CN113053789A - Polycrystalline circle edge grinding system - Google Patents

Polycrystalline circle edge grinding system Download PDF

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Publication number
CN113053789A
CN113053789A CN202110397385.XA CN202110397385A CN113053789A CN 113053789 A CN113053789 A CN 113053789A CN 202110397385 A CN202110397385 A CN 202110397385A CN 113053789 A CN113053789 A CN 113053789A
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CN
China
Prior art keywords
wafer
grinding machine
equipment
wafers
correction
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110397385.XA
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Chinese (zh)
Inventor
罗爱斌
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Individual
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Individual
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Priority to CN202110397385.XA priority Critical patent/CN113053789A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a multi-wafer edge grinding system which comprises a wafer box for storing wafers, a wafer correcting device, a grinding machine for grinding the wafers and a wafer cleaning device, wherein mechanical arms are arranged between the wafer box and the wafer correcting device, between the wafer correcting device and the grinding machine, between the grinding machine and the wafer cleaning device and between the wafer cleaning device and the wafer box, and a plurality of suckers for adsorbing the wafers are arranged on the mechanical arms between the wafer correcting device and the grinding machine and between the grinding machine and the wafer cleaning device. Because part of the mechanical arms of the wafer edge grinding equipment adopt a multi-sucker structure for adsorbing wafers, compared with the prior art that the mechanical arms obtain a single wafer at a time, the edge grinding system for the polycrystalline circle has the advantage that the processing efficiency is improved.

Description

Polycrystalline circle edge grinding system
Technical Field
The invention relates to processing equipment of a wafer, in particular to grinding equipment of the wafer.
Background
A series of processes are performed on the ingot to form a silicon substrate, i.e., a wafer, that meets semiconductor manufacturing requirements. The cut wafer requires a flat cutting surface, and the surface requires no slide, no area contamination, no edge breakage, no crack, no pit and the like. Therefore, wafer edge grinding and chamfering are necessary processes.
Disclosure of Invention
The technical problems solved by the invention are as follows: the efficiency of wafer edging is improved.
In order to solve the technical problems, the invention provides the following technical scheme: one set of polycrystal circle edging system, including the spool box of storing the wafer, wafer correction equipment, the grinder to the wafer edging, wafer cleaning equipment, between spool box and the wafer correction equipment, between wafer correction equipment and the grinder, between grinder and the wafer cleaning equipment to and all be equipped with the manipulator between wafer cleaning equipment and the spool box, wherein, the manipulator between wafer correction equipment and the grinder, and, the manipulator between grinder and the wafer cleaning equipment all is equipped with a plurality of sucking discs that adsorb the wafer.
Wafers to be processed in the wafer box are transferred to the wafer correction equipment through the mechanical arm, the wafer correction equipment is transferred to the grinding machine through the mechanical arm, the grinding machine is transferred to the wafer cleaning equipment through the mechanical arm, the wafer cleaning equipment is transferred to the wafer box through the mechanical arm, and the work cycle of a closed loop path is automatically completed.
And the mechanical arm between the wafer box and the wafer correction equipment transfers the wafers in the wafer box to the wafer correction equipment one by one. And the mechanical arm between the wafer correcting equipment and the grinding machine can acquire a plurality of wafers from the wafer correcting equipment at one time and transfer the wafers to the grinding machine at one time. And the mechanical arm between the grinding machine and the wafer cleaning equipment can acquire a plurality of wafers from the grinding machine at one time and transfer the wafers to the wafer cleaning equipment at one time. And the manipulator between the wafer cleaning equipment and the wafer box transfers the wafers on the wafer cleaning equipment to the wafer box one by one.
Because part of the mechanical arms of the wafer edge grinding equipment adopt a multi-sucker structure for adsorbing wafers, compared with the prior art that the mechanical arms obtain a single wafer at a time, the edge grinding system for the polycrystalline circle has the advantage that the processing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a multicrystalline circular edge grinding system;
FIG. 2 is a schematic view of the second robot 42 and the wafer alignment apparatus 20;
FIG. 3 is a left side view of FIG. 2;
FIG. 4 is a top view of FIG. 2;
fig. 5 is a perspective view of fig. 2.
The symbols in the drawings illustrate that:
10. the position of the grinding machine;
20. wafer correction equipment; 21. a correction unit; 211. a bearing table; 212. a rotation unit; 213. a laser displacement sensor;
30. a wafer;
41. a first manipulator; 42. a second manipulator; 421. a suction cup holder; 422. a suction cup; 423. a lifting cylinder; 424. a rotating electric machine; 425. a displacement frame; 426. a screw mechanism; 427. a base; 43. a third manipulator;
50. a sheet cassette;
60. the wafer cleaning equipment is located.
Detailed Description
Referring to fig. 1, a multi-wafer edge grinding system includes a wafer box 50 for storing wafers, a wafer aligning device 20, a grinding machine for grinding the wafers, and a wafer cleaning device, wherein manipulators are respectively disposed between the wafer box and the wafer aligning device, between the wafer aligning device and the grinding machine, between the grinding machine and the wafer cleaning device, and between the wafer cleaning device and the wafer box, wherein a plurality of suckers for sucking the wafers are respectively disposed on the manipulators between the wafer aligning device and the grinding machine, and between the grinding machine and the wafer cleaning device.
Let the robot between the cassette and the wafer correction device 20 be the first robot 41, the robot between the wafer correction device and the grinder be the second robot 42, and the robot between the grinder and the wafer cleaning device be the third robot 43. The robot between the wafer cleaning apparatus and the cassette is the same as the robot between the cassette and the wafer correction apparatus 20, i.e., the first robot.
The first mechanical arm 41, the wafer correcting device 20, the grinding machine and the wafer cleaning device are arranged on a closed loop path, and under the transfer of all the mechanical arms, the wafer moves along the closed loop path in a single direction, starts from a wafer box and ends at the wafer box. The wafer correcting device 20, the wafer cleaning device and the wafer box are located within the operating radius range of the first manipulator, and the first manipulator not only transfers the wafer to be processed in the wafer box to the wafer correcting device, but also transfers the wafer at the wafer cleaning device to the wafer box.
The second manipulator 42 and the third manipulator 43 are both provided with a rotary suction cup frame 421, and the plurality of suction cups 422 are circumferentially and uniformly distributed around the rotation center of the suction cup frame. Alternatively, the second robot and the third robot are respectively provided with six suction cups, and taking the second robot as an example, and referring to fig. 2 to 5, the suction cups 422 are mounted on a lifting cylinder 423, the lifting cylinder is mounted on a suction cup holder 421, the suction cup holder is mounted on a rotary motor 424, the rotary motor is mounted on a displacement holder 425, the displacement holder is mounted on a screw rod mechanism 426, and the screw rod mechanism is mounted on a base 427. The second robot 42 can absorb six wafers at a time.
Referring to fig. 2 to 5, the wafer calibration apparatus 20 includes a plurality of calibration units 21, each of which includes a stage 211 driven by a rotation unit 212, a laser displacement sensor 213, and a microprocessor capable of receiving signals from the laser displacement sensor. The wafer calibration unit 21 may calibrate the wafer by using the laser positioning of the product in the prior art, or according to the following method of the present invention: the rotation unit 212 drives the wafer on the susceptor 211 to rotate; measuring the edge data of the wafer by a laser displacement sensor 213 while the wafer rotates 360 degrees; the microprocessor collects data, calculates the eccentricity of the wafer in the X direction and the Y direction, and synthesizes a vector by using an algorithm, wherein the vector direction is the same as the displacement direction of the displacement frame 425; under the drive of the lifting cylinder 423, the sucking disc 422 sucks up the wafer, and under the control of the microprocessor, the displacement frame 425 corrects the wafer deviation amount according to the vector; thereafter, the chuck 422 lowers the wafer to the susceptor 211. After the correction is completed, the second robot starts the conveying operation.
Alternatively, the wafer correction apparatus 20 includes two correction units 21, which are disposed corresponding to two adjacent suction cups 422 of the robot up and down. Thus, the chuck holder 421 rotates three times to complete the calibration of six wafers on the robot. The susceptor 211 of any one of the calibration units fixes the wafer 30 by vacuum suction.
The grinding machine is provided with a plurality of processing tables, and the processing tables can be in one-to-one correspondence with a plurality of suckers of a manipulator between the wafer correcting equipment and the grinding machine. The number of the processing tables is six corresponding to the six suckers of the manipulator, the grinding wheel of the grinding machine is positioned at the center position of the six processing tables, the processing tables rotate to drive the wafers on the processing tables to rotate, and the grinding wheel simultaneously processes the wafers on the six processing tables. The grinding machine processes six wafers simultaneously, and the production efficiency is higher than that of the existing automatic equipment.
The wafer cleaning equipment is provided with a plurality of cleaning tables, and the cleaning tables can be in one-to-one correspondence with a plurality of suckers of a manipulator between the grinding machine and the wafer cleaning equipment from top to bottom. The number of cleaning stations is six corresponding to six suction cups of the robot. Six cleaning stations are arranged on the rotary table, and the cleaning spray heads clean six wafers simultaneously. And after cleaning, rotating the turntable to spin-dry the wafer.
In the prior art, a first robot provided with a single chuck takes out wafers from a cassette in sequence and then places them on a stage of a wafer alignment apparatus (taking 10 seconds). The wafer alignment equipment aligns the wafer (taking 40 seconds) and a second robot with a single chuck delivers the aligned wafer to the wafer processing station of the grinder (taking 6 seconds). The grinding machine grinds the circumference of a single wafer by using a grinding wheel model which is set in advance, and a chamfer with a specific shape and a specific size is machined (the time is 45 seconds). The third robot with a single chuck removed the processed wafer from the processing station (6 seconds) and the wafer cleaning equipment cleaned the single wafer and spin dried (20 seconds). The first robot, provided with a single suction cup, takes the spun wafer out of the cleaning station and then places it in the corresponding cassette position (10 seconds). One working cycle took 137 seconds, and actually processed continuously about 240 tablets per shift for 8 hours, 0.5 tablet per minute.
According to the edge grinding system for the polycrystalline circle, the first mechanical arm 41 sequentially takes out the wafers from the wafer box and then places the wafers on the bearing table of the correction equipment one by one, and six wafers are placed in total (each wafer takes 10 seconds and each wafer takes 60 seconds). The wafer correction equipment corrects the wafer (two pieces of correction each time, one piece of correction takes 20 seconds, and 60 seconds in total). The second robot 42 of the present invention transfers the wafer after the alignment to the wafer processing station of the grinding machine (6 wafers are simultaneously transferred, taking 6 seconds). The grinding machine grinds the periphery of six wafers by using a preset grinding wheel model, and chamfers with specific shapes and sizes are machined (6 wafers are machined simultaneously, and the time is 45 seconds). The third robot 43 of the present invention moves the processed wafer out of the processing station (6 wafers are simultaneously transported, taking 6 seconds). The wafer cleaning equipment cleans six wafers and spin-dries (6 wafers clean simultaneously, 20 seconds). The first robot 41 takes out the spun-dried wafers one by one from the cleaning station and then places the wafers in the corresponding wafer cassette positions (10 seconds for each wafer and 60 seconds for common use). The time of one working cycle is 257 seconds, wherein the wafer can be corrected after the first mechanical arm sends two wafers to the correction position, the first mechanical arm transfers the wafers to the correction position and the wafer correction equipment corrects the wafers, the total time of the two processes is 10+ 40-50 seconds, and thus, the time of one working cycle is reduced to 187 seconds (the time consumed by integrating the single continuous processing is comprehensive). 8 hours of continuous processing, the time consumed by the single integration of continuous processing is about 20% less than 187 seconds (the time consumed by the single integration of continuous processing in the continuous processing is about 149.6 seconds), the time consumed by the single integration is about 25.7 seconds, and the time consumed by the single integration of continuous processing is about 8 hours (8 × 60) ÷ 149.6 × 6 ═ 1155 sheets per shift, and the efficiency is 1155 ÷ 240 ÷ 4.81 times that of the prior art.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.

Claims (7)

1. One set of polycrystal circle edging system, including the spool box (50), the wafer correction equipment (20) of storing the wafer, to grinder, the wafer cleaning equipment of wafer edging, between spool box and the wafer correction equipment, between wafer correction equipment and the grinder, between grinder and the wafer cleaning equipment to and all be equipped with manipulator, its characterized in that between wafer cleaning equipment and the spool box: and the mechanical arm between the wafer correcting equipment and the grinding machine and the mechanical arm between the grinding machine and the wafer cleaning equipment are respectively provided with a plurality of suckers for adsorbing wafers.
2. The set of multi-wafer edging systems of claim 1, wherein: any manipulator is provided with a rotary sucker frame, and a plurality of suckers are circumferentially and uniformly distributed by taking the rotation center of the sucker frame as the center.
3. A set of multicrystalline circular edging systems according to claim 1 or 2, characterized in that: the wafer correction device (20) comprises a plurality of correction units (21), wherein each correction unit comprises a bearing table (211) driven by a rotating unit (212), a laser displacement sensor (213) and a microprocessor capable of receiving signals from the laser displacement sensor.
4. A set of multicrystalline circular edging systems according to claim 3, wherein: the rotating unit (212) drives the wafer on the bearing table (211) to rotate, and the laser displacement sensor (213) measures the edge data of the wafer while the wafer rotates for a circle; the microprocessor collects data, calculates the eccentric quantities of the wafer in the X direction and the Y direction, and synthesizes the eccentric quantities of the wafer in the X direction and the Y direction into a vector; the rotation unit enables the direction of the vector to be the same as the direction of the wafer conveyed by the mechanical arm between the wafer correction equipment and the grinding machine, and after the mechanical arm obtains the wafer from the bearing table, the mechanical arm drives the wafer to move by the distance of the vector, and then the wafer is placed back to the bearing table.
5. A set of multicrystalline circular edging systems according to claim 1 or 2, characterized in that: the grinding machine is provided with a plurality of processing tables, and the processing tables can be in one-to-one correspondence with a plurality of suckers of a manipulator between the wafer correcting equipment and the grinding machine.
6. The set of multi-wafer edging systems of claim 5, wherein: the grinding machine processes the wafers on the plurality of processing tables simultaneously.
7. A set of multicrystalline circular edging systems according to claim 1 or 2, characterized in that: the wafer cleaning equipment is provided with a plurality of cleaning tables, and the cleaning tables can be in one-to-one correspondence with a plurality of suckers of a manipulator between the grinding machine and the wafer cleaning equipment from top to bottom.
CN202110397385.XA 2021-04-14 2021-04-14 Polycrystalline circle edge grinding system Pending CN113053789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110397385.XA CN113053789A (en) 2021-04-14 2021-04-14 Polycrystalline circle edge grinding system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110397385.XA CN113053789A (en) 2021-04-14 2021-04-14 Polycrystalline circle edge grinding system

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CN113053789A true CN113053789A (en) 2021-06-29

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CN202110397385.XA Pending CN113053789A (en) 2021-04-14 2021-04-14 Polycrystalline circle edge grinding system

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CN (1) CN113053789A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200820333A (en) * 2006-10-23 2008-05-01 Powertech Technology Inc Wafer backside grinding apparatus
CN105609453A (en) * 2014-11-11 2016-05-25 沈阳新松机器人自动化股份有限公司 Semiconductor wafer transmission device
CN106971970A (en) * 2017-04-28 2017-07-21 东莞市安达自动化设备有限公司 A kind of make-up machine for semiconductor pad pasting
CN109571232A (en) * 2018-12-28 2019-04-05 西安奕斯伟硅片技术有限公司 Wafer grinding method and its grinding system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200820333A (en) * 2006-10-23 2008-05-01 Powertech Technology Inc Wafer backside grinding apparatus
CN105609453A (en) * 2014-11-11 2016-05-25 沈阳新松机器人自动化股份有限公司 Semiconductor wafer transmission device
CN106971970A (en) * 2017-04-28 2017-07-21 东莞市安达自动化设备有限公司 A kind of make-up machine for semiconductor pad pasting
CN109571232A (en) * 2018-12-28 2019-04-05 西安奕斯伟硅片技术有限公司 Wafer grinding method and its grinding system

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