CN113088082B - 用于高温绝缘应用的硅树脂复合物 - Google Patents
用于高温绝缘应用的硅树脂复合物 Download PDFInfo
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- CN113088082B CN113088082B CN202110006199.9A CN202110006199A CN113088082B CN 113088082 B CN113088082 B CN 113088082B CN 202110006199 A CN202110006199 A CN 202110006199A CN 113088082 B CN113088082 B CN 113088082B
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- Prior art keywords
- silicone
- composite
- insulating layer
- metal portion
- inorganic filler
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 76
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- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 33
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 12
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
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- LCCNCVORNKJIRZ-UHFFFAOYSA-N parathion Chemical compound CCOP(=S)(OCC)OC1=CC=C([N+]([O-])=O)C=C1 LCCNCVORNKJIRZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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Abstract
公开了一种用于高温绝缘应用的硅树脂复合物。该复合物由混合在一起的硅树脂和可热分解的无机填料形成。然后将复合材料注射模制,包覆模制,压缩模制,浇铸,层压,挤出或分配。当硅树脂复合物暴露于高温时,它会形成无机复合物,并保持其绝缘性能和尺寸稳定性。
Description
技术领域
本发明涉及包含硅树脂和无机填料的硅树脂复合物,其中当硅树脂复合物暴露于高温下时,硅树脂复合物形成至少一部分无机复合物并保持其尺寸稳定性。
背景技术
有许多需要绝缘的应用可以承受高温。陶瓷或玻璃材料通常用作高温绝缘材料。陶瓷或玻璃材料也相对刚性和坚硬,由于其刚性和硬度而不能容易地用于许多应用中。这些材料比较脆,不能用于有振动力的应用中。此外,这些陶瓷或玻璃材料比其他材料具有更高的制造成本。
塑料材料包括宽范围的合成或半合成有机化合物。塑料材料通常是可延展的,可以轻松地模制成固体物体。塑料通常在低温(通常低于300℃)下具有良好的绝缘性能,并且不能在高温下用作绝缘材料。塑料材料的制造成本通常低于陶瓷或玻璃材料。
硅树脂复合物由于其物理和电学性能已在许多领域用作绝缘材料。已知用硅树脂橡胶或硅树脂复合物覆盖的电线和电缆具有改善的物理强度以及改善的电绝缘性能。但是,这些由硅树脂橡胶或硅树脂复合物制成的电线或电缆覆盖物在暴露于高于500℃的高温时会燃烧掉,从而导致电绝缘性能以及机械稳定性下降或损失。因此,这些硅树脂复合物不适用于复合物应保持其形状、具有足够强度并保持电绝缘的高温应用。
美国专利第4,269,753号(Mine等人)描述了一种硅氧烷复合物,该硅氧烷复合物可以在正常的固化温度时转化成弹性体或树脂,但是在烧到更高的温度时会陶瓷化,从而得到具有电绝缘性能和优异物理性能的柔性陶瓷。该复合物基本上由以下构成:(a)100重量份的硅氧烷共聚物,其基本上由R3SiO1/2单元组成,其中R是每分子具有1-10个碳原子并且包含至少两个不饱和基团和与硅原子键合的至少两个烷氧基的一价有机基团,(b)0-600重量份的直链或支链有机聚硅氧烷聚合物,其每分子具有与硅原子键合的至少两个不饱和基团,(c)每分子具有与硅原子键合的至少两个氢原子的有机聚硅氧烷,(d)3-300重量份的陶瓷形成填料物质,和(e)催化量的加成反应催化剂,其中在组分(a)、(b)和(c)中,与硅原子键合的氢原子和与硅键合的不饱和基团的摩尔比为0.5/1至10/1,并且组分(a)和组分(b)中不饱和基团的总数与组分(c)中的与硅原子键合的氢原子总数为至少5。当用该复合物涂覆固体基材并加热到500℃或更高时,它会形成陶瓷。陶瓷成形填料物质是不可热分解的。
J Mater Sci,42(15),6046-6055,2007年8月的文章“Investigation ofCeramifying Process of Modified Silicone-Silicate Compositions”描述了在硅树脂基复合物中添加玻璃料以改善高温下的低温陶瓷化。该文章得出结论,玻璃料在低于云母-硅共晶温度的温度下熔化,并与硅树脂橡胶的无机填料和热解产物结合,以帮助形成陶瓷。玻璃料与填料和二氧化硅基体反应形成液体中间相,该液体中间相将填料和二氧化硅基体粘结在一起,从而使炭强度提高。
国际公开号WO2010/097705 A1(Nexans)描述了一种防火材料和包括该材料的电缆。该公开描述了一种防火材料,该防火材料包括含有硅树脂聚合物的聚合物和碳酸钙填料,其特征在于,碳酸钙填料以在该材料暴露于火后留下燃烧后残留物的量存在于该材料中,所述材料包括相对于100重量份的聚合物的少于50重量份的可陶瓷化的填料。碳酸钙具有约840℃的高分解温度。该混合物在暴露于火时分解,以提供保护层。
International Polymer Science and Technology,43(4),T33-T40,2016年4月的文章“The Thermal Stabilisation and Ceramifying of Silicone Rubbers”讨论了寻找添加剂、填料和催化剂的需求,这些添加剂、填料和催化剂可显着提高硅氧烷弹性体复合物在高于300℃的温度下的使用寿命,或通过燃烧过程促进陶瓷状材料的形成。硅树脂橡胶具有很高的耐热性,在热降解或燃烧时不会释放有毒产品。将添加剂、填料和催化剂添加到硅树脂橡胶中,然后在常规挤压设备上进行加工,以形成片材、型材或涂层。在有火的条件下,可以由复合物形成耐火陶瓷。这些复合物中许多都使用铂作为添加剂来提高阻燃性。该文章还描述了一种制造电缆的方法,该电缆具有基于硅树脂弹性体、碳酸钙和其他玻璃形成填料的陶瓷化硅护套。当暴露于火焰中时,护套分解,在引线上提供保护层或电绝缘层。
因此,提供可用于高温应用的硅树脂复合物将是有益的。优选地,提供在500℃下约至少15分钟内和在1200℃下约至少10秒内,或在500℃下约至少30分钟内和在1200℃至少10秒内,能保持其绝缘性能并具有良好的尺寸稳定性的硅树脂复合物将是有益的。最优选地,提供这样的硅树脂复合物将是有益的,该硅树脂复合物可以在不使用燃烧过程形成所述复合物的情况下以良好的尺寸稳定性保持其绝缘性能。此外,提供一种形成可用于高温应用的硅树脂复合物的方法以及由这种硅树脂复合物形成的制品将是有益的。
发明内容
一个实施例涉及具有可热分解的无机填料的硅树脂复合物,其可以被加工并且可以用于高温绝缘应用,由此当硅树脂复合物暴露于高温时,其形成至少一部分无机复合物,同时保持其强度和形状,收缩率不超过25%。
一个实施例涉及一种包括第一金属部分、第二金属部分、可选的聚合物层和绝缘层的设备,其中第一金属部分和第二金属部分彼此隔开,其中聚合物层和/或绝缘层在第一金属层和第二金属层之间,并且绝缘层在空间上在聚合物层和金属部分之一之间或在两个金属部分之间,其中所述绝缘层是包含硅树脂和无机填料的硅树脂复合物,其可以在500℃或更低的温度下分解。
一个实施例涉及一种连接器、电路保护装置、继电器装置、电池组、配电单元或电池断开单元,其包括第一金属部分、第二金属部分、可选的聚合物层和绝缘层,其中第一金属部分和第二金属部分彼此隔开,而聚合物层在空间上位于第一金属部分和第二金属部分之间,并且绝缘层在空间上位于聚合物层和金属部分之一之间或两个金属部分之间,其中所述绝缘层是包含硅树脂和无机填料的硅树脂复合物,其可以在500℃或更低的温度下分解。
通过以下结合附图的更详细描述,本发明的其他特征和优点将变得显而易见,附图以示例的方式示出了本发明的原理。
附图说明
图1是流程图,示出了用于形成硅树脂复合物的步骤。
图2是流程图,示出了将硅树脂复合物转化为可以承受高温同时保持其强度和尺寸稳定性的无机复合物的过程。
图3是含有无机填料的硅树脂复合物的模制样品的照片。
图4是在没有负载的情况下经受高温三十分钟的含有无机填料的硅树脂复合物的模制样品的照片。
图5是在负载下经受高温三十分钟的含有无机填料的硅树脂复合物的模制样品的照片。
图6是在负载下经受高温六十分钟的含有无机填料的硅树脂复合物的模制样品的照片。
图7是在无负载下经受1200℃一分钟的含有无机填料的硅树脂复合物的模制样品的照片。
图8是在无负载下经受1200℃一分钟的耐高温聚合物材料的比较性模制样品的照片。
图9是含有无机填料的环氧复合物的比较性模制样品的照片。
图10是经受高温和负荷三十分钟的环氧复合物的比较性模制样品的照片。
图11是含有无机填料的聚烯烃复合物的比较性模制样品的照片。
图12是在有负荷和无负荷两种情况下经受高温的含有无机填料的聚烯烃的比较性模制样品的照片。
图13(a)至13(f)示出了用于形成根据本发明的设备的金属、聚合物和绝缘层的层的可能构造的示意图。
具体实施方式
旨在结合附图阅读根据本发明原理的说明性实施例的描述,这些附图应被认为是整个书面描述的一部分。在本文公开的本发明的实施例的描述中,对方向或取向的任何引用仅旨在描述的方便,而不意图以任何方式限制本发明的范围。相对术语,例如“下部”,“上部”,“水平”,“竖直”,“上方”,“下方”,“向上”,“向下”,“顶部”和“底部”及其派生词(例如,“水平地”,“向下地”,“向上地”等)应解释为是指如当时所描述的取向或在所讨论的附图中所示的取向。这些相对术语仅是为了描述的方便,并且不需要以特定的取向构造或操作该设备,除非明确地指出。诸如“附接”,“固定”,“连接”,“联接”,“互连”等类似的术语是指这样的关系,其中结构直接地或通过中间结构间接地彼此固定或附接,以及可移动或刚性的附接或关系,除非另有明确说明。
而且,本发明的特征和优点通过参考优选实施例来说明。因此,本发明明确地不应限于示出可以单独存在或以特征的其他组合存在的特征的一些可能的非限制性组合的实施例,本发明的范围由所附权利要求书限定。
提供了一种新的绝缘材料,其能够在450℃、500℃或650℃下在至少5分钟、10分钟、15分钟、30分钟或60分钟内以及在1100℃、1200℃或1300℃下在至少5秒、10秒、20秒、30秒或60秒内保持其绝缘性能同时保持良好的尺寸稳定性。该新的绝缘材料能够提供与塑料、玻璃和陶瓷类似的绝缘性能。在一个实施例中,这种新的绝缘材料是柔性的,其硬度不高于肖氏D90,包括不高于肖氏D 70,不高于肖氏D 50,可模制并且比陶瓷或玻璃更容易制造,且成本低得多。取决于其最终用途,可以将绝缘材料模制,浇铸,层压,挤压或分配成不同的形状。此外,这种新绝缘材料具有塑料、陶瓷或玻璃的综合性能。由于硅树脂的固有特性,该新型绝缘材料比大多数塑料更具柔韧性,并且在暴露于高温后,它可以保持如陶瓷的形状和强度。新型绝缘层由硅树脂复合物形成。
这种新型硅树脂复合物由硅树脂聚合物和无机填料形成。这种新颖的硅树脂复合物当暴露于高温时,将硅树脂复合物转化为至少一部分无机复合物,并且可以在需要稳定绝缘材料的应用中用作绝缘材料。在一些实施方案中,硅树脂复合物可以在500℃及以上的温度下转化成至少一部分无机复合物。在其他实施方案中,硅树脂复合物可以在不超过500℃的温度下,例如在大约350℃到小于500℃的温度下,包括从400℃到低于500℃的温度,转变成至少一部分无机复合物。这种低温转化的无机复合物将帮助硅树脂复合物在大约500℃至大约1300℃的非常宽的温度范围内保持良好的尺寸稳定性。在一个具体的实施方案中,通过加热复合物完成转化。没有使用火焰、火或其他燃烧过程。在该实施方案中,转化过程也不具有液体中间状态。这对于在下文中讨论的某些将压力施加在绝缘硅树脂复合物上的应用非常重要。在特定的实施例中,硅树脂复合物不含玻璃料。
用于硅树脂复合物中的硅树脂可以是任何硅树脂弹性体或包含由硅和氧原子交替组成的链的聚合物。它可以是液体硅橡胶(LSR),高稠度橡胶(HCR),氟硅树脂,多面体低聚倍半硅氧烷(POSS),硅树脂聚酰胺,硅树脂聚氨酯,硅树脂环氧和其他硅树脂。合适的硅树脂的示例是GE Silicones的LSR 2660和LSR7060。所用硅树脂的类型取决于最终应用。取决于最终所需的最终用途,用于硅树脂复合物的硅树脂还可包含其他添加剂。合适的添加剂的示例包括热解法二氧化硅,抗氧化剂,助焊剂或催化剂。合适的抗氧化剂包括酚抗氧化剂或胺抗氧化剂。合适的助熔剂的示例包括NH4F,NH4Cl和Na2B4O7。可以使用的可能的催化剂包括过氧化物或铂催化剂。
然后将硅氧烷与无机填料混合。可以使用任何已知的混合装置将硅树脂与无机填料混合以形成均匀的混合物。混合装置的例子包括FlackTek速度混合器,Ross混合器,kneader混合器,两辊混合器,三辊研磨机或任何其他可将两种材料混合的装置。
本发明中使用的无机填料可以是任何无机填料。优选地,无机填料可以在500℃或更低的温度下分解。可以使用的可能的无机填料的例子包括但不限于氢氧化镁,碳酸镁,氢氧化钙,碳酸氢钠,碳酸氢钾,氢氧化铝及其混合物。无机填料占硅树脂复合物的约10wt.%至约90wt.%,优选约30wt.%至约90wt.%,或约50wt.%至约85wt.%。最优选地,由于它们的阻燃特性,使用了氢氧化镁和氢氧化铝。在一个实施方案中,按重量优选使用至少30%的氢氧化镁或氢氧化铝来达到期望的结果。无机填料的粒度优选为20微米或更小,10微米或更小,更优选5微米或更小,最优选3微米或更小。具体地,对于氢氧化镁,粒径为10微米或更小,更优选5微米或更小,最优选3微米或更小。
一旦硅树脂和无机填料混合,就将它们加工成具有所需形状的加工复合物。任何常规的模制,浇铸,层压,挤出或分配过程都可用于获得所需形状的加工复合物。合适的模制工艺的例子包括注射模制,包覆模制或压缩模制。在一些实施例中,将混合的硅树脂和无机填料分配成期望的形状。
然后将加工复合物固化以产生硅树脂复合物。尽管优选在约50-200℃的温度范围内固化复合物,但是固化可在室温下进行。所使用的固化类型以及固化条件取决于所用硅树脂的类型。例如,硅树脂复合物可以通过湿气,紫外线或通过将复合物暴露于高温来固化。
硅树脂复合物可用于多种应用。硅树脂复合物是柔性的和可模制的。根据本发明形成的硅树脂复合物,当暴露于高达1300℃的高温下时,保持其形状、强度和尺寸稳定性,收缩率不超过25%,包括收缩率不超过20%,或者不超过15%。期望存在膨胀而不是收缩。在本发明中,任何尺寸上的膨胀都不被认为是尺寸稳定性变化。硅树脂复合物在5x104 N/平方米的负载下保持其形状,包括在大于500℃的温度下不超过1x104 N/平方米或不超过1x103 N/平方米。一旦将硅树脂复合物暴露于高温,而不受任何理论的限制,据信会发生两个另外的反应。首先,将硅树脂复合物中的硅树脂还原为氧化硅(SiOx)。然后该氧化硅与无机填料或其分解的组分反应,从而形成无机复合物。该无机复合物具有优异的尺寸稳定性,强度和绝缘性能。
本发明的另一方面是使用硅树脂复合物形成的设备。在一个实施例中,该设备包括第一金属部分,第二金属部分,可选的聚合物层和包含本发明的硅树脂复合物的绝缘层。聚合物层可以是可以形成所需形状和厚度的任何聚合物层。聚合物层可以选自包括以下的组:聚对苯二甲酸丁二酯(PBT),尼龙,聚对苯二甲酸乙二酯(PET),聚苯硫醚(PPS),聚醚酰亚胺(PEI),聚醚醚酮(PEEK),聚碳酸酯(PC)和丙烯腈丁二烯苯乙烯(ABS)。第一金属部分和第二金属部分彼此分离。聚合物层在空间上位于第一和第二金属部分之间。则绝缘层可以在聚合物层与金属部分中的至少一个之间,或如果没有聚合物层,绝缘层可以在两个金属部分之间。可替代地,可以在两个金属层和绝缘层之间设置气隙。
图13(a)-13(f)是由硅树脂复合物形成的设备的各种实施例的示意图。从各种实施例可以看出,1和2是金属部分,3是聚合物层,而4是绝缘层。应当注意,各部分和各层不需要彼此接触。换句话说,例如在图13(e)中所示,在部分或层之间可以存在气隙。其他实施例也是可能的,只要实施例包括本文所述的硅树脂复合物。金属层可以由任何合适的金属制成。合适的金属的例子包括铜,铜合金,铝或铝合金。设备的绝缘层是硅树脂复合物。该设备的绝缘层的厚度例如小于5mm,包括小于2mm,包括小于1mm。硅树脂复合物包含硅树脂和无机填料,其可以在500℃或更低的温度下分解。当绝缘层暴露于高温时,硅树脂复合物形成具有良好尺寸稳定性的至少一部分无机复合物。该设备例如可以是连接器,电路保护装置,继电器装置或电池组。具有该所需质量的任何其他类型的设备都可以由该硅树脂复合物制成。
硅树脂复合物可用于任何需要机械强度和电气绝缘的应用中,其中硅树脂复合物要暴露于高温。复合物的尺寸取决于最终用途。此外,加工条件还取决于复合物的最终用途。例如,本发明的硅树脂复合物可以用在牵引电池中以使用于电池连接的铝汇流条绝缘。如果没有绝缘,则如果一个电池单元产生过多的热量,则可能会使其他电池单元或整个电池组件爆炸(set off)。结果,柔软且低熔点的铝汇流条将变形,并且可能发生短路。使用本发明的硅树脂复合物作为铝汇流条的绝缘材料将保护电路免于短路甚至着火。
示例
在该实施例中,将LSR 2660硅树脂橡胶在FlackTek Speed Mixer DAC 150.1 FVZ离心混合器上与氢氧化镁混合以形成具有重量上50%的氢氧化镁的硅树脂复合物。混合后,将糊料压制成所需的厚度。然后将产物在180℃下固化30分钟,以形成硅树脂复合物。图3是由硅树脂复合物模制而成的样品的照片。图4示出了在没有负载的情况下在500℃的烤箱中放置30分钟后的样品。图5示出了在3700Pa的负载下,在500℃的烤箱中30分钟后的复合物样品。图6示出了在500℃的烤箱中在负载之下总共60分钟后与图3相同的样品。这些图3-6表明,硅树脂复合物样品可以在500℃下暴露30至60分钟,并且无论有无负载都可以保持其原始形状。该实施例说明,当暴露于高温下时,本发明的硅树脂复合物形成无机复合物,并且可以用于有负载和无负载的高温应用。
在另一示例中,将LSR 2660硅树脂橡胶在FlackTek Speed Mixer DAC 150.1 FVZ离心混合器上与氢氧化镁混合,以形成具有重量上50%的氢氧化镁的硅树脂复合物。混合后,将糊料压制成所需的厚度。然后将产物在180℃下固化三十分钟以形成硅树脂复合物。图7示出了首先在炉中以500℃放置15分钟、然后在1200℃的炉中烧制1分钟之后的复合物的样品。该实施例说明,当暴露于高温下时,本发明的硅树脂复合物形成无机复合物,并且可以用于有负载和无负载的高温应用。
在一个比较性示例中,一系列耐高温聚合物材料,如Sabic的2300聚醚酰亚胺、Vitrex的/>PEEK 450GL30、PEEK/Ultem共混物(70wt.%/30wt.%)和PEEK/PPS(来自Celanese的/>聚苯硫醚SF3001)(70wt.%/30wt.%)共混物注射模制成50mm×10mm×1mm的所需尺寸。图8示出了首先在炉中在500℃下放置15分钟、然后在1200℃炉中烧制1分钟之后的模制的耐高温聚合物材料的照片。这些材料在1200℃下暴露一分钟之后完全燃烧掉。这些比较性示例清楚地表明,即使是耐高温的聚合物材料也不能获得与本发明的复合物相同的结果。
在该比较性示例中,将来自Epoxy Technology,Inc.的环氧树脂337与氢氧化镁混合以得到具有重量上50%的氢氧化镁的复合组合物。将环氧复合物模制并在150℃下固化60分钟。图9示出了模制的环氧复合物的照片。在没有负载的情况下,将环氧复合物在烤箱中暴露于500℃持续30分钟。环氧复合物粉碎成无机粉末。图10显示了在没有负载的情况下高温时环氧树脂样品的结果。如图10所示,环氧复合物失去了形状和强度。该比较性示例表明,加载有无机填料的环氧树脂不能产生与用本发明的硅树脂复合物所获得的相同的性能。
在该第三示例中,将来自Prime Polymer Co,Ltd.的低密度等级聚乙烯SP 1540与无机填料氢氧化镁混合。所述聚烯烃复合物包含重量上70%的氢氧化镁,并在120℃下用Brabender混合器混合30分钟。将复合物在120℃下压制成两个样品。图11是显示模制聚乙烯复合物样品的照片。然后将该聚乙烯复合物的两个样品放在500℃的烤箱中30分钟,一个样品的负载约为1000Pa,另一个样品没有负载。图12显示了在有负载和无负载的情况下,聚乙烯复合物在高温下都分解成灰烬。该比较性示例表明,加载有无机填料的聚烯烃不产生与本发明的硅树脂复合物所获得的相同性能。
尽管已经参照优选实施例描述了本发明,但是本领域技术人员将理解,在不脱离如随附的权利要求限定的本发明的精神和范围的情况下,可以进行各种改变并且可以用等同物代替其元件。本领域的技术人员将理解,本发明可以在本发明的实践中所使用的结构、布置、比例、尺寸、材料和部件的许多修改下使用,这些修改特别适合于特定的环境和操作要求,而不会脱离本发明的原理。因此,当前公开的实施例在所有方面都应被认为是说明性的而不是限制性的,本发明的范围由所附权利要求限定,并且不限于前述描述或实施例。
Claims (11)
1.一种设备,包括:第一金属部分,第二金属部分,聚合物层和绝缘层,其中所述第一金属部分和所述第二金属部分彼此分离,且所述聚合物层在空间上位于所述第一金属部分和所述第二金属部分之间,并且所述绝缘层在空间上位于所述聚合物层与所述第一金属部分和所述第二金属部分之一之间,其中所述绝缘层是包含硅树脂和无机填料的硅树脂复合物,所述无机填料能够在不超过500℃的温度下分解,并且当所述硅树脂复合物暴露于高温下时,它形成具有良好尺寸稳定性的无机复合物,其中所述设备是连接器、电路保护装置、继电器装置或电池组的一部分。
2.所述根据权利要求1所述的设备,其中,
当暴露在高于500℃的温度,绝缘层仍保持绝缘,并在负载下保持其形状。
3.所述根据权利要求1所述的设备,其中,
绝缘层在500℃的温度下暴露至少15分钟时仍保持绝缘并保持其形状。
4.所述根据权利要求1所述的设备,其中,
绝缘层在1200℃的温度下暴露至少10秒时仍保持绝缘并保持其形状。
5.所述根据权利要求1所述的设备,其中,
绝缘层直接模制,浇铸,层压,插入或分配在聚合物层上。
6.所述根据权利要求1所述的设备,其中,
绝缘层在暴露于高温时保持其尺寸稳定性,收缩率不超过25%。
7.所述根据权利要求1所述的设备,其中,
所述无机填料选自包括以下的组:氢氧化镁,碳酸镁,氢氧化钙,碳酸氢钠,碳酸氢钾,氢氧化铝及其混合物。
8.所述根据权利要求1所述的设备,其中,
所述无机填料为所述硅树脂复合物的重量的10%至90%。
9.所述根据权利要求1所述的设备,其中,
绝缘层的厚度小于2mm。
10.所述根据权利要求1所述的设备,其中,
第一金属部分或第二金属部分由铝或铝合金制成。
11.所述根据权利要求1所述的设备,其中,
所述硅树脂复合物能够在不超过500℃的温度时形成至少一部分无机复合材料,并保持其尺寸稳定性。
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