CN113093473A - MEMS chip glue spraying and homogenizing equipment and technological method thereof - Google Patents
MEMS chip glue spraying and homogenizing equipment and technological method thereof Download PDFInfo
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- CN113093473A CN113093473A CN202110327917.2A CN202110327917A CN113093473A CN 113093473 A CN113093473 A CN 113093473A CN 202110327917 A CN202110327917 A CN 202110327917A CN 113093473 A CN113093473 A CN 113093473A
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- 238000005507 spraying Methods 0.000 title claims abstract description 70
- 239000003292 glue Substances 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 33
- 235000012431 wafers Nutrition 0.000 claims abstract description 52
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 230000008569 process Effects 0.000 claims abstract description 24
- 239000007921 spray Substances 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000007306 turnover Effects 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000001259 photo etching Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses MEMS chip glue spraying and homogenizing equipment and a process method thereof, wherein the MEMS chip glue spraying and homogenizing equipment comprises the following steps: the automatic glue spraying device comprises a gas supply mechanism and an electrical control mechanism, wherein the gas supply mechanism and the electrical control mechanism are arranged on an assembly box body, a material taking and placing area is arranged in the assembly box body, a positioning rail is arranged in the material taking and placing area, an intelligent manipulator is arranged on the positioning rail and used for taking and placing wafers, a plurality of glue spraying stations are circumferentially arranged in the material taking and placing area, and a glue spraying module is arranged at each glue spraying station; spout gluey module includes: the X, Y coordinate track of setting on the installation base, the installation base is last to set up and to spout gluey district, spouts to place on the gluey district and treats the processing wafer, spouts gluey district top and sets up the soft solid dish of heating, and soft solid dish one side of heating sets up the guard plate, sets up wafer business turn over protection mouth on the guard plate, sets up the ultrasonic spray head on the X, Y coordinate track, and the ultrasonic spray head below sets up the nozzle. The effective combination of the glue spraying module and the heating mechanism is utilized, the glue spraying efficiency is effectively improved, the precision of photoresist spraying is improved, excessive photoresist is avoided, and the waste of the photoresist is reduced.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to MEMS (micro-electromechanical systems) chip glue spraying and homogenizing equipment and a technological method thereof.
Background
At present, a photoresist coating machine, a photoetching machine and a developing machine respectively complete photoresist coating, photoetching and developing operations on a wafer in a photoetching process in semiconductor wafer processing, and with the improvement of the processing technology level of the semiconductor wafer, technical personnel provide a device system for connecting a coating developing device and the photoetching machine together to realize the whole photoetching process, and the device system can improve the production efficiency of the photoetching process. The glue spreading and developing equipment is essential processing equipment in chip manufacturing process, the transmission and processing of the wafer among various systems are realized by utilizing a mechanical arm, and the perfect matching with a photoetching machine is realized, so that the technological processes of photoresist coating, curing, developing and the like of the wafer are completed.
The photoresist homogenizing and developing device is matched with a photoetching machine in a photoetching process to finish a photoresist coating process and a developing process, wherein the photoresist homogenizing process is to uniformly spray required exposure photoresist on the surface of a silicon wafer or a wafer, and the developing process is to treat the exposed exposure photoresist so as to remove exposed or unexposed parts. The input of the photoetching machine, namely the coating of photoresist before exposure and the output, namely the development of patterns after exposure, the performance of the photoresist developing equipment not only directly influences the formation of fine exposure positions, but also has deep influence on the pattern transfer results in subsequent etching and ion implantation processes by the pattern quality and error control of the developing process. The gluing and developing equipment is a core station in the chip manufacturing process and is an important link for realizing the semiconductor manufacturing process. MEMS processing has been developed through integrated circuit fabrication, however, MEMS fabrication involves the communication of various materials, MEMS fabrication technology is more personalized and diversified, and is widely used in various fields, and such diversification of fabrication processes causes difficulties in achieving standardization in the fabrication processes thereof, and the existing fabrication technologies lack standard MEMS fabrication processes.
At present, the glue homogenizing developing equipment in the MEMS chip manufacturing process is the same process for manufacturing the integrated circuit chip, the glue homogenizing developing equipment adopted by the integrated circuit chip is mainly a rotary glue homogenizing technology, rotary glue coating is only aimed at flat surface appearance, or the fluctuation of a surface structure is in a nanometer range, the fluctuation of the surface appearance of the MEMS chip reaches the level of micron or even millimeter, the thickness of different areas required by glue coating thickness is different, the thickness of photoresist in partial areas of a special process even reaches nearly 1mm, the pain point is the pain point which limits the MEMS research and development at present, and the pain point also limits the MEMS production efficiency to be improved. Therefore, there is a need for an apparatus that improves the precision spray coating of photoresist onto a wafer surface.
Disclosure of Invention
The invention overcomes the defects of the prior art and provides MEMS chip glue spraying and homogenizing equipment and a process method thereof.
In order to achieve the purpose, the invention adopts the technical scheme that: an MEMS chip glue spraying and homogenizing device and a process method thereof comprise the following steps: the assembling device comprises an assembling box body, a gas supply mechanism and an electrical control mechanism, wherein the gas supply mechanism and the electrical control mechanism are arranged on the assembling box body;
spout gluey module includes: installation base and setting are in X, Y coordinate track on the installation base, the installation base top sets up the soft solid dish of heating, the soft solid dish top of heating sets up and spouts gluey district, it places the wafer of treating processing in the gluey district to spout, heating soft solid dish one side sets up the guard plate, set up wafer business turn over protection mouth on the guard plate, set up the ultrasonic spray head on the X, Y coordinate track, the ultrasonic spray head below sets up the nozzle.
In a preferred embodiment of the invention, a control cabinet is arranged on one side of the X, Y coordinate track, and the control cabinet is used for controlling the position of the ultrasonic spray head.
In a preferred embodiment of the present invention, the heating flexible fixing disc is connected to the mounting base through a fixing frame, and a plurality of infrared heating mechanisms are disposed on the heating flexible fixing disc.
In a preferred embodiment of the invention, the ultrasonic spray head is fixed on the X, Y coordinate track through a vertical track, and the ultrasonic spray head is connected with the vertical track in a sliding way.
In a preferred embodiment of the invention, a high-precision flow control valve is arranged on the ultrasonic nozzle and used for controlling the glue spraying speed of the ultrasonic nozzle.
In a preferred embodiment of the invention, the assembly box body is provided with a centering station, and the centering station is used for positioning the gas supply mechanism, the electric control mechanism and the glue spraying station.
In a preferred embodiment of the invention, an operation human-machine interface is arranged at the front part of the assembling box body, and a warning lamp is arranged above the assembling box body.
In a preferred embodiment of the present invention, the gas supply mechanism and the electrical control mechanism are disposed on two sides of one of the glue spraying stations.
The second technical scheme adopted by the invention is as follows:
step S1: the intelligent mechanical arm places the wafer to be processed on the glue spraying station through the wafer in-out protective opening, transmits a program command to the control cabinet through operating the human-computer interface, and the control cabinet adjusts the X coordinate and the Y coordinate of the nozzle to enable the nozzle to be located above the glue spraying area to be sprayed of the wafer.
Step S2: the Z coordinate of the nozzle is adjusted through the control cabinet, the photoresist is uniformly sprayed on the surface of the wafer, the photoresist spraying speed of the ultrasonic sprayer is controlled through the high-precision flow control valve, trace photoresist spraying is achieved, and meanwhile, the photoresist sprayed by the ultrasonic sprayer is heated through the heating flexible fixing disc.
Step S3: the intelligent mechanical arm takes out the processed wafer through the wafer in-out protective opening and places the processed wafer on the feeding and discharging station.
In a preferred embodiment of the present invention, the heating flexible fixing plate is in a ring shape, and different areas of the heating flexible fixing plate can be independently controlled.
The invention solves the defects in the background technology, and has the following beneficial effects:
(1) according to the invention, the photoresist sprayed on the wafer is heated through the infrared heating mechanism, so that the heated photoresist can be more accurately sprayed on the wafer, and the effective combination of the photoresist spraying module and the heating mechanism is utilized, so that the photoresist spraying efficiency is effectively improved, the photoresist spraying precision is improved, the excessive use of the photoresist is avoided, and the waste of the photoresist is further reduced.
(2) According to the invention, the control cabinet controls the X coordinate, the Y coordinate and the Z coordinate of the ultrasonic spray head, so that the position of the ultrasonic spray head can be accurately positioned, and the qualified rate of wafer processing is improved; simultaneously, through the high accuracy flow control valve that sets up on the supersound shower nozzle, realize the accurate control to supersound shower nozzle spouts gluey speed, realize the accurate ration output of photoresist, the photoresist rate of utilization is showing and is improving, and the waste rate is effectively reduced, and the promotion is risen and is reached more than 90%, breaks through the bottleneck that the photoresist is with high costs and thickness even control is difficult, can realize accurate minimizing, and the practicality is strong.
(3) The invention realizes linear working range and incremental control of glue amount and stable uniformity by a micro glue spraying process, can realize thick glue even layer aiming at the rugged wafer surface aiming at MEMS and special integrated circuit manufacture procedures, and can quickly realize the requirements of different thicknesses of photoresist at different area positions.
(4) According to the invention, through the centering station arranged on the assembly box body, the accurate layout of the equipment can be further ensured, so that each equipment can be reasonably arranged in the assembly box body, and meanwhile, the intelligent manipulator can be precisely matched with each glue spraying module, the process progress of the equipment is promoted, the wafer processing efficiency is further improved, and the production speed of the product is increased.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a top view of a preferred embodiment of the present invention;
FIG. 2 is a front view of a preferred embodiment of the present invention;
FIG. 3 is a side view of a preferred embodiment of the present invention;
FIG. 4 is a perspective view of a membrane spraying assembly according to a preferred embodiment of the present invention;
FIG. 5 is a schematic plan view of a membrane spraying assembly according to a preferred embodiment of the present invention.
Specifically, 110-assembly box body, 120-feeding and discharging station, 130-warning light, 140-operation man-machine interface, 150-centering station, 160-gas supply mechanism, 170-electric control mechanism, 180-intelligent mechanical arm, 181-positioning track,
210-X, Y coordinate orbit, 220-control cabinet, 230-protection plate, 231-entrance and exit protection port, 250-heating soft fixed disk, 260-fixed frame, 270-installation base, 280-ultrasonic spray head and 281-vertical orbit.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the scope of the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1, fig. 2 and fig. 3, an apparatus for spraying a glue on an MEMS chip and a process method thereof includes: the assembling box body 110, and the gas supply mechanism 160 and the electric control mechanism 170 which are arranged on the assembling box body 110, wherein the gas supply mechanism 160 and the electric control mechanism 170 are arranged at two sides of one glue spraying station, power is provided for devices such as air cylinders in equipment through the gas supply mechanism 160, a material taking and placing area is arranged in the assembling box body 110, a positioning track 181 is arranged in the material taking and placing area, an intelligent manipulator 180 is arranged on the positioning track 181, the intelligent manipulator 180 is used for taking and placing wafers, a plurality of glue spraying stations are circumferentially arranged in the material taking and placing area, and a glue spraying module is arranged at the glue spraying station;
as shown in fig. 4 and 5, the glue spraying module includes: installation base 270 and the X, Y coordinate track 210 of setting on installation base 270, installation base 270 top sets up heating solid flexible disk 250, and the setting of heating solid flexible disk 250 top is spouted gluey district, spouts to place on the gluey district and treats the processing wafer, and heating solid flexible disk 250 is the annular form, and the different regions of heating solid flexible disk 250 can independent control, and heating solid flexible disk 250 one side sets up protection plate 230, sets up wafer business turn over protection mouth 231 on the protection plate 230. Set up operation human-computer interface 140 in assembly box 110 anterior side, realize the intelligent control to each equipment, and through set up warning light 130 in assembly box 110 top, can indicate the place that the staff need pay attention to the crystal, avoid the machine to damage, prevent the emergence of dangerous condition simultaneously.
In a preferred embodiment of the present invention, the X, Y coordinate rail 210 is provided with the ultrasonic nozzle 280, the X, Y coordinate rail 210 is provided with the control cabinet 220 at one side, the control cabinet 220 is used for controlling the position of the ultrasonic nozzle 280, and the nozzle is arranged below the ultrasonic nozzle 280. The control cabinet 220 commands the electrical control mechanism 170 to drive the ultrasonic nozzle 280 to change the X coordinate and the Y coordinate of the ultrasonic nozzle 280, on the other hand, the ultrasonic nozzle 280 is fixed on the X, Y coordinate rail 210 through the vertical rail 281, the ultrasonic nozzle 280 is connected with the vertical rail 281 in a sliding manner, the Z coordinate of the ultrasonic nozzle 280 is changed through the vertical rail 281, the position of the ultrasonic nozzle 280 is accurately positioned, and the qualification rate of wafer processing is improved; meanwhile, through the high-precision flow control valve arranged on the ultrasonic sprayer 280, the accurate control of the glue spraying speed of the ultrasonic sprayer 280 is realized, the accurate quantitative output of the photoresist is realized, the photoresist utilization rate is obviously improved, the waste rate is effectively reduced, the lifting rate is increased by more than 90%, the bottleneck that the photoresist is high in cost and difficult to control the thickness uniformly is broken through, the accurate quantification is realized, and the practicability is high.
In a preferred embodiment of the present invention, the heating flexible fixing disc 250 is connected to the mounting base 270 through the fixing frame 260, and a plurality of infrared heating mechanisms are disposed on the heating flexible fixing disc 250, and the infrared heating mechanisms may be infrared heaters or electric heating pipes; the infrared heating mechanism heats the photoresist sprayed on the wafer, so that the heating photoresist can be more accurately sprayed on the wafer, the effective combination of the photoresist spraying module and the heating mechanism is utilized, the efficiency of photoresist spraying is effectively improved, the precision of photoresist spraying is improved, excessive photoresist is avoided, and the waste of the photoresist is reduced.
In a preferred embodiment of the present invention, the ultrasonic nozzle 280 is provided with a high-precision flow control valve, and the high-precision flow control valve is used for controlling the glue spraying speed of the ultrasonic nozzle 280 so as to achieve the purpose of micro glue spraying; the linear working range and the incremental glue amount control and the stable uniformity are realized through the micro glue spraying process, the thick glue even layer can be realized on the uneven wafer surface aiming at the MEMS and special integrated circuit manufacturing process, and the requirements of different thicknesses of the photoresist can be quickly realized in different region positions.
In a preferred embodiment of the present invention, a centering station 150 is provided on the assembly housing 110, and the centering station 150 is used for positioning the gas supply mechanism 160, the electrical control mechanism 170 and the glue spraying station. Through the centering station 150 that sets up on assembly box 110, can further guarantee the accurate overall arrangement of equipment, make each equipment can the rational arrangement in assembly box 110, guarantee simultaneously that intelligent machine hand 180 can each glue spraying module of accurate cooperation, realize that the process of equipment advances, and then improves the efficiency of wafer processing, improves the production speed of product.
When the intelligent mechanical arm is used, the intelligent mechanical arm 180 places a wafer to be processed on a glue spraying station through the wafer in-out protective opening 231, transmits a program command to the control cabinet 220 through the operating human-machine interface 140, and the control cabinet 220 adjusts the X coordinate and the Y coordinate of the nozzle to enable the nozzle to be positioned above a glue spraying area of the wafer; adjusting the Z coordinate of the nozzle through the control cabinet 220, uniformly spraying the photoresist on the surface of the wafer, controlling the photoresist spraying speed of the ultrasonic sprayer 280 through a high-precision flow control valve to realize micro-quantity photoresist spraying, and meanwhile, heating the photoresist sprayed by the ultrasonic sprayer 280 through the heating flexible fixing disc 250; the intelligent robot 180 takes out the processed wafer through the wafer in-out protective opening 231 and places the processed wafer on the feeding and discharging station 120 to complete the wafer processing.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A MEMS chip spouts even gluey equipment, includes: an assembly box body, a gas supply mechanism and an electric control mechanism which are arranged on the assembly box body,
a material taking and placing region is arranged in the assembling box body, a positioning rail is arranged in the material taking and placing region, an intelligent manipulator is arranged on the positioning rail and used for taking and placing wafers, a plurality of glue spraying stations are circumferentially arranged in the material taking and placing region, and a glue spraying module is arranged at each glue spraying station;
spout gluey module includes: installation base and setting are in X, Y coordinate track on the installation base, the installation base top sets up the soft solid dish of heating, the soft solid dish top of heating sets up and spouts gluey district, it places the wafer of treating processing in the gluey district to spout, heating soft solid dish one side sets up the guard plate, set up wafer business turn over protection mouth on the guard plate, set up the ultrasonic spray head on the X, Y coordinate track, the ultrasonic spray head below sets up the nozzle.
2. The MEMS chip glue spraying and leveling device according to claim 1, wherein: and a control cabinet is arranged on one side of the X, Y coordinate track and is used for controlling the position of the ultrasonic spray head.
3. The MEMS chip glue spraying and leveling device according to claim 1, wherein: the heating flexible fixing disc is connected with the mounting base through a fixing frame, and a plurality of infrared heating mechanisms are arranged on the heating flexible fixing disc.
4. The MEMS chip glue spraying and leveling device according to claim 1, wherein: the ultrasonic spray head is fixed on the X, Y coordinate track through a vertical track, and the ultrasonic spray head is connected with the vertical track in a sliding manner.
5. The MEMS chip glue spraying and leveling device according to claim 1, wherein: the ultrasonic sprayer is provided with a high-precision flow control valve, and the high-precision flow control valve is used for controlling the glue spraying speed of the ultrasonic sprayer.
6. The MEMS chip glue spraying and leveling device according to claim 1, wherein: and the assembly box body is provided with a centering station, and the centering station is used for positioning the gas supply mechanism, the electric control mechanism and the glue spraying station.
7. The MEMS chip glue spraying and leveling device according to claim 1, wherein: an operation human-computer interface is arranged on the front portion of the assembling box body, and a warning lamp is arranged on the upper portion of the assembling box body.
8. The MEMS chip glue spraying and leveling device according to claim 1, wherein: the gas supply mechanism and the electric control mechanism are arranged on two sides of one of the glue spraying stations.
9. The process method of the MEMS chip glue spraying and evening device according to claim 1, which is characterized in that:
step S1: the intelligent mechanical arm places the wafer to be processed on the glue spraying station through the wafer in-out protective opening, transmits a program command to the control cabinet through operating the human-computer interface, and the control cabinet adjusts the X coordinate and the Y coordinate of the nozzle to enable the nozzle to be positioned above the glue spraying area of the wafer;
step S2: adjusting a Z coordinate of a nozzle through a control cabinet, uniformly spraying photoresist on the surface of a wafer, uniformly spraying the photoresist on the surface of the wafer, controlling the photoresist spraying speed of an ultrasonic sprayer through a high-precision flow control valve to realize trace photoresist spraying, and meanwhile, heating the photoresist sprayed by the ultrasonic sprayer through a heating flexible fixing disc;
step S3: the intelligent mechanical arm takes out the processed wafer through the wafer in-out protective opening and places the processed wafer on the feeding and discharging station.
10. The MEMS chip glue spraying and leveling device according to claim 1, wherein: the heating soft solid disc is in an annular shape, and different areas of the heating soft solid disc can be independently controlled.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110327917.2A CN113093473A (en) | 2021-03-26 | 2021-03-26 | MEMS chip glue spraying and homogenizing equipment and technological method thereof |
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| CN202110327917.2A CN113093473A (en) | 2021-03-26 | 2021-03-26 | MEMS chip glue spraying and homogenizing equipment and technological method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515666A (en) * | 2022-01-18 | 2022-05-20 | 深圳大学 | Gluing device and gluing method based on robot |
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| CN114515666A (en) * | 2022-01-18 | 2022-05-20 | 深圳大学 | Gluing device and gluing method based on robot |
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