CN107967200A - It is a kind of based on PCB region temperature detecting come prevent HDD backboards burn plate method - Google Patents
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Abstract
本申请发明一种基于PCB区域温度侦测来防止HDD背板烧板的方法,在HDD背板的12V和5V供电位置确定合适的热点位置,在选好的热点位置摆放温度传感器,通过温度传感器侦测每个热点的实际温度,再通过I2C总线将各个热点温度数据传送给MCU,由MCU对数据进行判断并切断HDD背板供电。因此可避免因PCB材质受环境温度、数度影响,阻抗变小,导致热量局部累计效应,造成PCB局部着火的问题发生。
This application invents a method for preventing HDD backplane burn-in based on PCB area temperature detection. Determine the appropriate hot spot position at the 12V and 5V power supply positions of the HDD backplane, place a temperature sensor at the selected hot spot position, and pass the temperature The sensor detects the actual temperature of each hotspot, and then transmits the temperature data of each hotspot to the MCU through the I2C bus, and the MCU judges the data and cuts off the power supply of the HDD backplane. Therefore, the PCB material is affected by the ambient temperature and temperature, and the impedance becomes smaller, which leads to the local accumulation effect of heat and causes the problem of local fire on the PCB.
Description
技术领域technical field
本发明涉及服务器温度监测领域,具体涉及一种基于PCB区域温度侦测来防止HDD背板烧板的方法。The invention relates to the field of server temperature monitoring, in particular to a method for preventing HDD backplane burn-in based on PCB area temperature detection.
背景技术Background technique
伴随着互联网的快速发展,云计算技术的不断兴起,网上业务量也不断增加,这对服务器工作稳定性的要求越来越高。由于客户的网上业务一般是持续进行的,一旦服务器宕机或掉电,将会中断业务、丢失交易数据,给客户带来损失,因此对机房服务器的供电可靠性要求也越来越高。With the rapid development of the Internet, the continuous rise of cloud computing technology, and the continuous increase of online business volume, the requirements for server stability are getting higher and higher. Since the customer's online business is generally continuous, once the server goes down or the power fails, the business will be interrupted, the transaction data will be lost, and the customer will suffer losses. Therefore, the requirements for the power supply reliability of the server in the computer room are getting higher and higher.
在实际应用中,有可能还存在更严重的隐患。根据一份对客户端问题的统计调查数据显示,服务器的机房一般无人值守,通常服务器内的HDD(Hard disk硬盘)背板由于板材所处的环境温度和湿度发生变化,导致背板PCB层与层之间的某些位置会出现阻抗变小、漏电流变大的现象发生。随着时间的积累,PCB局部会出现温度过高,甚至超出PCB材料着火点,进而引起冒烟甚至会出现明火的致命风险。这些隐患对于服务器机房的安全是致命的。In practical applications, there may be more serious hidden dangers. According to a statistical survey data on client problems, the computer room of the server is generally unattended. Usually, the HDD (Hard disk hard disk) backplane in the server changes due to changes in the ambient temperature and humidity of the board, causing the backplane PCB layer to be damaged. In some positions between the layer and the layer, the impedance becomes smaller and the leakage current becomes larger. With the accumulation of time, the temperature of the PCB will be too high locally, even exceeding the ignition point of the PCB material, which will cause the fatal risk of smoke or even an open flame. These hidden dangers are fatal to the security of the server room.
现有的方式一般是通过如下方式进行防护:The existing methods are generally protected by the following methods:
附图1所示的是改进前的防止HDD背板烧板设计方案示意图。防止HDD背板烧板的结构包含:PSU(Power supply unit电源供应器)、HDD背板,PSU的12V输出进入HDD背板,经12V E-FUSE(Electronic fuse电子保险丝)后分出两路:第一路12V给硬盘HDD1\HDD2\...\HDDN提供12V供电;第二路12V作为DC/DC线路:12V转P5V_HDD的输入。P5V_HDD给硬盘HDD1\HDD2\...\HDDN提供5V供电。其中的VR线路、12V转P5V_HDD和12VE-FUSE都具备OCP(OverCurrent Protection过流保护)保护功能。一旦HDD端的P12V_HDD或P5V_HDD出现过流或短路,12V E-FUSE和12V转P5V_HDD即刻关断开关管,切断与HDD之间的供电通道。Figure 1 is a schematic diagram of the design scheme for preventing HDD backplane burn-in before improvement. The structure to prevent the HDD backplane from burning includes: PSU (Power supply unit), HDD backplane, the 12V output of the PSU enters the HDD backplane, and is divided into two circuits after passing through the 12V E-FUSE (Electronic fuse): The first 12V supply 12V power supply to the hard disk HDD1\HDD2\...\HDDN; the second 12V is used as DC/DC line: 12V to P5V_HDD input. P5V_HDD provides 5V power supply to hard disk HDD1\HDD2\...\HDDN. The VR line, 12V to P5V_HDD and 12VE-FUSE all have OCP (OverCurrent Protection) protection function. Once the P12V_HDD or P5V_HDD on the HDD side has an overcurrent or short circuit, the 12V E-FUSE and 12V to P5V_HDD will immediately turn off the switch tube and cut off the power supply channel with the HDD.
现有安全防护措施存在的缺点是,当HDD背板PCB材质受环温、湿度影响,阻抗变小,漏电流变大,但不足以触发OCP,随着时间积累,板材上的热量也不断积累增加,直至达到PCB的着火点。改进前的HDD背板供电可靠性设计是不能对这种情况进行防护处理的。The disadvantage of the existing safety protection measures is that when the HDD backplane PCB material is affected by the ambient temperature and humidity, the impedance becomes smaller and the leakage current becomes larger, but it is not enough to trigger OCP. Over time, the heat on the board will also continue to accumulate. increase until the ignition point of the PCB is reached. The HDD backplane power supply reliability design before improvement cannot protect against this situation.
针对上述情况,本申请发明一种基于PCB区域温度侦测来防止HDD背板烧板的方法,可以解决因PCB材质受环境温度、数度影响,阻抗变小,HDD背板上12v和5V漏电流增加,导致热量局部累计效应,造成PCB局部着火的问题。In view of the above situation, the present application invented a method based on PCB area temperature detection to prevent HDD backplane burning, which can solve the problem of 12v and 5V leakage on the HDD backplane due to the influence of PCB material by ambient temperature and temperature, and the impedance becomes smaller. The current increases, resulting in a local accumulation effect of heat, causing the problem of local fire on the PCB.
发明内容Contents of the invention
本申请发明一种基于PCB区域温度侦测来防止HDD背板烧板的方法,其主要实现方式是在HDD背板的12V和5V供电位置确定合适的热点位置,然后在选好的热点位置摆放相应的温度传感器,通过温度传感器侦测每个热点位置的实际温度,再通过I2C总线将各个热点温度数据传送给MCU,由MCU对数据进行判断并切断HDD背板供电。This application invents a method for preventing HDD backplane burn-in based on PCB area temperature detection. Put the corresponding temperature sensor, detect the actual temperature of each hot spot through the temperature sensor, and then transmit the temperature data of each hot spot to the MCU through the I2C bus, and the MCU will judge the data and cut off the power supply of the HDD backplane.
具体地,本申请请求保护一种基于PCB区域温度侦测来防止HDD背板烧板的方法,其特征在于,该方法具体包括如下步骤:Specifically, the application claims protection of a method for preventing HDD backplane burn-in based on PCB area temperature detection, which is characterized in that the method specifically includes the following steps:
在HDD背板上将PCB的版面划分成若干个区域,并确定每个区域的中心;Divide the PCB layout into several areas on the HDD backplane, and determine the center of each area;
确定12V和5V供电分布区域,设置PCB热点检测位置;Determine the distribution area of 12V and 5V power supply, and set the PCB hot spot detection position;
在每个热点位置上放置一个温度传感器;place a temperature sensor at each hotspot location;
将每个温度传感器连上Re-driver后与I2C SWITCH互联;Connect each temperature sensor to Re-driver and interconnect with I2C SWITCH;
MCU通过I2C总线与I2C SWITCH互联;The MCU is interconnected with the I2C SWITCH through the I2C bus;
将MCU输出的一路控制信号连接在PSU的使能引脚上,用于控制PSU 12V输出;Connect a control signal output by the MCU to the enable pin of the PSU to control the 12V output of the PSU;
MCU对I2C上的数据进行轮巡读取;The MCU polls and reads the data on the I2C;
MCU轮巡读取后,选取最高温度值,与MCU内设置的温度阈值进行对比;若实际最高温度超过该阈值,MCU就会发出信号触发PSU停止工作,切断供电。After the MCU polls and reads, select the highest temperature value and compare it with the temperature threshold set in the MCU; if the actual highest temperature exceeds the threshold, the MCU will send a signal to trigger the PSU to stop working and cut off the power supply.
如上所述的基于PCB区域温度侦测来防止HDD背板烧板的方法,其特征还在于,PCB热点检测位置可以是多个。The above-mentioned method for preventing HDD backplane burn-in based on PCB area temperature detection is also characterized in that there may be multiple PCB hotspot detection locations.
如上所述的基于PCB区域温度侦测来防止HDD背板烧板的方法,其特征还在于,设置PCB热点检测位置是根据HDD背板上12V和5V的layout实际情况,沿着12V和5V供电路径选择合适的区域中心作为PCB热点检测位置。The above-mentioned method for preventing HDD backplane burn-in based on PCB area temperature detection is also characterized in that setting the PCB hotspot detection position is based on the actual layout of 12V and 5V on the HDD backplane, and power supply along 12V and 5V The path selects the appropriate center of the area as the PCB hotspot detection location.
附图说明Description of drawings
图1、改进前的防止HDD背板烧板设计方案示意图Figure 1. Schematic diagram of the design scheme for preventing HDD backplane burn-in before improvement
图2、改进后的防止HDD背板烧板设计方案示意图Figure 2. Schematic diagram of the improved design scheme for preventing HDD backplane burn-in
图3、HDD背板热点位置示意图Figure 3. Schematic diagram of hot spots on the HDD backplane
具体实施方式Detailed ways
附图2所示是改进后的防止HDD背板烧板设计方案示意图。其组成和改进前的方案差异点在于:Figure 2 is a schematic diagram of an improved design scheme for preventing HDD backplane burn-in. The difference between its composition and the scheme before improvement lies in:
改进前,在HDD背板的12V供电通道上设置12V E-FUSE。Before improvement, set 12V E-FUSE on the 12V power supply channel of HDD backplane.
改进后,在HDD背板的12V和5V供电位置确定合适的热点位置。然后在选好的热点位置摆放相应的温度传感器,通过温度传感器侦测每个热点位置的实际温度。通过I2C总线将各个热点温度数据传送给MCU(Micro controller Unit单片机),由MCU对数据进行判断并切断HDD背板供电。After the improvement, determine the appropriate hotspot position at the 12V and 5V power supply positions of the HDD backplane. Then place the corresponding temperature sensor at the selected hot spot position, and detect the actual temperature of each hot spot position through the temperature sensor. The temperature data of each hot spot is transmitted to the MCU (Micro controller Unit) through the I2C bus, and the MCU judges the data and cuts off the power supply of the HDD backplane.
改进后的方案其工作原理如下:The working principle of the improved scheme is as follows:
将HDD背板版面按照附图3所示,划分成若干块区域,每个区域的中心即为图中黑点所在位置。待区域中心位置确定好后,再根据HDD背板12V和5V实际Layout普通位置,确定热点位置即为附图3中空心圈所在位置。Divide the HDD backplane layout into several areas as shown in Figure 3, and the center of each area is where the black dot in the figure is located. After the location of the center of the area is determined, according to the actual 12V and 5V actual Layout positions of the HDD backplane, determine the location of the hotspot, which is the location of the hollow circle in Figure 3.
然后,将温度传感器1、2、...、N依次放在相应的热点位置。每个温度传感器通过一路I2C经re-driver连在I2C SWITCH上。MCU会对I2C上的N路I2C总线上的数据进行轮巡读取。Then, the temperature sensors 1, 2, . . . , N are sequentially placed on the corresponding hot spots. Each temperature sensor is connected to the I2C SWITCH through a re-driver through an I2C. The MCU will poll and read the data on the N-way I2C bus on the I2C.
每做完依次轮询,会对所读到的N个温度数据进行排序,选取最高温度值,并与MCU内设置的温度阈值进行对比。若实际最高温度超过该阈值,MCU就会发出信号触发PSU停止工作,切断供电。After polling in turn, the read N temperature data will be sorted, the highest temperature value will be selected, and compared with the temperature threshold set in the MCU. If the actual maximum temperature exceeds the threshold, the MCU will send a signal to trigger the PSU to stop working and cut off the power supply.
其中:Re-driver是保证I2C信号的传输质量,用于信号增强;I2C SWITCH是实现MCU对N路I2C的轮流访问。Among them: Re-driver is to ensure the transmission quality of the I2C signal and used for signal enhancement; I2C SWITCH is to realize the MCU's access to N-way I2C in turn.
为清楚的说明该设计方法的实现情况,下面结合附图2、附图3来说明实现步骤。具体如下:In order to clearly illustrate the implementation of the design method, the implementation steps will be described below in conjunction with accompanying drawings 2 and 3 . details as follows:
1)、在HDD背板上,将其PCB的版面划分成若干个区域,并确定每个区域的中心;1) On the HDD backplane, divide the PCB layout into several areas, and determine the center of each area;
2)、根据HDD背板上12V和5V的layout实际情况,确定12V和5V供电分布区域,并沿着12V和5V供电路径选择合适的区域中心作为PCB热点检测位置;2) According to the actual layout of 12V and 5V on the HDD backplane, determine the distribution area of 12V and 5V power supply, and select the appropriate center of the area along the 12V and 5V power supply path as the PCB hotspot detection position;
3)、待PCB热点检测位置定好后,在相应的热点位置放置一个温度传感器;3) After the PCB hot spot detection position is determined, place a temperature sensor at the corresponding hot spot position;
4)、将每个温度传感器连上Re-driver后,与I2C SWITCH互联;4) After connecting each temperature sensor to Re-driver, interconnect with I2C SWITCH;
5)、MCU再通过I2C总线与I2C SWITCH互联;5), MCU is interconnected with I2C SWITCH through I2C bus;
6)、将MCU输出的一路控制信号连接在PSU的使能引脚上,用于控制PSU 12V输出。6) Connect a control signal output by the MCU to the enable pin of the PSU to control the 12V output of the PSU.
通过这种连接方式,本申请提出的一种基于PCB区域温度侦测来防止HDD背板烧板的设计方法即可得以实现。Through this connection method, a design method for preventing HDD backplane burn-in based on PCB area temperature detection proposed in this application can be realized.
显而易见地,上面所示的仅仅是本发明的一个具体实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据上述实施例获得其他的技术方案,以及在本发明保护的范围内做出的等同变化均应落入本发明的保护范围内,都属于本发明保护的范围。Obviously, what is shown above is only a specific embodiment of the present invention, and for those skilled in the art, other technical solutions can also be obtained according to the above-mentioned embodiments without creative work, and in this All equivalent changes made within the protection scope of the invention shall fall within the protection scope of the present invention, and all belong to the protection scope of the present invention.
综上所述,本发明采用读各个温度传感器来检测PCB多个热点位置的温度,并通过MCU对这些热点温度进行处理,控制硬盘供电输入,因此可避免因PCB材质受环境温度、数度影响,阻抗变小,HDD背板上12v和5V漏电流增加,导致热量局部累计效应,造成PCB局部着火的问题发生。方法实现简单,无需人工值守机房,节约了成本,提高了工作效率。本发明所述的技术方案还可用服务器主板、电源板、风扇板等其他PCB板卡的应用场合。In summary, the present invention detects the temperature of multiple hot spots on the PCB by reading each temperature sensor, and processes these hot spots through the MCU to control the power supply input of the hard disk, so it can avoid the PCB material being affected by the ambient temperature and temperature , the impedance becomes smaller, and the leakage current of 12v and 5V on the HDD backplane increases, which leads to the local accumulation effect of heat and causes the problem of local fire on the PCB. The method is simple to implement, and does not need to be manually guarded in the computer room, which saves costs and improves work efficiency. The technical scheme of the present invention can also be used in other PCB boards such as server main boards, power supply boards, and fan boards.
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CN119902115A (en) * | 2025-03-28 | 2025-04-29 | 苏州元脑智能科技有限公司 | Power supply detection component, monitoring circuit, method, electronic device, product and medium |
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Application publication date: 20180427 |