200825650 九、發明說明： 【發明所屬之技術領域】 種锨机里喷吐監測控制系統，尤指一種應用於微流 i喷吐裝置之監測控制系統，用以精確控制喷吐量。 【先前技術】 微流置喷吐方式在半導體製造的領域中扮演著相當 重要的角色’例如，在㈣製程中，光阻當作被侧薄膜 的罩幕，以保持所需圖案不被餘刻反應去除。而在離子植 入製程中，光阻也具備罩幕的功能，使掺質（D〇pant)只掺 雜到預定區域中。 在微影製程中所使用的光阻是液態，係由光阻塗佈裝 置上的泵浦帶出液態儲存槽内的液態物，然後藉由控制閥 控制其官線上的液態物流出量，使液態物（光阻）自喷嘴喷 吐到晶片表面上。其中晶片係放置於一旋轉塗佈機（Spin Coater)上，利用旋轉塗佈機帶動晶片旋轉，藉由離心力使 光阻能均勻的塗佈到晶片表面上。光阻的材料主要是由樹 月曰、感光劑及溶劑依不同比例混合而成，故光阻的枯滯性 常因樹脂、感光劑及溶劑三者的混合比例不同產生變化。 所以’在光阻塗佈製程中，有時會產生如覆蓋不良 (Poor Coating)與平坦度不佳（Range t〇〇出㊁⑽現象，其問 題包括1·圓心附近的光阻厚度比其他位置高出許多的情 形；2·晶片非圓心之一區域的光阻厚度比其他位置厚的情 形；3·因光阻内部產生氣泡，使光阻不連續塗佈在晶片表 面上，4·晶片邊緣未塗佈光阻。當光阻塗佈具有上述缺陷 6 200825650 時’將導致晶片的良率或可靠度降低，情況嚴重者甚至造 成晶片報廢。 造成上述光阻覆蓋不良與平坦度不佳的原因，除了樹 脂、感光劑及溶劑三者的混合比例問題，或黏滯性改變 外，也會因光阻塗佈裝置情況不佳，導致塗佈到到晶片表 面上的光阻厚度不均勻，如噴吐位置有問題，與噴吐量的 控制。其中噴吐量=足或過量’其主要原因是㈣與控制 閥的控制，尤其是每次I浦所帶出之液體量，將會隨著長 時間的使用而有所誤差，因此經過—段時間的使用後，無 法精確地控制微流量之液體的喷吐量。 叙’若光阻的最大厚度減最小厚度（即平坦度)超過 埃’或在晶片製程過程中’發現上述光阻塗佈缺陷時， =停止機台，並對泵浦與控制閥進行功能測試與調 正。另，習知栗浦與控制閥的功能測試與調整方法係利用 肉眼目測與手按馬錶來進行。當輸出開啟錢給泵浦與控 以㈣管路使光㈣出__下馬錶開始計時， 魏时嘴口，當相光阻不㈣㈣立即按下 *、（亍止物’由馬錶上所顯示的時間可判斷泵浦盥控制 閥的功能是否疋當，十π# 彳同水痛”役制 曰 或可糟由調整此時間以獲得最好的光 =量。但：用肉眼目測與手按馬錶來進行容易產生人 ’、、、决，故無法滿足高精確度光阻的噴吐量要求。 另’對半導體製造而言，因為此類液體都相當昂貴， 成太=使用里不大’但長期的喷吐過量，卻也是會造成 成本晋加；然而’如果液體时吐量不足，卻又會造成塗 7 200825650 _ 佈不足，將導致晶片的良率或可靠度降低，情況嚴重者甚 •至造成晶片報廢。所以，在前述習知的喷吐量監控方式 下，除喷吐量的喷出調整不易外，亦無法時時監控每次的 喷吐量，無法精確的控制每次液體的喷吐量，也就無法控 制製程品質與製造成本。尤其，目前微流量之喷吐裝置並 無監測的機置，當泵浦與控制閥在長期作動後，當其動作 有所誤差或失效時，不能由流量異常來即時反應泵浦與控 制閥的功能異常。 【發明内容】 為解決上述之缺失，避免缺失存在，本發明之目的在 提供一種能精確掌握液態物之喷吐量之監測控制系統，提 高塗佈製程精確度，與塗佈的平坦度，也提高晶片的良率 或可靠度。 為達上述之目的，本發明提出一種微流量喷吐監測控 制系統，該微流量喷吐監測控制系統係應用於微流量喷吐 裝置，該微流量喷吐裝置係由一泵浦吸出一供給槽之液 體，再由一控制閥控制液體由一喷嘴流出之量。本發明之 監測控制系統包括：一微流量感測器，配設在前述控制閥 與喷嘴之間，係用以監測液體之流量；一監控裝置，用以 接收並記錄該微流量感測器傳來之信號，並將該信號做流 量/喷吐量演算及顯示流量/喷吐量狀態，藉由流量/喷吐量 狀態與内部參考數比對，並發出控制信號對該泵浦與控制 閥進行必要之調整；以及一警示裝置，用以接收該監控裝 置之信號，當計算結果偏離正常範圍時發出警示訊息，其 8 200825650 中，該警示裝置包括發光指示或/及聲音指示。 其中，該監控裝置包括：一信號處理模組，其透過一 信號接收器接受該微流量感測器傳來之信號，並將該信號 進行做流量演算及參考值的比對；一互動操作介面，用以 做為該監控裝置之操作介面，與流量/喷吐量狀態之顯示； 一記憶模組，其包含一紀錄模組及一參數模組，該紀錄模 組用以紀錄該信號處理模組流量/喷吐量的演算結果，該參 數模組用以儲存各模組需要之設定值與參考值；以及一控 制模組，用以根據該信號處理模組之演算結果對該泵浦、 控制閥及警示裝置傳送控制信號。 其中，該監控裝置進一步包括一資料傳送模組，用以 將該信號處理模組的流量/喷吐量的演算結果及異常回報 傳至一電腦主機。 【實施方式】 茲有關本發明之詳細内容及技術說明，現以實施例來 作進一步說明，但應瞭解的是，該等實施例僅為例示說明 之用，而不應被解釋為本發明實施之限制。 請參閱「第1圖」所示，係本發明之微流量喷吐監測 控制系統之示意圖。本發明係一種微流量喷吐監測控制系 統，該微流量喷吐監測控制系統係應用於微流量喷吐裝 置，該微流量喷吐裝置係由一泵浦20吸出一供給槽10内 之液體（如光阻），再由一控制閥30控制液體由一喷嘴40 流出之液體量，使液體（如光阻）自喷嘴40喷吐該製程所需 之液體量到晶片表面上，用以進行該製程動作。 9 200825650 本發明之監測控制系統包括：一微流量感測器50，該 微流量感測器50係配設在前述控制閥30與喷嘴40之間， 用以監測液體由該控制閥30流出至該之喷嘴40流量。一 監控裝置60，該監控裝置60係用以接收並記錄該微流量 感測器50傳來其量測之流量信號，其中該微流量感測器 50係監測液體之流量，並將該流量轉換成電壓或電流信號 傳至該監控裝置60。該監控裝置60再將該信號做流量/喷 吐量的演算及顯示流量/喷吐量的狀態，藉由流量/喷吐量 狀態與内部參考數比對，當該流量/喷吐量比對後發現喷嘴 40在單位時間内喷吐之液體量不足或過量時，因為隨著長 時間的使用，該泵浦20與控制閥30所帶出之液體量將會 而有所誤差。例如原本所需之量1.5cc誤差±0.1cc，經過該 監控裝置60計算後，該次的喷吐量誤差超過±0.1cc，表示 該泵浦20與控制閥30的作動對於喷吐量已失去精確，此 時該監控裝置60發出設備異常之信號，並送出控制信號 給該泵浦20與控制閥30，對該泵浦20與控制閥30進行 必要之調整，使液體自喷嘴40喷吐至該製程到晶片表面 之液體量精確。以及一警示裝置80，該警示裝置80係用 以接收該監控裝置60發出之設備異常號之信號，當該監 控裝置60計算結果偏離正常範圍時發出警示訊息，其中 該警示裝置80包括發光指示（如發出一閃爍之紅光）或/ 及聲音指示（如以語音提醒使用者異常狀態）。 請再參閱「第2圖」所示，係本發明之監控裝置之示 意圖。該監控裝置60包括：一信號處理模組63，該信號 200825650 處理模組63透過一信號接收器61接受該微流量感測器傳 來之信號，並將該信號進行做流量/喷吐量的演算及參考值 的比對；一互動操作介面62，用以做為該監控裝置60之 操作介面，與流量/喷吐量之顯示用介面；一記憶模組64， 該記憶模組64包含一紀錄模組641及一參數模組642，該 紀錄模組641用以紀錄該信號處理模組63每次流量/喷吐 量的演算後的結果資料，而該參數模組642係用以儲存該 監控裝置60内各模組需要之設定值與前述之參考值，該 些設定值與參考值係透過該互動操作介面62進行修改與 更新。一控制模組65，該控制模組65根據該信號處理模 組63之演算結果，藉由流量/喷吐量與内部參考數比對， 當該流量/喷吐量比對後發現喷嘴40喷吐之液體量不足或 過量時，對該泵浦20、控制閥30及警示裝置80傳送控制 信號。當該信號處理模組63之演算結果表示此次泵浦20 與控制閥30喷吐量已失去精確度時，該信號處理模組63 送出控制信號給該泵浦20與控制閥30,並對該泵浦20與 控制閥30進行必要之調整，使液體自喷嘴40喷吐至該製 程到晶片表面之液體量精確，而該警示裝置80係用以接 收該監控裝置60發出之設備異常號之信號。 該信號處理模組63内之演算方法係當接受該微流量 感測器傳來之信號，將每次的信號量轉換為當下時間該喷 嘴40喷出之喷吐量，然後將該信號傳至該互動操作介面 62顯示，或直接以坐標軸方式透過圖形顯示一次該喷嘴 40喷吐時間内多次監測所得的當時喷吐量，連接每點監測 11 200825650 所得的喷吐量，形成如「第3、4圖」之曲線圖。而其異 常狀況為，假設每次喷吐後該互動操作介面62顯示之曲 線最高點正常值在信號h0處，而其可誤差上下分別為信 號h2與hi，該些信號（喷吐量）也就是該參數模組642内部 所儲存，針對該次製程每次喷吐結果所需要的參數值設 定。當曲線的最高點高於該信號h2，表示該次的喷吐量過 量，而當曲線的最高點低於該信號hi，表示該次的喷吐量 不足，此時就可對該泵浦20、控制閥30及警示裝置80傳 送控制信號。另對於曲線的斜率（各量測時間點之曲線上的 切線），該信號處理模組63可以即時算出與參考值是否偏 差，而即時透過警示裝置80發出之設備異常號之信號， 使用者可以即時判斷喷吐裝置的好壞，而不至於再繼續後 續晶片的製程，時時監控每次的流量/喷吐量，精確的控制 每次液態物的喷吐量，也就控制製程品質與製造成本。 另，該監控裝置60内進一步可包括一資料傳送模組 66，藉由該資料傳送模組66用以將該信號處理模組63每 次流量/喷吐量的計算結果及異常回報資料傳送到一電腦 主機70。如此遠端之監控者可以透過該電腦主機70與網 路，進行遠端的監測控制，且因為電腦主機70的資料儲 存量可遠大於該記憶模組64的記憶儲存量，所以電腦主 機70可以儲存本發明之微流量喷吐監測控制系統長期監 測之資料，該資料可以供製程長期的分析與應用。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 12 200825650 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 第1圖，係本發明之微流量喷吐監測控制系統之示意 圖。 第2圖，係本發明之監控裝置之示意圖。 第3圖，係本發明之資料記錄之示意圖。 第4圖，係本發明之資料記錄之另一種示意圖。 【主要元件符號說明】 10 :供給槽 20 :泵浦 30 :控制閥 40 :喷嘴 50 :微流量感測器 60 :監控裝置 61 :信號接收器 62 :互動操作介面 63 :信號處理模組 64 :記憶模組 641 :紀錄模組 642 :參數模組 65 :控制模組 66 :資料傳送模組 70 :電腦主機 警示裝置 13 80200825650 IX. INSTRUCTIONS: [Technical field of invention] The spout monitoring control system in a seedling machine, especially a monitoring control system applied to a microfluidic i spitting device, for accurately controlling the amount of spitting. [Prior Art] The micro-flow spouting method plays a very important role in the field of semiconductor manufacturing. For example, in the (four) process, the photoresist is used as a mask for the side film to keep the desired pattern from being reverberated. Remove. In the ion implantation process, the photoresist also has the function of a mask, so that the dopant (D〇pant) is only doped into the predetermined region. The photoresist used in the lithography process is a liquid state, which is pumped out of the liquid storage tank by the pump on the photoresist coating device, and then the liquid flow of the official line is controlled by the control valve. The liquid (photoresist) is ejected from the nozzle onto the surface of the wafer. The wafer is placed on a spin coater, and the wafer is rotated by a spin coater to uniformly apply the photoresist to the surface of the wafer by centrifugal force. The material of the photoresist is mainly composed of a tree scorpion, a sensitizer and a solvent mixed in different proportions, so the stagnation of the photoresist often changes due to the mixing ratio of the resin, the sensitizer and the solvent. Therefore, in the photoresist coating process, Poor Coating and poor flatness sometimes occur (Range t〇〇2(10) phenomenon, and the problem includes that the thickness of the photoresist near the center of the circle is higher than other positions. a lot of situations; 2) the thickness of the photoresist in one of the non-centers of the wafer is thicker than other locations; 3. The bubble is generated inside the photoresist, so that the photoresist is not continuously coated on the surface of the wafer. Coating photoresist. When the photoresist coating has the above defect 6 200825650, 'the yield or reliability of the wafer will be reduced, and the serious situation may even cause the wafer to be scrapped. The reason for the poor coverage and flatness of the above photoresist is caused. In addition to the mixing ratio of the resin, the sensitizer, and the solvent, or the change in viscosity, the photoresist coating device may be uneven in thickness, resulting in uneven thickness of the photoresist applied to the surface of the wafer, such as spitting. There is a problem with the position, and the control of the amount of spout. The amount of spout = foot or excess 'The main reason is (4) and the control of the control valve, especially the amount of liquid brought out by each I pump will be made with the long time There is an error in use, so after a period of time, it is impossible to accurately control the amount of liquid flow of the micro flow. The maximum thickness of the photoresist minus the minimum thickness (ie, flatness) exceeds the angstrom' or in the wafer process. During the process of 'discovering the above-mentioned photoresist coating defects, the machine is stopped and the pump and control valve are functionally tested and adjusted. In addition, the function test and adjustment method of the Lipu and control valves is visually observed by the naked eye. Press the horse table with the hand. When the output opens the money to the pump and control (4) the pipeline makes the light (four) out __ the next time the watch starts, Wei mouth mouth, when the phase light is not (four) (four) immediately press *, (亍The stop 'is judged by the time displayed on the horse watch whether the function of the pump 盥 control valve is jingle, ten π# 彳 水 ” ” ” 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整 调整However, it is difficult to meet the requirements of high-precision photoresist with the naked eye by visual inspection and hand-pressing the horse's watch. It is also difficult for semiconductor manufacturing because such liquids are quite expensive. , Cheng Tai = not very big in use' but long term Excessive vomiting will also cost up; however, 'if the liquid is not enough, it will cause the coating to be insufficient, which will lead to a decrease in the yield or reliability of the wafer. Therefore, in the conventional method of monitoring the amount of discharge, it is not easy to adjust the discharge amount of the discharge amount, and it is impossible to monitor the amount of each discharge at any time, and it is impossible to accurately control the amount of liquid per injection. Control process quality and manufacturing cost. In particular, the current micro-flow spout device does not have a monitoring device. When the pump and control valve are operated for a long time, when the operation is in error or invalid, the flow cannot be immediately reacted. The function of the pump and the control valve is abnormal. SUMMARY OF THE INVENTION In order to solve the above-mentioned defects and avoid the absence of the present invention, the object of the present invention is to provide a monitoring and control system capable of accurately grasping the discharge amount of a liquid substance, and improving the accuracy of the coating process. Flatness with coating also increases wafer yield or reliability. In order to achieve the above object, the present invention provides a micro-flow spout monitoring control system, which is applied to a micro-flow spouting device, which sucks a liquid from a supply tank by a pump, and then The amount of liquid flowing from a nozzle is controlled by a control valve. The monitoring control system of the present invention comprises: a micro flow sensor disposed between the control valve and the nozzle for monitoring the flow of the liquid; and a monitoring device for receiving and recording the micro flow sensor The signal is sent, and the signal is used to calculate the flow/discharge amount and display the flow/discharge status. The flow/discharge status is compared with the internal reference number, and a control signal is issued to perform the necessary operation on the pump and the control valve. And an alerting device for receiving a signal of the monitoring device, and issuing a warning message when the calculation result deviates from a normal range, wherein the warning device includes an illumination indication and/or an audible indication in 2008. The monitoring device includes: a signal processing module that receives a signal transmitted by the micro flow sensor through a signal receiver, and performs the flow calculus and reference value comparison; an interactive operation interface For the display of the operation interface and the flow/discharge status of the monitoring device; a memory module comprising a recording module and a parameter module for recording the signal processing module The calculation result of the flow/discharge amount, the parameter module is used for storing the set value and the reference value required by each module; and a control module for calculating the pump and the control valve according to the calculation result of the signal processing module And the warning device transmits a control signal. The monitoring device further includes a data transmission module for transmitting the calculation result of the flow/discharge amount of the signal processing module and the abnormal return to a computer host. The embodiments and the technical description of the present invention are further described in the following examples, but it should be understood that the embodiments are merely illustrative and should not be construed as being The limit. Please refer to Fig. 1 for a schematic diagram of the micro flow ejection monitoring control system of the present invention. The invention relates to a micro-flow spout monitoring control system, which is applied to a micro-flow spouting device, which sucks a liquid (such as a photoresist) in a supply tank 10 by a pump 20. Then, a control valve 30 controls the amount of liquid flowing out of the nozzle 40, so that a liquid (such as a photoresist) ejects the amount of liquid required for the process from the nozzle 40 onto the surface of the wafer for performing the process. 9 200825650 The monitoring control system of the present invention comprises: a micro flow sensor 50 disposed between the aforementioned control valve 30 and the nozzle 40 for monitoring the flow of liquid from the control valve 30 to The nozzle 40 has a flow rate. a monitoring device 60 for receiving and recording the measured flow signal sent by the micro flow sensor 50, wherein the micro flow sensor 50 monitors the flow of the liquid and converts the flow A voltage or current signal is transmitted to the monitoring device 60. The monitoring device 60 further performs the calculation of the flow rate/discharge amount and the state of the flow rate/discharge amount, and compares the flow/discharge amount state with the internal reference number. When the flow rate/discharge amount is compared, the nozzle 40 is found. When the amount of liquid spouted per unit time is insufficient or excessive, the amount of liquid carried by the pump 20 and the control valve 30 will be inaccurate with the use for a long period of time. For example, the amount of 1.5 cc error ± 0.1 cc originally required, after the calculation by the monitoring device 60, the error of the ejection amount exceeds ± 0.1 cc, indicating that the operation of the pump 20 and the control valve 30 has lost accuracy for the ejection amount. At this time, the monitoring device 60 sends a signal indicating that the device is abnormal, and sends a control signal to the pump 20 and the control valve 30, and the pump 20 and the control valve 30 are adjusted as necessary to cause the liquid to be ejected from the nozzle 40 to the process. The amount of liquid on the surface of the wafer is accurate. And a warning device 80 for receiving a signal of the device abnormal number sent by the monitoring device 60, and sending an alert message when the monitoring device 60 calculates a deviation from the normal range, wherein the alert device 80 includes an illumination indication ( For example, a flashing red light or / and an audible indication (such as a voice to alert the user to an abnormal state). Please refer to the "Fig. 2" for the purpose of the monitoring device of the present invention. The monitoring device 60 includes a signal processing module 63. The signal 200825650 processing module 63 receives the signal from the micro-flow sensor through a signal receiver 61, and performs the calculation of the flow/discharge amount. And an alignment of the reference value; an interactive operation interface 62 for use as an interface for the operation of the monitoring device 60, and a display interface for the flow/discharge amount; a memory module 64, the memory module 64 including a recording module The group 641 and a parameter module 642 are used to record the result of the calculation of the flow/discharge amount of the signal processing module 63. The parameter module 642 is used to store the monitoring device 60. The set values required by each module and the aforementioned reference values are modified and updated through the interactive operation interface 62. a control module 65, the control module 65 compares the flow/discharge amount with the internal reference number according to the calculation result of the signal processing module 63, and finds the liquid discharged by the nozzle 40 when the flow/discharge amount is compared. When the amount is insufficient or excessive, a control signal is transmitted to the pump 20, the control valve 30, and the warning device 80. When the calculation result of the signal processing module 63 indicates that the pump 20 and the control valve 30 have lost the accuracy, the signal processing module 63 sends a control signal to the pump 20 and the control valve 30, and The pump 20 and the control valve 30 are adjusted as necessary to accurately discharge the liquid from the nozzle 40 to the surface of the wafer to the wafer surface, and the warning device 80 is configured to receive a signal of the device abnormal number issued by the monitoring device 60. The calculation method in the signal processing module 63 is to receive the signal from the micro flow sensor, convert each semaphore into the amount of ejection of the nozzle 40 at the current time, and then transmit the signal to the signal. The interactive operation interface 62 displays, or directly displays the current discharge amount of the nozzle 40 in the ejection time by the coordinate mode, and connects the discharge amount of each point monitoring 11 200825650 to form a "Fig. 3, 4". The graph of "". The abnormal condition is that the normal value of the highest point of the curve displayed by the interactive operation interface 62 after each ejection is at the signal h0, and the upper and lower errors of the error are the signals h2 and hi, respectively, and the signals (the amount of ejection) are The parameter module 642 stores the parameter values set for each ejection of the process. When the highest point of the curve is higher than the signal h2, it means that the amount of ejection is excessive, and when the highest point of the curve is lower than the signal hi, it means that the amount of ejection is insufficient, and the pump 20 can be controlled at this time. Valve 30 and warning device 80 transmit control signals. In addition, for the slope of the curve (the tangent on the curve of each measurement time point), the signal processing module 63 can immediately calculate whether the deviation from the reference value is instantaneous, and the signal of the device abnormal number sent by the warning device 80 is immediately available, and the user can Instantly judge the quality of the spout device, and not continue the subsequent wafer process, monitor each flow/spray amount from time to time, accurately control the amount of liquid per liquid, and control the process quality and manufacturing cost. Further, the monitoring device 60 further includes a data transmission module 66 for transmitting the calculation result of the flow/discharge amount and the abnormal return data to the signal processing module 63. Computer host 70. The remote monitoring device can perform remote monitoring control through the computer host 70 and the network, and because the data storage capacity of the computer host 70 can be much larger than the memory storage capacity of the memory module 64, the computer host 70 can The data for long-term monitoring of the micro-flow spout monitoring control system of the present invention is stored, and the data can be used for long-term analysis and application of the process. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the scope of the invention and the description of the invention is as follows. Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a micro flow ejection monitoring control system of the present invention. Figure 2 is a schematic view of the monitoring device of the present invention. Figure 3 is a schematic representation of the data record of the present invention. Figure 4 is another schematic diagram of the data record of the present invention. [Main component symbol description] 10: Supply tank 20: Pump 30: Control valve 40: Nozzle 50: Micro flow sensor 60: Monitoring device 61: Signal receiver 62: Interactive operation interface 63: Signal processing module 64: Memory module 641: recording module 642: parameter module 65: control module 66: data transmission module 70: computer host warning device 13 80