CN105609453A - Semiconductor wafer transmission device - Google Patents
Semiconductor wafer transmission device Download PDFInfo
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- CN105609453A CN105609453A CN201410635657.5A CN201410635657A CN105609453A CN 105609453 A CN105609453 A CN 105609453A CN 201410635657 A CN201410635657 A CN 201410635657A CN 105609453 A CN105609453 A CN 105609453A
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- semiconductor crystal
- crystal wafer
- sensor
- conveyer
- semiconductor wafer
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Abstract
The invention relates to the field of industrial automation, and specifically discloses a semiconductor wafer transmission device. The device is composed of a manipulator, a first sensing unit, a second sensing unit, a driving mechanism, a control unit and a data acquisition unit. The manipulator includes a circular carrying surface for carrying a semiconductor wafer, and is used for handling the semiconductor wafer under the drive of the driving unit. The first sensor and the second sensor are arranged on the movement path of the manipulator, and are used for detecting the edge of the semiconductor wafer and sending information to the data acquisition unit. The data acquisition unit is used for acquiring and storing the data and sending the acquired data to the control unit. The control unit is used for calculating the center and offset of the semiconductor wafer and making the driving mechanism move according to the offset in order to correct and compensate for the offset of the center position of the semiconductor wafer. By setting the two sensors, the influence of the defects of semiconductor wafers on measurement is eliminated, and the system reliability is improved.
Description
Technical field
The present invention relates to field of intelligent control, particularly a kind of transmission of semiconductor crystal wafer dressPut.
Background technology
In semicon industry, between each chamber or between station, conventionally complete with robotThe transmission of wafer. In this wafer transfer system, off normal or wafer breakage etc. when avoiding getting sheetThe generation of objective factor, improves the degree of accuracy that wafer picks and places, and needs to design and use AWC mouldPiece detects and proofreaies and correct. AWC (ActiveWaferCentering wafer self-centering meritCan) transmit the off normal situation of practical center and teaching center in wafer process for manipulator,In the motion process of manipulator, automatically correct, guaranteed that wafer is normally transported to specific bitPut.
But, in existing practical application, conventionally only realize AWC with a sensorFunction, adopts and can realize in the ordinary course of things in this way this function, but cannot detectThree kinds of situations below:
1, wafer somewhere is damaged or with crackle;
2, the notch mouth of wafer self or other breaches;
3, wafer is come in and gone out when sensor, between image data or exist and postpone.
Summary of the invention
The present invention is intended to overcome existing semiconductor conveyer to be only had a sensor and cannot examineSurvey wafer breakage, crackle and image data and have the technological deficiency postponing, provide one to haveThe conveyer of the semiconductor crystal wafer of high reliability.
For achieving the above object, the present invention by the following technical solutions: one provided by the inventionThe conveyer of semiconductor crystal wafer, manipulator, the first sensing unit, the second sensing unit, drivesActuation mechanism, control module and data acquisition unit;
Described manipulator comprises the circular mounting surface of carrying described semiconductor crystal wafer, and drives describedUnder the driving of moving cell, described semiconductor crystal wafer is carried; Described first sensor and secondSensor is separately positioned on described robot movement path, for detection of described semiconductor crystal waferEdge, concurrent carry information is given described data acquisition unit, described data acquisition unit gathers numberAccording to also preserving, and collected data are sent to control module, described in control module calculatesThe side-play amount in the center of circle of semiconductor crystal wafer and the center of circle of described semiconductor crystal wafer, described control listUnit, according to driving mechanism motion described in described side-play amount control, carries out semiconductor crystal wafer home positionCorrection compensation.
In some embodiment, described the first sensing unit and described the second sensing unit are laser positionDisplacement sensor or transmission-type laser sensor.
In some embodiment, described control module is IRC robot controller.
In some embodiment, described IRC robot controller by RS232 or Ethernet andTeach box connects.
In some embodiment, described driving mechanism comprises Z axis driver, R axle driver and TAxle driver.
In some embodiment, described control module passes according to described first sensor and described secondTime difference between sensor position and rising edge and trailing edge, calculate respectively described first sensorAnd distance between described the second sensor rising edge and trailing edge, obtain described semiconductor dieThe actual home position of circle.
Beneficial effect of the present invention is: by two sensors are set at each station, eliminateSemiconductor crystal wafer itself exist the defect such as damaged on measuring the impact causing, improved systemReliability.
Brief description of the drawings
Fig. 1 is the module map of the conveyer of a kind of semiconductor crystal wafer of the present invention;
Fig. 2 is machinery in specific embodiment of conveyer of a kind of semiconductor crystal wafer of the present inventionHands movement process schematic diagram;
Fig. 3 is specific embodiment of conveyer of a kind of semiconductor crystal wafer of the present invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction withDrawings and the specific embodiments, are further elaborated to the present invention. Should be appreciated that hereinDescribed specific embodiment is only in order to explain the present invention, and is not construed as limiting the invention.
Thinking of the present invention is: in existing clean vacuum transfer system wafer self-centering functionBasis on a wafer transmission control method more reliably that designs, this control method due toAdopt two laser sensors to detect semiconductor crystal wafer home position. Due to each workPosition has been used two laser sensors, so each semiconductor crystal wafer has been realized to 2 detections,There is the situations such as breakage during when some, also can detect and realize AWC function by another point.
Referring to Fig. 1, is the module map of the conveyer of a kind of semiconductor crystal wafer of the present invention. BagDraw together manipulator 1, driving mechanism 2, control module 3, data acquisition unit 4, the first sensing listUnit 51 and the second sensing unit 52. Manipulator 1 comprises a circular mounting surface, for mountingSemiconductor crystal wafer. Particularly, under the control of control module 3, driving mechanism 2 driving devicesHand 1 moves, in the motion process of manipulator 1, and the first sensing unit 51 and the second sensingUnit 52 is respectively at the marginal position of different position probing semiconductor crystal wafers. When detecting halfWhen the edge of conductor wafer passes through sensor, transmission information is to data acquisition unit 4, data acquisitionThe information gathering number that collection unit 4 sends according to the first sensing unit 51 and the second sensing unit 52According to, and collected data are sent to control module 3, control module 3 calculates semiconductorDeviation between practical center position and the target location of wafer, and control driving mechanism 2 and moveProofread and correct, manipulator 1 moves to target bit by semiconductor crystal wafer under the driving of driver 2Put, complete the transmission of semiconductor crystal wafer.
Referring to Fig. 2, is conveyer one specific embodiment of a kind of semiconductor crystal wafer of the present inventionMiddle manipulator 1 motion process schematic diagram. At (a) state, manipulator 1 is retracted in start bitPut, the first sensing unit 51 and the second sensing unit 52 are arranged at manipulator 1 start bit and orderOn motion path between cursor position 1a. Manipulator 1 starts to transport semiconductor crystal wafer, sensingDevice will detect four positions of (b), (c), (d), (e) as shown in Figure 2. Particularly, exist(b), when state, the edge of semiconductor crystal wafer touches sensor for the first time, in the position of (c)Secondary touch sensor, touch sensor for the third time while moving to (d), while moving to (e),The 4th touch sensor. The first sensing unit 51 and the second sensing unit 52 are four positionsWhile there is touching, transmission information is to data acquisition unit 4, and data acquisition unit is by 4 positionsLatch, moving to the process of (f) from position (e), control module 2 will calculate semiconductorThe center of circle side-play amount of wafer, and carry out automatic calibration after station (f) is specified in arrival.
Refer to Fig. 3, for of the conveyer of a kind of semiconductor crystal wafer of the present invention concrete realExecute example. Comprise Z axis driver 21, R axle driver 22, T axle driver 23, IRC masterControl panel 3, IO collection plate 4, an AWC deflection correction sensor 51, the 2nd AWC correctionSensor 52, teach box 7, and first motor 61, second motor corresponding with driver62, the 3rd motor 63. Manipulator is not shown in Fig. 3. Z axis driver 21, R axle driveLogical respectively between moving device 22, T axle driver 23, IRC master board 3 and IO collection plate 4Crossing CAN bus (ControllerAreaNetwork, controller local area network) communicates.Teach box 7 is for gathering the target position data of semiconductor crystal wafer, with IRC master board 3Connect by RS232 or Ethernet, and by collected semiconductor crystal wafer target position dataSend to IRC master board 3. The one AWC deflection correction sensor 51, the 2nd AWC correctionSensor 52 is laser displacement sensor or transmission-type laser sensor, respectively at IO collection plate4 connect, and send IO signal to IO collection plate 4, and IO collection plate 4 image data are also preserved,And data are sent to IRC master board 3 by CAN bus, IRC master board 3 connectsReceive data message, and calculate wafer practical center, and compare with the data at center, target location, calculate side-play amount. When manipulator stretching, extension puts in place, R axle driver and T axle driveMoving device compensates processing to this bias vector automatically, realizes automatic deviation correction, until deviation is eliminatedAfter, order fulfillment, ensures that wafer is accurately sent to target location. Preferably, IRC master controlMaking sheet 3 is according to AWC deflection correction sensor 51, the 2nd AWC deflection correction sensor 52 rising edgesAnd the time difference between trailing edge, calculate respectively AWC deflection correction sensor 51 and the 2nd AWCDistance between deflection correction sensor 52 rising edges and trailing edge, obtains described semiconductor crystal waferActual home position.
The above the specific embodiment of the present invention, does not form protection domain of the present inventionLimit. Various other corresponding changes and change that any technical conceive according to the present invention has been doneShape, all should be included in the protection domain of the claims in the present invention.
Claims (6)
1. a conveyer for semiconductor crystal wafer, is characterized in that, comprising: manipulator,The first sensing unit, the second sensing unit, driving mechanism, control module and data acquisition unit;
Described manipulator comprises the circular mounting surface of carrying described semiconductor crystal wafer, and drives describedUnder the driving of moving cell, described semiconductor crystal wafer is carried; Described first sensor and secondSensor is separately positioned on described robot movement path, for detection of described semiconductor crystal waferEdge, concurrent carry information is given described data acquisition unit, described data acquisition unit gathers numberAccording to also preserving, and collected data are sent to control module, described in control module calculatesThe side-play amount in the center of circle of semiconductor crystal wafer and the center of circle of described semiconductor crystal wafer, described control listUnit, according to driving mechanism motion described in described side-play amount control, carries out semiconductor crystal wafer home positionCorrection compensation.
2. the conveyer of semiconductor crystal wafer as claimed in claim 1, is characterized in that,Described the first sensing unit and described the second sensing unit are laser displacement sensor or transmission-typeLaser sensor.
3. the conveyer of semiconductor crystal wafer as claimed in claim 1, is characterized in that,Described control module is IRC robot controller.
4. the conveyer of semiconductor crystal wafer as claimed in claim 3, is characterized in that,Described IRC robot controller is connected with teach box by RS232 or Ethernet.
5. the conveyer of semiconductor crystal wafer as claimed in claim 1, is characterized in that,Described driving mechanism comprises Z axis driver, R axle driver and T axle driver.
6. the conveyer of semiconductor crystal wafer as claimed in claim 1, is characterized in that,Described control module is according to described first sensor and described the second sensing station and rising edgeAnd the time difference between trailing edge, calculate respectively described first sensor and described the second sensorDistance between rising edge and trailing edge, the position, the actual center of circle that obtains described semiconductor crystal waferPut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410635657.5A CN105609453A (en) | 2014-11-11 | 2014-11-11 | Semiconductor wafer transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410635657.5A CN105609453A (en) | 2014-11-11 | 2014-11-11 | Semiconductor wafer transmission device |
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| CN105609453A true CN105609453A (en) | 2016-05-25 |
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| CN201410635657.5A Pending CN105609453A (en) | 2014-11-11 | 2014-11-11 | Semiconductor wafer transmission device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109592413A (en) * | 2018-12-24 | 2019-04-09 | 惠科股份有限公司 | A kind of carrying device and diced system |
| CN112786475A (en) * | 2019-11-08 | 2021-05-11 | 沈阳新松机器人自动化股份有限公司 | Automatic deviation rectifying method for wafer |
| CN113053789A (en) * | 2021-04-14 | 2021-06-29 | 罗爱斌 | Polycrystalline circle edge grinding system |
| CN113161275A (en) * | 2021-04-13 | 2021-07-23 | 上海广川科技有限公司 | Semiconductor device with a plurality of semiconductor chips |
| CN106684026B (en) * | 2017-03-13 | 2023-07-11 | 北京京仪自动化装备技术股份有限公司 | Automatic wafer center-searching device |
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| CN101217127A (en) * | 2007-01-04 | 2008-07-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A silicon slice deviation dynamic regulation method and device by photoelectric switch |
| JP2008218903A (en) * | 2007-03-07 | 2008-09-18 | Olympus Corp | Centripetal apparatus and centripetal method for wafer |
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2014
- 2014-11-11 CN CN201410635657.5A patent/CN105609453A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101217127A (en) * | 2007-01-04 | 2008-07-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A silicon slice deviation dynamic regulation method and device by photoelectric switch |
| JP2008218903A (en) * | 2007-03-07 | 2008-09-18 | Olympus Corp | Centripetal apparatus and centripetal method for wafer |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684026B (en) * | 2017-03-13 | 2023-07-11 | 北京京仪自动化装备技术股份有限公司 | Automatic wafer center-searching device |
| CN109592413A (en) * | 2018-12-24 | 2019-04-09 | 惠科股份有限公司 | A kind of carrying device and diced system |
| CN109592413B (en) * | 2018-12-24 | 2021-08-06 | 惠科股份有限公司 | Carrying device and cutting system |
| CN112786475A (en) * | 2019-11-08 | 2021-05-11 | 沈阳新松机器人自动化股份有限公司 | Automatic deviation rectifying method for wafer |
| CN113161275A (en) * | 2021-04-13 | 2021-07-23 | 上海广川科技有限公司 | Semiconductor device with a plurality of semiconductor chips |
| CN113053789A (en) * | 2021-04-14 | 2021-06-29 | 罗爱斌 | Polycrystalline circle edge grinding system |
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