CN114108063A - Adding device and adding method for copper balls or tin balls in printed board plating line - Google Patents
Adding device and adding method for copper balls or tin balls in printed board plating line Download PDFInfo
- Publication number
- CN114108063A CN114108063A CN202111600416.3A CN202111600416A CN114108063A CN 114108063 A CN114108063 A CN 114108063A CN 202111600416 A CN202111600416 A CN 202111600416A CN 114108063 A CN114108063 A CN 114108063A
- Authority
- CN
- China
- Prior art keywords
- balls
- copper
- ball
- lead
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 239000010949 copper Substances 0.000 title claims abstract description 99
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 99
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000007747 plating Methods 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 230000007306 turnover Effects 0.000 claims abstract description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 23
- 239000010936 titanium Substances 0.000 claims description 23
- 229910052719 titanium Inorganic materials 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 230000005484 gravity Effects 0.000 description 8
- 210000001503 joint Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a copper ball or tin ball adding device and a copper ball or tin ball adding method in a printed board plating line, wherein the adding device comprises a lead-in wire slot for leading in a copper ball or tin ball, a plurality of adding slots which are arranged at the lower end of the lead-in wire slot at intervals and are sequentially arranged from front to back, and a plurality of plate turnover mechanisms which are arranged at the rear side of the adding slots in a one-to-one correspondence manner, through holes for the copper ball or tin ball to penetrate through are arranged on the adding slots in a penetrating manner, openings communicated with the through holes are arranged at positions, corresponding to the adding slots, on the lead-in wire slot, and the plate turnover mechanisms are used for closing or opening the openings. The adding device realizes the automatic adding of the copper balls or the solder balls, avoids the need of manually carrying the whole bag of copper balls/solder balls to the corresponding groove body of the production line each time during adding, reduces the labor intensity of workers and improves the adding efficiency.
Description
Technical Field
The invention relates to the technical field of circuit board production and manufacturing, in particular to a device and a method for adding copper balls or tin balls in a printed board plating line.
Background
In the manufacturing process of the printed circuit board, the production line of the pattern electroplating process needs to add copper balls/solder balls regularly to ensure sufficient anode materials, and the industry usually adopts a manual adding mode to operate during adding, so that the operation intensity of workers is increased, the loss of the copper balls/solder balls is easy to occur, and the management problem is inconvenient.
The prior method has the following defects:
1. because the shapes of the copper ball/tin ball adding materials are all spheres, the problem that the copper ball/tin ball is easy to slip and lose in the adding process is easily caused.
2. Before adding the copper balls/tin balls, the whole bag of copper balls/tin balls needs to be manually moved to the trolley, each bag of copper balls/tin balls on the trolley is moved to the corresponding groove body, and finally, a plurality of copper balls/tin balls are manually taken by personnel each time and are manually placed into the titanium basket on the side wall of the groove body, so that the adding work is complicated, the working strength is high, and meanwhile, the problem of insufficient adding of the titanium basket is easily caused; the adding efficiency is influenced, and the cost is wasted.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the adding device of the copper balls or the solder balls in the electroplating line of the printed board.
In order to solve the technical problem, the invention provides a copper ball or tin ball adding device in a printed board plating line, which comprises a lead-in line slot for leading in a copper ball or tin ball, a plurality of adding slots which are arranged at the lower end of the lead-in line slot at intervals and are sequentially arranged from front to back, and a plurality of plate turnover mechanisms which are arranged at the rear side of the adding slots in a one-to-one correspondence manner, wherein through holes for the copper ball or tin ball to penetrate through are arranged on the adding slots in a penetrating manner, openings communicated with the through holes are arranged at positions, corresponding to the adding slots, on the lead-in line slot, and the plate turnover mechanisms are used for closing or opening the openings.
Furthermore, the plate turning mechanism opens the opening after being pressed by the copper balls or the solder balls, so that the copper balls or the solder balls fall into the adding groove, and after the through holes are filled with the copper balls or the solder balls, the plate turning mechanism closes the corresponding opening.
Further, panel turnover mechanism includes that one end rotates to be located on the leading-in wire casing and with the closing plate that the opening size matches, locate the limiting plate of closing plate one side perpendicularly and be used for making the closing plate inclines the piece that resets that sets up, so that the closing plate backstop copper ball or tin ball earlier, just the limiting plate slope is inserted in the through-hole, one side contained angle orientation between closing plate and the limiting plate leading-in end one side of leading-in wire casing.
Furthermore, one end of the closing plate is rotatably arranged at the rear side end of the opening through a rotating shaft.
Furthermore, one end of the closing plate is provided with a sleeve which is rotatably sleeved on the rotating shaft.
Furthermore, the rear end of the opening is provided with an inclined surface for limiting the inclination angle of the closing plate.
Further, the piece that resets is located the balancing weight of sleeve rear side, the weight of balancing weight is greater than the weight sum of closing plate and limiting plate both.
Further, the reset piece is a torsion spring arranged between the sleeve and the lead-in wire slot.
Furthermore, the adding groove is hung at the bottom of the lead-in wire groove through a fixing rod, and the lead-in end of the lead-in wire groove is obliquely arranged.
The invention also discloses an adding method of the copper balls or the solder balls in the electroplating line of the printed board, which adopts the adding device as any one of the above devices for adding, wherein the lower end of each adding groove is butted with a titanium basket, and the adding method comprises the following steps:
s1, putting the copper ball or the solder ball into the lead-in end of the lead-in slot, and enabling the copper ball or the solder ball to be conveyed forwards along the lead-in slot;
s2, after the copper balls or the solder balls reach the first adding groove position, the plate turning mechanism automatically opens the opening to enable the copper balls or the solder balls to sequentially fall into the adding grooves and enter the corresponding titanium baskets;
s3, after the titanium basket and the first adding groove are filled with copper balls or solder balls, the opening corresponding to the adding groove is sealed by a plate turning mechanism;
s4, the copper balls or solder balls are conveyed forward, and the steps S2 and S3 are repeated to make the copper balls or solder balls fill all the titanium baskets and the adding grooves in sequence.
Compared with the prior art, the invention has the following beneficial effects:
the automatic adding device realizes the automatic adding of the copper balls or the tin balls, realizes the continuous leading-in of the copper balls or the tin grooves by utilizing the leading-in wire grooves, realizes the adding purpose by utilizing the titanium baskets on the adding groove butt joint production line, has a plurality of adding grooves, can butt joint the titanium baskets of a plurality of electroplating cylinders in the production line, realizes the one-to-many adding, avoids the need of manually carrying the whole bag of copper balls/tin balls to the corresponding groove body of the production line each time during the adding, reduces the labor intensity, improves the adding efficiency, can solve the problem of the loss of the copper balls/tin balls during the adding, saves materials, and solves the problem of the insufficient adding of the titanium baskets during the adding of personnel.
The plate turning mechanism is characterized in that the adding grooves are fully added by utilizing the combined action of the limiting plate and the closing plate through the structural design of the plate turning mechanism, so that copper balls are fully filled, in addition, the plate turning mechanism opens the openings by utilizing the gravity of the copper balls or the solder balls, and closes the openings after the adding grooves are fully added, so that the purpose of automatically adding the copper balls one by one is realized by utilizing the design of a mechanical mechanism, other electric driving structures are reduced, the structure is simple, and the energy consumption is reduced; meanwhile, the purpose of guiding and forward conveying is achieved through the landslide design of the guiding end in the guiding-in wire groove.
Drawings
FIG. 1 is a schematic view of an adding apparatus in the embodiment;
FIG. 2 is a side view of the adding apparatus in the embodiment;
FIG. 3 is a front view of the adding apparatus in the embodiment;
FIG. 4 is a sectional view of the adding apparatus in the embodiment;
FIG. 5 is an enlarged view of B in FIG. 4;
fig. 6 is an enlarged schematic view of a in fig. 5.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and explained with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1 to 6, the adding device for copper balls or solder balls in a printed board plating line in the embodiment includes a lead-in slot 1 for leading in the copper balls or solder balls 100, a plurality of adding slots 2 disposed at the lower end of the lead-in slot 1 at intervals and sequentially arranged from front to back, and a plurality of plate turnover mechanisms 3 disposed at the rear side of the adding slots 2 in a one-to-one correspondence manner, that is, the number of the plate turnover mechanisms is the same as that of the adding slots; in addition, the lead-in wire slot 1 is U-shaped, the inner side of the U-shaped forms a U-shaped groove 11 for forward transmission of the copper ball or the solder ball, one lead-in end of the lead-in wire slot is obliquely arranged, namely the front end of the lead-in wire slot is provided with a landslide, so that the copper ball or the solder ball is forward transmitted along the landslide and the U-shaped groove under the influence of gravity; the adding groove 2 is provided with a through hole 21 for the copper ball or the tin ball to pass through up and down, the lead-in wire groove 1 is provided with an opening 12 communicated with the through hole 21 at the position corresponding to the adding groove 2, so that the copper ball or the tin ball enters the adding groove through the opening, the lower end of the adding groove is butted with a titanium basket in the electroplating cylinder, namely the adding groove is utilized to lead the copper ball or the tin ball into the titanium basket one by one, and the plate turning mechanism is used for sealing or opening the opening 12.
In the aforesaid, utilize leading-in wire casing to realize lasting leading-in of copper ball or molten tin bath, and utilize the titanium basket that adds on the groove butt joint production line to realize the purpose that will add, it has a plurality ofly to add the groove in addition, can dock the titanium basket of a plurality of electroplating jars in the production line, realize a pair of many additions, need carry whole bag copper ball/tin ball to the corresponding cell body of production line at every turn the manual work when avoiding adding, reduce artifical intensity of labour, improve and add efficiency, still can solve the problem of losing of copper ball/tin ball when adding, save material, and the titanium basket that appears when solving personnel and adding adds not full problem.
In this embodiment, the plate turnover mechanism 3 includes a sealing plate 31 with one end rotatably disposed on the lead-in slot 1 and matched with the opening 12, a limiting plate 32 vertically disposed on the front side of the sealing plate 31, and a reset member 33 for making the sealing plate 31 tilt upwards, and the limiting plate 32 is inserted into the through hole 21 in an inclined manner to semi-close the opening (as shown in fig. 6), a side angle between the sealing plate 31 and the limiting plate 32 faces the lead-in end side of the lead-in slot 1, the tilting structure can make the sealing plate stop the copper balls or solder balls conveyed forward in the U-shaped slot, and the copper balls or solder balls press the limiting plate under the influence of gravity, in the specific implementation process, the gravity of the copper balls or solder balls is greater than the force applied by the reset member to the plate turnover mechanism, so that the plate turnover mechanism rotates downwards to open the opening completely after being pressed, and the copper balls or solder balls fall into the adding slot and then enter the titanium basket, until the through hole in the adding groove is filled with the copper ball or the solder ball finally, the limiting plate is pressed by the copper ball or the solder ball, and the aim of resetting cannot be achieved, and the closing plate in the plate turning mechanism closes the corresponding opening 12 (as shown in fig. 5).
Specifically, one end of the closing plate 31 is rotatably provided at the rear side end of the opening 12 through a rotating shaft 34, a sleeve 35 rotatably fitted on the rotating shaft 34 is provided at one end of the closing plate 31, and an inclined surface 121 for limiting the inclination angle of the closing plate 31 is provided at the rear side end of the opening 12, so that the inclination angle of the closing plate is set to the inclination angle of the inclined surface by the restoring action of the restoring member, and the inclination angle is set to be between 45 degrees and 60 degrees.
Specifically, the reset piece 33 is a balancing weight arranged in the middle of the rear side of the sleeve 35, and the weight of the balancing weight is greater than the sum of the weights of the closing plate 31 and the limiting plate 32, so that the front end of the plate turnover mechanism is tilted upwards by utilizing the gravity of the balancing weight; in addition, the balancing weight is positioned at the lower end of the lead-in wire groove, when the plate turnover mechanism rotates downwards under the gravity of the copper balls or the solder balls, the balancing weight rotates upwards and finally contacts with the bottom of the lead-in wire groove, and at the moment, the upper side of the sealing plate just seals the opening with the lead-in wire groove horizontally, so that the copper balls or the solder balls can be continuously conveyed forwards.
In the above, through the structural design of the plate turnover mechanism, the adding grooves are fully added by utilizing the combined action of the limiting plate and the closing plate, so that the copper balls are fully filled, in addition, the plate turnover mechanism opens the opening by utilizing the gravity of the copper balls or the solder balls, and closes the opening after the adding grooves are fully added, so that the purpose of automatically adding the copper balls one by one is realized by utilizing the design of a mechanical mechanism, other electric driving structures are reduced, the structure is simple, and the energy consumption is reduced; meanwhile, the purpose of guiding and forward conveying is achieved through the landslide design of the guiding end in the guiding-in wire groove.
Specifically, the adding groove 2 is hung at the bottom of the lead-in wire casing 1 through a fixing rod 4 fixed at two sides of the lead-in wire casing 1.
In other embodiments, the reset piece can also be a torsion spring arranged between the sleeve and the lead-in wire slot, the plate turnover mechanism is reset by utilizing the elasticity of the torsion spring so as to enable the sealing plate to be obliquely arranged, and in addition, the reset elasticity of the torsion spring is smaller than the gravity of the copper ball or the solder ball so as to realize the purpose of pressing the plate turnover mechanism downwards to open the opening.
In other embodiments, a storage box (not shown) is further disposed at the tail of the wire guiding slot for storing the copper balls or solder balls that do not enter the adding slot, so as to prevent the copper balls or solder balls at the tail from affecting the reset of the front-end flipping mechanism.
Example 2
The invention also discloses an adding method of the copper balls or the solder balls in the electroplating line of the printed board, which adopts the adding device as described in embodiment 1 to add, wherein the lower end of each adding groove is butted with a titanium basket, and the adding method comprises the following steps:
a. putting the copper ball or the solder ball into the lead-in slot from the lead-in end of the lead-in slot, and enabling the copper ball or the solder ball to be conveyed forwards along the lead-in slot;
b. after the copper balls or the tin balls reach the first adding groove position, the plate turning mechanism is pressed to automatically open the opening to enable the copper balls or the tin balls to fall into the adding groove and enter the corresponding titanium basket, then the plate turning mechanism is rotated upwards to reset under the action of the resetting piece, the next copper balls or the tin balls fall into the adding groove again, and the resetting mechanism is opened and reset repeatedly to enable the copper balls or the tin balls to fall into the adding groove in sequence;
c. after the corresponding titanium basket and the first adding groove are filled with copper balls or tin balls, the last copper ball or tin ball entering the adding groove can just press the limiting plate, so that the plate turnover mechanism cannot be reset, and the sealing plate in the plate turnover mechanism just horizontally seals the opening to be used as a part of the lead-in wire groove, so that the copper balls or tin balls can be continuously conveyed forwards and enter the next adding groove;
d. and c, the copper balls or the solder balls are conveyed forwards, and the modes of the steps b and c are repeated, so that all the titanium baskets and the adding grooves are filled with the copper balls or the solder balls in sequence.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides an interpolation device of copper ball or tin ball in printed board electric plate wire, a serial communication port, locate leading-in wire casing lower extreme and by the interpolation groove and a plurality of one-to-one that set gradually after going to and locate the panel turnover mechanism who adds the groove rear side including leading-in wire casing, a plurality of intervals that are used for leading-in copper ball or tin ball, run through on adding the groove and be equipped with the through-hole that is used for copper ball or tin ball to pass from top to bottom, the position department in the corresponding interpolation groove on the leading-in wire casing is equipped with the opening with the through-hole intercommunication, panel turnover mechanism is used for sealing or opening the opening.
2. The adding device of copper balls or solder balls in a printed board plating line according to claim 1, wherein the plate turnover mechanism opens the opening after being pressed by the copper balls or solder balls, so that the copper balls or solder balls fall into the adding groove, and after the through holes are filled with the copper balls or solder balls, the plate turnover mechanism closes the corresponding opening.
3. The adding device of copper balls or solder balls in a printed circuit board plating line according to claim 1 or 2, characterized in that the plate turnover mechanism comprises a sealing plate with one end rotating on the lead-in line slot and matching with the opening, a limiting plate vertically arranged on one side of the sealing plate, and a reset piece for enabling the sealing plate to be obliquely arranged upwards, so that the sealing plate stops the copper balls or solder balls first, the limiting plate is obliquely inserted into the through hole, and an included angle between the sealing plate and the limiting plate faces one side of the lead-in end of the lead-in line slot.
4. The adding device of copper balls or solder balls in the electroplating line of the printed board according to claim 3, wherein one end of the closing plate is rotatably arranged at the rear side end of the opening through a rotating shaft.
5. The adding device of copper balls or tin balls in the electroplating line of the printed board according to claim 4, wherein one end of the sealing plate is provided with a sleeve rotatably sleeved on the rotating shaft.
6. The adding device of copper balls or solder balls in the plating line of the printed board as claimed in claim 5, wherein the rear side end of the opening is provided with an inclined surface for limiting the inclination angle of the closing plate.
7. The adding device of copper balls or solder balls in a printed board plating line according to claim 6, wherein the resetting member is a weight block arranged at the rear side of the sleeve, and the weight of the weight block is greater than the sum of the weights of the closing plate and the limiting plate.
8. The adding device of copper balls or solder balls in printed board plating lines of claim 6, wherein the reset piece is a torsion spring arranged between the sleeve and the lead-in line slot.
9. The adding device of copper balls or tin balls in the electroplating line of the printed board as claimed in claim 1, wherein the adding groove is hung at the bottom of the lead-in line groove through a fixing rod, and the lead-in end of the lead-in line groove is obliquely arranged.
10. A method for adding copper balls or tin balls in a printed board plating line, which is characterized in that the adding device of any one of claims 1 to 9 is used for adding, wherein the lower end of each adding groove is butted with a titanium basket, and the adding method comprises the following steps:
s1, putting the copper ball or the solder ball into the lead-in end of the lead-in slot, and enabling the copper ball or the solder ball to be conveyed forwards along the lead-in slot;
s2, after the copper balls or the solder balls reach the first adding groove position, the plate turning mechanism automatically opens the opening to enable the copper balls or the solder balls to sequentially fall into the adding grooves and enter the corresponding titanium baskets;
s3, after the titanium basket and the first adding groove are filled with copper balls or solder balls, the opening corresponding to the adding groove is sealed by a plate turning mechanism;
s4, the copper balls or solder balls are conveyed forward, and the steps S2 and S3 are repeated to make the copper balls or solder balls fill all the titanium baskets and the adding grooves in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111600416.3A CN114108063A (en) | 2021-12-24 | 2021-12-24 | Adding device and adding method for copper balls or tin balls in printed board plating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111600416.3A CN114108063A (en) | 2021-12-24 | 2021-12-24 | Adding device and adding method for copper balls or tin balls in printed board plating line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114108063A true CN114108063A (en) | 2022-03-01 |
Family
ID=80362859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111600416.3A Pending CN114108063A (en) | 2021-12-24 | 2021-12-24 | Adding device and adding method for copper balls or tin balls in printed board plating line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114108063A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201016125Y (en) * | 2007-03-02 | 2008-02-06 | 陈焕宗 | Copper ball automatically adding groove |
| CN201201981Y (en) * | 2008-04-11 | 2009-03-04 | 陈焕宗 | Copper ball automatic feeding groove |
| CN202499923U (en) * | 2012-01-13 | 2012-10-24 | 深圳市深联电路有限公司 | Automatic copper ball adding device of electroplating tank |
| CN105239126A (en) * | 2015-10-28 | 2016-01-13 | 广德宝达精密电路有限公司 | Copper ball adding device for maintaining of plating line |
| CN109518263A (en) * | 2018-11-30 | 2019-03-26 | 广东骏亚电子科技股份有限公司 | Anode copper ball added automatically system and method |
| CN215251306U (en) * | 2021-03-16 | 2021-12-21 | 高德(苏州)电子有限公司 | Titanium basket assembly capable of improving electroplating uniformity |
-
2021
- 2021-12-24 CN CN202111600416.3A patent/CN114108063A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201016125Y (en) * | 2007-03-02 | 2008-02-06 | 陈焕宗 | Copper ball automatically adding groove |
| CN201201981Y (en) * | 2008-04-11 | 2009-03-04 | 陈焕宗 | Copper ball automatic feeding groove |
| CN202499923U (en) * | 2012-01-13 | 2012-10-24 | 深圳市深联电路有限公司 | Automatic copper ball adding device of electroplating tank |
| CN105239126A (en) * | 2015-10-28 | 2016-01-13 | 广德宝达精密电路有限公司 | Copper ball adding device for maintaining of plating line |
| CN109518263A (en) * | 2018-11-30 | 2019-03-26 | 广东骏亚电子科技股份有限公司 | Anode copper ball added automatically system and method |
| CN215251306U (en) * | 2021-03-16 | 2021-12-21 | 高德(苏州)电子有限公司 | Titanium basket assembly capable of improving electroplating uniformity |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111470296B (en) | Router shell intensity automated inspection equipment | |
| CN206142422U (en) | Part upset material feeding unit | |
| CN212247259U (en) | Full-automatic barrel-plating equipment of environment-friendly | |
| CN114108063A (en) | Adding device and adding method for copper balls or tin balls in printed board plating line | |
| CN116900559A (en) | Battery welding equipment with automatic feeding and discharging functions | |
| CN216470621U (en) | PCB turnover mechanism and processing equipment | |
| CN209279888U (en) | A kind of chip tab full-automatic detector | |
| CN219547133U (en) | Continuous plate type transmission electroplating device | |
| CN209939840U (en) | Lithium battery clamping and operating device and production line thereof | |
| CN207047354U (en) | A kind of electroplanting device for board production | |
| CN212125223U (en) | Raw material conveying mechanism of asphalt feeding equipment | |
| CN111519236B (en) | Automatic detection equipment for electroplating anode material | |
| CN216685617U (en) | Tool is deposited to printed circuit board | |
| CN213864216U (en) | Feeding device | |
| CN108328215B (en) | Material shifting unit for feeding mechanism in circular workpiece laser marking machine | |
| CN207749173U (en) | A kind of tin plating mechanism | |
| CN215794998U (en) | Lithium battery labeling device convenient to process | |
| CN207608650U (en) | A kind of automatic hang device up and down of solar battery sheet plating | |
| CN217970538U (en) | Corner stacking bin | |
| CN216104708U (en) | Upward-moving automatic discharging device | |
| CN211958200U (en) | Prefabricated welding ring feeding operation head for contact pin of connector | |
| CN206225484U (en) | A kind of cylindrical battery production line automatic loading mechanism | |
| CN215451366U (en) | Crystalline silicon cell high-throughput sequencing positioning device | |
| CN217250307U (en) | Battery loading frame turning device | |
| CN217731055U (en) | Labeling device for lithium battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220301 |