CN202499923U - Automatic copper ball adding device of electroplating tank - Google Patents

Automatic copper ball adding device of electroplating tank Download PDF

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Publication number
CN202499923U
CN202499923U CN 201220016679 CN201220016679U CN202499923U CN 202499923 U CN202499923 U CN 202499923U CN 201220016679 CN201220016679 CN 201220016679 CN 201220016679 U CN201220016679 U CN 201220016679U CN 202499923 U CN202499923 U CN 202499923U
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CN
China
Prior art keywords
box
copper ball
copper
anode titanium
automatic
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Expired - Fee Related
Application number
CN 201220016679
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Chinese (zh)
Inventor
李长生
胡卓
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Shenzhen Sun & Lynn Circuits Co Ltd
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Shenzhen Sun & Lynn Circuits Co Ltd
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Priority to CN 201220016679 priority Critical patent/CN202499923U/en
Application granted granted Critical
Publication of CN202499923U publication Critical patent/CN202499923U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an automatic copper ball adding device of an electroplating tank. The automatic copper ball adding device comprises anode titanium baskets arranged in the electroplating tank and further comprises an adding box arranged above the anode titanium basket and an importer communicated with the adding box, wherein the adding box is provided with an opening corresponding to the anode titanium baskets, and a communication part between the adding box and the importer is further provided with a clamping position. According to the utility model, by means of arranging one adding box above the anode titanium baskets, importing copper balls into the adding box through the importer, and making the copper balls enter the anode titanium baskets correspondingly through the opening in the adding box, the automatic adding of the copper balls is realized. Compared with the prior art, the automatic copper ball adding device disclosed by the utility model realizes the rapid, accurate and automatic adding of the copper balls of the electroplating tank, so that the production efficiency is increased greatly, and meanwhile, the waste of the copper balls is avoided.

Description

The automatic adding set of plating tank copper ball
Technical field
The utility model belongs to the wiring board production technical field, and what be specifically related to is the automatic adding set of a kind of plating tank copper ball.
Background technology
Electroplating technology is the important step in the course of manufacturing printed circuit board, and it is meant and utilizes electrolysis principle, forms process even, fine and close, that combine good metal or alloy deposition layer on products such as wiring board surface.In present electroplating industry, have electrolytic solution and several anode titanium baskets in the plating tank, all be equipped with the plating material in each anode titanium basket,, the plating material can carry out electroplating activity when filling up anode titanium basket.As in via, conduction trough, figure and the panel plating copper process of printed substrate, to produce for ease, the copper material in the anode titanium basket is processed to spherical; Be commonly called as copper ball, and dropped in the anode titanium basket, along with the carrying out that produces; Copper ball can by electrolytic solution constantly electrolysis fall; So need regularly replenish aborning, can carry out smoothly to guarantee the electro-coppering process, and form uniform electrolytic coating.
When adding copper ball in the production; The production operation personnel generally adopt the artificial mode directly to drop into copper ball in the anode titanium basket; This mode efficient is lower, and takes a plurality of copper balls simultaneously, occurs copper ball easily and falls into plating tank and the dissolved situation occurs; Can pollute electroplate liquid, also waste copper ball simultaneously.For avoiding occurring the phenomenon that copper ball drops; Sometimes also adopt the mode of adding of shutting down in the prior art; Promptly stop to produce, on production line, utilize the funnel-form inducting device to carry out manual work and add, though this mode has avoided copper ball to fall into the wasting problem of electrolytic solution; But production capacity is caused influence but shut down to produce, reduced production efficiency.
The utility model content
For this reason; The purpose of the utility model is to provide a kind of plating tank copper ball automatic adding set; Fall into plating tank easily to solve the existing copper ball of present employing manual type interpolation copper ball, and shut down and add the problem that the existing production efficiency of copper ball mode is low, production capacity is not high.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
The automatic adding set of a kind of plating tank copper ball; Comprise the anode titanium basket (4) that is installed in the plating tank; Wherein also comprise the interpolation box (2) that is installed in anode titanium basket (4) top; And the inducting device (1) that is communicated with interpolation box (2), said interpolation box (2) is provided with and anode titanium basket (4) position corresponding opening (202), and interpolation box (2) also is provided with a screens (201) with inducting device (1) place of connection.
Wherein said inducting device (1) constitutes by putting copper box (101) and importing pipeline (102), said importing pipeline (102) one ends with put copper box (101) and be communicated with, the other end is provided with the clamp (103) with the corresponding engaging of screens (201).
Wherein said interpolation box (2) split shed (202) locates also to be provided with valve (203).
Wherein said interpolation box (2) split shed (202) is communicated with anode titanium basket (4) through pipeline (3).
The utility model adds box through on anode titanium basket, being provided with one, through inducting device copper ball is imported to and adds in the box, and enter into anode titanium basket through the opening that adds in the box through the piping correspondence, has realized the automatic interpolation of copper ball.With compared with techniques in the past, the utility model realized to the plating tank copper ball fast, accurately and automatically add, improved production efficiency greatly, also avoided the waste of copper ball simultaneously.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Identifier declaration among the figure: inducting device 1, put copper box 101, import pipeline 102, clamp 103, add box 2, screens 201, opening 202, valve 203, pipeline 3, anode titanium basket 4.
Embodiment
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model.The utility model provides the automatic adding set of a kind of plating tank copper ball, comprises the anode titanium basket 4 that is installed in the plating tank, is installed in the interpolation box 2 of anode titanium basket 4 tops, and the inducting device 1 that is communicated with interpolation box 2.
Inducting device 1 is processed for pvc material; Can prevent the acid-basicity solution corrosion; The one of which end be triangular shape put copper box 101, put copper box 101 1 ends and be connected with an importing pipeline 102, import pipeline 102 the other ends when adding copper ball and be connected with interpolation box 2 through a clamp 103; Form a unimpeded path with this, make that pouring the copper ball of putting in the copper box 101 into adds in the box 2 through importing pipeline 102 rolling entering.
The hollow groove body section that adds box 2 is a rectangle structure; Process with pvc material; Can prevent the acid-basicity solution corrosion, the one of which end is provided with a screens 201, matches with the clamp 103 of inducting device 1; When make adding copper ball inducting device 1 with add box 2 and be connected as a wholely, and the square port that is positioned at directly over the screens 201 also matches with the outlet of importing pipeline 102; Said interpolation box 2 is provided with a plurality of openings 202, and the quantity of anode titanium basket 4 equates in the quantity of said opening 202 and the plating tank; Integral part when said interpolation box 2 is connected with inducting device 1 generally speaking forms a gradient with horizontal plane; Concrete divide two sections: first section forms about 15 gradients spent with horizontal plane; For adding the box part; Second section forms the gradient of about 30 degree with horizontal plane, is inducting device 1 part, and the purpose that forms the gradient is to make the copper ball can be smoothly from putting copper box 101 be rolled to interpolation box 2 through importing pipelines 102 and square port end under the self gravitation effect; In each opening 202 valve 203 is housed all on the said interpolation box 2; Said valve 203 is made for stainless material; Its effect is: when the copper ball in anode titanium basket 4 and the pipeline 3 is filled when being stacked into opening 202 places; A uppermost copper ball will push down following of valve 203 cause valve 203 last slice seal opening 202, stop the entering of copper ball.
Following pipeline 3 is a right cylinder; Make with pvc material; Quantity equals the quantity of titanium basket 4, and its upper end is connected with the opening 202 that adds box 2 bottoms, and the lower end is connected with the port of anode titanium basket 4; Form a passage, copper ball is added in the anode titanium basket 4 through piping 3 by the opening 202 that adds box 2 bottoms.
Anode titanium basket 4 is that right cylinder is netted; Make with titanium metal material, its quantity designs according to electrolyzer size and throughput, and the upper end is connected with pipeline 3 lower ends; Its integral body is submerged in below the electrolytic solution; When electroplating, form the loop line,, realize electroplating processes circuit card through the copper ball generation electrolytic reaction in the anode titanium basket 4 as anode and the circuit card (negative electrode) that is immersed in the electrolytic solution.
The principle of work of the utility model is: at first, inducting device 1 terminal clamp 103 is connected with the screens 201 of adding box 2; Secondly, slowly pour the copper ball of some amount into leg-of-mutton putting in the copper box 101, this moment copper ball the effect of himself gravity down through import pipeline 102, square port rolls and gets in the interpolation box 2, copper ball can roll under himself action of gravity and advance; Then, after copper ball got into and adds box 2, continuing rolls forward arrived first opening 202; Drop into down pipeline 3, drop into thus in the anode titanium basket 4, when titanium basket 4 and pipeline 3 are filled copper ball and be accumulated to opening 202; Opening 202 uppermost copper balls can be pushed down 203 times sheets of valve, cause valve 203 last slice seal opening 202 and stop that the continuation of copper ball gets into (upper and lower design written treaty an angle of 90 degrees of valve), copper ball can roll across from the valve in first opening 202 203 last slice then; Moving on drops into second opening 202, by that analogy, all fills copper ball up to all titanium baskets 4 with pipeline 3; When copper ball in the electrolytic process constantly consumes, because the copper balls in the opening 202 are not pushed down 203 times sheets of valve, so valve 203 last slice will be upspring automatically; Opening 202 is opened, and prompting needs to continue to add copper ball; At last, when operation finishes when not needing to add copper ball again, the copper ball inducting device 1 of dismantling is preserved and is got final product.
More than be that the automatic adding set of a kind of plating tank copper ball that the utility model is provided has carried out detailed introduction; Used concrete example among this paper the structural principle and the embodiment of the utility model are set forth, above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.

Claims (4)

1. automatic adding set of plating tank copper ball; Comprise the anode titanium basket (4) that is installed in the plating tank; It is characterized in that also comprising the interpolation box (2) that is installed in anode titanium basket (4) top; And the inducting device (1) that is communicated with interpolation box (2), said interpolation box (2) is provided with and anode titanium basket (4) position corresponding opening (202), and interpolation box (2) also is provided with a screens (201) with inducting device (1) place of connection.
2. the automatic adding set of plating tank copper ball according to claim 1; It is characterized in that said inducting device (1) constitutes by putting copper box (101) and importing pipeline (102); Said importing pipeline (102) one ends with put copper box (101) and be communicated with, the other end is provided with the clamp (103) with the corresponding engaging of screens (201).
3. the automatic adding set of plating tank copper ball according to claim 1 is characterized in that said interpolation box (2) split shed (202) locates also to be provided with valve (203).
4. the automatic adding set of plating tank copper ball according to claim 1 is characterized in that said interpolation box (2) split shed (202) is communicated with anode titanium basket (4) through pipeline (3).
CN 201220016679 2012-01-13 2012-01-13 Automatic copper ball adding device of electroplating tank Expired - Fee Related CN202499923U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220016679 CN202499923U (en) 2012-01-13 2012-01-13 Automatic copper ball adding device of electroplating tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220016679 CN202499923U (en) 2012-01-13 2012-01-13 Automatic copper ball adding device of electroplating tank

Publications (1)

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CN202499923U true CN202499923U (en) 2012-10-24

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104562156A (en) * 2015-01-16 2015-04-29 东莞市东汇电子有限公司 PLC-based automatic feeding production line for plating copper balls and feeding method
CN105239126A (en) * 2015-10-28 2016-01-13 广德宝达精密电路有限公司 Copper ball adding device for maintaining of plating line
CN106995934A (en) * 2016-01-25 2017-08-01 陈焕宗 A kind of copper ball added automatically system
CN107937971A (en) * 2017-12-29 2018-04-20 无锡星亿智能环保装备股份有限公司 A kind of air draught and the electroplating bath of anode charging integral type
CN109518263A (en) * 2018-11-30 2019-03-26 广东骏亚电子科技股份有限公司 Anode copper ball added automatically system and method
CN109735893A (en) * 2019-02-19 2019-05-10 胡俊 A kind of lead frame anode assembly for electroplating
CN113913909A (en) * 2021-11-17 2022-01-11 天水华洋电子科技股份有限公司 Anode assembly for electroplating of integrated circuit lead frame
CN114108063A (en) * 2021-12-24 2022-03-01 大连崇达电路有限公司 Adding device and adding method for copper balls or tin balls in printed board plating line

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104562156A (en) * 2015-01-16 2015-04-29 东莞市东汇电子有限公司 PLC-based automatic feeding production line for plating copper balls and feeding method
CN104562156B (en) * 2015-01-16 2017-07-11 广州尚诚知识产权运营有限公司 Plating copper ball automation charging production line and charging process based on PLC
CN105239126A (en) * 2015-10-28 2016-01-13 广德宝达精密电路有限公司 Copper ball adding device for maintaining of plating line
CN106995934A (en) * 2016-01-25 2017-08-01 陈焕宗 A kind of copper ball added automatically system
CN106995934B (en) * 2016-01-25 2019-01-25 陈焕宗 A kind of copper ball added automatically system
CN107937971A (en) * 2017-12-29 2018-04-20 无锡星亿智能环保装备股份有限公司 A kind of air draught and the electroplating bath of anode charging integral type
CN109518263A (en) * 2018-11-30 2019-03-26 广东骏亚电子科技股份有限公司 Anode copper ball added automatically system and method
CN109518263B (en) * 2018-11-30 2020-08-18 广东骏亚电子科技股份有限公司 Automatic anode copper ball adding system and method
CN109735893A (en) * 2019-02-19 2019-05-10 胡俊 A kind of lead frame anode assembly for electroplating
CN113913909A (en) * 2021-11-17 2022-01-11 天水华洋电子科技股份有限公司 Anode assembly for electroplating of integrated circuit lead frame
CN113913909B (en) * 2021-11-17 2022-05-10 天水华洋电子科技股份有限公司 Anode assembly for electroplating of integrated circuit lead frame
CN114108063A (en) * 2021-12-24 2022-03-01 大连崇达电路有限公司 Adding device and adding method for copper balls or tin balls in printed board plating line

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121024

Termination date: 20160113