CN220719902U - Frequency piece glues stone roller mechanism - Google Patents
Frequency piece glues stone roller mechanism Download PDFInfo
- Publication number
- CN220719902U CN220719902U CN202321761551.0U CN202321761551U CN220719902U CN 220719902 U CN220719902 U CN 220719902U CN 202321761551 U CN202321761551 U CN 202321761551U CN 220719902 U CN220719902 U CN 220719902U
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- compression
- block
- cylinder
- limiting block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 241001504664 Crossocheilus latius Species 0.000 title claims description 3
- 239000003292 glue Substances 0.000 title claims description 3
- 230000006835 compression Effects 0.000 claims abstract description 25
- 238000007906 compression Methods 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims description 31
- 239000010453 quartz Substances 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000712 assembly Effects 0.000 abstract description 5
- 238000000429 assembly Methods 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005056 compaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to the field of quartz wafer processing and discloses a frequency sheet weight sticking mechanism for improving compression efficiency, which comprises a bottom plate, wherein a limiting block and compression assemblies arranged on two sides of the limiting block are arranged on the bottom plate, the limiting block is arranged in the center of the bottom plate, the compression assemblies comprise compression cylinders, push blocks connected to the output ends of the compression cylinders and compression plates connected to the push blocks, the compression cylinders are fixedly connected to the bottom plate through support fixing plates, the push blocks are connected with the output ends of the compression cylinders through adjusting assemblies, and two ends of each compression plate are connected with the bottom plate through sliding assemblies.
Description
Technical Field
The utility model relates to the field of quartz wafer processing, in particular to a frequency chip weight sticking mechanism.
Background
In the process of quartz wafer processing, a large-size quartz wafer needs to be cut into an extremely small size, and in order to avoid damage to the quartz wafer during cutting, operators must bond the quartz wafer into a wafer weight first and then process the size of the wafer. The existing technology for sticking the crystalline blocks is mainly to put a baking tray on a heating plate and heat the baking tray to about 80 degrees, uniformly coat a layer of adhesive, arrange and arrange square sheets, respectively add 1 white glass sheet with the same specification at two ends, put the square sheets into the baking tray, coat adhesive rods on crystalline blocks in the baking tray, bake the crystalline blocks in a baking oven with the temperature of 100 degrees for 40-60 min, take out the crystalline blocks one by one and adhere and fix the crystalline blocks after baking, and finish the process after cooling, wherein the thickness of adhesive between each layer of wafers in the bonded crystalline blocks is different, so that the thickness of the bonded crystalline blocks is difficult, and the cutting of the subsequent crystalline blocks is easy to influence. In the prior art, manual operation is adopted during the block sticking and curing, and the processing operation of each block has lower production efficiency.
In the application document with the publication number of CN216707976U, a pneumatic block sticking device is disclosed, pneumatic block sticking is carried out through an air cylinder, the device can ensure that the thickness of wax layers between wafers is consistent, the thickness of each crystal block is consistent, but only one crystal block can be pressed at a time, and in this regard, a frequency sheet block sticking mechanism for improving the pressing efficiency is designed by researchers in the field.
Disclosure of Invention
The utility model aims to solve the technical problem of overcoming the defects of the prior art and providing a frequency sheet weight sticking mechanism for improving the compaction efficiency.
The technical scheme of the utility model is as follows: the utility model provides a piece mechanism is glued to frequency piece, includes the bottom plate, be provided with the stopper on the bottom plate and set up the compression subassembly of stopper both sides, the stopper sets up the bottom plate center, compression subassembly is including compressing tightly the cylinder, connecting push block on compressing tightly the cylinder output and connecting compressing tightly the board on the push block, compressing tightly the cylinder and being in through supporting fixed plate fixed connection on the bottom plate, the push block pass through adjusting part with compressing tightly the cylinder output and being connected, compressing tightly the board both ends pass through sliding component with the bottom plate is connected.
According to the scheme, the limiting block is used for limiting the wafer, and the pressing assembly drives the pushing block to press the crystal on the limiting block through the pressing cylinder.
The adjusting assembly comprises an adjusting screw and a nut in threaded connection with the adjusting screw, the nut is connected to the joint of the adjusting screw and the output end of the compression cylinder, and the pushing block is connected to the end part of the adjusting screw. Therefore, the nut can properly adjust the moving distance of the pressing plate through moving on the adjusting screw rod, so that the nut is convenient for meeting the requirements of forming different sizes of crystal blocks.
The sliding component comprises guide rails arranged on two sides of the limiting block and sliding blocks which are connected to the guide rails in a sliding mode, and the sliding blocks are fixedly connected to two ends of the pressing plate. Therefore, when the pressing plate is driven by the pressing cylinder, the pressing force is more uniform through the movement of the sliding block on the guide rail.
The limiting block is in a cross-shaped arrangement, and the compressing plate is provided with a compressing abutting block matched with the limiting block. Therefore, the pressing plate presses the wafers placed on the cross-shaped limiting blocks through the pressing abutting blocks.
The pressing cylinder is connected with a manual switch and a foot switch, the manual switch is arranged on the bottom plate, and the foot switch is arranged on the ground. It can be seen that the hold-down cylinder is controlled by a manual switch or a foot switch.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model;
fig. 3 is a view showing the placement of the crystal block according to the present utility model.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
As shown in fig. 1 to 3, the utility model relates to a frequency sheet weight sticking mechanism, which comprises a bottom plate 1, wherein a limiting block 2 and pressing components arranged on two sides of the limiting block 2 are arranged on the bottom plate 1, the two groups of pressing components are arranged in the center of the bottom plate 1, the limiting block 2 is arranged in a cross shape, the bottom part of the limiting block 2 is divided into four areas for placing crystal blocks, the pressing components comprise a pressing cylinder 3, a pushing block 4 connected to the output end of the pressing cylinder 3 and a pressing plate 5 connected to the pushing block 4, the pressing plate 5 is provided with a pressing abutting block 51 matched with the limiting block 2, the pressing cylinder 3 is fixedly connected to the bottom plate 1 through a supporting fixing plate 6, the pushing block 4 is connected to the output end of the pressing cylinder 3 through an adjusting group 7, two ends of the pressing plate 5 are connected to the bottom plate 1 through a sliding component 8, the pressing cylinder 3 is connected with a manual switch 31 and a foot switch 32, the manual switch 31 is arranged on the bottom plate 1, and the foot switch 32 is arranged on the ground to press the crystal blocks through the foot switch 31 and the foot switch 32.
In this embodiment, the reference number of the crystal weight is 100, the compression cylinder 3 adopts a double-piston cylinder, and two compression supporting blocks 51 are respectively arranged on the compression plate 5, so that two crystal weights on the same side on the limiting block 2 can be conveniently compressed at the same time, and the compression supporting blocks 51 are detachably connected with the compression plate 5, so that the disassembly and the assembly are convenient.
The adjusting group 7 comprises an adjusting screw 71 and a nut 72 in threaded connection with the adjusting screw 71, the nut 72 is connected to the joint of the adjusting screw 71 and the output end of the compressing cylinder 3, and the pushing block 4 is connected to the end of the adjusting screw 71.
The sliding component 8 comprises guide rails 81 arranged on two sides of the limiting block 2 and sliding blocks 82 which are connected to the guide rails 81 in a sliding mode, and the sliding blocks 82 are fixedly connected to two ends of the pressing plate 5.
The working flow of the utility model is as follows: simultaneously, four crystal blocks 100 are placed in the area formed by the limiting blocks, then the foot switch 32 is stepped down or the manual switch 31 is pressed down, the compression assemblies at the left side and the right side of the bottom plate 1 simultaneously compress in opposite directions, and the compression block 4 is pushed by the compression cylinder 3 to compress the compression supporting block 51 on the compression plate 5, so that the crystal blocks are uniformly compressed. The moving distance of each cylinder is the same, so that the whole pressing process is stable and uniform in stress, the stress sizes among different crystal blocks are consistent, the thickness of wax layers among wafers is ensured to be consistent, the thickness of the adhered crystal block 100 is consistent, the left pressing cylinder 3 and the right pressing cylinder 3 simultaneously act to realize simultaneous pressing of the four crystal blocks 100 on the limiting block 2, and the pressing efficiency of the crystal block 100 is improved.
Finally, it should be emphasized that the above description is not intended to limit the utility model, but rather that various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the utility model, and any modifications, equivalents, improvements, etc. are intended to be included within the scope of the present utility model.
Claims (5)
1. The utility model provides a piece glues stone roller mechanism which characterized in that: including bottom plate (1), be provided with stopper (2) and setting on bottom plate (1) the compression assembly of stopper (2) both sides, stopper (2) set up bottom plate (1) center, compression assembly is including compressing tightly cylinder (3), connecting push block (4) on compressing tightly cylinder (3) output and connecting compressing tightly board (5) on push block (4), compressing tightly cylinder (3) are in through supporting fixed plate (6) fixed connection on bottom plate (1), push block (4) through adjusting group (7) spare with compressing tightly cylinder (3) output and being connected, compressing tightly board (5) both ends through sliding component (8) with bottom plate (1) are connected.
2. The frequency chip bonding weight mechanism according to claim 1, wherein: the adjusting group (7) comprises an adjusting screw (71) and a nut (72) in threaded connection with the adjusting screw (71), the nut (72) is connected to the joint of the adjusting screw (71) and the output end of the compression cylinder (3), and the pushing block (4) is connected to the end part of the adjusting screw (71).
3. The frequency chip bonding weight mechanism according to claim 1, wherein: the sliding assembly (8) comprises guide rails (81) arranged on two sides of the limiting block (2) and sliding blocks (82) connected to the guide rails (81) in a sliding mode, and the sliding blocks (82) are fixedly connected to two ends of the pressing plate (5).
4. The frequency chip bonding weight mechanism according to claim 1, wherein: the limiting block (2) is arranged in a cross shape, and the compressing plate (5) is provided with a compressing block (51) matched with the limiting block (2).
5. The frequency chip bonding weight mechanism according to claim 1, wherein: the pressing cylinder (3) is connected with a manual switch (31) and a foot switch (32), the manual switch (31) is arranged on the bottom plate (1), and the foot switch (32) is arranged on the ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321761551.0U CN220719902U (en) | 2023-07-06 | 2023-07-06 | Frequency piece glues stone roller mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321761551.0U CN220719902U (en) | 2023-07-06 | 2023-07-06 | Frequency piece glues stone roller mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220719902U true CN220719902U (en) | 2024-04-05 |
Family
ID=90492736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321761551.0U Active CN220719902U (en) | 2023-07-06 | 2023-07-06 | Frequency piece glues stone roller mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220719902U (en) |
-
2023
- 2023-07-06 CN CN202321761551.0U patent/CN220719902U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |