CN113046804A - Special gilding closed nozzle device for continuous electroplating line - Google Patents
Special gilding closed nozzle device for continuous electroplating line Download PDFInfo
- Publication number
- CN113046804A CN113046804A CN202110449653.8A CN202110449653A CN113046804A CN 113046804 A CN113046804 A CN 113046804A CN 202110449653 A CN202110449653 A CN 202110449653A CN 113046804 A CN113046804 A CN 113046804A
- Authority
- CN
- China
- Prior art keywords
- liquid inlet
- device shell
- groove
- closed nozzle
- nozzle device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Abstract
The invention discloses a special gold-plating closed nozzle device for a continuous plating line, and aims to provide a special gold-plating closed nozzle device for a continuous plating line, which has the technical scheme that: the electroplating device comprises a device shell, wherein a hollow groove is formed in the center of the device shell, a product channel is arranged in the hollow groove, a safety baffle is arranged at the bottom of the product channel, and an electroplating opening area is arranged below the safety baffle; the top of the device shell is respectively provided with a first liquid inlet, a second liquid inlet and a third liquid inlet, a liquid guide pipe is connected below the first liquid inlet, the second liquid inlet and the third liquid inlet, and the liquid guide pipe is positioned right above the product channel.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a special gold-plated closed nozzle device of a continuous electroplating line.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The electroplating bath is an infrastructure for electroplating workpieces, but the existing electroplating bath has the problems of uneven electroplating, incapability of controlling the flow rate of a solution and the density of current and low working efficiency.
Disclosure of Invention
The invention aims to provide a special gold-plating closed nozzle device for a continuous plating line, which has the advantages that the flow velocity of a solution is increased and the density of current is changed through an adjustable upper pressing plate and an adjustable lower pressing plate, so that the processing efficiency of a product is improved.
The technical purpose of the invention is realized by the following technical scheme:
a special gold-plating closed nozzle device for a continuous plating line comprises a device shell, wherein a hollow groove is formed in the center of the device shell, a product channel is arranged in the hollow groove, a safety partition plate is arranged at the bottom of the product channel, and a plating opening area is arranged below the safety partition plate; the top of the device shell is respectively provided with a first liquid inlet, a second liquid inlet and a third liquid inlet, liquid guide pipes are connected below the first liquid inlet, the second liquid inlet and the third liquid inlet, and the liquid guide pipes are positioned right above the product channel; the device comprises a device shell, a liquid guide pipe, upper pressure adjusting mechanisms, a lower pressure adjusting mechanism and a liquid guide pipe, wherein the upper pressure adjusting mechanisms are arranged on two sides of the device shell and comprise upper mounting grooves arranged on the surfaces of the two sides of the device shell, a horizontally adjusting rod in sliding connection in the upper mounting grooves, an upper pressure plate arranged at the bottom of the horizontally adjusting rod, and an upper pressure opening groove arranged on the horizontal plane of the upper pressure plate and positioned on the surface of; the lower pressure adjusting mechanism comprises a lower mounting groove arranged below the upper mounting groove, a lower pressing plate in sliding connection and positioned in the lower mounting groove, and a lower pressure opening groove which is arranged on the horizontal plane of the lower pressing plate and positioned on the surface of the liquid guide pipe.
Through adopting above-mentioned technical scheme, this kind of special gilding of continuous plating line airtight nozzle device mountable is at the gilding inslot, the product that will carry out the electroplating is placed in the product passageway, then solution passes through the first inlet at top, the interior inflow of second inlet and third inlet, solution flows to the product surface through the pipe, wherein set up upper portion pressure adjustment mechanism and lower part pressure adjustment mechanism on the device shell, thereby staff's accessible pulling level adjustment pole drives lower plate horizontal migration, thereby change the cross sectional area to the pipe, thereby the velocity of flow of solution has been increased, current density has been increased, and the lower part pressure adjustment mechanism of below can further increase the velocity of flow of solution, increase current density, thereby improve the machining efficiency of product.
Further setting: still be equipped with electroplating jig in the product passageway, electroplating jig is including installing in the first push cylinder of fretwork groove surface, second push cylinder, including being located the tight piece of clamp on the piston rod of first push cylinder and second push cylinder.
Through adopting above-mentioned technical scheme, the electroplating fixture who sets up in the product passageway can realize pressing from both sides fast tightly and the location to the product through the tight piece of clamp on first push cylinder, the second push cylinder and the piston rod to guarantee the stability of product when electroplating processing.
Further setting: the device shell surface is equipped with a plurality of set screw, the set screw surface is equipped with fastening nut.
Through adopting above-mentioned technical scheme, the fixed screw on device shell surface can make the connection precision of shell obtain guaranteeing, and life obtains the extension.
Further setting: the device shell both sides are equipped with fixed connection's mounting panel, be equipped with fixed connection's picture peg on the mounting panel, the picture peg surface still is equipped with fixed connection's stopper.
Through adopting above-mentioned technical scheme, set up in the mounting panel and the picture peg of device shell both sides and can set up and install on the production line to the stopper can play the effect of protection.
Further setting: the surface of the clamping block is provided with a slot, and an anti-skid friction plate is arranged in the slot.
Through adopting above-mentioned technical scheme, set up the anti-skidding friction disc in the slot and can strengthen the frictional force between product and the clamp block, prevent to produce and slide, cause electroplating process's error.
In conclusion, the invention has the following beneficial effects: the device is arranged in a gold plating groove, and the flow velocity of the solution is increased, the current density is increased and the processing efficiency of the product is improved by adjusting the upper and lower pressing plates; meanwhile, the electroplating fixture is simple to operate, products of different styles can be used by adjusting the electroplating fixture, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the front structure of a special gold-plated closed nozzle device of a continuous plating line;
FIG. 2 is a schematic diagram of the overall structure of a special gold-plated closed nozzle device of a continuous plating line.
In the figure, 1, the device housing; 2. hollowing out the grooves; 3. a product channel; 4. electroplating the clamp; 41. a first push cylinder; 42. a second push cylinder; 43. a clamping block; 5. an upper pressure adjusting mechanism; 51. mounting grooves; 52. a horizontal adjusting rod; 53. an upper pressure plate; 54. an upper pressure port groove; 6. a lower pressure adjusting mechanism; 61. a lower mounting groove; 62. a lower pressing plate; 63. pressing a notch groove; 7. a first liquid inlet; 8. a second liquid inlet; 9. a third liquid inlet; 10. a slot; 11. an anti-slip friction plate; 12. fixing screws; 13. fastening a nut; 14. mounting a plate; 15. Inserting plates; 16. and a limiting block.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A special gold-plating closed nozzle device for a continuous plating line is shown in figures 1 and 2 and comprises a device shell 1, wherein a hollow groove 2 is formed in the center of the device shell 1, a product channel 3 is arranged in the hollow groove 2, a safety baffle is arranged at the bottom of the product channel 3, and a plating opening area is arranged below the safety baffle; the top of the device shell 1 is respectively provided with a first liquid inlet 7, a second liquid inlet 8 and a third liquid inlet 9, liquid guide pipes are connected below the first liquid inlet 7, the second liquid inlet 8 and the third liquid inlet 9, and the liquid guide pipes are positioned right above the product channel 3; the two sides of the device shell 1 are provided with upper pressure adjusting mechanisms 5, each upper pressure adjusting mechanism 5 comprises an upper mounting groove 51 arranged on the two side surfaces of the device shell 1, a horizontal adjusting rod 52 positioned in the upper mounting groove 51 and connected in a sliding manner, an upper pressure plate 53 arranged at the bottom of the horizontal adjusting rod 52, and an upper pressure opening groove 54 arranged on the horizontal plane of the upper pressure plate 53 and positioned on the surface of the liquid guide pipe; the lower pressure adjusting mechanism 6 is arranged below the upper pressure adjusting mechanism 5, and the lower pressure adjusting mechanism 6 comprises a lower mounting groove 61 arranged below the upper mounting groove 51, a lower pressing plate 62 which is positioned in the lower mounting groove 61 and is in sliding connection with the lower pressing plate, and a lower pressure opening groove 63 which is arranged on the horizontal plane of the lower pressing plate 62 and is positioned on the surface of the liquid guide pipe.
Still be equipped with electroplating jig 4 in the product passageway 3, electroplating jig 4 is including installing in the first push cylinder 41 on fretwork groove 2 surface, second push cylinder 42, including being located the tight piece 43 of clamp on the piston rod of first push cylinder 41 and second push cylinder 42, presss from both sides tight piece 43 surface and is equipped with slot 10, is equipped with anti-skidding friction disc 11 in the slot 10.
The surface of the device shell 1 is provided with a plurality of fixing screws 12, and the surface of each fixing screw 12 is provided with a fastening nut 13. The device shell 1 both sides are equipped with fixed connection's mounting panel 14, are equipped with fixed connection's picture peg 15 on the mounting panel 14, and picture peg 15 surface still is equipped with fixed connection's stopper 16.
The main working principle is as follows: this kind of special gilt airtight nozzle device of continuous plating line can install in the gilt inslot, places the product that will carry out the electroplating in product passageway 3, sets up electroplating jig 4 in product passageway 3 and can realize the tight and location of quick clamp to the product through first push cylinder 41, second push cylinder 42 and the clamp block 43 on the piston rod to guarantee the stability of product when electroplating processing. Then the solution flows in through the first inlet 7 at top, the second inlet 8 and the third inlet 9, the solution flows to the product surface through the pipe, wherein set up upper portion pressure adjustment mechanism 5 and lower part pressure adjustment mechanism 6 on device shell 1, thereby staff's accessible pulling leveling lever 52 drives upper and lower board horizontal migration, thereby change the cross sectional area to the pipe, thereby the velocity of flow of solution has been increased, current density has been increased, and lower part pressure adjustment mechanism 6 of below can further increase the velocity of flow of solution, increase current density, thereby improve the machining efficiency of product.
The above-mentioned embodiments are merely illustrative and not restrictive, and those skilled in the art can make modifications to the embodiments without inventive contribution as required after reading the present specification, but only protected by the patent laws within the scope of the claims.
Claims (5)
1. A continuous plating line special gold plating closed nozzle device comprises a device shell (1), and is characterized in that: a hollow groove (2) is formed in the center of the device shell (1), a product channel (3) is arranged in the hollow groove (2), a safety baffle is arranged at the bottom of the product channel (3), and an electroplating opening area is arranged below the safety baffle; a first liquid inlet (7), a second liquid inlet (8) and a third liquid inlet (9) are respectively formed in the top of the device shell (1), liquid guide pipes are connected below the first liquid inlet (7), the second liquid inlet (8) and the third liquid inlet (9), and the liquid guide pipes are positioned right above the product channel (3); the device comprises a device shell (1), wherein upper pressure adjusting mechanisms (5) are arranged on two sides of the device shell (1), each upper pressure adjusting mechanism (5) comprises an upper mounting groove (51) arranged on the surface of each side of the device shell (1), a horizontally adjusting rod (52) positioned in the upper mounting groove (51) and connected in a sliding manner, an upper pressure plate (53) arranged at the bottom of the horizontally adjusting rod (52), and an upper pressure opening groove (54) arranged on the horizontal plane of the upper pressure plate (53) and positioned on the surface of a liquid guide pipe; the upper pressure adjusting mechanism (5) is provided with a lower pressure adjusting mechanism (6) below, the lower pressure adjusting mechanism (6) comprises a lower mounting groove (61) arranged below the upper mounting groove (51), a lower pressing plate (62) which is positioned in the lower mounting groove (61) and is connected in a sliding manner, and a lower pressure opening groove (63) which is arranged on the horizontal plane of the lower pressing plate (62) and is positioned on the surface of the liquid guide pipe.
2. The continuous plating line special gold plating closed nozzle device according to claim 1, characterized in that: still be equipped with electroplating jig (4) in product passageway (3), electroplating jig (4) are including installing first push cylinder (41), second push cylinder (42) on fretwork groove (2) surface, including being located clamping block (43) on the piston rod of first push cylinder (41) and second push cylinder (42).
3. The continuous plating line special gold plating closed nozzle device according to claim 1, characterized in that: the device is characterized in that a plurality of fixing screws (12) are arranged on the surface of the device shell (1), and fastening nuts (13) are arranged on the surfaces of the fixing screws (12).
4. The continuous plating line special gold plating closed nozzle device according to claim 1, characterized in that: the device shell (1) both sides are equipped with fixed connection's mounting panel (14), be equipped with fixed connection's picture peg (15) on mounting panel (14), picture peg (15) surface still is equipped with fixed connection's stopper (16).
5. The continuous plating line special gold plating closed nozzle device according to claim 1, characterized in that: the surface of the clamping block (43) is provided with a slot (10), and an anti-skid friction plate (11) is arranged in the slot (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110449653.8A CN113046804A (en) | 2021-04-25 | 2021-04-25 | Special gilding closed nozzle device for continuous electroplating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110449653.8A CN113046804A (en) | 2021-04-25 | 2021-04-25 | Special gilding closed nozzle device for continuous electroplating line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113046804A true CN113046804A (en) | 2021-06-29 |
Family
ID=76520437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110449653.8A Pending CN113046804A (en) | 2021-04-25 | 2021-04-25 | Special gilding closed nozzle device for continuous electroplating line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113046804A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1572911A (en) * | 2003-05-29 | 2005-02-02 | 株式会社荏原制作所 | Apparatus and method for plating a substrate |
| TW200716791A (en) * | 2006-11-08 | 2007-05-01 | Akahoshi Co Ltd | The metal foil electrolytic manufacturing apparatus |
| KR20150046935A (en) * | 2013-10-23 | 2015-05-04 | 주식회사 위스코하이텍 | Surface treatment device |
| CN208390958U (en) * | 2018-07-09 | 2019-01-18 | 天津中晟泰新能源科技有限公司 | A kind of amorphous band spray device |
| CN208414584U (en) * | 2018-06-14 | 2019-01-22 | 南亚电路板（昆山）有限公司 | A kind of routing support plate product plating apparatus facilitating adjusting |
| CN208472223U (en) * | 2018-06-21 | 2019-02-05 | 襄阳旭威特汽车零部件有限公司 | Continuous electroplating automatic control system |
| CN109735892A (en) * | 2019-03-20 | 2019-05-10 | 广东天承科技有限公司 | A kind of VCP electroplanting device |
| CN209338694U (en) * | 2018-11-29 | 2019-09-03 | 佳波(惠州)电镀有限公司 | A kind of cleaning plant based on electroplate liquid in electroplating bath |
| CN111472037A (en) * | 2020-05-26 | 2020-07-31 | 朱永安 | Single-side electroplating device and electroplating process thereof |
| CN212669817U (en) * | 2020-07-23 | 2021-03-09 | 余姚市爱迪升电镀科技有限公司 | Device for improving gold plating uniformity of automobile product |
| CN113026080A (en) * | 2021-04-25 | 2021-06-25 | 山王电子(无锡)有限公司 | Special nickel plating solution nozzle for electroplating production line |
| CN214782203U (en) * | 2021-04-25 | 2021-11-19 | 山王电子(无锡)有限公司 | Special gilding closed nozzle device for continuous electroplating line |
| CN214782251U (en) * | 2021-04-20 | 2021-11-19 | 山王电子(无锡)有限公司 | Continuous electroplating gilding general type base device |
-
2021
- 2021-04-25 CN CN202110449653.8A patent/CN113046804A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1572911A (en) * | 2003-05-29 | 2005-02-02 | 株式会社荏原制作所 | Apparatus and method for plating a substrate |
| TW200716791A (en) * | 2006-11-08 | 2007-05-01 | Akahoshi Co Ltd | The metal foil electrolytic manufacturing apparatus |
| KR20150046935A (en) * | 2013-10-23 | 2015-05-04 | 주식회사 위스코하이텍 | Surface treatment device |
| CN208414584U (en) * | 2018-06-14 | 2019-01-22 | 南亚电路板（昆山）有限公司 | A kind of routing support plate product plating apparatus facilitating adjusting |
| CN208472223U (en) * | 2018-06-21 | 2019-02-05 | 襄阳旭威特汽车零部件有限公司 | Continuous electroplating automatic control system |
| CN208390958U (en) * | 2018-07-09 | 2019-01-18 | 天津中晟泰新能源科技有限公司 | A kind of amorphous band spray device |
| CN209338694U (en) * | 2018-11-29 | 2019-09-03 | 佳波(惠州)电镀有限公司 | A kind of cleaning plant based on electroplate liquid in electroplating bath |
| CN109735892A (en) * | 2019-03-20 | 2019-05-10 | 广东天承科技有限公司 | A kind of VCP electroplanting device |
| CN111472037A (en) * | 2020-05-26 | 2020-07-31 | 朱永安 | Single-side electroplating device and electroplating process thereof |
| CN212669817U (en) * | 2020-07-23 | 2021-03-09 | 余姚市爱迪升电镀科技有限公司 | Device for improving gold plating uniformity of automobile product |
| CN214782251U (en) * | 2021-04-20 | 2021-11-19 | 山王电子(无锡)有限公司 | Continuous electroplating gilding general type base device |
| CN113026080A (en) * | 2021-04-25 | 2021-06-25 | 山王电子(无锡)有限公司 | Special nickel plating solution nozzle for electroplating production line |
| CN214782203U (en) * | 2021-04-25 | 2021-11-19 | 山王电子(无锡)有限公司 | Special gilding closed nozzle device for continuous electroplating line |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214782203U (en) | Special gilding closed nozzle device for continuous electroplating line | |
| CN104790022A (en) | Novel full-automatic vertical and continuous electroplating device for PCB | |
| CN207210561U (en) | A kind of aluminium section bar oxidation unit | |
| CN113046804A (en) | Special gilding closed nozzle device for continuous electroplating line | |
| CN103014792A (en) | Tin-cobalt alloy decorative chromium-substituted electroplate liquid and electroplate method thereof | |
| KR20100125487A (en) | Mask structure electrode plate box for pcb of plating equipment | |
| CN214782251U (en) | Continuous electroplating gilding general type base device | |
| CN206486617U (en) | A kind of thin plate rack device for solving thin-plate electroplating buckling problem | |
| CN102560608A (en) | Vertical plating tank with independent adjustable function | |
| CN211445960U (en) | Sub-tank capable of adjusting liquid level for electroplating | |
| CN215163286U (en) | Automatic plating liquid level control device | |
| CN214782254U (en) | Special nickel plating shield for electroplating production line | |
| CN204298483U (en) | The electric deposition device of HDI printed circuit board through hole | |
| CN211445959U (en) | Tinning equipment | |
| CN211445958U (en) | Stable sub-tank for electroplating | |
| CN113026080A (en) | Special nickel plating solution nozzle for electroplating production line | |
| US7678243B2 (en) | Internal heat spreader plating methods and devices | |
| CN207259627U (en) | Electroplating clamp for circuit board | |
| CN210826428U (en) | Jet device for electroplating of automobile parts | |
| CN217585926U (en) | A installation component for cement pipeline's ultrasonic flowmeter | |
| CN216712287U (en) | Interval adjustable formula panel is electroplated and is shielded system | |
| CN218626217U (en) | Water pollution monitoring devices is with installation fixed establishment | |
| CN211972483U (en) | Electroplating simulation tank | |
| CN216891286U (en) | Circuit board pattern electroplating equipment with uniform copper plating function | |
| CN211204548U (en) | Argon arc melts and covers water-cooling base member forced cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |