show that the glue solution provided by the invention has good bonding strength, can reach high strength in a short time, has good brittleness, is not easy to bond on a diamond wire, and can further reduce the wire breakage rate of the diamond wire.
According to the splicing method, the splicing seams are filled with glue solution, so that in the subsequent cutting and wiring process, the splicing seams do not need to be avoided, and empty sections are arranged on the left and right of the splicing seams, namely diamond wires are arranged in the full size within the length range of the silicon square rods 10 and 20. Table 2 shows the comparison value of the wire breakage rate of the diamond wire when the silicon square bar obtained by the splicing method and the silicon square bar obtained by the prior art are subjected to wire cutting, and it can be seen from table 2 that the wire breakage rate of the diamond wire is 2.01% after the silicon square bar obtained by the splicing method is cut; after the silicon square rod spliced in the prior art is cut, the wire breakage rate of the diamond wire is 3.25%, the wire breakage rate of the diamond wire in the subsequent wire cutting process can be reduced by using the splicing method provided by the invention, and the number of chips per kilogram of the silicon square rod is increased.
TABLE 1 hardness and shear strength results of the glue solutions of the present invention after 4h of cure compared to the prior art
Table 2 comparison of the wire breakage rate results of the present invention with the prior art
The splicing method designed by the invention has the advantages of uniform gluing and good bonding effect, can improve the sheet yield of the single crystal square rod, can prevent the cutting line from being broken, reduces the line breaking rate, has high production efficiency and good silicon wafer quality, has high silicon wafer quality yield close to the splicing seam position, improves the silicon wafer quality and reduces the production cost.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A solar silicon square rod splicing method is characterized by comprising the following steps:
gluing: coating glue solution on the end face of one of the silicon square rods in a full-size manner;
butt joint: horizontally placing the two silicon square rods on a positioning device, and butting and fixing the two silicon square rods;
and (3) curing: and curing the bonded silicon square rod on the positioning device for a certain time.
2. The method for splicing the solar silicon square rods as claimed in claim 1, wherein the glue solution is thrown onto the end faces at one time in the gluing process and then is coated from the edge of the end faces of the silicon square rods to the center of the end faces in the forward direction.
3. The method for splicing the solar silicon square rods according to claim 2, wherein the glue solution comprises glue A and glue B, and the glue A and the glue B are prepared in a weight ratio of 2: 1, the time from glue taking to completion of preparation is 2-10 min.
4. The method for splicing the solar silicon square rods according to claim 3, wherein the glue A and the glue B are weighed by an electronic balance, and the weight error is less than or equal to 0.5 g.
5. The method for splicing the solar silicon square bars according to claim 4, wherein the method further comprises cleaning the end faces of the silicon square bars with alcohol before applying the glue solution.
6. The method for splicing the solar silicon square rods according to any one of claims 1 to 5, wherein the glue solution is used within 10 to 15min after being prepared.
7. The method as claimed in claim 6, wherein during the butt joint process, the positioning device comprises a bottom plate and a support plate which are vertically crossed, the bottom plate and the support plate are both rectangular structures and have the same size, and the width of the bottom plate is 5-10mm larger than the side length of the silicon square rod.
8. The method according to claim 7, wherein two sections of the silicon square rods are horizontally placed on the positioning device, so that the two side planes of the two sections of the silicon square rods are respectively in contact with the bottom plate and the support plate, and the butt planes are placed in alignment.
9. The method for splicing the solar silicon square rods according to claim 8, wherein the silicon square rod with the glue solution on the positioning device is fixed, and the other section of the silicon square rod is pushed to move towards one side of the silicon square rod with the glue solution along the length direction of the bottom plate for butt joint, so that the width of a butt joint seam is 0.5-3 mm; and after the butt joint is finished, standing the silicon square rod on the positioning device.
10. The method for splicing solar silicon square bars according to any one of claims 1-5 and 7-9, wherein the curing time is not less than 4 h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010047798.0A CN113136625A (en) | 2020-01-16 | 2020-01-16 | Solar silicon square rod splicing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010047798.0A CN113136625A (en) | 2020-01-16 | 2020-01-16 | Solar silicon square rod splicing method |
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| CN113136625A true CN113136625A (en) | 2021-07-20 |
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| CN202010047798.0A Pending CN113136625A (en) | 2020-01-16 | 2020-01-16 | Solar silicon square rod splicing method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914813A (en) * | 2010-09-04 | 2010-12-15 | 山西天能科技有限公司 | Method for bonding crystal bar splicing seams |
| CN102002760A (en) * | 2010-11-04 | 2011-04-06 | 浙江芯能光伏科技有限公司 | Method for splicing short silicon rods |
| CN102294757A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for splicing short mono-crystal rods cut by using diamond wire |
| CN110670140A (en) * | 2019-09-30 | 2020-01-10 | 内蒙古中环光伏材料有限公司 | Large-size monocrystalline silicon round rod splicing method |
-
2020
- 2020-01-16 CN CN202010047798.0A patent/CN113136625A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101914813A (en) * | 2010-09-04 | 2010-12-15 | 山西天能科技有限公司 | Method for bonding crystal bar splicing seams |
| CN102002760A (en) * | 2010-11-04 | 2011-04-06 | 浙江芯能光伏科技有限公司 | Method for splicing short silicon rods |
| CN102294757A (en) * | 2011-08-08 | 2011-12-28 | 江西金葵能源科技有限公司 | Method for splicing short mono-crystal rods cut by using diamond wire |
| CN110670140A (en) * | 2019-09-30 | 2020-01-10 | 内蒙古中环光伏材料有限公司 | Large-size monocrystalline silicon round rod splicing method |
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