CN201442986U - Lead frame plating bath - Google Patents
Lead frame plating bath Download PDFInfo
- Publication number
- CN201442986U CN201442986U CN2009200256614U CN200920025661U CN201442986U CN 201442986 U CN201442986 U CN 201442986U CN 2009200256614 U CN2009200256614 U CN 2009200256614U CN 200920025661 U CN200920025661 U CN 200920025661U CN 201442986 U CN201442986 U CN 201442986U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- coating bath
- bath
- cell body
- box body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a lead frame plating bath which comprises a bath body, anodes arranged in the bath body and an upper liquid pipe with an upward liquid outlet arranged at the bottom of the bath body. The bath body is internally provided with a bath-shaped box body with a downward opening; the bottom of the bath-shaped box body corresponds to a bar-shaped distributing hole which is arranged at the marching position of a lead frame chip along the length direction thereof, so as to form an upper liquid channel; and the bath-shaped box body is internally provided with a transverse diaphragm with a hole grid. The utility model provides a lead frame plating bath with which a plated area is easy to control.
Description
(1) technical field
The utility model relates to a kind of lead frame coating bath, relate to a kind of particularly to the galvanized lead frame coating bath of lead frame piece single-side pin of lead frame in groups that has before the single lead frame unit blanking, the anode that it has cell body and embeds cell body, and the last liquid pipe that is positioned at the cell body bottom.
(2) background technology
Zinc-plated now employing of lead frame pin encapsulates the back that finishes to its tinned technology more, development along with production technique, occurred at present after lead frame is finished, utilized its surface cleaning and not need to remake the advantage that oil removing, rust cleaning etc. handle in earlier stage directly zinc-plated to it.Because lead frame is zinc-plated mainly to be to carry out zinc-plated to its pin, therefore, on the lead frame piece before lead frame unit blanking it zinc-platedly had an efficient height with lead frame in groups, be convenient to control zinc-plated amount, promptly have the more accurate characteristics in zinc-plated zone, those skilled in the art is promoting this technology at present.
Because this tin plating technique needs lead frame piece to move along its length direction, its width edge is in vertical state, and a side pin is electroplated, therefore, in order to obtain more accurate plating area, must stablize the flow velocity homogeneity of living plating bath liquid level and plating bath, and the uniform distribution of plating bath.But the present coating bath that is applied to this technology, liquid pipe is positioned at the cell body bottom on it, and velocity ratio is bigger, and local flow stream velocity is big, and whole body fluid flow instability causes the bad control in plating area.
(3) summary of the invention
Therefore, the existing electroplating technology of the utility model is applied to the galvanized above-mentioned defective of lead frame piece, and the lead frame coating bath of a kind of easy control plating area is provided.
In order to realize the foregoing invention purpose, the technical solution adopted in the utility model is:
The utility model lead frame coating bath, comprise cell body and be arranged on the intravital anode of groove, and the liquid outlet last liquid pipe up that is arranged on the cell body bottom, in described cell body, be provided with the flute profile box body that Open Side Down, this grooved box body bottom is corresponding to the dispensing orifice of the bar shaped lead frame piece advanced positions and that be provided with along its length direction, liquid passage in the formation, and be provided with transverse wall in the described flute profile box body with hole grid.
Based on the lead frame coating bath of technical solutions of the utility model, have the flute profile box body of liquid liquid stream on the uniformly distributing plating bath, its principle is, by the distribution effect of hole grid,, thereby make liquid pressure basically identical on dividing plate top with the flow stream pressure homogenizing, and the liquid that the dispensing orifice that makes comes out stream, before and after hydraulic pressure is even basically, flow speed stability, and the distribution by bar hole, make fluid liquid stream front and back long, just in time consistent with the direct of travel of lead frame piece, the electroplating efficiency height, quality is good.And, obtain the higher plating area of precision easily because above-mentioned liquid stream is stable.
Above-mentioned lead frame coating bath, the side panel middle part of described cell body is provided with flashboard and the setting device thereof that is used to control the plating bath return flow.
Described flashboard is that cross section is the plate of U-shaped, and U-shaped spatial two ends are embedded on the limit of refluxing opening, and it moves up and down by a screw drive that cooperates with this silk hole, flashboard bottom.
The front and back end of described cell body is provided with baffle plate and the hoisting appliance thereof that is used for overflow.
Described baffle plate bottom is positioned at the groove that cooperates with its slip liquid sealing, and its hoisting appliance is for driving its screw rod that moves up and down.
Be provided with in the middle of the described baffle plate top and be used for positioning and guiding seam that lead frame is positioned and leads.
Described baffle plate top is wedge shape.
(4) description of drawings
Below in conjunction with Figure of description the technical solution of the utility model is further described, makes those skilled in the art better understand the utility model:
Fig. 1 is a kind of structural representation of the utility model lead frame coating bath.
Fig. 2 is a kind of structural representation of cell body.
Fig. 3 is a kind of structural representation of flute profile box body.
Among the figure: 1, anode, 2, screw rod, 3, flashboard, 4, screw rod, 5, the positioning and guiding seam, 6, baffle plate, 7, the flute profile box body, 8, go up the liquid pipe, 9, cell body, 10, side panel, 11, wedge-shaped part, 12, front panel, 13, dispensing orifice, 14, upper plate, 15, transverse wall.
(5) embodiment
Below the technical solution of the utility model is made exemplary illustration:
With reference to explanation accompanying drawing 1 to 3, present embodiment lead frame coating bath, comprise cell body 9 and be arranged on the intravital anode 1 of groove, and the liquid outlet last liquid pipe 8 up that is arranged on the cell body bottom, in described cell body, be provided with the flute profile box body 7 that Open Side Down, this grooved box body bottom is corresponding to the dispensing orifice 13 of the bar shaped lead frame piece advanced positions and that be provided with along its length direction, liquid passage in the formation, and be provided with transverse wall 15 in the described flute profile box body with hole grid.
Wherein said anode adopts the anode of titanium basket structure.This programme is not limited to zinc-plated, at silver-plated, nickel plating that at present can be widely used in pin in this area etc. and the similar electroplating technology of tin plating technique.
In order to obtain reasonable electroplating effect, need keep the electrolyte balance of electroplate liquid, therefore, the flow velocity of plating bath needs control, and above-mentioned flashboard is mainly used in its flow velocity of control.
Described flashboard is that cross section is the plate of U-shaped, and U-shaped spatial two ends are embedded on the limit of refluxing opening, and it moves up and down by screw rod 2 drivings that cooperate with this silk hole, flashboard bottom, adopt this texture ratio to be convenient to the sealing of mating surface, and adopting screw rod as actuator, cost is low, and is simple in structure.
In order to obtain more accurate plating area, the front and back end of described cell body is provided with baffle plate 6 and the hoisting appliance thereof that is used for overflow, by adjusting the height of baffle plate, obtains accurate plating area, and the plating bath that is higher than this setting plating bath degree of depth is flowed out.Overflow and backflow cooperatively interact, and have both kept electrolytical balance, prevent that again flooding velocity is excessive, and the liquid level instability influences the cladding region precision), it is main forming backflow, overflow is the equilibrium state of assisting.
Described baffle plate bottom is positioned at the groove that cooperates with its slip liquid sealing, and its hoisting appliance is for driving its screw rod that moves up and down 4.
For the ease of the location of lead frame, its charged plating position is immersed in plating bath, be provided with in the middle of the described baffle plate top and be used for positioning and guiding seam 5 that lead frame is positioned and leads, not only simple in structure, and be easy to control.
For the ease of location and processing, described baffle plate top is wedge shape.
Claims (7)
1. lead frame coating bath, comprise cell body (9) and be arranged on the intravital anode of groove (1), and the liquid outlet last liquid pipe (8) up that is arranged on the cell body bottom, it is characterized in that: in described cell body, be provided with the flute profile box body (7) that Open Side Down, this grooved box body bottom is corresponding to the dispensing orifice (13) of the bar shaped lead frame piece advanced positions and that be provided with along its length direction, liquid passage in the formation, and be provided with transverse wall (15) in the described flute profile box body with hole grid.
2. lead frame coating bath according to claim 1 is characterized in that: the side panel of described cell body (10) middle part is provided with flashboard (3) and the setting device thereof that is used to control the plating bath return flow.
3. lead frame coating bath according to claim 2 is characterized in that: described flashboard is that cross section is the plate of U-shaped, and U-shaped spatial two ends are embedded on the limit of refluxing opening, and drives it by a screw rod (2) that cooperates with silk hole, this flashboard bottom and move up and down.
4. lead frame coating bath according to claim 1 is characterized in that: the front and back end of described cell body is provided with baffle plate (6) and the hoisting appliance thereof that is used for overflow.
5. lead frame coating bath according to claim 4 is characterized in that: described baffle plate bottom is positioned at the groove that cooperates with its slip liquid sealing, and its hoisting appliance is for driving its screw rod that moves up and down (4).
6. lead frame coating bath according to claim 5 is characterized in that: be provided with in the middle of the described baffle plate top and be used for positioning and guiding seam (5) that lead frame is positioned and leads.
7. lead frame coating bath according to claim 6 is characterized in that: described baffle plate top is wedge shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200256614U CN201442986U (en) | 2009-05-19 | 2009-05-19 | Lead frame plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009200256614U CN201442986U (en) | 2009-05-19 | 2009-05-19 | Lead frame plating bath |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201442986U true CN201442986U (en) | 2010-04-28 |
Family
ID=42547662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009200256614U Expired - Lifetime CN201442986U (en) | 2009-05-19 | 2009-05-19 | Lead frame plating bath |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201442986U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
-
2009
- 2009-05-19 CN CN2009200256614U patent/CN201442986U/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
CN104313668A (en) * | 2014-09-30 | 2015-01-28 | 苏州芯航元电子科技有限公司 | Electrochemical treatment trough for electron production wire |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104005077B (en) | The electroplanting device of optimized temperature field distribution and electro-plating method thereof | |
CN202499923U (en) | Automatic copper ball adding device of electroplating tank | |
CN201442986U (en) | Lead frame plating bath | |
CN201109803Y (en) | Electrolysis liquid-storing case having automatic fluid infusion apparatus | |
CN108588803B (en) | Electro-deposition device | |
CN204982087U (en) | Copper electrolyte circulating device | |
CN102560608A (en) | Vertical plating tank with independent adjustable function | |
CN205688030U (en) | A kind of copper refining electrolysis bath circulating remove impurity formula | |
CN209098831U (en) | A kind of copper electrolysis cells | |
CN214782251U (en) | Continuous electroplating gilding general type base device | |
CN205616970U (en) | Electroplating device of pipe fitting | |
CN201172695Y (en) | Refluxing device of liquid level selecting electroplate | |
CN203807578U (en) | Device and system for electroplating thin plate | |
CN202509147U (en) | Electroplating bath | |
CN202297834U (en) | Electroplating device with adjustable plating liquid flow direction | |
CN208055484U (en) | A kind of electroplating bath | |
CN206157243U (en) | At uniform velocity sharp reciprocal agitating unit | |
CN203807581U (en) | Electroplating flow guide device and system | |
CN202989320U (en) | Plastic-packaged integrated circuit continuous-plating shielding device | |
CN220589025U (en) | Electrolyte inlet pipeline | |
CN216445475U (en) | Electrolytic tank for stabilizing working condition of electrolytic manganese | |
CN207294917U (en) | A kind of continuous electrophoresis selects coating bath | |
CN203793812U (en) | Resin containing bucket for producing glass fiber reinforced plastics | |
CN109518243A (en) | A kind of chip-resistance electroplanting device | |
CN210657191U (en) | Slow pull groove with water guide mechanism |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20100428 |
|
CX01 | Expiry of patent term |