CN215542397U - Large quartz wafer sticking lump positioning and clamping device - Google Patents
Large quartz wafer sticking lump positioning and clamping device Download PDFInfo
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- CN215542397U CN215542397U CN202121279767.4U CN202121279767U CN215542397U CN 215542397 U CN215542397 U CN 215542397U CN 202121279767 U CN202121279767 U CN 202121279767U CN 215542397 U CN215542397 U CN 215542397U
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Abstract
A large quartz wafer sticking lump positioning and clamping device is provided with a cylinder, a clamping block, a horizontal guide rail and a positioning and clamping seat; the cylinder is arranged on the workbench in a horizontal placement state through a cylinder seat, and a telescopic arm of the cylinder is connected with one end of the clamping block; the bottom surface of the clamping block is provided with a sliding chute matched with the horizontal guide rail, and the other end of the clamping block is provided with a vertical clamping surface; the horizontal guide rail is arranged between the cylinder seat and the positioning clamping seat; the positioning and clamping seat is fixedly arranged on the workbench and is arranged opposite to the clamping block, the positioning and clamping seat is provided with a bottom plate and an L-shaped side wall, and two positioning reference surfaces which are vertical to each other are formed on the inner surface of the L-shaped side wall. The utility model provides reliable positioning for the wafer lump workpiece, and avoids the phenomena of bubbles and uneven thickness of a wax layer between wafers, thereby achieving the purpose of ensuring the quality of wafer products.
Description
Technical Field
The utility model relates to a positioning and clamping device, in particular to a workpiece positioning and clamping device suitable for large-size quartz crystal wafer lump sticking operation, and belongs to the technical field of quartz crystal wafer processing.
Background
At present, in a quartz crystal production enterprise, a large-size quartz single crystal cutting mode (hereinafter referred to as a large wafer) is adopted for processing a quartz wafer, and the large wafer process comprises the following steps: the method comprises the steps of adhering ground or polished quartz single crystal wafers together by using wax (called sticking lumps for short), adding protective glass on two surfaces of the quartz single crystal wafers, slitting crystal lumps, grinding lumps, melting wax and the like to manufacture finished product wafers meeting the design size requirement, wherein the large wafer mode has the advantages of high production efficiency, angle consistency, frequency stability of finished product crystals, good electrical performance indexes and the like, and in order to ensure that the edges of the wafers have no problems of damage, edge breakage and the like, the four corners of the crystal lumps after sticking lumps are required to be 90 degrees, and the included angles of the side walls and the main surface are 90 degrees, and meanwhile, the phenomena of bubbles between the wafers and uneven thickness of wax layers are avoided, so that a workpiece positioning and clamping device in the process of sticking lumps on the large quartz wafers needs to be innovatively designed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a large quartz wafer sticking lump positioning and clamping device, which aims to provide reliable positioning for a workpiece through mutually vertical reference surfaces and avoid the phenomena of bubbles and uneven thickness of a wax layer between wafers by means of stable clamping force of a cylinder so as to achieve the aim of ensuring the quality of wafer products.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a large quartz wafer sticking lump positioning and clamping device is provided with a cylinder, a clamping block, a horizontal guide rail and a positioning and clamping seat; the cylinder is arranged on the workbench in a horizontal placement state through a cylinder seat, and a telescopic arm of the cylinder is connected with one end of the clamping block; the bottom surface of the clamping block is provided with a sliding chute matched with the horizontal guide rail, and the other end of the clamping block is provided with a vertical clamping surface; the horizontal guide rail is arranged between the cylinder seat and the positioning clamping seat; the positioning and clamping seat is fixedly arranged on the workbench and is arranged opposite to the clamping block, the positioning and clamping seat is provided with a bottom plate and an L-shaped side wall, and two positioning reference surfaces which are vertical to each other are formed on the inner surface of the L-shaped side wall.
According to the large quartz wafer sticking lump positioning and clamping device, the bottom plate and the L-shaped side wall of the positioning and clamping seat are provided with a plurality of rows of glue holes.
Above-mentioned big quartz wafer glues positioning and clamping device that sticks together, the cylinder passes through the gas circuit and connects compressed air source, sets up the compressed air pressure gauge in the gas circuit to set up the time relay in the control system of gas circuit.
Above-mentioned big quartz wafer glues position clamping device that sticks together cylinder telescopic arm and clamp tight piece junction are equipped with buffer spring.
The utility model relates to a large quartz wafer sticking lump positioning and clamping device, which is characterized in that during the operation process of sticking a lump on a large quartz wafer, a plurality of quartz wafers are firstly attached together for gum dipping treatment, then the crystal lump is placed on a bottom plate of a positioning and clamping seat, the crystal lump is positioned by two positioning datum surfaces of the inner surfaces of L-shaped side walls of the positioning and clamping seat, an air cylinder is started, a clamping block is driven by the air cylinder to slide along a horizontal guide rail, the crystal lump is extruded by the vertical clamping surface of the clamping block, so that the quartz wafers are precisely attached and adhered together, air bubbles and redundant glue solution between the quartz wafers are extruded, and the extruded glue solution is discharged from glue discharge holes on the bottom plate of the positioning and clamping seat and the L-shaped side walls. The utility model also arranges a compressed air pressure regulating meter in the air passage of the cylinder and a time relay in the control system of the air passage, which can control the pressure and the compaction time of the cylinder, thereby ensuring the bonding quality of the crystal lump. According to the utility model, the buffer spring is arranged at the joint of the cylinder telescopic arm and the clamping block, so that the clamping block can be flexibly contacted with the crystal lump, and the violent impact on the crystal lump caused by the extrusion process is avoided. Therefore, the wafer lump workpiece is reliably positioned by the wafer lump positioning device, and the phenomena of bubbles and uneven thickness of a wax layer between wafers are avoided, so that the aim of ensuring the quality of wafer products is fulfilled.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a sectional view taken along line A-A in FIG. 1;
FIG. 4 is a schematic view of the working state of the present invention;
fig. 5 is a top view of fig. 4.
The list of labels in the figure is:
1. a cylinder; 2. A buffer spring; 3. 3-1 parts of a clamping block, and vertical clamping surfaces; 4. 4-1 parts of a positioning clamping seat, 4-2 parts of glue discharging holes and a positioning datum plane; 5. A horizontal guide rail; 6. A cylinder block; 7. and (4) crystallizing lump.
Detailed Description
The utility model is further described with reference to the following figures and specific embodiments.
Referring to fig. 1, 2 and 3, the large quartz wafer lump-sticking positioning and clamping device of the present invention is provided with a cylinder 1, a clamping block 3, a horizontal guide rail 5 and a positioning and clamping seat 4; the air cylinder 1 is horizontally arranged on the workbench through an air cylinder seat 6, the air cylinder 1 is connected with a compressed air source through an air passage, a compressed air pressure regulator is arranged in the air passage, a time relay is arranged in a control system of the air passage, a telescopic arm of the air cylinder 1 is connected with one end of the clamping block 3, and a buffer spring 2 is arranged at the joint of the telescopic arm of the air cylinder 1 and the clamping block 3; the bottom surface of the clamping block 2 is provided with a sliding chute matched with the horizontal guide rail 5, and the other end of the clamping block 3 is provided with a vertical clamping surface 3-1; the horizontal guide rail 5 is arranged between the cylinder block 6 and the positioning clamping block 4; the positioning clamping seat 4 is fixedly arranged on the workbench and is opposite to the clamping block 3, the positioning clamping seat 4 is provided with a bottom plate and an L-shaped side wall, and two positioning reference surfaces 4-2 which are vertical to each other are formed by the inner surface of the L-shaped side wall.
Referring to fig. 1 and 2, in the large quartz wafer lump-sticking positioning and clamping device of the present invention, a plurality of glue discharging holes 4-1 are formed in the bottom plate and the L-shaped side wall of the positioning and clamping base 4.
Referring to fig. 4 and 5, in the large quartz wafer lump adhering positioning and clamping device of the present invention, during the large quartz wafer lump adhering operation, a plurality of quartz wafers are first bonded together and subjected to gum dipping treatment; then placing the crystal lump 7 on a bottom plate of the positioning clamping seat 4, and positioning the crystal lump 7 through two mutually vertical positioning reference surfaces 4-2 on the inner surface of the L-shaped side wall of the crystal lump; starting the air cylinder 1, driving the clamping block 3 to slide along the horizontal guide rail 5 by the air cylinder 1, extruding the crystal lump 7 through the vertical clamping surface 3-1 of the clamping block 3 to precisely attach and bond the quartz wafers together, extruding bubbles and redundant glue solution among the quartz wafers, and discharging the extruded glue solution from a bottom plate of the positioning clamping seat 4 and glue discharging holes on the L-shaped side wall; after the pressure is maintained for a certain time, the control system controls the telescopic arm of the cylinder 1 to retract, the driving clamping block 3 is separated from the crystal lump 7, the crystal lump 7 is taken out from the positioning clamping seat 4, and the adhering lump operation process is completed.
Claims (4)
1. A big quartz crystal plate sticking lump positioning and clamping device is characterized by being provided with a cylinder (1), a clamping block (3), a horizontal guide rail (5) and a positioning and clamping seat (4); the air cylinder (1) is arranged on the workbench in a horizontal placement state through an air cylinder seat (6), and a telescopic arm of the air cylinder (1) is connected with one end of the clamping block (3); the bottom surface of the clamping block (3) is provided with a sliding chute matched with the horizontal guide rail (5), and the other end of the clamping block (3) is provided with a vertical clamping surface (3-1); the horizontal guide rail (5) is arranged between the cylinder seat (6) and the positioning clamping seat (4); the positioning and clamping seat (4) is fixedly arranged on the workbench and is arranged opposite to the clamping block (3), the positioning and clamping seat (4) is provided with a bottom plate and an L-shaped side wall, and two positioning reference surfaces (4-2) which are vertical to each other are formed on the inner surface of the L-shaped side wall.
2. The large quartz crystal plate sticking lump positioning and clamping device as claimed in claim 1, wherein the bottom plate and the L-shaped side wall of the positioning and clamping base (4) are provided with a plurality of rows of glue holes (4-1).
3. The large quartz wafer sticking lump positioning and clamping device as claimed in claim 1 or 2, wherein the cylinder (1) is connected with a compressed air source through an air passage, a compressed air pressure gauge is arranged in the air passage, and a time relay is arranged in a control system of the air passage.
4. The large quartz wafer sticking lump positioning and clamping device as claimed in claim 3, wherein a buffer spring (2) is arranged at the joint of the telescopic arm of the cylinder (1) and the clamping block (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121279767.4U CN215542397U (en) | 2021-06-08 | 2021-06-08 | Large quartz wafer sticking lump positioning and clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121279767.4U CN215542397U (en) | 2021-06-08 | 2021-06-08 | Large quartz wafer sticking lump positioning and clamping device |
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| Publication Number | Publication Date |
|---|---|
| CN215542397U true CN215542397U (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121279767.4U Active CN215542397U (en) | 2021-06-08 | 2021-06-08 | Large quartz wafer sticking lump positioning and clamping device |
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| CN (1) | CN215542397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114770365A (en) * | 2022-04-19 | 2022-07-22 | 成都贝瑞光电科技股份有限公司 | Self-adaptive assembling double-side grinding and polishing process |
-
2021
- 2021-06-08 CN CN202121279767.4U patent/CN215542397U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114770365A (en) * | 2022-04-19 | 2022-07-22 | 成都贝瑞光电科技股份有限公司 | Self-adaptive assembling double-side grinding and polishing process |
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