CN113058926B - Cleaning device for improving cleaning capability of silicon wafer surface and control method thereof - Google Patents

Cleaning device for improving cleaning capability of silicon wafer surface and control method thereof Download PDF

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Publication number
CN113058926B
CN113058926B CN202110361901.3A CN202110361901A CN113058926B CN 113058926 B CN113058926 B CN 113058926B CN 202110361901 A CN202110361901 A CN 202110361901A CN 113058926 B CN113058926 B CN 113058926B
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cleaning
silicon wafer
wafer
box
silicon
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CN113058926A (en
Inventor
戚定定
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Hangzhou Semiconductor Wafer Co Ltd
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Hangzhou Semiconductor Wafer Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention relates to a cleaning device for improving the cleaning capacity of the surface of a silicon wafer and a control method thereof, belonging to the technical field of silicon wafer cleaning equipment. The cleaning assembly comprises a wafer box, a plurality of silicon wafers which are distributed at equal intervals are arranged in the wafer box, upper baffles which are integrated with the wafer box are arranged at two ends of the upper portion of the silicon wafers, and lower baffles which are integrated with the wafer box are arranged at two ends of the lower portion of the silicon wafers. Has the characteristics of simple structure, good cleaning effect, high running stability and long service life. Solves the problem that the surface of the silicon wafer is scratched mechanically.

Description

Cleaning device for improving cleaning capability of silicon wafer surface and control method thereof
Technical Field
The invention relates to the technical field of silicon wafer cleaning equipment, in particular to a cleaning device for improving the cleaning capability of the surface of a silicon wafer and a control method thereof.
Background
In the manufacturing process of the conductor silicon wafer, in order to avoid the fact that pollutants such as metal ions, atoms, organic matters and particles are re-remained on the surface of the silicon wafer before the manufacturing process, the surface of the conductor silicon wafer needs to be subjected to multiple surface cleaning steps so as to remove the pollutants attached to the surface. At present, a wet chemical cleaning method is mainly used as a main flow of a silicon wafer cleaning technology, an acid-base solution is generally used for cleaning the surface of the silicon wafer, pure water overflows and is washed, and finally spin-drying is performed by a spin dryer (spin dryer).
In the production process of the silicon wafer, a plurality of working procedures are needed, and the different process technologies and production machine stations of the working procedures lead the surface orientations of the silicon wafer placed in the wafer box of the working procedures to be different. Because of the limitation of the input port and the placing mode of the wafer box in the spin dryer, if the orientation of the placing surface of the silicon wafer in the cleaning tank and the spin dryer needs to be changed, the current technology can only be realized by pouring the wafer box before feeding. The film rewinding method comprises the following steps: the whole silicon wafer box is led into another silicon wafer box by a film reverser. This process not only reduces the cleaning efficiency, but also presents the potential for mechanical scratching of the wafer surface.
In the production process, the number of silicon wafers of each batch of products is different, and after a plurality of wafer boxes are filled, the situation that the remaining silicon wafers are not filled with one box exists. During cleaning and spin-drying, two boxes of silicon wafers with similar mass are needed to keep balance during rotation. In the prior art, a PFA sheet or a silicon sheet with the same doping is used as a matching sheet to match the silicon sheet without the full box, so that the rotation mass balance is realized. The compact has a life span, needs to be replaced regularly, and there are risks of mixing, particle contamination and metal contamination.
When the cleaning equipment is maintained, the liquid medicine tank and the water tank are washed and soaked by pure water, the inner wall of the spin dryer is sprayed by pure water, so that the effects of removing dirt and particles in the cleaning tank and the inner wall of the spin dryer cannot be effectively achieved, and even secondary pollution of the cleaning tank and the spin dryer can be possibly caused.
Disclosure of Invention
The invention mainly solves the defects of poor cleaning effect, low operation stability and short service life in the prior art, and provides the cleaning device for improving the cleaning capability of the surface of the silicon wafer and the control method thereof, which have the characteristics of simple structure, good cleaning effect, high operation stability and long service life. Solves the problem that the surface of the silicon wafer is scratched mechanically.
The technical problems of the invention are mainly solved by the following technical proposal:
the cleaning device for improving the surface cleaning capability of the silicon wafer comprises a cleaning tank, an upper frame is arranged above the cleaning tank, a cleaning assembly is arranged in the cleaning tank, a lifting cylinder is arranged between the cleaning assembly and the upper frame, and a rotating motor is arranged between the lifting cylinder and the upper frame. The cleaning assembly comprises a wafer box, a plurality of silicon wafers which are distributed at equal intervals are arranged in the wafer box, upper baffles which are integrated with the wafer box are arranged at two ends of the upper portion of the silicon wafers, and lower baffles which are integrated with the wafer box are arranged at two ends of the lower portion of the silicon wafers.
Preferably, a rotating shaft which is movably nested and connected with the cleaning tank is arranged between the lower end of the cleaning assembly and the cleaning tank, and a bearing is arranged between the rotating shaft and the cleaning tank.
Preferably, a tray is arranged between the rotating shaft and the cleaning assembly.
Preferably, a connecting flange is arranged between the lifting cylinder and the cleaning assembly.
A control method of a cleaning device for improving the cleaning capability of the surface of a silicon wafer comprises the following operation steps:
the first step: the silicon wafer is placed in the wafer box, the lifting air cylinder is in a contracted state, and the wafer box is of a hollowed-out box body structure.
And a second step of: injecting cleaning agent into the cleaning tank, and stretching by a lifting cylinder on the upper frame to enable the cleaning component to descend to be in press connection with the tray.
And a third step of: the rotating motor is started, and the tray is fixedly connected with the cleaning tank through the rotating shaft and the bearing, so that the cleaning assembly stably rotates in the cleaning tank.
Fourth step: after the silicon wafer cleaning process is finished, the rotating motor stops running, and the lifting cylinder contracts to enable the wafer box to leave the cleaning agent in the cleaning tank.
Fifth step: then placing the silicon wafer in the wafer box on an empty cleaning tank for pure water spraying, and then starting the rotating motor to operate so as to spin-dry the cleaning agent and water on the surface of the silicon wafer.
Preferably, the upper end and the lower end of the wafer box play a limiting role on the silicon wafer through the upper baffle plate and the lower baffle plate.
Preferably, the cleaning agent is SC1 solution, SC1 is prepared from NH 4 OH、H 2 O 2 、H 2 O is mixed to form, NH 4 OH:H 2 O 2 :H 2 The ratio concentration of O is 1:3:30-1:6:30.
The invention can achieve the following effects:
compared with the prior art, the cleaning device for improving the cleaning capability of the surface of the silicon wafer and the control method thereof have the characteristics of simple structure, good cleaning effect, high operation stability and long service life. Solves the problem that the surface of the silicon wafer is scratched mechanically.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of the structure of the cleaning assembly of the present invention.
In the figure: the cleaning device comprises a cleaning tank 1, an upper frame 2, a rotating motor 3, a lifting cylinder 4, a connecting flange plate 5, a cleaning assembly 6, a tray 7, a bearing 8, a rotating shaft 9, a wafer box 10, an upper baffle 11, a silicon wafer 12 and a lower baffle 13.
Detailed Description
The technical scheme of the invention is further specifically described below through examples and with reference to the accompanying drawings.
Examples: as shown in fig. 1 and 2, a cleaning device for improving the cleaning capability of the surface of a silicon wafer comprises a cleaning tank 1, wherein an upper frame 2 is arranged above the cleaning tank 1, a cleaning assembly 6 is arranged in the cleaning tank 1, a rotating shaft 9 movably nested and connected with the cleaning tank 1 is arranged between the lower end of the cleaning assembly 6 and the cleaning tank 1, and a bearing 8 is arranged between the rotating shaft 9 and the cleaning tank 1. A tray 7 is arranged between the rotating shaft 9 and the cleaning component 6. A lifting cylinder 4 is arranged between the cleaning component 6 and the upper frame 2, and a connecting flange plate 5 is arranged between the lifting cylinder 4 and the cleaning component 6. A rotating motor 3 is arranged between the lifting cylinder 4 and the upper frame 2. The cleaning assembly 6 comprises a wafer box 10, 10 silicon wafers 12 which are distributed at equal intervals are arranged in the wafer box 10, upper baffle plates 11 which are integrated with the wafer box 10 are arranged at two ends of the upper part of the silicon wafers 12, and lower baffle plates 13 which are integrated with the wafer box 10 are arranged at two ends of the lower part of the silicon wafers 12.
A control method of a cleaning device for improving the cleaning capability of the surface of a silicon wafer comprises the following operation steps:
the first step: the silicon wafer 12 is placed in the wafer box 10, and the upper end and the lower end of the wafer box 10 play a limiting role on the silicon wafer 12 through the upper baffle 11 and the lower baffle 13. At this time, the lifting cylinder 4 is in a contracted state, and the box 10 is of a hollowed-out box structure.
And a second step of: injecting a cleaning agent into the cleaning tank 1, wherein the cleaning agent is SC1 solution, and the SC1 is prepared from NH 4 OH、H 2 O 2 、H 2 O is mixed to form, NH 4 OH:H 2 O 2 :H 2 The ratio concentration of O is 1:3:30-1:6:30. The lifting cylinder 4 on the upper frame 2 is then pulled so that the cleaning assembly 6 is lowered into pressure contact with the tray 7.
And a third step of: the rotating motor 3 is started, and the tray 7 is fixedly connected with the cleaning tank 1 through the rotating shaft 9 and the bearing 8, so that the cleaning assembly 6 stably rotates in the cleaning tank 1.
Fourth step: after the silicon wafer 12 is washed, the rotary motor 3 stops running, and the lifting cylinder 4 contracts to enable the wafer box 10 to leave the cleaning agent in the cleaning tank 1.
Fifth step: then the silicon wafer 12 in the wafer box 10 is placed on an empty cleaning tank 1 to spray pure water, and then the rotary motor 3 is started to operate, so that the cleaning agent and water on the surface of the silicon wafer 12 are dried.
In summary, the cleaning device for improving the cleaning capability of the surface of the silicon wafer and the control method thereof have the characteristics of simple structure, good cleaning effect, high operation stability and long service life. Solves the problem that the surface of the silicon wafer is scratched mechanically.
The above embodiments are merely examples of the present invention, but the present invention is not limited thereto, and any changes or modifications made by those skilled in the art are included in the scope of the present invention.

Claims (4)

1. A cleaning device of a cleaning device for improving the cleaning capability of the surface of a silicon wafer is characterized in that: the cleaning device structurally comprises a cleaning tank (1), an upper frame (2) is arranged above the cleaning tank (1), a cleaning component (6) is arranged in the cleaning tank (1), a lifting cylinder (4) is arranged between the cleaning component (6) and the upper frame (2), and a rotating motor (3) is arranged between the lifting cylinder (4) and the upper frame (2); the cleaning assembly (6) comprises a wafer box (10), a plurality of silicon wafers (12) distributed at equal intervals are arranged in the wafer box (10), upper baffle plates (11) integrated with the wafer box (10) are arranged at two ends of the upper part of the silicon wafers (12), and lower baffle plates (13) integrated with the wafer box (10) are arranged at two ends of the lower part of the silicon wafers (12);
a rotating shaft (9) movably nested and connected with the cleaning tank (1) is arranged between the lower end of the cleaning component (6) and the cleaning tank (1), a bearing (8) is arranged between the rotating shaft (9) and the cleaning tank (1), and a tray (7) is arranged between the rotating shaft (9) and the cleaning component (6);
the control method comprises the following operation steps:
the first step: placing a silicon wafer (12) into a wafer box (10), wherein the lifting cylinder (4) is in a contracted state, and the wafer box (10) is of a hollowed-out box body structure;
and a second step of: injecting cleaning agent into the cleaning tank (1), and then stretching by a lifting cylinder (4) on the upper frame (2) to enable the cleaning component (6) to descend to be in pressure connection with the tray (7);
and a third step of: starting the rotating motor (3), and fixedly connecting the tray (7) with the cleaning tank (1) through the rotating shaft (9) and the bearing (8), so that the cleaning assembly (6) stably rotates in the cleaning tank (1);
fourth step: after the cleaning process of the silicon wafer (12) is finished, the rotating motor (3) stops running, and the lifting cylinder (4) contracts to enable the wafer box (10) to leave the cleaning agent in the cleaning tank (1);
fifth step: then, the silicon wafer (12) in the wafer box (10) is placed on an empty cleaning tank (1) to spray pure water, and then the rotary motor (3) is started to operate, so that the cleaning agent and water on the surface of the silicon wafer (12) are dried.
2. A cleaning apparatus of a cleaning apparatus for improving the cleaning ability of a silicon wafer surface as set forth in claim 1, wherein: a connecting flange plate (5) is arranged between the lifting cylinder (4) and the cleaning component (6).
3. The control method of a cleaning apparatus for improving the cleaning ability of a silicon wafer surface according to claim 1, characterized by: the upper end and the lower end of the wafer box (10) play a limiting role on the silicon wafer (12) through the upper baffle (11) and the lower baffle (13).
4. The control method of a cleaning apparatus for improving the cleaning ability of a silicon wafer surface according to claim 1, characterized by: the cleaning agent is SC1 solution, SC1 is prepared from NH 4 OH、H 2 O 2 、H 2 O is mixed to form, NH 4 OH:H 2 O 2 :H 2 The ratio concentration of O is 1:3:30-1:6:30.
CN202110361901.3A 2021-04-02 2021-04-02 Cleaning device for improving cleaning capability of silicon wafer surface and control method thereof Active CN113058926B (en)

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Publication number Priority date Publication date Assignee Title
CN113894106B (en) * 2021-10-09 2023-01-13 杭州中欣晶圆半导体股份有限公司 Automatic feeding and discharging system of cleaning machine and operation method
CN113823579B (en) * 2021-11-19 2023-11-17 杭州中欣晶圆半导体股份有限公司 Silicon wafer surface notch detection device
CN114210636B (en) * 2021-12-06 2022-12-09 杭州中欣晶圆半导体股份有限公司 Etching device and method for improving etching rate of silicon chip oxide film

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002219431A (en) * 2001-01-30 2002-08-06 Nippon Hoso Kyokai <Nhk> Robot camera maintenance box
CN204596762U (en) * 2015-04-23 2015-08-26 麦斯克电子材料有限公司 A kind of composite type for Wafer Cleaning loads film magazine
CN208111403U (en) * 2018-02-01 2018-11-16 天津创昱达科技有限公司 A kind of full-automatic inserted sheet cleaning all-in-one machine of environmental protection
CN212683935U (en) * 2020-08-12 2021-03-12 青岛高测科技股份有限公司 Liftable silicon chip storage device
CN214813186U (en) * 2021-04-02 2021-11-23 杭州中欣晶圆半导体股份有限公司 Cleaning device for improving surface cleaning capability of silicon wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002219431A (en) * 2001-01-30 2002-08-06 Nippon Hoso Kyokai <Nhk> Robot camera maintenance box
CN204596762U (en) * 2015-04-23 2015-08-26 麦斯克电子材料有限公司 A kind of composite type for Wafer Cleaning loads film magazine
CN208111403U (en) * 2018-02-01 2018-11-16 天津创昱达科技有限公司 A kind of full-automatic inserted sheet cleaning all-in-one machine of environmental protection
CN212683935U (en) * 2020-08-12 2021-03-12 青岛高测科技股份有限公司 Liftable silicon chip storage device
CN214813186U (en) * 2021-04-02 2021-11-23 杭州中欣晶圆半导体股份有限公司 Cleaning device for improving surface cleaning capability of silicon wafer

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