CN113009314A - Root cause analysis method and device for printed circuit board burning failure - Google Patents
Root cause analysis method and device for printed circuit board burning failure Download PDFInfo
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- G—PHYSICS
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
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- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
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Abstract
The application provides a root cause analysis method and a root cause analysis device for printed circuit board burning failure, which relate to the technical field of printed circuit boards, and the method comprises the following steps: acquiring failure basic information of a printed circuit board with a burned board failed; obtaining a failure mode of the printed circuit board according to the failure basic information; detecting the printed circuit board to obtain a corresponding detection result; and analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode. The method and the device can accurately obtain the root cause of the failure of the burning plate by adopting a reasonable and standard analysis process without depending on the experience of an analyst too much.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a root cause analysis method and a root cause analysis device for printed circuit board burning failure.
Background
At present, in the rapid development process of the electronic information industry, due to the development of the commercialization of the 5G technology and the continuous improvement of the requirements of users on electronic products, various electronic products have a development trend of multifunction and miniaturization, and the functional integration level of the electronic products is higher and higher. As a core component of electronic products, printed circuit boards are required to be developed into smaller and thinner shapes with increasing numbers of electronic circuits and components. Therefore, the working loading voltage of the printed circuit board is increased, the power is continuously increased, the heat dissipation is more difficult, and the Joule heat accumulated on the printed circuit board is rapidly increased.
Because the printed circuit board gathers too much joule heat, the risk that the printed circuit board will burn out board failure, such as insulation space breakdown, arc striking, printed circuit board overheating board burning, printed circuit board short circuit burning, environmental deterioration and fire, etc., is also increasing. When the printed circuit board is burnt to lose effectiveness, the printed circuit board, components and even complete equipment are damaged and scrapped, and serious safety accidents such as fire, explosion and the like are caused, so that great threats and property losses are brought to the safety of consumers, public praise of enterprise brands, social safety and the like. However, at present, for the problem of board burning failure of the printed circuit board, an empirical analysis method is often used to find the cause of the failure, and the empirical analysis method not only depends too much on the experience of an analyst, but also lacks a reasonable and normative analysis process, and cannot accurately obtain the root cause of the board burning failure.
Disclosure of Invention
The embodiment of the application aims to provide a root cause analysis method and a root cause analysis device for printed circuit board burn-in failure, which can accurately obtain the root cause of the burn-in failure by adopting a reasonable and standard analysis flow without depending on the experience of an analyst too much.
In a first aspect, an embodiment of the present application provides a root cause analysis method for printed circuit board burn-in failure, including:
acquiring failure basic information of a printed circuit board with a burned board failed;
obtaining a failure mode of the printed circuit board according to the failure basic information;
detecting the printed circuit board to obtain a corresponding detection result;
and analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode.
In the implementation process, according to the root cause analysis method for printed circuit board burn-in failure, the failure mode of the printed circuit board is obtained through analysis by obtaining the failure basic information of the printed circuit board burn-in failure; then, reasonably detecting the printed circuit board to obtain a corresponding detection result; and finally, determining the failure root cause of the printed circuit board by combining the detection result and the failure mode analyzed before.
Further, the detecting the printed circuit board to obtain a corresponding detection result includes:
acquiring position information of the abnormal position of the printed circuit board;
performing nondestructive testing on the abnormal position according to the position information to obtain a corresponding nondestructive testing result;
according to the position information, slice analysis is carried out on the abnormal position to obtain a corresponding slice analysis result;
performing element analysis on the abnormal position according to the position information to obtain a corresponding element analysis result; and/or measuring the abnormal position according to the position information to obtain a corresponding measurement result;
the detection result includes the position information, the non-destructive detection result, the slice analysis result, and at least one of the elemental analysis result and the measurement result.
In the implementation process, the method respectively adopts a plurality of analysis methods to detect the printed circuit board, and the analysis methods include but are not limited to: the position information of the abnormal position of the printed circuit board is detected, nondestructive detection, section analysis and element analysis are carried out on the printed circuit board, the measured information of the abnormal position of the printed circuit board is obtained through measurement, and the failure root cause of the printed circuit board with board burning failure can be comprehensively and objectively analyzed through the application of various analysis methods, so that the failure root cause of the printed circuit board with board burning failure can be reliably obtained.
Further, the analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode includes:
analyzing to obtain a failure root cause set according to the failure mode;
and analyzing to obtain the failure root cause of the printed circuit board according to the failure root cause set and the detection result.
In the implementation process, the method firstly analyzes the failure mode obtained before, limits the range of the failure root cause by using the failure mode, and forms the limited failure root causes into a failure root cause set; and selecting the failure root cause which accords with the monitoring result from the failure root cause set as the failure root cause obtained after analysis according to the detection result obtained before, and the processing method can limit the range of the failure root causes to a certain extent, thereby improving the accuracy of failure root cause analysis and reducing the complexity of processing the failure root causes.
Further, the performing slice analysis on the abnormal position according to the position information to obtain a corresponding slice analysis result includes:
according to the position information, vertically slicing or horizontally slicing the abnormal position to obtain slice information, wherein the slice information comprises the section morphology and the section size of the abnormal part;
and analyzing the slice information to obtain a corresponding slice analysis result.
In the implementation process, after the position information of the abnormal position is obtained, the abnormal position is vertically sliced or horizontally sliced according to the condition of the position information, and information such as the section morphology information and the section size of the abnormal position obtained by slicing is analyzed, so that a slice analysis result is obtained, the slice analysis can effectively obtain information such as the internal morphology size of the abnormal position which is very important for failure root cause analysis, and the method is effectively helped to analyze and confirm the failure root cause.
Further, after the analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode, the method further comprises:
acquiring a reproduction result corresponding to a reproduced printed circuit board, wherein the reproduced printed circuit board is a printed circuit board obtained by performing simulation reproduction according to the failure root;
and obtaining a root cause analysis result according to the recurrence result and the failure root cause.
In the implementation process, according to the characteristics of the failure root cause, the method designs a root cause recurrence mode corresponding to the failure root cause for the failure root cause of the obtained printed circuit board, firstly obtains the recurrence printed circuit board designed according to the mode, then carries out simulation recurrence on the recurrence printed circuit board, and finally obtains a recurrence result.
Further, obtaining a root cause analysis result according to the recurrence result and the failure root cause comprises:
judging whether the reproduction result is matched with a preset reproduction result corresponding to the failure root factor;
if so, matching to obtain the improvement information of the printed circuit board according to the failure root cause;
if not, obtaining failure elimination root cause;
the root cause analysis result is the improvement information or the failure elimination root cause.
In the implementation process, after a specific recurrence result is obtained through analysis, the recurrence result is matched with a preset recurrence result of the failure root factor obtained before, if the recurrence result is consistent with the preset recurrence result of the failure root factor, the accuracy of the failure root factor can be determined, and a corresponding improvement method and improvement information are obtained, if the recurrence result is inconsistent with the preset recurrence result of the failure root factor, the possibility of the failure root factor is eliminated, the improvement method is matched for the failure root factor through the matching of the recurrence result, the efficiency of improving the failure problem of the board burning is improved, and the failure problem of the subsequent board burning can be effectively avoided.
In a second aspect, an embodiment of the present application provides a root cause analysis device for printed circuit board burn-in failure, where the device includes: the information acquisition module is used for acquiring failure basic information of the printed circuit board with the burning failure; the mode analysis module is used for obtaining the failure mode of the printed circuit board according to the failure basic information; the detection processing module is used for detecting the printed circuit board to obtain a corresponding detection result; and the root cause analysis module is used for analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode.
In the implementation process, the root cause analysis device for printed circuit board burning failure in the embodiment of the application can smoothly run a reasonable and standard analysis flow, and can accurately obtain the root cause of the board burning failure without depending on the analysis experience of people.
Further, the root cause analysis device for printed circuit board burn-in failure further comprises: the recurrence acquisition module is used for acquiring a recurrence result corresponding to a recurrent printed circuit board, wherein the recurrent printed circuit board is a printed circuit board obtained by simulation recurrence according to the failure root; and the recurrence analysis module is used for obtaining a root cause analysis result according to the recurrence result and the failure root cause.
In the implementation process, the device can confirm the correctness of the failure root cause obtained before according to the reproduction result, and the device carries out simulation reproduction confirmation on the failure root cause through the process, so that the reliability of the obtained failure root cause is improved.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a memory and a processor, where the memory is used to store a computer program, and the processor runs the computer program to make the electronic device execute the above root cause analysis method for printed circuit board burn-in failure.
In a fourth aspect, the present application provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the computer program implements the root cause analysis method for printed circuit board burn-in failure described above.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a first schematic flow chart of a root cause analysis method for printed circuit board burn-in failure according to an embodiment of the present disclosure;
fig. 2 is a schematic flowchart of step S130 according to a first embodiment of the present application;
fig. 3 is a schematic flowchart of step S140 according to a first embodiment of the present application;
fig. 4 is a schematic flowchart of step S133 according to a first embodiment of the present application;
FIG. 5 is a second schematic flow chart of a root cause analysis method for printed circuit board burn-in failure according to an embodiment of the present application;
fig. 6 is a schematic flowchart of step S160 according to a first embodiment of the present application;
fig. 7 is a first structural block diagram of a cause analysis apparatus for printed wiring board burn-in failure according to a second embodiment of the present application;
fig. 8 is a second structural block diagram of a cause analysis apparatus for printed wiring board burn-in failure according to the second embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
At present, aiming at the problem of board burning failure of the printed circuit board, the failure reason can only be found by adopting an empirical analysis method, and the empirical analysis method not only depends too much on the experience of an analyst, but also lacks a reasonable and standard analysis flow, and can not accurately obtain the root cause of the board burning failure.
In view of the problems in the prior art, the application provides a root cause analysis method and a root cause analysis device for printed circuit board burn-in failure, which can accurately obtain the root cause of burn-in failure by adopting a reasonable and standard analysis flow without depending on the experience of an analyst too much.
Example one
Referring to fig. 1, fig. 1 is a first flowchart of a root cause analysis method for printed wiring board burn-in failure according to an embodiment of the present application, and the root cause analysis method for printed wiring board burn-in failure described below in the embodiment of the present application is applicable to a server.
The root cause analysis method for printed circuit board burning failure of the embodiment of the application comprises the following steps:
and step S110, acquiring failure basic information of the printed circuit board with the burning failure.
The printed circuit board is also called as a printed circuit board, is an important electronic component, is a support body of an electronic component, and is also a carrier for electrical connection of the electronic component, and a large number of electronic components are welded on the printed circuit board after the printed circuit board passes through an electronic assembly process.
The board burning failure means that after the printed circuit board is subjected to subsequent testing and assembled on equipment, the printed circuit board is loaded with voltage and works in a charged state, and if abnormal phenomena such as voltage breakdown, high-temperature burning and scorching, smoke generation, open fire and the like occur to the printed circuit board and electronic components on the board in the working process, the board burning failure is caused.
And step S120, obtaining the failure mode of the printed circuit board according to the failure basic information.
The failure basic information of the printed circuit board with the burned board failure can comprise failure field information, failure background information, failure phenomena, failure stages, failure proportion, service application working conditions of failure samples, working current and voltage and other failure basic information.
Optionally, the failure site information may include one or more of a hot environment, a high temperature environment, a high and low temperature cycle environment, sand dust, a vibration environment, a high acid-base salt, a high altitude, industrial waste gas, and the like; if the basic failure information includes the information of the failure site, it is considered that the failure mode is the aging and morphological change of the conductors such as copper and nickel or the aging and deterioration of the insulating medium due to the corrosion under the action of humidity, temperature change, high temperature, acid, alkali, salt, waste gas, etc.
Alternatively, the failure background information may include that the printed circuit boards all have the same position characteristics, such as all occurring in fixed holes, circuit structures or fixed areas, and if the failure basic information includes the failure background information, it indicates that the failure mode may be a printed circuit board design problem, insufficient insulation spacing, deviation, abnormal conductor morphology, and the like.
Optionally, the failure background information may include that an oversized lot and high failure rate of a printed circuit board product or a product of the same type occur in an early stage of live operation, and if the failure basic information includes the failure background information, it may be quickly inferred that the failure mode is an insulation medium abnormality, a conductor deviation, a current overload, and the like.
Alternatively, the possibility of some failure modes can be eliminated through the failure basic information, for example, in a stable environment such as indoor environment, the product is put into use for a short time, and the board is burned, because the insulating medium is stable in a short time and has no inducing factor of rapid aging and deterioration, so that the board is not burned due to aging of the insulating medium under the condition, and the failure mode of aging of the insulating medium can be eliminated.
The insulation medium is generally filled between adjacent conductors of the printed board, common insulation filling media comprise various resins, glass fibers, inorganic fillers, organic fillers and other materials, the surface layer conductors of the printed board are mostly filled with solder resist ink, dry films, glue and other organic or inorganic insulation materials, and when the insulation medium is abnormal in state, short circuit, breakdown or a phenomenon that the resistance value of an insulation resistor is lower than 100M omega may occur, so that the board is burned.
And step S130, detecting the printed circuit board to obtain a corresponding detection result.
The detection of the printed circuit board with the failed burned board includes but is not limited to appearance detection, X-ray projection, ultrasonic scanning, industrial CT, microsection analysis and the like, and aims to observe the state of objects such as conductors, insulators and the like between inner and outer conductors of the printed circuit board.
And step S140, analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode.
The failure root cause of the printed circuit board with the failed burning board can comprise failure root causes such as abnormal insulation distance, abnormal conductor, abnormal insulating medium and the like, and can also comprise failure root causes such as ion migration, electromigration, Conductive Anode Filament (CAF), current overload, voltage overload, arc ignition, external fire source and the like.
According to the root cause analysis method for the printed circuit board burn-in failure, the failure mode of the printed circuit board is obtained through analysis according to the acquired failure basic information of the printed circuit board burn-in failure; then, reasonably detecting the printed circuit board to obtain a corresponding detection result; and finally, determining the failure root cause of the printed circuit board by combining the detection result and the failure mode analyzed before.
Referring to fig. 2, fig. 2 shows a flowchart of the specific step of step S130, which specifically includes the following steps:
step S131, acquiring position information of the abnormal position of the printed circuit board;
step S132, according to the position information, carrying out nondestructive testing on the abnormal position to obtain a corresponding nondestructive testing result;
step S133, according to the position information, performing slice analysis on the abnormal position to obtain a corresponding slice analysis result;
step S134, performing element analysis on the abnormal position according to the position information to obtain a corresponding element analysis result; and/or measuring the abnormal position according to the position information to obtain a corresponding measurement result.
The position information comprises the size of the abnormal position, the specific distribution of the abnormal position on the printed circuit board, the insulation distance of the abnormal position and other information.
The non-destructive testing means includes means such as X-ray projection, ultrasonic scanning and industrial CT, and the non-destructive testing means can detect the non-destructive testing results, including but not limited to: the specific deviation positions of the patterns such as the circuit, the hole, the bonding pad and the like of the printed circuit board; abnormal conditions of hole copper of a hole structure on the printed circuit board; whether the size of the conductor in the burning board area on the printed board is abnormal or not and the conductor size abnormal area; whether the insulating medium in the printed board falls off, loses, bubbles, cavities, cracks and other abnormalities exist.
Alternatively, if the position information is that the insulation interval of the abnormal position is insufficient, vertical slice and horizontal slice analysis may be considered for the abnormal position.
The element analysis includes, but is not limited to, detection means such as an X-ray energy spectrometer, secondary ion mass spectrometry, infrared spectroscopy, ultraviolet spectroscopy, nuclear magnetic resonance, and the like.
Wherein the detection result includes the position information, the non-destructive detection result, the slice analysis result, and at least one of the elemental analysis result and the measurement result.
Referring to fig. 3, fig. 3 shows a flowchart of the specific step of step S140, which specifically includes the following steps:
step S141, analyzing to obtain a failure root cause set according to the failure mode;
and S142, analyzing and obtaining the failure root cause of the printed circuit board according to the failure root cause set and the detection result.
For example, if the failure mode is determined as an insulation medium problem, the failure root cause can be preliminarily determined as an insulation medium abnormality, and a set of root causes such as air bubble cavity layering in the insulation medium, medium deterioration, aging and decomposition, insulation medium loss, insulation medium misuse and the like is obtained;
for example, if the failure mode is judged that the conductor morphology is abnormal, the failure root cause can be preliminarily judged as the conductor morphology abnormality, and a set of root causes such as conductor size abnormality, conductor defect bending deformation and conductor cracks is obtained;
for example, if the failure mode is determined as the insulation gap problem, the failure cause may be used to preliminarily determine the insulation gap abnormality, and obtain a set of causes such as incomplete copper residue after etching, copper nickel gold tin diffusion, foreign residue adhesion on the conductor, back-drilled stub superscript, blind via short circuit, via offset, and pattern offset.
The failure root causes such as incomplete copper residue after etching, copper-nickel-gold-tin diffusion and the like, residual adhesion of foreign matters on the conductors and the like can be classified as related root causes of the foreign matters between the conductors; the excessive standard of the back drilling residual pile, the short circuit of the blind hole and the deviation of the via hole can be classified as related root causes of the hole structure abnormity.
It should be noted that the failure mode may be the above-mentioned failure mode, may also include other failure modes, and may also be one or more of the failure modes, and the determined root cause set may also be one or more of the above-mentioned failure root cause and other failure root causes.
For example, if the failure root cause set includes a root cause related to a foreign matter between conductors, the failure root cause set may be analyzed according to an elemental analysis result in the detection result, for example, if the elemental analysis result is that the relic mainly contains elements such as carbon, oxygen, copper, nickel, gold, tin, lead, silver, etc., and then a slice analysis result may be combined, for example, the slice analysis result is: the foreign matter and the printed board substrate generate a typical basic copper appearance, so that the foreign matter can be obtained according to the following steps: residual copper is not completely etched; and if the slice analysis result is: if the foreign matter is in the form of foreign matter adhering to and remaining on the conductor, the following can be obtained: conductive impurity residues containing the above-mentioned elemental components; and if the slice analysis result is: the cross section position of the foreign matter is consistent with the phenomena of copper plating, gold plating, tin plating, silver plating and other plating layers of the printed board, and the failure root can be considered as copper, nickel, gold, silver, tin and other metals which are infiltrated and plated in the coating or plating process of the printed board.
For example, if the failure root cause set includes a root cause with insufficient insulation distance, the actual insulation distance L between conductors can be obtained according to the specific deviation position of the patterns such as the lines, holes, pads, and the like of the printed board in the nondestructive testing result, in combination with the measurement result obtained by slicing the deviation position, that is, the pattern deviation size L1, and according to the printed board insulation distance design value L0 in the printed board design file, the calculation formula is L0-L1, and if the actual insulation distance L is smaller than the specified safe insulation distance, the failure root cause is the printed board pattern deviation.
For example, if the failure root cause set comprises root causes related to hole structure abnormity, the same hole structure of the area without fire on the printed board can be obtained through a nondestructive testing result, for example, the hole structure is a back drilling hole, the measured length of the back drilling stub is obtained, and if the length of the back drilling stub exceeds the standard, the insulation distance is insufficient, the failure root cause is that the back drilling stub is too long; for example, if the hole structure is a laser blind hole structure, it can be obtained whether the blind hole has abnormal short circuits such as drilling through the blind hole and short circuit with other conductors caused by excessive laser ablation in the slicing result, and if so, it can be obtained that the failure root is the laser blind hole short circuit.
For example, if the failure root cause set includes root causes related to conductor form abnormality, the failure root causes can be obtained through slice analysis results and measurement results, for example, when the conductor such as a line has abnormal forms such as rough appearance, insufficient width, insufficient thickness, conductor defect, conductor bending, conductor corrosion, conductor crack and the like, the resistance value of the conductor is abnormal, and the root causes of the sintered plate due to the conductor form abnormality can be obtained as corresponding conductor form abnormality failure root causes such as conductor defect, insufficient width and the like.
For example, if the set of failure causes includes a cause related to an abnormal insulating medium, the failure causes can be obtained through a slicing analysis result and an elemental analysis result, for example, if the abnormal metallic and non-metallic abnormal elements such as copper, nickel, gold, tin, lead, silver, nitrogen, chlorine, etc. are found to remain in the insulating medium in the elemental analysis result, the failure causes can be obtained as an insulating medium doping.
In addition, the glass transition temperature Tg, the curing factor Δ Tg, the thermal decomposition temperature Td, the coefficient of thermal expansion CTE and the like of the insulating medium can be detected by using equipment such as a static thermomechanical analyzer, a dynamic thermomechanical analyzer, a thermogravimetric analyzer and the like, and the abnormality such as the deterioration, cracking, degradation, aging, quality failure and the like of the insulating medium can be eliminated and confirmed.
Referring to fig. 4, fig. 4 shows a flowchart of the specific step of step S133, which specifically includes the following steps:
step S133a, according to the position information, vertically or horizontally slicing the abnormal position to obtain slice information, wherein the slice information includes the section morphology and the section size of the abnormal position.
Step S133b, the slice information is analyzed to obtain a corresponding slice analysis result.
Referring to fig. 5, fig. 5 shows a second flow chart of the method for analyzing the root cause of the printed circuit board burn-in failure according to the embodiment of the present application, and in step S140, after the root cause of the printed circuit board burn-in failure is obtained through analysis according to the detection result and the failure mode, the method may further include the following steps:
s150, acquiring a reproduction result corresponding to a reproduced printed circuit board, wherein the reproduced printed circuit board is a printed circuit board obtained by simulation reproduction according to the failure root;
and step S160, obtaining a root cause analysis result according to the reproduction result and the failure root cause.
For example, when the failure root is a relevant root of foreign matter existing between conductors, and the foreign matter between the conductors causes insufficient insulation distance to cause short circuit board burning, the reproduced printed wiring board is the printed wiring board with the failed original board burning, and the printed wiring board with the foreign matter between the conductors cleaned is cleaned, and the method for obtaining the corresponding reproduction result is the printed wiring board cleaned, and the cleaning measures include, but are not limited to, cleaning, mechanical processing and laser ablation.
For example, when the failure cause is pattern deviation, the obtained reproduced printed wiring board is a combination of a printed wiring board having the same design pattern as that of a printed wiring board having a failed board by firing, but having no problem of pattern deviation, and a printed wiring board having a failed board by firing.
For example, when the cause of failure is a cause related to the abnormality of the hole structure, the reproduced printed wiring board obtained is a combination of a printed wiring board of the same design as the board-burned-out printed wiring board but without the abnormality of the hole structure and a printed wiring board of which the original board-burned-out printed wiring board has failed.
For example, when the failure root is a related root of the abnormal form of the conductor, the obtained recurrent printed wiring board is formed by adding a conductor by adopting methods such as an external lead and the like to form a parallel circuit with the abnormal form conductor, so that the abnormal form conductor is replaced to carry out circuit communication; for example, a metal wire is soldered by a bonding process such as a gold wire, an aluminum wire, or a copper wire, or a wire is directly soldered, thereby connecting a conductor circuit.
For example, when the cause of failure is a cause related to abnormality of the insulating medium, the reproduced printed wiring board obtained is a printed board to which the same design as that of the printed wiring board in which the burn-in board failed is applied but in which abnormality of the insulating medium has not occurred.
Optionally, the reproduced printed circuit board is subjected to power-on processing or simulated live-line operation, and an operation result obtained after the operation is a corresponding reproduction result.
Referring to fig. 6, fig. 6 shows a flowchart of the specific step of step S160, which specifically includes the following steps:
step S161, determining whether the recurrence result matches a predetermined recurrence result corresponding to the failure root cause;
step S162, according to the failure root cause, obtaining improvement information of the printed circuit board through matching;
in step S163, the failure elimination root cause is obtained.
If the recurrence result is determined to match the predetermined recurrence result corresponding to the failure root, executing step S162; if it is determined that the recurrence result does not match the predetermined recurrence result corresponding to the failure root, step S163 is executed.
For example, if the failure root cause is a root cause of foreign matter existing between conductors, a root cause of abnormal conductor form or a root cause of abnormal insulating medium, the preset recurrence result is that the repeated printed circuit board is not burned for failure when being electrified; if the failure root cause is the related root cause of the abnormal hole structure, the preset recurrence result is that the printed circuit board with the normal hole structure is not subjected to board burning, and the printed circuit board with the short-circuited hole structure is subjected to board burning; if the failure root is pattern deviation, the preset recurrence result is that the printed circuit board with normal patterns is not subjected to board burning, and the printed circuit board with the deviated patterns is subjected to board burning, if the recurrence result is very obvious different from the actual recurrence result, the problem can be considered to occur in the root cause analysis, and the failure root obtained in the previous analysis is not the real root cause of board burning failure of the printed circuit board, so that the failure elimination root is obtained.
The root cause analysis result is improvement information or a failure elimination root cause, the failure elimination root cause means that the previously confirmed failure root cause is eliminated, and other possible failure root causes can be analyzed according to the specific situation of the failure mode.
Example two
In order to implement the corresponding method of the above embodiments to achieve the corresponding functions and technical effects, a root cause analysis device for printed circuit board burn-in failure is provided below.
Referring to fig. 7, fig. 7 is a first structural block diagram of a printed circuit board burn-in failure root cause analysis device according to an embodiment of the present application, where the device may be a module, a program segment, or a code on an electronic device.
The root cause analysis device for printed circuit board burning failure of the embodiment of the application comprises:
and the information acquisition module 210 is used for acquiring the failure basic information of the printed circuit board with the burn-in failure.
And the mode analysis module 220 is configured to obtain a failure mode of the printed circuit board according to the failure basic information.
And the detection processing module 230 is configured to detect the printed circuit board to obtain a corresponding detection result.
And the root cause analysis module 240 is configured to analyze the failure root cause of the printed circuit board according to the detection result and the failure mode.
Referring to fig. 8, fig. 8 is a second structural block diagram of a printed circuit board burn-in failure root cause analysis device according to an embodiment of the present application.
Optionally, the root cause analysis device for printed circuit board burn-in failure in the embodiment of the present application further includes:
a recurrence acquiring module 250, configured to acquire a recurrence result corresponding to a recurring printed wiring board, where the recurring printed wiring board is a printed wiring board obtained by performing simulation recurrence according to the failure cause.
And the recurrence analysis module 260 is configured to obtain a root cause analysis result according to the recurrence result and the failure root cause.
Optionally, the detection processing module 230 includes:
the position detection module is used for acquiring the position information of the abnormal position of the printed circuit board;
the nondestructive testing module is used for carrying out nondestructive testing on the abnormal position according to the position information to obtain a corresponding nondestructive testing result;
the slice detection module is used for carrying out slice analysis on the abnormal position according to the position information to obtain a corresponding slice analysis result;
the element detection module is used for carrying out element analysis on the abnormal position according to the position information to obtain a corresponding element analysis result;
and the measurement detection module is used for measuring the abnormal position according to the position information to obtain a corresponding measurement result.
Optionally, the root cause analysis module 240 includes:
the root cause set analysis module is used for analyzing and obtaining a failure root cause set according to the failure mode;
and the failure root cause analysis module is used for analyzing and obtaining the failure root cause of the printed circuit board according to the failure root cause set and the detection result.
Optionally, the slice detection module comprises:
the slicing module is used for vertically slicing or horizontally slicing the abnormal position according to the position information and obtaining slicing information, and the slicing information comprises the section morphology and the section size of the abnormal position;
and the analysis module is used for analyzing the slice information to obtain a corresponding slice analysis result.
Optionally, the recurrence analysis module 260 comprises:
the recurrence result matching module is used for judging whether the recurrence result is matched with a preset recurrence result corresponding to the failure root factor;
the matching result analysis module is used for obtaining a root cause analysis result according to the matching result; if so, matching to obtain the improvement information of the printed circuit board according to the failure root cause; if not, the failure elimination root cause is obtained.
The root cause analysis device for printed circuit board burn-in failure can implement the root cause analysis method for printed circuit board burn-in failure of the first embodiment. The alternatives in the first embodiment are also applicable to the present embodiment, and are not described in detail here.
The rest of the embodiments of the present application may refer to the contents of the first embodiment, and in this embodiment, details are not repeated.
EXAMPLE III
The embodiment of the application provides electronic equipment, which comprises a memory and a processor, wherein the memory is used for storing a computer program, and the processor runs the computer program to enable the electronic equipment to execute the root cause analysis method for the burn-in failure of the printed circuit board.
Alternatively, the electronic device may be a server.
In addition, the embodiment of the application also provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to realize the root cause analysis method for printed circuit board burn-in failure.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A root cause analysis method for printed circuit board burning failure is characterized by comprising the following steps:
acquiring failure basic information of a printed circuit board with a burned board failed;
obtaining a failure mode of the printed circuit board according to the failure basic information;
detecting the printed circuit board to obtain a corresponding detection result;
and analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode.
2. The method for analyzing the root cause of the burn-in failure of the printed circuit board according to claim 1, wherein the step of detecting the printed circuit board to obtain a corresponding detection result comprises the following steps:
acquiring position information of the abnormal position of the printed circuit board;
performing nondestructive testing on the abnormal position according to the position information to obtain a corresponding nondestructive testing result;
according to the position information, slice analysis is carried out on the abnormal position to obtain a corresponding slice analysis result;
performing element analysis on the abnormal position according to the position information to obtain a corresponding element analysis result; and/or measuring the abnormal position according to the position information to obtain a corresponding measurement result;
the detection result includes the position information, the non-destructive detection result, the slice analysis result, and at least one of the elemental analysis result and the measurement result.
3. The method for analyzing the root cause of printed circuit board burn-in failure according to claim 1, wherein the analyzing the root cause of the printed circuit board failure according to the detection result and the failure mode comprises:
analyzing to obtain a failure root cause set according to the failure mode;
and analyzing to obtain the failure root cause of the printed circuit board according to the failure root cause set and the detection result.
4. The method for analyzing the root cause of printed circuit board burn-in failure according to claim 2, wherein the slicing analysis is performed on the abnormal position according to the position information to obtain a corresponding slicing analysis result, and the method comprises the following steps:
according to the position information, vertically slicing or horizontally slicing the abnormal position to obtain slice information, wherein the slice information comprises the section morphology and the section size of the abnormal part;
and analyzing the slice information to obtain a corresponding slice analysis result.
5. The method for analyzing root cause of printed wiring board burn-in failure according to claim 1, wherein after analyzing the root cause of failure of the printed wiring board according to the detection result and the failure mode, the method further comprises:
acquiring a reproduction result corresponding to a reproduced printed circuit board, wherein the reproduced printed circuit board is a printed circuit board obtained by performing simulation reproduction according to the failure root;
and obtaining a root cause analysis result according to the recurrence result and the failure root cause.
6. The method for analyzing the root cause of the burn-in failure of the printed circuit board according to claim 5, wherein the obtaining of the root cause analysis result according to the recurrence result and the failure root cause comprises:
judging whether the reproduction result is matched with a preset reproduction result corresponding to the failure root factor;
if so, matching to obtain the improvement information of the printed circuit board according to the failure root cause;
if not, obtaining failure elimination root cause;
the root cause analysis result is the improvement information or the failure elimination root cause.
7. A root cause analysis device for printed circuit board burning failure is characterized by comprising:
the information acquisition module is used for acquiring failure basic information of the printed circuit board with the burning failure;
the mode analysis module is used for obtaining the failure mode of the printed circuit board according to the failure basic information;
the detection processing module is used for detecting the printed circuit board to obtain a corresponding detection result;
and the root cause analysis module is used for analyzing and obtaining the failure root cause of the printed circuit board according to the detection result and the failure mode.
8. The printed wiring board burn-in failure root cause analysis device of claim 7, further comprising:
the recurrence acquisition module is used for acquiring a recurrence result corresponding to a recurrent printed circuit board, wherein the recurrent printed circuit board is a printed circuit board obtained by simulation recurrence according to the failure root;
and the recurrence analysis module is used for obtaining a root cause analysis result according to the recurrence result and the failure root cause.
9. An electronic device, comprising a memory for storing a computer program and a processor for executing the computer program to make the electronic device execute a root cause analysis method for printed wiring board burn-in failure according to any one of claims 1 to 6.
10. A computer-readable storage medium, characterized in that it stores a computer program which, when executed by a processor, implements a root cause analysis method of printed wiring board burn-in failure according to any one of claims 1 to 6.
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Cited By (1)
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| CN114252402A (en) * | 2021-12-21 | 2022-03-29 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Analysis processing method for discoloration of solder mask of printed circuit board |
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