CN201185186Y - Mechanism apparatus for sorting and carrying wafer - Google Patents
Mechanism apparatus for sorting and carrying wafer Download PDFInfo
- Publication number
- CN201185186Y CN201185186Y CNU2007201308994U CN200720130899U CN201185186Y CN 201185186 Y CN201185186 Y CN 201185186Y CN U2007201308994 U CNU2007201308994 U CN U2007201308994U CN 200720130899 U CN200720130899 U CN 200720130899U CN 201185186 Y CN201185186 Y CN 201185186Y
- Authority
- CN
- China
- Prior art keywords
- contiguous block
- slide block
- wafer
- manipulator
- linear bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to a chip sorting carrying mechanism device which consists of a manipulator, a stepping motor, a synchronous wheel, a manipulator arm, a high-precision slide block, a connection block A, a connection block B, a linear bearing, a connection bracket, an outer side plate and a subpressure sucker; the stepping motor drives the synchronous wheel; the manipulator arm is arranged on the shaft of the synchronous wheel; the bearing of the manipulator arm is fixed on the connection block A; the connection block A is connected with the front end of the high-precision slide block and the connection bracket for fixing the manipulator; the connection block A slides on the vertical track of the high-precision slide block; the back end of the high-precision slide block is fixed on the connection block B; the connection B slides on the linear bearing; the linear bearing is fixed on the outer side plate. The stepping motor drives the synchronous wheel; the manipulator arm is arranged on the shaft of the synchronous wheel and rotates along the shaft by 180 degrees to drive the high-precision slide block to move up and down; the connection B moves left and right on the linear bearing; simultaneously the manipulator makes arc motion of 180 degrees correspondingly to suck or drop a chip.
Description
One, technical field
The utility model relates to the sorting Handling device of the slim and microminiature wafer of a kind of carrying mechanism device, especially smd to wafer separation.
Two, background technology
Develop rapidly along with applying electronic produce markets such as communication apparatus, mobile phone, computer, household electrical appliances and networks, the market demand of quartz crystal components and parts is growing, SMD is slim with the thickness of microminiature wafer even below 0.1 millimeter, long and wide minimum dimension is the 1-2 millimeter, can't adopt traditional method of measurement to carry out sorting.
The applicant had applied for that for example Chinese patent CN00240759.0 quartz wafer was located frequency measurement sorting unit, CN03278891.6 sheet type piezoelectric ceramic and the automatic locating test device of related device automatically to the automatic system of measuring of wafer.Existing wafer separation equipment adopts dynamic wafer transfer mode: deliver to straight line feeder after through feeding screw scattered wafer being arranged, measure by measurement mechanisms such as oscillators.The signal that obtains is handled through delivering to behind the counter in the computer.After the result treatment of computer according to counting, by the display display result and control the blanking part, wafer is sent in the magazine of setting.This dynamic transfer causes lamination, the punching phenomenon of wafer easily, can't be to wafer, and especially smd is slim measures accurately with the microminiature wafer, thereby causes the test mass of whole system can not guarantee that operating efficiency is low.Carrying therefore slim at smd and the microminiature wafer needs special-purpose sorting Handling device.
Three, summary of the invention
The utility model purpose is: propose special-purpose Handling device in the sorting test process of the slim and microminiature wafer of a kind of smd, be subordinated to the automatic testing, sorting device of the slim and microminiature wafer of smd, realize wafer accurately, fast, transport automatically reliably, satisfy the requirement of later process, improve the measuring accuracy of entire equipment.
The technical solution of the utility model is: wafer separation carrying mechanism device, by manipulator, stepping motor, synchronizing wheel, mechanical arm, the high accuracy slide block, first contiguous block (contiguous block A), second contiguous block (contiguous block B), linear bearing, connect support, outer panel, the negative pressure suction nozzle constitutes, the step motor drive synchronizing wheel, mechanical arm is contained on the synchronous wheel shaft, the mechanical arm bearing fixing is on contiguous block A, contiguous block A links to each other with the front end of high accuracy slide block and the support that is connected of solid mechanical hand, contiguous block A slides on the vertical track of high accuracy slide block, the rear end of high accuracy slide block is fixed on the contiguous block B, contiguous block B slides on linear bearing, and linear bearing is fixed on the outer panel.The step motor drive synchronizing wheel, the mechanical arm that mechanical arm is contained on the synchronous wheel shaft rotates around axle 180 degree, drive high accuracy slide block moves up and down, contiguous block B side-to-side movement on linear bearing, and manipulator is just correspondingly done the circular motions absorption of 180 degree or put down wafer simultaneously.
Described manipulator is the negative pressure suction nozzle of adhesive wafer, carries out the measurement of various parameters by index dial transferring plates to corresponding station then.Described manipulator is done 180 circular motions of spending around axle, carries out carrying wafers to the 180 degree position with 0 degree position.The start angle of manipulator circular motion is controlled by two photoelectric sensors.When manipulator arrived 0 degree position, photoelectric sensor was controlled its stop motion, draws wafer; When manipulator arrived 180 degree positions, photoelectric sensor was controlled its stop motion, puts down wafer.
The utility model mechanism is the carrying wafers structure function device before being used to measure, the wafer that is about to the last process transmission is transferred on the index dial of next procedure accurately, reliably, safely by manipulator, and the index dial carry wafer is displaced to the measurement station and measures.The utility model mechanism can conveniently finish this operation.
The beneficial effects of the utility model are: this device for mechanical transmission accuracy height, and accurate positioning, reliable operation, and simple in structure, easy to adjust, be an organic link of whole sorting work flow process.Punching, biplate phenomenon in the wafer handling are avoided in the carrying of employing manipulator, have guaranteed the monolithic test of wafer, thereby strengthen stability, the reliability of complete machine work.
Four, description of drawings
Fig. 1 be the utility model back structural representation,
Fig. 2 is the utility model front structure schematic diagram
1, stepping motor, 2, synchronizing wheel A, 3, synchronous belt, 4, synchronizing wheel B, 5, regulating wheel, 6, suction nozzle connects support, 7, suction nozzle, 8, mechanical arm, 9, linear bearing, 10, slide block, 11, photoelectric sensor, 12, outer panel, 13, base, 14, i.e. first contiguous block of contiguous block A, 15, i.e. second contiguous block of contiguous block B.
Five, embodiment
As shown in Figure 1, be provided with an independently manipulator Handling device, constitute wafer and accurately measure to carrying also automatically from sorting.Drive second synchronizing wheel (synchronizing wheel B) 4 by stepping motor 1 by first synchronizing wheel (synchronizing wheel A) 2, synchronous belt 3, and be provided with regulating wheel 5 assurances synchronously, mechanical arm is contained on the synchronous wheel shaft B, the mechanical arm bearing fixing is on contiguous block A, the front end of contiguous block A and high accuracy slide block and solid mechanical hand are that the support 7 that is connected of suction nozzle 7 links to each other, high accuracy slide block 10 slides on the vertical track of contiguous block A14, the rear end of high accuracy slide block is fixed on the contiguous block B, contiguous block B15 slides on linear bearing 9, and linear bearing is fixed on the outer panel.The circular arc action of 180 degree of manipulator is finished by step motor drive.Contrary, clockwise 180 degree of stepping motor rotate, synchronizing wheel A on it drives synchronizing wheel B rotation by belt, mechanical arm on the synchronizing wheel B axle just back and forth rotates around axle 180 degree, and drive and to fix the high accuracy slide block knee-action on it, contiguous block B side-to-side movement on linear bearing of slide block rear end, manipulator is then done circular motion and is inhaled, puts wafer.The negative pressure suction nozzle is connected to electromagnetically operated valve by tracheae, and electromagnetically operated valve is controlled turnover gas mode.When 0 degree position, the solenoid control suction nozzle produces negative pressure, and after the negative-pressure vacuum degree reached set point, manipulator was drawn wafer; When 180 degree positions, the solenoid control suction nozzle produces malleation, and manipulator puts down wafer, closes the malleation of suction nozzle.
Feeding screw carries out ordered queue with wafer to be measured at random, be delivered to the end of straight line feeder, when the B/P EGR Back Pressure Transducer EGR that is fixed on the straight line feeder end has been sensed wafer, send the signal controlling straight line feeder by interface circuit and stop vibration, at this moment, Single Chip Microcomputer (SCM) program control manipulator is inhaled sheet, to the straight line feeder end, photoelectric sensor is controlled its stop motion to manipulator from the downward movement in a curve of holding fix, draws wafer, then upwards do 180 degree circular motions to index dial film releasing station, photoelectric sensor is controlled its stop motion, puts down wafer, and manipulator continues circular motion to holding fix then, wait for and draw next wafer, and so forth.And the wafer on the index dial continues to be displaced to test position, carries out parameter measurements such as frequency.
Claims (3)
1, wafer separation carrying mechanism device, it is characterized in that by manipulator, stepping motor, synchronizing wheel, mechanical arm, the high accuracy slide block, first contiguous block (14), second contiguous block (15), linear bearing, connect support, outer panel, the negative pressure suction nozzle constitutes, the step motor drive synchronizing wheel, mechanical arm is contained on the synchronous wheel shaft, the mechanical arm bearing fixing is on first contiguous block, first contiguous block links to each other with the front end of high accuracy slide block and the support that is connected of solid mechanical hand, first contiguous block slides on the vertical track of high accuracy slide block, the rear end of high accuracy slide block is fixed on second contiguous block, second contiguous block slides on linear bearing, and linear bearing is fixed on the outer panel; The step motor drive synchronizing wheel, the mechanical arm that mechanical arm is contained on the synchronous wheel shaft rotates around axle 180 degree, drive high accuracy slide block moves up and down, the side-to-side movement on linear bearing of second contiguous block, and manipulator is just correspondingly done the circular motions absorption of 180 degree or put down wafer simultaneously.
2, wafer separation carrying mechanism device according to claim 1 is characterized in that: first synchronizing wheel (2) top of stepping motor is provided with big second synchronizing wheel (4), and they link to each other by synchronous belt (3); The axle of second synchronizing wheel is provided with a mechanical arm that sways.
3, wafer separation carrying mechanism device according to claim 1 is characterized in that: described manipulator is the negative pressure suction nozzle of adhesive wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201308994U CN201185186Y (en) | 2007-12-12 | 2007-12-12 | Mechanism apparatus for sorting and carrying wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201308994U CN201185186Y (en) | 2007-12-12 | 2007-12-12 | Mechanism apparatus for sorting and carrying wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201185186Y true CN201185186Y (en) | 2009-01-21 |
Family
ID=40272919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201308994U Expired - Fee Related CN201185186Y (en) | 2007-12-12 | 2007-12-12 | Mechanism apparatus for sorting and carrying wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201185186Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324449A (en) * | 2011-08-23 | 2012-01-18 | 广东志成华科光电设备有限公司 | Chip turning device for surface-mounted device (SMD) light-emitting diode (LED) patch light splitting machine |
| CN102658551A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Chip transfer manipulator |
| CN104112788A (en) * | 2013-04-16 | 2014-10-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer inserting device |
| CN109822419A (en) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | Wafer transfer device and wafer transfer method |
| CN113093473A (en) * | 2021-03-26 | 2021-07-09 | 硅芯崟科技(苏州)有限公司 | MEMS chip glue spraying and homogenizing equipment and technological method thereof |
-
2007
- 2007-12-12 CN CNU2007201308994U patent/CN201185186Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324449A (en) * | 2011-08-23 | 2012-01-18 | 广东志成华科光电设备有限公司 | Chip turning device for surface-mounted device (SMD) light-emitting diode (LED) patch light splitting machine |
| CN102324449B (en) * | 2011-08-23 | 2013-05-15 | 广东志成华科光电设备有限公司 | Chip turning device for surface-mounted device (SMD) light-emitting diode (LED) patch light splitting machine |
| CN102658551A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Chip transfer manipulator |
| CN102658551B (en) * | 2012-05-18 | 2014-04-16 | 山东理工大学 | Chip transfer manipulator |
| CN104112788A (en) * | 2013-04-16 | 2014-10-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer inserting device |
| CN109822419A (en) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | Wafer transfer device and wafer transfer method |
| CN113093473A (en) * | 2021-03-26 | 2021-07-09 | 硅芯崟科技(苏州)有限公司 | MEMS chip glue spraying and homogenizing equipment and technological method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090121 Termination date: 20151212 |
|
| EXPY | Termination of patent right or utility model |