CN113003530B - MEMS sensor and packaging structure thereof - Google Patents
MEMS sensor and packaging structure thereof Download PDFInfo
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- CN113003530B CN113003530B CN202110191010.8A CN202110191010A CN113003530B CN 113003530 B CN113003530 B CN 113003530B CN 202110191010 A CN202110191010 A CN 202110191010A CN 113003530 B CN113003530 B CN 113003530B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 213
- 239000004020 conductor Substances 0.000 claims description 17
- 210000000988 bone and bone Anatomy 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 8
- 230000000149 penetrating effect Effects 0.000 description 6
- 230000006698 induction Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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Abstract
The application discloses a MEMS sensor and a packaging structure thereof, wherein the packaging structure comprises: the shell is provided with a first substrate, a second substrate and a connecting plate for connecting the first substrate and the second substrate, wherein a cavity is formed on the inner surface of the first substrate, the inner surface of the second substrate and the inner surface of the connecting plate, the first substrate and the second substrate respectively extend along the top surface of the shell to the bottom surface of the shell, and the inner surface of the first substrate and/or the inner surface of the second substrate are provided with conductive areas; at least one electrode located outside the cavity and disposed on a bottom surface of the housing, the bottom surface of the housing including at least one of the outer surfaces of the connection plate; and at least one conductive structure for electrically connecting the electrodes to the respective conductive areas via the first substrate and/or the second substrate, respectively. The packaging structure simplifies wiring of the MEMS sensor, thereby increasing reliability of the MEMS sensor, reducing complexity of the process flow and lowering cost.
Description
Technical Field
The application relates to the technical field of MEMS sensors, in particular to a microphone, a pressure sensor, bone conduction and a packaging structure thereof.
Background
A sensor manufactured based on Micro Electro-mechanical system (Micro Electro MECHANICAL SYSTEMS, MEMS) is called a MEMS sensor, which is regarded as being very small in volume and good in performance. MEMS sensors typically include a MEMS chip and a signal processing chip electrically connected to the MEMS chip, and in order to prevent chip breakage and reduce environmental interference to the chip, the MEMS chip and the signal processing chip in the MEMS sensor need to be protected by a package structure, and the signal processing chip needs to be electrically connected to the outside through the package structure.
As shown in fig. 10, in some prior art, a package structure of a MEMS sensor is composed of an upper substrate 1, a connection plate 2, and a lower substrate 3, wherein a micro-electromechanical structure chip 4, a signal processing chip 5, and a filter capacitor 6 in the MEMS sensor are all fixed on an inner surface of the upper substrate 1. In order to realize the mounting of the MEMS sensor from the side without the through hole 1d or the mounting from the side with the through hole 1d, it is necessary to flexibly induce the output signal to the outer surface of the upper substrate 1 or the lower substrate 3. In order to meet the above requirements, a conductive post 1a and a conductive post 1b penetrating through the upper substrate 1, a mounting pad 1c located on the outer surface of the upper substrate 1 and electrically connecting the conductive post 1a and the conductive post 1b, a conductive post 2a penetrating through the connecting plate 2, a conductive post 3b penetrating through the lower substrate 3, and a mounting pad 3b located on the outer surface of the lower substrate 3 are respectively provided, so that an output signal may cause the mounting pad 1c through the conductive post 1a, and may also cause the mounting pad 3b through the conductive post 1a, the mounting pad 1c, the conductive post 1b, the conductive post 2a, and the conductive post 3a in sequence.
However, since the micro-electro-mechanical structure chip 4, the signal processing chip 5 and the filter capacitor 6 are all fixed on the upper substrate 1, the occupied area of the upper substrate 1 is larger, and more conductive columns are arranged in the upper substrate 1, the connecting plate 2 and the lower substrate 3, the wiring arrangement for transmitting output signals is more complex, the interference among the wirings is more, the reliability of the MEMS sensor is further reduced, the complexity of the process flow is improved, and the cost is increased.
In addition, in some special cases, it is also necessary to have the through hole of the MEMS sensor located at the side of the mounting position, and therefore, it is desirable to provide a MEMS sensor and its packaging structure to improve the above-mentioned problems.
Disclosure of Invention
In view of the above, the invention provides a MEMS sensor and a packaging structure thereof, which have the advantages of small occupied area of a substrate, simple process flow, low cost and high reliability.
According to an aspect of an embodiment of the present invention, there is provided a package structure of a MEMS sensor, a case having a first substrate, a second substrate, and a connection board connecting the first substrate and the second substrate, wherein an inner surface of the first substrate, an inner surface of the second substrate, and an inner surface of the connection board form a cavity, the first substrate and the second substrate extend along a top surface of the case toward a bottom surface of the case, respectively, and an inner surface of the first substrate and/or an inner surface of the second substrate have a conductive region; at least one electrode positioned outside the cavity and arranged on the bottom surface of the shell, wherein the bottom surface of the shell at least comprises one outer surface of the connecting plate; and at least one conductive structure for electrically connecting the electrodes to the respective conductive regions via the first substrate and/or the second substrate, respectively.
Optionally, the conductive structure comprises at least one or a combination of the following components: the inner surface of the first substrate is provided with a wire, the outer surface of the first substrate is provided with a wire, the inner surface of the second substrate is provided with a wire, the inner of the second substrate is provided with a wire, and the outer surface of the second substrate is provided with a wire.
Optionally, the conductive structure further comprises one or a combination of the following: the inner surface of the connecting plate is provided with leads, the inside of the connecting plate is provided with leads, the surface of the connecting plate opposite to the first substrate is provided with conductors, and the surface of the connecting plate opposite to the second substrate is provided with conductors.
Optionally, the bottom surface of the housing further includes a surface of the first substrate and/or the second substrate in a thickness direction.
Optionally, the electrode comprises a plating layer.
Optionally, the bottom surface of the housing has a plane and a groove, each electrode covers a surface of the groove and adjacent electrodes are separated by the plane.
Optionally, the device further comprises an electromagnetic shielding layer, at least part of which is positioned on the inner surface of the connecting plate and fixedly connected with the first substrate and the second substrate.
Optionally, the first substrate and the connecting plate are in an integrated structure, or the second substrate and the connecting plate are in an integrated structure.
Optionally, at least one through hole is provided on the housing.
According to another aspect of an embodiment of the present invention, there is provided a MEMS sensor, a package structure as described above; and the micro-electromechanical structure and the signal processing chip are electrically connected, and the micro-electromechanical structure and the signal processing chip are both positioned in the cavity.
Optionally, the microelectromechanical structure includes at least one of a microphone chip, a pressure sensor chip, and a bone conduction chip.
Optionally, at least one through hole is provided on the housing.
Optionally, one of the first substrate and the second substrate is used for carrying the microelectromechanical structure, and the axis of the through hole is not parallel to the surface of the sensing film of the microelectromechanical structure.
Optionally, the axis is perpendicular to a surface of the sensing film.
Optionally, the signal processing chip and the microelectromechanical structure are both located on the first substrate or the second substrate; or the signal processing chip is positioned on one of the first substrate and the second substrate, and the micro-electromechanical structure is positioned on the other of the first substrate and the second substrate.
According to the MEMS sensor and the packaging structure thereof provided by the embodiment of the invention, the shell of the packaging structure is formed by the first substrate, the second substrate and the connecting plate, the first substrate and the second substrate respectively extend along the top surface of the shell towards the direction of the bottom surface provided with the electrode, and the conductive area is electrically connected to the electrode on the bottom surface of the shell by utilizing the first substrate and/or the second substrate, so that the wiring of the MEMS sensor is simplified, the reliability of the MEMS sensor is further improved, the complexity of the process flow is reduced, and the cost is reduced.
The through holes are formed in the first substrate and/or the second substrate, so that the through holes and the electrodes can be located on different surfaces of the shell, the through holes and the electrodes are not opposite, and after the packaging structure of the MEMS sensor is fixed through the electrodes, the requirements that the through holes of the MEMS sensor are located on the side face of the mounting position are met by the aid of the positions of the electrodes and the through holes on the shell.
The conductive structure is electrically connected with the electrode on the bottom surface of the shell and the conductive area on the inner surface of the cavity through the first substrate, the second substrate and the connecting plate of the shell, and the conductive structure, the conductive area and the electrode are attached to the surface of the shell, so that the complexity of the packaging structure is reduced, the production efficiency of a product is improved, the assembly of the product is facilitated, and the miniaturization of the product is facilitated.
The conductive structure provides various conductive paths between the conductive area and the electrode, so that the micro-electromechanical structure and the signal processing chip in the MEMS sensor can be flexibly arranged on the first substrate and the second substrate, and the micro-electromechanical structure is arranged on the other of the first substrate and the second substrate by arranging the signal processing chip on one of the first substrate and the second substrate, so that the area of the first substrate and the second substrate is fully utilized, and the packaging volume is further reduced.
The axis of the through hole of the packaging structure is not parallel to the surface of the induction film of the micro-electromechanical structure, and external signals can be more effectively acted on the induction film of the micro-electromechanical structure under the requirement that the through hole of the MEMS sensor is positioned on the side surface of the mounting position.
By having the through hole axis perpendicular to the surface of the sensing film, the sensitivity of the MEMS sensor is further improved.
By providing the electrode as a plating layer, the electrode can be more stably attached to the outer surface of the case.
Through set up the recess in the bottom surface of casing, and place every electrode on the surface of recess, increased the area of electrode in limited space, reduced the contact resistance of electrode and external circuit, after being connected through electrode and external circuit electricity, this recess can match with the protruding of junction surface, more is favorable to increasing MEMS sensor's reliability and stability.
The first substrate and the connecting plate are arranged into an integral structure, or the second substrate and the connecting plate are arranged into an integral structure, so that the packaging process steps are further reduced, and the packaging efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following brief description of the drawings of the embodiments will make it apparent that the drawings in the following description relate only to some embodiments of the present application and are not limiting of the present application.
Fig. 1a and fig. 1b are schematic structural diagrams of a housing of a package structure according to an embodiment of the invention.
Fig. 2a and fig. 2b are schematic structural diagrams of a first substrate and a second substrate of a housing according to an embodiment of the invention.
Fig. 3 shows a schematic structural view of a connection board according to an embodiment of the present invention.
Fig. 4 shows a schematic structural view of the load-bearing platform.
Fig. 5 shows a schematic structural diagram of a MEMS microphone according to a first embodiment of the present invention.
Fig. 6a and 6b are schematic structural diagrams of the first substrate in fig. 5.
Fig. 7 is a schematic structural diagram of the first substrate of fig. 5 after being connected to the connection board.
Fig. 8a and 8b are schematic structural diagrams of a MEMS microphone according to a second embodiment of the present invention.
Fig. 9 shows a schematic structural diagram of the second substrate in fig. 8 b.
Fig. 10 shows a schematic structural diagram of a MEMS sensor in the prior art.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements are denoted by like reference numerals throughout the various figures. For clarity, the various features of the drawings are not drawn to scale. Furthermore, some well-known portions may not be shown. The semiconductor structure obtained after several steps may be depicted in one figure for simplicity.
It will be understood that when a layer, an area, or a structure of a device is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or further layers or areas can be included between the other layer, another area, etc. And if the device is flipped, the one layer, one region, will be "under" or "beneath" the other layer, another region.
If, for the purposes of describing a situation directly overlying another layer, another region, the expression "directly overlying … …" or "overlying … … and adjoining it" will be used herein.
Numerous specific details of the invention, such as device structures, materials, dimensions, processing techniques and technologies, are set forth in the following description in order to provide a thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
The invention may be embodied in various forms, some examples of which are described below.
The following describes the housing structure of the MEMS microphone package structure according to the embodiment of the present invention in detail with reference to fig. 1a and 1b, fig. 2a and 2b, fig. 3 and fig. 4.
Although microelectromechanical structure 200 is illustrated as a microphone chip, it may be a pressure sensor chip, a bone conduction chip, or the like MEMS sensor chip. The present invention does not limit the type of sensor chip.
In the embodiment of the invention, the housing of the package structure has a first substrate 110, a second substrate 120 and a connection board 130. The first substrate 110 and the second substrate 120 respectively extend along the top surface 101 of the housing toward the bottom surface 102 of the housing, and the second substrate 120 is penetrated by the through hole 140. The connection plate 130 is located between the first substrate 110 and the second substrate 120, has two surfaces 132 opposite to the first substrate 110 and the second substrate 120, and is connected to the first substrate 110 and the second substrate 120 through the two surfaces 132, respectively. The inner surface 111 of the first substrate 110, the inner surface 121 of the second substrate 120, and the inner surface 131 of the connection plate 130 form a cavity. In some other embodiments, the connection plate 130 may also surround at least one of the first substrate 110 and the second substrate 120.
In the embodiment of the present invention, the housing of the package structure is substantially rectangular, and the bottom surface 102 of the housing includes one side surface 133 of the outer surface of the connecting plate 130, and further includes one side surface 113 of the first substrate 110 (a surface extending in the thickness direction of the first substrate 110) and one side surface 123 of the second substrate 120 (a surface extending in the thickness direction of the second substrate 120). The bottom surface 102 of the housing has a groove 102a and a plane 102b separating the groove 102a, the side surface 113 has a groove 113a and a plane 113b, the side surface 123 has a groove 123a and a plane 123b, the side surface 133 has a groove 133a and a plane 133b, and after the first substrate 110, the second substrate 120 and the connecting plate 130 are combined, the groove 113a, the groove 123a and the groove 133a together form the groove 102a. The shape of the groove 102a may be configured as an arc-shaped groove, a square groove, a trapezoid groove, a triangular groove, or the like, as desired. After the packaging structure is fixed on the bearing platform 900, the protrusions 901 of the bearing platform are clamped with the grooves 102a of the bottom surface 102 of the shell, so that the stability of the product after being fixed is improved. In some other embodiments, the first substrate 110 and the connection plate 130 are integrally formed, such as a cover-like structure formed by integrally forming the first substrate 110 and the connection plate 130 in a preformed manner. In still other embodiments, the second substrate 120 is integrally formed with the connection plate 130, such as by forming the second substrate 120 and the connection plate 130 as a cavity-like structure integrally formed with each other in a preformed manner.
The structure of the MEMS microphone according to the first embodiment of the present invention will be described in detail with reference to fig. 5, 6a, 6b, and 7.
The MEMS microphone of the first embodiment of the present invention includes: a package structure, a microelectromechanical structure 200, a signal processing chip 300, and a plurality of discrete devices 400. The packaging structure comprises: the housing, the through-hole 140, the at least one electrode 150, and the at least one conductive structure. The description of the package structure with reference to fig. 1a and 1b, fig. 2a and 2b, and fig. 3 will not be repeated here.
In the present embodiment, each electrode 150 is disposed on the bottom surface 102 of the housing, and the number of the electrodes 150 is 3, wherein two electrodes 150 are used as conventional electrodes for extracting electrical signals of the MEMS microphone, such as an output signal and a ground signal. The other electrode 150 serves as a back-up electrode for extracting the electrical signal of the MEMS microphone instead of the conventional electrode, as needed. However, the present embodiment is not limited thereto, and those skilled in the art may make other settings for the number of electrodes 150 and the corresponding electrical signal functions as needed.
In some specific embodiments, the electrode 150 comprises a plating layer formed on the bottom surface 102 of the housing using a plating process. Each electrode 150 covers the surface of the corresponding recess 102a, adjacent electrodes 150 being separated by a plane 102 b. The electrode 150 may be located only at the side 133 of the connection plate, or only at the side 113 of the first substrate 110, or only at the side 123 of the second substrate 120, and the electrode 150 may be located at any combination of the side 133 of the connection plate 130, the side 113 of the first substrate 110, and the side 123 of the second substrate 120.
In the present embodiment, the inner surface 111 of the first substrate 110 has the conductive region 160, and the microelectromechanical structure 200, the signal processing chip 300, and the discrete device 400 are all fixed on the inner surface 111 of the first substrate 110. The discrete device 400 is, for example, a capacitor, a resistor, an inductor, etc., and the microelectromechanical structure 200 is electrically connected to the signal processing chip 300 through the lead 301, and the signal processing chip 300 and the discrete device 400 are respectively electrically connected to the corresponding conductive area 160. In some preferred embodiments, after the signal processing chip 300 is electrically connected to the conductive region 160 of the first substrate 110, a protective layer 10 is further disposed on the signal processing chip 300, where a material of the protective layer 10, such as glue, may further firmly fix the signal processing chip 300 on the first substrate 110 while protecting the signal processing chip 300.
However, the embodiment of the present invention is not limited thereto, and one skilled in the art may also partially dispose the conductive region 160 on the inner surface 121 of the second substrate 120 and flexibly dispose the signal processing chip 300 and the discrete device 400 on the first substrate 110 and the second substrate 120 as needed. In some other embodiments, capacitance, resistance, inductance, etc. may be integrated with the first substrate 110 and/or the second substrate 120, and thus the discrete device 400 may not be visible in the MEMS microphone.
In this embodiment, the axis of the through hole 140 is not parallel to the surface of the sensing film of the mems 200. In some specific embodiments, the axis of the through-hole 140 is perpendicular to the surface of the sensing film, and in the case of mounting (soldering) the MEMS microphone on the carrier structure 900 such as an external printed circuit board or an external flexible circuit board using the electrode 150, the axis of the through-hole 140 can be parallel to the external printed circuit board or the external flexible circuit board. However, embodiments of the present invention are not limited thereto, and those skilled in the art may make other arrangements where the axis of the through-hole 140 is at an angle to the surface of the sensing film, as desired. Further, the sensing membrane may be a sensing membrane of a microphone chip, a bone conduction chip, or a sensing membrane of a pressure sensor chip.
In this embodiment, the conductive structure includes a conductive wire 172 disposed on the outer surface 112 of the first substrate 110, and the conductive wire 172 is electrically connected to the conductive region 160 on the inner surface of the first substrate 110 through a conductive hole penetrating the first substrate 110.
The conductive structure further includes electrical conductors 171 located on the inner surface 111 of the first substrate 110, the inner surface 121 and the outer surface 122 of the second substrate 120, and also located on two surfaces 132 of the connection substrate 130 opposite the first substrate 110 and the second substrate 120, respectively, each electrical conductor 171 being in contact with the electrode 150. After the first substrate 110 is fixedly connected to the connection board 130, the conductors 171 on the first substrate 110 and the connection board 130 are correspondingly connected to each other. After the second substrate 120 is fixedly connected to the connection board 130, the conductors 171 on the second substrate 120 and the connection board 130 are correspondingly connected to each other.
In this embodiment, the package structure further includes an electromagnetic shielding layer 180 located on the inner surface 131 of the connection board 130 and extending to two surfaces 132 opposite to the first substrate 110 and the second substrate 120, respectively. The first substrate 110 also has an annular conductor 180a on an inner surface thereof, the annular conductor 180a being in contact with the electromagnetic shielding layer 180 when the first substrate 110 is fixed to the connection plate 130. The corresponding second substrate 120 also has an annular conductor 180a on the inner surface 121, the annular conductor 180a being in contact with the electromagnetic shield 180 when the second substrate 120 is secured to the connection plate 130. In the case where the electromagnetic shielding layer 180 is provided, since the electromagnetic shielding layer 180 has a certain thickness, a gap exists between the first substrate 110 and the second substrate 120 to the surface 132 of the connection plate after the ring-shaped conductor 180a is connected to the electromagnetic shielding layer 180, and thus it is necessary to join between the substrates using the conductor 171 having a predetermined thickness. Of course, in some environments where the MEMS microphone is insensitive to electromagnetic interference, the electromagnetic shielding layer 180 and the annular conductor 180a may not be provided, and accordingly, the conductor 171 may be omitted.
The structure of the MEMS microphone according to the second embodiment of the present invention will be described with reference to fig. 8a, 8b and 9.
The MEMS microphone of the second embodiment of the present invention includes: a package structure, a microelectromechanical structure 200, a signal processing chip 300, and a plurality of discrete devices 400. The packaging structure comprises: the housing, the through-hole 140, the at least one electrode 150, and the at least one conductive structure. The MEMS microphone structure of the second embodiment of the present invention is substantially identical to that of the first embodiment, and will not be described herein. The difference from the first embodiment is that the mems 200 of the present embodiment is located on the inner surface 121 of the second substrate 120, the through hole 140 penetrating through the second substrate 120 is in communication with the back cavity of the mems 120, the inner surface 121 of the second substrate 120 is further provided with a conductive region 160, and the signal processing chip 300 and the discrete device 400 are also located on the inner surface 121 of the second substrate 120 and are electrically connected with the corresponding conductive region 160.
In the present embodiment, the electrical conductor 171 is located on the inner surface 111 and the outer surface 112 of the first substrate 110, the inner surface 121 of the second substrate 120, and also on the two surfaces 132 of the connection substrate 130 opposite to the first substrate 110 and the second substrate 120, respectively. The conductive wires 172 are disposed on the outer surface 122 of the second substrate 120, and the conductive wires 172 are electrically connected to the conductive areas 160 of the inner surface of the second substrate 120 through conductive holes penetrating the second substrate 120.
However, the arrangement of the conductive structure is not limited to the above two embodiments, and the conductive structure may be attached to the housing, and those skilled in the art may perform other arrangements on the configuration of the conductive structure as required, for example, the conductive structure includes at least one or a combination of the following components: wires provided on the inner surface 111 of the first substrate 110, wires provided on the inside (sandwich structure or the like) of the first substrate 110, wires provided on the outer surface 112 of the first substrate 110, wires provided on the inner surface 121 of the second substrate 120, wires provided on the inside of the second substrate 120, wires provided on the outer surface 122 of the second substrate 120, wires provided on the inner surface 131 of the connection board 130, wires provided on the inside of the connection board 130. More preferably, the conductive structure is attached to only the surfaces of the first substrate 110, the second substrate 120, and the connection plate 130.
According to the MEMS microphone and the packaging structure thereof provided by the embodiment of the invention, the shell of the packaging structure is formed by the first substrate, the second substrate and the connecting plate, the first substrate and the second substrate respectively extend along the top surface of the shell towards the direction of the bottom surface provided with the electrode, the arrangement position and the number of the through holes are not limited, the through holes can be arranged on any surface, one or more through holes can be arranged on at least one surface, and when the through holes are arranged on at least one surface of four surfaces adjacent to the surface where the electrode is arranged, after the packaging structure of the MEMS microphone is fixed by the electrode, the side sound inlet function of the MEMS microphone can be realized by utilizing the positions of the electrode and the through holes on the shell. Further, when the through-hole axis is set to be perpendicular to the surface of the sensing film, the sensitivity can be improved. In addition, the bone conduction chip may or may not be provided with a through hole.
The conductive structure is electrically connected with the electrode on the bottom surface of the shell and the conductive area on the inner surface of the cavity through the first substrate, the second substrate and the connecting plate of the shell, and the conductive structure, the conductive area and the electrode are attached to the shell, so that the complexity of the packaging structure is reduced, the production efficiency of a product is improved, the assembly of the product is facilitated, and the miniaturization of the product is facilitated.
The conductive structure provides various conductive paths between the conductive regions and the electrodes, so that the microelectromechanical structure, the signal processing chip, and the discrete devices in the MEMS microphone can be flexibly arranged on the first substrate and the second substrate.
The axis of the through hole of the packaging structure is not parallel to the surface of the induction film of the micro-electromechanical structure, and under the condition that the side sound inlet function of the MEMS microphone is realized, sound signals can more effectively act on the induction film of the micro-electromechanical structure, so that the sound receiving performance of the MEMS microphone is ensured.
By providing the electrode as a plating layer, the electrode can be more stably attached to the outer surface of the case.
Through set up the recess in the bottom surface of casing, and place every electrode on the surface of recess, increased the area of electrode in limited space, reduced the contact resistance of electrode and external circuit, after being connected through electrode and external circuit electricity, this recess can match with the arch of junction surface, more is favorable to increasing the stability of MEMS microphone.
Through setting up the through-hole on first base plate or second base plate, and the area of first base plate and second base plate is great, and first base plate and second base plate are all integrated into one piece structure, have reduced the offered degree of difficulty of through-hole, make the setting of through-hole position more nimble simultaneously.
The first substrate and the connecting plate are arranged into an integral structure, or the second substrate and the connecting plate are arranged into an integral structure, so that the packaging process steps are further reduced, and the packaging efficiency is improved.
By arranging the signal processing chip on one of the first substrate and the second substrate and arranging the micro-electromechanical structure on the other of the first substrate and the second substrate, the area of the first substrate and the second substrate is fully utilized, and the packaging volume is further reduced.
In the above description, technical details of patterning, etching, and the like of each layer are not described in detail. Those skilled in the art will appreciate that layers, regions, etc. of the desired shape may be formed by a variety of techniques. In addition, to form the same structure, those skilled in the art can also devise methods that are not exactly the same as those described above. In addition, although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination.
The embodiments of the present invention are described above. These examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be made by those skilled in the art without departing from the scope of the invention, and such alternatives and modifications are intended to fall within the scope of the invention.
Claims (13)
1. A packaging structure of a MEMS sensor, comprising:
The device comprises a shell, a first substrate, a second substrate and a connecting plate for connecting the first substrate and the second substrate, wherein a cavity is formed on the inner surface of the first substrate, the inner surface of the second substrate and the inner surface of the connecting plate, the first substrate and the second substrate respectively extend along the top surface of the shell towards the bottom surface of the shell, and the inner surface of the first substrate and/or the inner surface of the second substrate are/is provided with a conductive area;
At least one electrode positioned outside the cavity and arranged on the bottom surface of the shell, wherein the bottom surface of the shell at least comprises one outer surface of the connecting plate; and
At least one conductive structure for electrically connecting the electrodes to the respective conductive areas via the first substrate and/or the second substrate, respectively,
Wherein the conductive structure comprises at least one or a combination of the following components:
Wires arranged on the inner surface of the first substrate, wires arranged inside the first substrate, wires arranged on the outer surface of the first substrate, wires arranged on the inner surface of the second substrate, wires arranged inside the second substrate, wires arranged on the outer surface of the second substrate,
The bottom surface of the shell also comprises a surface of the first substrate and/or the second substrate along the thickness direction.
2. The package structure of claim 1, wherein the conductive structure further comprises one or a combination of the following:
The inner surface of the connecting plate is provided with leads, the inside of the connecting plate is provided with leads, the surface of the connecting plate opposite to the first substrate is provided with conductors, and the surface of the connecting plate opposite to the second substrate is provided with conductors.
3. The package structure according to claim 1 or 2, wherein the electrode includes a plating layer.
4. The package structure according to claim 1 or 2, wherein a bottom surface of the case has a plane and a groove, each of the electrodes covers a surface of the groove and adjacent electrodes are separated by the plane.
5. The package structure according to claim 1 or 2, further comprising an electromagnetic shielding layer at least partially located on an inner surface of the connection board, and fixedly connected to the first substrate and the second substrate.
6. The package structure according to claim 1 or 2, wherein the first substrate is of unitary structure with the connection board, or the second substrate is of unitary structure with the connection board.
7. The packaging structure according to claim 1 or 2, wherein at least one through hole is provided on the housing.
8. A MEMS sensor, comprising:
The package structure of any one of claims 1-7; and
The micro-electromechanical structure and the signal processing chip are electrically connected, and the micro-electromechanical structure and the signal processing chip are both positioned in the cavity.
9. The MEMS sensor of claim 8, wherein the microelectromechanical structure comprises at least one of a microphone chip, a pressure sensor chip, and a bone conduction chip.
10. The MEMS sensor of claim 9, wherein the housing is provided with at least one through hole.
11. The MEMS sensor of claim 10, wherein one of the first substrate and the second substrate is configured to carry the microelectromechanical structure, and wherein an axis of the via is non-parallel to a surface of the sensing film of the microelectromechanical structure.
12. The MEMS sensor of claim 11, wherein the axis is perpendicular to a surface of the sensing membrane.
13. The MEMS sensor of any of claims 8-12, wherein the signal processing chip and the microelectromechanical structure are both located on the first substrate or the second substrate;
Or the signal processing chip is positioned on one of the first substrate and the second substrate, and the micro-electromechanical structure is positioned on the other of the first substrate and the second substrate.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026902A (en) * | 2007-03-28 | 2007-08-29 | 梅嘉欣 | Microelectromechanical acoustical sensor package structure |
| CN109850839A (en) * | 2019-04-01 | 2019-06-07 | 武汉耐普登科技有限公司 | Micro-electro-mechanical sensors encapsulating structure and manufacturing method |
| CN212393002U (en) * | 2020-06-19 | 2021-01-22 | 无锡韦尔半导体有限公司 | Micro-electromechanical sensor connecting structure |
| CN214570728U (en) * | 2021-02-19 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | MEMS sensor and packaging structure thereof |
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| TWM543239U (en) * | 2017-01-26 | 2017-06-11 | 日月光半導體製造股份有限公司 | MEMS package structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026902A (en) * | 2007-03-28 | 2007-08-29 | 梅嘉欣 | Microelectromechanical acoustical sensor package structure |
| CN109850839A (en) * | 2019-04-01 | 2019-06-07 | 武汉耐普登科技有限公司 | Micro-electro-mechanical sensors encapsulating structure and manufacturing method |
| CN212393002U (en) * | 2020-06-19 | 2021-01-22 | 无锡韦尔半导体有限公司 | Micro-electromechanical sensor connecting structure |
| CN214570728U (en) * | 2021-02-19 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | MEMS sensor and packaging structure thereof |
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