CN215163286U - Automatic plating liquid level control device - Google Patents
Automatic plating liquid level control device Download PDFInfo
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- CN215163286U CN215163286U CN202121638069.9U CN202121638069U CN215163286U CN 215163286 U CN215163286 U CN 215163286U CN 202121638069 U CN202121638069 U CN 202121638069U CN 215163286 U CN215163286 U CN 215163286U
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- liquid level
- fixedly connected
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- level control
- water level
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Abstract
The utility model discloses an automatic change plating bath level control device relates to electroplating automation, including the chamber shell, chamber shell left side fixedly connected with end cover, cylinder installing support upper end fixed mounting has the liquid level control cylinder, liquid level control cylinder output end fixedly connected with U-shaped connecting piece, U-shaped connecting piece upper end is rotated and is connected with the connecting rod, the end cover left side is in liquid level control cylinder top fixedly connected with supporting shoe of position department, the connecting rod middle part is rotated through pivot and supporting shoe and is connected, the connecting rod passes the rectangle through-hole and extends to inside the chamber shell, the connecting rod extends to the inside one end rotation of chamber shell and is connected with the transmission connecting piece, transmission connecting piece lower extreme rotates and is connected with the water level baffle, water level baffle sliding connection is inside the chamber shell. The utility model has the advantages that: by adopting the overflow device principle to control the liquid level of the electroplating bath, the requirement of accurately positioning the liquid level of the liquid medicine can be met, automatic water level adjustment is realized, the electroplating efficiency is improved, and the electroplating quality is ensured.
Description
Technical Field
The utility model relates to an electroplate automatic field, specifically relate to an automatic change plating bath level control device.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.
With the continuous progress of science and technology and the continuous development of production, the technical performance and the automation degree of production process equipment are higher and higher. At present, the water level of the electroplating liquid of most electroplating equipment is mainly adjusted by a manual valve, errors exist in manual control, the speed of the produced product is slow, and the electroplating precision is difficult to ensure; moreover, manual control needs a special water level measuring observation instrument, so that multiple products cannot be shared, the cost is wasted, and the operation is difficult; meanwhile, manual control cannot be automated, a large amount of labor cost is increased, and the yield is not high.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the technical scheme provides an automatic electroplating liquid level control device, and solves the problems that the water level of the electroplating liquid of most of the existing electroplating equipment proposed in the background art is mainly adjusted by a manual valve, the manual control has errors, the speed of the produced product is slow, and the electroplating precision is difficult to ensure; moreover, manual control needs a special water level measuring observation instrument, so that multiple products cannot be shared, the cost is wasted, and the operation is difficult; meanwhile, manual control cannot be realized automatically, a large amount of labor cost is increased, and the yield is not high.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
an automatic plating liquid level control device comprises a cavity shell, wherein an end cover is fixedly connected to the left side of the cavity shell, a cylinder mounting support is fixedly connected to the upper middle part of the left side of the end cover, a liquid level control cylinder is fixedly mounted at the upper end of the cylinder mounting support, a U-shaped connecting piece is fixedly connected to the output end of the liquid level control cylinder, a connecting rod is rotatably connected to the upper end of the U-shaped connecting piece, a supporting block is fixedly connected to the left side of the end cover above the liquid level control cylinder, a top cover is fixedly connected to the upper end of the cavity shell, a rectangular through hole is formed in the left side of the top cover and corresponds to the supporting block in a penetrating mode, the middle part of the connecting rod is rotatably connected with the supporting block through a rotating shaft, the connecting rod penetrates through the rectangular through hole and extends into the cavity shell, a transmission connecting piece is rotatably connected to one end of the connecting rod extending into the cavity shell, and a water level baffle is rotatably connected to the lower end of the transmission connecting piece, the water level baffle is slidably connected to the interior of the chamber shell.
Preferably, the equal fixedly connected with mounting panel in both sides rear end around the chamber shell, inside main cavity, the water level baffle setting zone and the overflow chamber of being provided with of chamber shell, the water level baffle setting zone sets up between main cavity and overflow chamber.
Preferably, the bottom surface of the overflow cavity is bucket-shaped, and the bottom surface of the overflow cavity is lower than the bottom surface of the main cavity.
Preferably, the bottom of the main cavity is fixedly connected with a communicating pipe, the bottom of the overflow cavity is fixedly connected with an overflow pipe, and the main cavity and the overflow cavity are communicated with the electroplating main circulation pipeline through the communicating pipe and the overflow pipe respectively.
Preferably, the equal fixedly connected with slide in both sides around water level baffle sets up the inside district, the bottom of slide is less than the bottom surface of main cavity, the equal sliding connection in slide of the water level baffle left and right sides is inside.
Compared with the prior art, the utility model has the advantages of:
1) the principle of a communicating vessel is adopted, the main cavity is communicated with the electroplating main circulation pipeline through a communicating pipe in the using process to ensure that the liquid level inside the main cavity is the same as the liquid level inside the electroplating bath, the principle of an overflow vessel is adopted to carry out liquid level control, when the liquid level of the main cavity is higher than the upper end height of the water level baffle, the fluid inside the main cavity can flow into the overflow cavity, the overflow cavity inputs the fluid into the electroplating main circulation pipeline through an overflow pipe, the liquid level of the main cavity is ensured to be the same as the upper end height of the water level baffle, so that the liquid level inside the electroplating bath is the same as the upper end height of the water level baffle, and the effect of adjusting the liquid level inside the electroplating bath is achieved;
2) the utility model discloses a liquid level control cylinder is as the drive arrangement who adjusts water level baffle position, liquid level control cylinder output passes through lever structure and is connected with water level baffle, whole transmission simple structure, be convenient for install, adopt the position of lever structure can accurate regulation water level baffle simultaneously, the position of adjusting water level baffle through the liquid level control cylinder can reach the effect of the inside liquid level of automatic regulation plating bath, can avoid equipment manual regulation, satisfy the demand of accurate positioning liquid medicine water level, and can realize fast through automated control that control electroplates the cladding material size, improve electroplating efficiency, guarantee to electroplate the quality.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention with the end cap and the top cover removed;
fig. 3 is a cross-sectional view of the present invention.
The reference numbers in the figures are:
1. a chamber housing; 101. mounting a plate; 102. a main chamber; 103. an overflow chamber; 104. a water level baffle setting area; 2. an end cap; 3. a cylinder mounting bracket; 4. a liquid level control cylinder; 5. a U-shaped connector; 6. a connecting rod; 7. a support block; 8. a top cover; 9. a transmission connection member; 10. a water level baffle; 11. an overflow pipe; 12. a communicating pipe; 13. a slideway.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
Referring to fig. 1-3, an automatic plating liquid level control device comprises a chamber shell 1, wherein an end cover 2 is fixedly connected to the left side of the chamber shell 1, a cylinder mounting bracket 3 is fixedly connected to the upper middle position of the left side of the end cover 2, a liquid level control cylinder 4 is fixedly mounted at the upper end of the cylinder mounting bracket 3, a U-shaped connecting piece 5 is fixedly connected to the output end of the liquid level control cylinder 4, a connecting rod 6 is rotatably connected to the upper end of the U-shaped connecting piece 5, a supporting block 7 is fixedly connected to the left side of the end cover 2 at the position above the liquid level control cylinder 4, a top cover 8 is fixedly connected to the upper end of the chamber shell 1, a rectangular through hole is formed in the left side of the top cover 8 and corresponds to the supporting block 7, the middle part of the connecting rod 6 is rotatably connected to the supporting block 7 through a rotating shaft, the connecting rod 6 passes through the rectangular through hole and extends into the chamber shell 1, a transmission connecting piece 9 is rotatably connected to one end of the connecting rod 6 extending into the chamber shell 1, the lower extreme of transmission connecting piece 9 rotates and is connected with water level baffle 10, water level baffle 10 sliding connection is inside 1 of chamber shell, U-shaped connecting piece 5, connecting rod 6, lever drive structure is constituteed to supporting shoe 7 and transmission connecting piece 9, whole transmission simple structure, the installation of being convenient for, it is accurate to adopt lever structure position transmission simultaneously, adjust the position of water level baffle 10 through level control cylinder 4 and then can reach the effect of the inside liquid level of automatic regulation plating bath, can avoid equipment manual regulation, satisfy the demand of accurate positioning liquid medicine water level, and can realize fast through automated control and control electroplating coating size, improve electroplating efficiency, guarantee to electroplate the quality.
The rear ends of the front side and the rear side of the cavity shell 1 are fixedly connected with a mounting plate 101, a main cavity 102, a water level baffle setting area 104 and an overflow cavity 103 are arranged in the cavity shell 1, the water level baffle setting area 104 is arranged between the main cavity 102 and the overflow cavity 103, the bottom surface of the overflow cavity 103 is bucket-shaped, the bottom surface of the overflow cavity 103 is lower than the bottom surface of the main cavity 102, the bottom of the main cavity 102 is fixedly connected with a communicating pipe 12, the bottom of the overflow cavity 103 is fixedly connected with an overflow pipe 11, the main cavity 102 and the overflow cavity 103 are respectively communicated with an electroplating main circulation pipeline through a communicating pipe 12 and the overflow pipe 11, the front side and the rear side of the water level baffle setting area 104 are respectively fixedly connected with slideways 13, the bottommost parts of the slideways 13 are lower than the bottom surface of the main cavity 102, the left side and the right side of the water level baffle 10 are respectively connected with the electroplating main circulation pipeline through the communicating pipe 12 in a sliding way to ensure that the liquid level in the main cavity 102 is the same as the liquid level in the electroplating bath, adopt the overflow ware principle to carry out level control, when the liquid level height of main cavity 102 is higher than the upper end height of water level baffle 10, the inside fluid of main cavity 102 can flow into in the overflow chamber 103, overflow chamber 103 inputs the fluid wherein to electroplate main circulation pipeline through overflow pipe 11, guarantee that the liquid level height of main cavity 102 is the same with the upper end height of water level baffle 10, thereby make the inside liquid level height of plating bath the same with the upper end height of water level baffle 10, play the inside liquid level height control's of plating bath effect.
The utility model discloses a theory of operation does: before electroplating, a lever transmission structure consisting of the U-shaped connecting piece 5, the connecting rod 6, the supporting block 7 and the transmission connecting piece 9 is driven by the liquid level control cylinder 4 to drive the water level baffle 10 to move to an initial height position, then liquid medicine is conveyed to the electroplating bath through the electroplating main circulation pipeline, when the height of the liquid level in the electroplating bath is the same as the height of the upper end of the water level baffle 10, the height of the liquid level in the electroplating bath does not rise any more, and when the liquid level is required to be carried out in the electroplating process, the height of the water level baffle 10 can be directly adjusted and controlled by changing the height of the water level baffle 10 through the liquid level control cylinder 4.
To sum up, the utility model has the advantages that: through adopting the overflow ware principle to carry out plating bath liquid level control, can satisfy the demand of accurate positioning liquid medicine water level, adopt the liquid level control cylinder to drive the water level baffle simultaneously and remove, realize automatic water level control, avoid equipment manual regulation, reduce artifical demand, improve electroplating efficiency, guarantee to electroplate the quality.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. An automatic plating liquid level control device is characterized by comprising a cavity shell (1), wherein an end cover (2) is fixedly connected to the left side of the cavity shell (1), a cylinder mounting support (3) is fixedly connected to the upper middle part of the left side of the end cover (2), a liquid level control cylinder (4) is fixedly mounted at the upper end of the cylinder mounting support (3), a U-shaped connecting piece (5) is fixedly connected to the output end of the liquid level control cylinder (4), a connecting rod (6) is rotatably connected to the upper end of the U-shaped connecting piece (5), a supporting block (7) is fixedly connected to the left side of the end cover (2) at the position above the liquid level control cylinder (4), a top cover (8) is fixedly connected to the upper end of the cavity shell (1), a rectangular through hole is formed in the position, corresponding to the supporting block (7), of the left side of the top cover (8), and the middle part of the connecting rod (6) is rotatably connected with the supporting block (7) through a rotating shaft, connecting rod (6) pass the rectangle through-hole and extend to inside chamber shell (1), connecting rod (6) extend to the inside one end of chamber shell (1) and rotate and be connected with transmission connecting piece (9), transmission connecting piece (9) lower extreme rotates and is connected with water level baffle (10), water level baffle (10) sliding connection is inside chamber shell (1).
2. The automatic plating solution level control device according to claim 1, wherein the rear ends of the front side and the rear side of the cavity shell (1) are fixedly connected with a mounting plate (101), a main cavity (102), a water level baffle setting area (104) and an overflow cavity (103) are arranged inside the cavity shell (1), and the water level baffle setting area (104) is arranged between the main cavity (102) and the overflow cavity (103).
3. The automated plating solution level control device according to claim 2, wherein the bottom surface of the overflow chamber (103) is configured as a hopper, and the bottom surface of the overflow chamber (103) is lower than the bottom surface of the main chamber (102).
4. The automatic electroplating liquid level control device according to claim 3, wherein a communicating pipe (12) is fixedly connected to the bottom of the main cavity (102), an overflow pipe (11) is fixedly connected to the bottom of the overflow cavity (103), and the main cavity (102) and the overflow cavity (103) are respectively communicated with an electroplating main circulation pipeline through the communicating pipe (12) and the overflow pipe (11).
5. The automatic plating solution level control device according to claim 4, wherein the water level baffle setting area (104) is fixedly connected with slideways (13) at the front side and the rear side, the bottommost part of the slideways (13) is lower than the bottom surface of the main cavity (102), and the water level baffle (10) is connected inside the slideways (13) in a sliding manner at the left side and the right side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121638069.9U CN215163286U (en) | 2021-07-19 | 2021-07-19 | Automatic plating liquid level control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121638069.9U CN215163286U (en) | 2021-07-19 | 2021-07-19 | Automatic plating liquid level control device |
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| Publication Number | Publication Date |
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| CN215163286U true CN215163286U (en) | 2021-12-14 |
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| CN202121638069.9U Active CN215163286U (en) | 2021-07-19 | 2021-07-19 | Automatic plating liquid level control device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114160382A (en) * | 2021-11-17 | 2022-03-11 | 合肥路明反光材料有限公司 | Coating machine is used in complex film production with glue prevents function of solidifying |
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2021
- 2021-07-19 CN CN202121638069.9U patent/CN215163286U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114160382A (en) * | 2021-11-17 | 2022-03-11 | 合肥路明反光材料有限公司 | Coating machine is used in complex film production with glue prevents function of solidifying |
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