CN113000487B - Tubular cleaning equipment and photovoltaic coating system - Google Patents
Tubular cleaning equipment and photovoltaic coating system Download PDFInfo
- Publication number
- CN113000487B CN113000487B CN202110205996.XA CN202110205996A CN113000487B CN 113000487 B CN113000487 B CN 113000487B CN 202110205996 A CN202110205996 A CN 202110205996A CN 113000487 B CN113000487 B CN 113000487B
- Authority
- CN
- China
- Prior art keywords
- cleaning
- gas
- carrier
- cylindrical cavity
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 204
- 239000011248 coating agent Substances 0.000 title claims abstract description 29
- 238000000576 coating method Methods 0.000 title claims abstract description 29
- 238000002347 injection Methods 0.000 claims abstract description 13
- 239000007924 injection Substances 0.000 claims abstract description 13
- 230000008021 deposition Effects 0.000 claims description 54
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 107
- 238000000151 deposition Methods 0.000 description 49
- 238000010926 purge Methods 0.000 description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 23
- 229910002804 graphite Inorganic materials 0.000 description 23
- 239000010439 graphite Substances 0.000 description 23
- 230000009286 beneficial effect Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- 239000007787 solid Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005086 pumping Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910020323 ClF3 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a tubular cleaning device which comprises a cylindrical cavity and a cleaning air supply part arranged in the cylindrical cavity. In the tubular cleaning device, one part of the plurality of air outlets included in the cleaning air supply part is arranged towards the same component of the cylindrical cavity so as to enable the supplied cleaning air to form a main injection track, and the other part of the plurality of air outlets is arranged towards the main injection track, so that the cleaning air sprayed from different air outlets can form turbulent flow, the concentration of the cleaning air at different parts in the cylindrical cavity, particularly at parts far away from the plurality of air outlets, can be enhanced and disturbed, and the remixing of the cleaning air in the cylindrical cavity and the contact area of a device to be cleaned and the cleaning air can be improved so as to improve the cleaning efficiency. The invention also provides a photovoltaic coating system comprising the tubular cleaning equipment.
Description
Technical Field
The invention relates to the technical field of solar cell manufacturing, in particular to tubular cleaning equipment and a photovoltaic coating system.
Background
In the solar cell manufacturing process, an antireflection film is formed on the surface of crystalline silicon by using a Plasma Enhanced Chemical Vapor Deposition (PECVD) method, so that the light energy utilization rate can be improved by reducing the light reflectivity, and meanwhile, the antireflection film can also play a passivation effect and provide long-term protection for the cell, thereby being beneficial to the improvement of the photoelectric conversion efficiency. Therefore, the high-quality silicon nitride film plays a crucial role in improving the performance and quality of the crystalline silicon solar cell.
In the prior art, a graphite boat capable of holding tens or even hundreds of silicon wafers is generally fed into a quartz tube, and PECVD deposition is performed by exciting plasma in the quartz tube. Because most surfaces of the graphite boat are also exposed in a reaction environment, the deposition of the antireflection film is carried out on the surfaces of the silicon wafers and the exposed surfaces of the graphite boat, and the deposition layers on the surfaces of the graphite boat easily pollute the surfaces of the silicon wafers. Therefore, the graphite boat needs to be periodically maintained.
In the prior art, chemical methods are generally adopted to clean and maintain devices related to the PECVD process. For example, chinese patent application publication No. CN105742159A discloses a method for removing surface contamination of photovoltaic related devices, such as graphite boats and quartz tubes, by mixing acid and pure water. However, this cleaning method is off-line cleaning, and needs to soak the quartz tube or graphite boat in acid solution or water, which involves remote transportation, the process of disassembling and assembling the quartz tube, and complicated cleaning processes, and is not favorable for improving the production efficiency.
Therefore, there is a need to develop a new tubular cleaning apparatus to solve the above problems of the prior art.
Disclosure of Invention
The invention aims to provide tubular cleaning equipment and photovoltaic coating equipment comprising the same, so that devices entering the tubular cleaning equipment can be cleaned on line, and the cleaning efficiency can be improved.
In order to achieve the above object, the tubular cleaning apparatus of the present invention includes a cylindrical chamber provided with a cleaning gas supply portion to supply a cleaning gas into the cylindrical chamber; the cleaning air supply part comprises a plurality of air outlets, one part of the air outlets are arranged towards the same component of the cylindrical cavity so as to enable the supplied cleaning air to form a main injection track, and the other part of the air outlets are arranged towards the main injection track.
The tubular cleaning equipment has the beneficial effects that: the cylindrical cavity is provided with a cleaning gas supply part so as to perform online cleaning on devices entering the tubular cleaning equipment; one part of the plurality of gas outlets included in the cleaning gas supply part faces the same component of the cylindrical cavity so that the provided cleaning gas forms a main injection track, the other part of the cleaning gas supply part faces the main injection track, so that the cleaning gas injected from different gas outlets can form turbulent flow, particularly the concentration of the cleaning gas far away from the plurality of gas outlets can play a role in enhancing and disturbing, the cleaning gas can be remixed in the cylindrical cavity, and the contact area between a device to be cleaned and the cleaning gas can be increased so as to improve the cleaning efficiency.
Preferably, the plurality of air outlets comprise a main air outlet and a secondary air outlet; the main air outlet is arranged on a first side in the cylindrical cavity so that air provided by the main air outlet is injected towards a second side opposite to the first side in the cylindrical cavity and forms a main injection track; the slave air outlet is disposed toward the main injection trajectory. The beneficial effects are that: the device is beneficial to forming turbulent flow, realizing remixing of cleaning gas in the cylindrical cavity and improving the contact area of the device to be cleaned and the cleaning gas to improve the cleaning efficiency.
Further preferably, the cylindrical cavity is formed by two opposite cavity doors and a cylindrical side wall located between the two cavity doors in an enclosing manner, the main air outlet faces any one of the two cavity doors, and the secondary air outlet faces the cylindrical side wall. The beneficial effects are that: the device is beneficial to forming turbulent flow, realizing remixing of cleaning gas in the cylindrical cavity and improving the contact area of the device to be cleaned and the cleaning gas to improve the cleaning efficiency.
Further preferably, the number of the secondary air outlets is at least 1, and the secondary air outlets are arranged at intervals along the axial direction or the circumferential direction of the cylindrical cavity. The beneficial effects are that: is beneficial to strengthening the cleaning effect.
Preferably, a carrier fixing part is arranged in the cylindrical cavity to detachably and fixedly connect a carrier comprising a plurality of carrier plates, and the main air outlet and the auxiliary air outlet are both arranged towards the grooved surface of the carrier. The beneficial effects are that: the carrier to be cleaned can be cleaned conveniently.
Further preferably, the cleaning air supply portion further includes a secondary cleaning pipe extending from any one of the two chamber doors to the cylindrical chamber, the secondary cleaning pipe is provided with the secondary air outlet, and the secondary cleaning pipe is provided along at least one of an axial direction and a circumferential direction of the cylindrical chamber. The beneficial effects are that: is beneficial to strengthening the cleaning effect.
Further preferably, the vertical distance from the air outlet to the inner side wall of the cylindrical cavity is not less than 25% of the inner diameter of the cylindrical cavity.
Further preferably, the vertical distance from the air outlet to either of the two chamber doors is not less than 25% of the length of the cylindrical chamber.
Further preferably, the cleaning air supply part further comprises a main cleaning pipeline, the main air outlet is arranged on the main cleaning pipeline, and the main cleaning pipeline penetrates through any one of the two cavity doors to extend along the axial direction of the cylindrical cavity.
Preferably, the device further comprises a heating device arranged on the cylindrical side wall to control the temperature in the cylindrical cavity.
Further preferably, the vacuum device is arranged on a different cavity door from the main air outlet so as to control the pressure in the cylindrical cavity.
Further preferably, the plasma processing device further comprises a centralized plasma generating device arranged on the same cavity door with the main air outlet.
Further preferably, the deposition gas supply system further comprises a deposition gas pipeline arranged on the same chamber door as the main gas outlet so as to supply deposition gas.
Further preferably, the plasma generating device in the carrier is arranged opposite to the concentrated plasma generating device, so that the plasma of the gas in the carrier is excited.
Preferably, the device further comprises a transmission device for driving the carrier to enter and exit the cylindrical cavity.
Preferably, the cleaning gas supply part further comprises a gas supply control part, and the gas supply control part is right for independently controlling the plurality of gas outlets or for cooperatively controlling at least part of the gas outlets in the plurality of gas outlets so as to adjust the flow and the gas supply time of the gas sprayed from different gas outlets.
The photovoltaic coating system comprises a coating deposition cavity and the tubular cleaning equipment. The beneficial effects are that: because the cylindric cavity is provided with the washing air feed portion in order to get into device in the tubular cleaning equipment carries out online cleaning, just the orientation of a plurality of gas outlets that the washing air feed portion includes is not the same, is favorable to forming the vortex and realizing each other through the purge gas who sprays from different gas outlets different positions in the cylindric cavity are especially kept away from the purge gas concentration at a plurality of gas outlets position is strengthened to realize the remixing of purge gas in the cylindric cavity and improve and treat that the contact area of cleaning device and purge gas improves cleaning efficiency.
Preferably, the photovoltaic coating system further comprises a carrier, the tubular cleaning device comprises a carrier fixing part and a deposition air outlet, when the carrier is detachably and fixedly connected to the carrier fixing part, the deposition air outlet and the vertical distance between the air outlets and the outer surface of the carrier are not less than 5 cm.
Drawings
FIG. 1 is a schematic view of an assembly structure of a tubular cleaning apparatus and a carrier according to an embodiment of the present invention;
FIG. 2 is a schematic view of the first door of FIG. 1 and an assembled configuration with components disposed on the first door;
FIG. 3 is a schematic view of a cylindrical chamber according to some embodiments of the present invention in use;
FIG. 4 is a schematic diagram of a slave purge line according to an embodiment of the present invention;
FIG. 5 is a schematic view of an assembled structure of a carrier and a partial slave cleaning line according to some embodiments of the present invention;
fig. 6 is a schematic structural view of a photovoltaic coating system according to some embodiments of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In the prior art, in the process of forming a coated substrate by a deposition process through a tubular PECVD device, as the substrate is loaded on a graphite boat, a deposition reaction is inevitably generated on the surface of the graphite boat while a dielectric film is deposited on the substrate. Considering that the cleaning degree of the surface of the graphite boat has great influence on the performance of the coated substrate, the graphite boat needs to be cleaned regularly.
Considering the influence of the disassembly and assembly of the graphite boat on the productivity and the energy consumption in the cleaning process, the cleaning and maintenance of the graphite boat generally can carry out cleaning treatment on the graphite boat when the surface pollution reaches a certain degree and the product quality is seriously influenced with great risk. Generally, taking the process of forming an antireflection film of 80-120 nm for each deposition reaction as an example, the graphite boat needs to be cleaned and maintained after the deposition times reach 55-80 times.
In the prior art, the graphite boat is usually required to be disassembled into a plurality of graphite plates, threaded connecting rods and other small parts for connection or reinforcement in cleaning and maintenance of the graphite boat, all the parts formed by disassembly are classified according to material types and are placed into different bearing vessels, and cleaning treatment is performed through different cleaning liquids. Taking graphite plates as an example, it is usually necessary to soak the carrier vessel and the graphite plates contained therein with an acid solution, such as a 20% hydrofluoric acid aqueous solution. Acid liquor has strong corrosivity, and a cleaning pool containing the acid liquor needs to be arranged far away from a cell production area.
In order to completely remove the pollution, the soaking time of the cleaning treatment in the prior art is usually not less than 6 hours; after the surface contamination is removed, the graphite plate is rinsed with pure water for a plurality of times until the hydrofluoric acid residue on the surface of the graphite plate is detected to be in accordance with the specification, and the time is usually not less than 4 hours. After the cleaning treatment of all parts is finished, low-temperature drying is carried out for about 12 hours, and then the parts are assembled again and the saturated plating boat is carried out, so that the parts can be used again; the large amount of acidic waste liquid generated from soaking and rinsing cannot be directly discharged, and must be recycled to prevent environmental pollution.
It can be seen that the negative impact of prior art cleaning and maintenance of graphite boats on productivity is significant, and the resulting energy consumption is also significant.
Moreover, the deposition process performed by the tubular PECVD apparatus requires the use of a vacuum apparatus including a vacuum pump and a pumping pipeline to maintain the pressure of the tubular deposition chamber, dust and some reactants generated by the deposition process can enter the pumping pipeline, and dust accumulation can occur if the cleaning is not performed for a long time, thereby causing the operation failure or even the damage of the vacuum pump.
Filters are commonly provided in the pumping circuit to intercept the accumulated dust, and such filters are generally cleaned every 1-2 months, plus replacement time, which is at least 2 hours down time for the corresponding tubular deposition chamber.
Aiming at the problems in the prior art, the embodiment of the invention provides a tubular cleaning device and a photovoltaic coating device comprising the tubular cleaning device, so as to perform online cleaning on devices entering the tubular cleaning device and be beneficial to improving the cleaning efficiency.
Fig. 1 is a schematic view of an assembly structure of a tubular cleaning apparatus and a carrier according to an embodiment of the present invention.
The tubular cleaning device comprises a cylindrical cavity. Specifically, referring to fig. 1, the cylindrical chamber 11 of the tubular cleaning apparatus 1 is enclosed by a first chamber door 111 and a second chamber door 112, which are opposite to each other, and a cylindrical sidewall 110 located between the first chamber door 111 and the second chamber door 112.
The cylindrical cavity is provided with a purge gas supply to supply purge gas into the cylindrical cavity. The cleaning air supply part comprises a main cleaning pipeline, a secondary cleaning pipeline and an air supply control part. Referring to fig. 1, one end of the main cleaning pipeline 122 penetrates the first chamber door 111 to extend along the axial direction of the cylindrical chamber 11, and the other end is connected to the air supply control unit 120.
Specifically, the axial direction of the cylindrical chamber 11 refers to a direction in which a central axis of the cylindrical chamber 11, which passes through the first and second gates 111 and 112, extends toward one of the two gates, which is opposite to the gate through which the main cleaning pipe 122 passes.
In some embodiments of the present invention, the main air outlet is disposed in the main cleaning pipeline 122 and located in the cylindrical cavity 11.
The secondary cleaning pipeline extends along the axial direction of the cylindrical cavity and is provided with a secondary air outlet positioned in the cylindrical cavity. Referring to fig. 1, the air supply control unit 120 is connected to one end of a purge line 121, extends in the axial direction of the cylindrical chamber 11, and has a plurality of branch lines (not shown) that communicate with each other. Each branch line (not shown) is provided with a slave air outlet, and one end thereof penetrates the cylindrical side wall 110 so that the slave air outlet is provided toward the cylindrical side wall 110.
The main air outlet is arranged on a first side in the cylindrical cavity so that air provided from the main air outlet is sprayed towards a second side opposite to the first side in the cylindrical cavity and forms a main spraying track. The secondary gas outlet is arranged on the branch pipeline, and the secondary gas outlet faces the main injection track to form turbulent flow and realize the enhancement of the concentration of the cleaning gas at different parts in the cylindrical cavity, particularly at the parts far away from the gas outlets, so that the remixing of the cleaning gas in the cylindrical cavity is realized, and the contact area of a device to be cleaned and the cleaning gas is increased to improve the cleaning efficiency. Referring to fig. 1, a first side of the cylindrical chamber 11 refers to a side of the cylindrical chamber 11 adjacent to the first door 111, and a second side opposite to the first side refers to a side of the cylindrical chamber 11 adjacent to the second door 112.
In some embodiments of the present invention, the air supply control part is composed of an air bottle and a control valve for controlling output of the air bottle, and the specific implementation form is a conventional technical means of those skilled in the art.
In some embodiments of the present invention, the air supply control part independently controls the plurality of air outlets or cooperatively controls at least some of the plurality of air outlets to adjust the flow rate and the air supply time of the gas ejected from different air outlets. The plurality of air outlets comprise at least one of a plurality of main air outlets and a plurality of auxiliary air outlets.
In some embodiments of the present invention, the orientations of the plurality of gas outlets included in the cleaning gas supply portion are not completely the same, which is beneficial to forming turbulent flow among the cleaning gases ejected from different gas outlets and realizing the enhancement of the concentration of the cleaning gas at different positions in the cylindrical cavity, especially at positions far away from the plurality of gas outlets, thereby realizing the remixing of the cleaning gas in the cylindrical cavity and improving the contact area between the device to be cleaned and the cleaning gas to improve the cleaning efficiency.
Referring to fig. 1, the pipe-type cleaning apparatus 1 further includes a deposition gas line 131 and a deposition gas supply part 130 connected to the deposition gas line 131 to supply a deposition gas into the cylindrical chamber 11. The deposition gas line 131, the main purge line 122, and the sub purge line 121 are disposed at the same chamber door.
In some embodiments of the present invention, at least one of the deposition gas line 131, the main purge line 122, and the sub purge line 121 is disposed at the cylindrical sidewall 110.
In some embodiments of the present invention, at least one of the deposition gas line 131, the main purge line 122, and the sub purge line 121 is introduced into the cylindrical chamber 11 from a flange seal between the cylindrical sidewall 110 and one of the two doors.
In some embodiments of the present invention, the tubular cleaning apparatus 1 further comprises a heating device disposed on the cylindrical sidewall 110 to control the temperature inside the cylindrical cavity.
In some embodiments of the present invention, referring to fig. 1, the tubular cleaning apparatus 1 further includes a transmission device 160 for driving a carrier 161 to be cleaned to enter and exit the cylindrical cavity 11 along the direction of the arrow shown in fig. 1.
Fig. 2 is a schematic view of the first door shown in fig. 1 and an assembly structure between the first door and a member disposed on the first door.
The tubular cleaning equipment also comprises a centralized plasma generating device which is arranged at the same cavity door with the main cleaning pipeline. Referring to fig. 1 and 2, the concentrated plasma generating apparatus is composed of a concentrated plasma power source 210, a first collecting electrode 211, a second collecting electrode 212, a conductive line (not shown) connecting the concentrated plasma power source 210 and the first collecting electrode 211, and a conductive line (not shown) connecting the concentrated plasma power source 210 and the second collecting electrode 212, and is disposed at the first chamber door 111.
Specifically, the first collecting electrode 211 and the second collecting electrode 212 are disposed in the cylindrical chamber 11 and adjacent to the deposition gas line 131 and the main cleaning line 122, respectively.
In some embodiments of the present invention, the vertical distance between the first collecting electrode 211 and the deposition gas line 131 and the main cleaning line 122 is 1 mm-100 cm. The vertical distance here refers to the linear distance of the two components in the direction of the plane in which the inner end face of the first door 111 lies.
In some embodiments of the present invention, a vertical distance between the first collecting electrode 211 and the deposition gas line 131 and the main purge line 122 is not more than at least one of 20 cm, 40 cm, 60 cm, and 80 cm.
In some embodiments of the present invention, the vertical distance between the second concentration electrode 212 and the deposition gas line 131 and the main purge line 122 is 1 mm-100 cm. The vertical distance here refers to the linear distance of the two components in the direction of the plane in which the inner end face of the first door 111 lies.
In some embodiments of the present invention, a vertical distance between the second concentration electrode 212 and the deposition gas line 131 and the main purge line 122 is not more than at least one of 20 cm, 40 cm, 60 cm, and 80 cm.
FIG. 3 is a schematic view of a cylindrical chamber according to some embodiments of the present invention in use.
The purge gas supply portion further includes a slave purge line extending from either of the two chamber doors into the cylindrical chamber. Referring to fig. 3, a secondary cleaning pipe line extending from one end of a cleaning pipe line 121, which is disposed in the cylindrical chamber 11 from the outlet port, penetrates the cylindrical chamber 11 from the first chamber door 111 and extends near the inner sidewall in the axial direction of the cylindrical chamber 11.
In some embodiments of the present invention, the number of the secondary air outlets is at least 1, and the secondary air outlets are spaced along the axial direction of the cylindrical cavity and are arranged toward the carrier 310 shown in fig. 3.
Specifically, the vertical distance from the air outlet to the inner side wall of the cylindrical cavity is not less than 25% of the inner diameter of the cylindrical cavity, so that a good spraying effect is ensured.
Specifically, the vertical distance from the air outlet to any one of the two cavity doors is not less than 25% of the length of the cylindrical cavity.
Further, a carrier fixing portion (not shown) for detachably and fixedly connecting a carrier 310 including a plurality of carrier plates is disposed in the cylindrical cavity 11, so that a main air outlet of the main cleaning pipeline 122 and a secondary air outlet of the secondary cleaning pipeline 121 are both arranged toward the carrier 310, which is beneficial to cleaning the interior of the carrier to be cleaned.
In some embodiments of the present invention, the main outlet of the main cleaning pipeline 122 is embodied as a port located at the end of the pipeline in the cylindrical cavity 11.
Specifically, the main gas outlet, the outlet of the deposition gas pipe 131 in the cylindrical cavity 11, and the vertical distance from the auxiliary gas outlet to the adjacent surface of the carrier 310 are not less than 5 cm.
The tubular cleaning equipment also comprises a plasma generating device in the carrier and a vacuum device, wherein the plasma generating device in the carrier is arranged opposite to the concentrated plasma generating device.
Referring to fig. 1 and 3, an in-carrier plasma generating device 140, which is composed of an in-carrier plasma power source 330, a first carrier electrode 331, a second carrier electrode 332, a conducting wire (not shown) connecting the in-carrier plasma power source 330 and the first carrier electrode 331, and a conducting wire (not shown) connecting the in-carrier plasma power source 330 and the second carrier electrode 332, is disposed in the second chamber 112 opposite to the main cleaning pipe 122, so as to facilitate the excitation of the gas in the carrier into plasma.
The vacuum device 150 comprises a vacuum pump 320 and an air duct (not shown) connecting the second chamber door 112 and the vacuum pump 320, wherein the air duct (not shown) penetrates through the second chamber door 112 to communicate with the inside of the cylindrical cavity 11, so that the vacuum pump 320 controls the pressure inside the cylindrical cavity 11.
Referring to fig. 3, the first collecting electrode 211, the second collecting electrode 212, the first carrier electrode 331 and the second carrier electrode 332 share the same in-carrier plasma power source 330 to simplify the design and enhance the cleaning effect.
Referring to fig. 3, the cylindrical cavity is further provided with a rotation driver 340, one end of the rotation driver 340 is a driving motor (not shown) movably disposed on the second cavity door 112, and the other end of the rotation driver 340 is fixed to the carrier 310, so as to drive the carrier 310 to rotate around the axis along the axis direction of the carrier 310, thereby enhancing the cleaning effect on the carrier 310.
Fig. 4 is a schematic structural diagram of a slave cleaning pipeline according to an embodiment of the present invention.
In some embodiments of the present invention, the secondary air outlets are spaced apart in a circumferential direction of the cylindrical cavity.
Referring to fig. 3 and 4, the secondary cleaning pipeline shown in fig. 4 includes an axial pipeline 41 connected to each other and a plurality of circumferential pipelines 42 disposed on the axial pipeline 41, and the plurality of circumferential pipelines 42 are communicated with each other through the axial pipeline 41. Each of the circumferential pipes 42 is sleeved with the carrier 310, and each of the circumferential pipes 42 is provided with a plurality of secondary gas outlets (not shown) facing the carrier 310 and spaced apart from each other to provide a cleaning gas.
In some embodiments of the invention, the secondary cleaning line is comprised of a plurality of circumferential lines 42 suspended within the cylindrical cavity.
Fig. 5 is a schematic view of an assembly structure of a carrier and a partial slave cleaning pipeline according to some embodiments of the present invention.
In some embodiments of the present invention, the main air outlet of the main cleaning pipeline and the auxiliary air outlet of the auxiliary cleaning pipeline are both disposed toward the grooved surface of the carrier, which is beneficial to cleaning the interior of the carrier.
Referring to fig. 5, the carrier shown in fig. 5 includes a first solid surface 51 and a second solid surface 52 disposed opposite to each other, and a plurality of carrier plates 53 disposed between the first solid surface 51 and the second solid surface 52 and parallel to each other, so as to mount a slide 54. The first solid surface 51 and the second solid surface 52 are both solid surfaces, and the cleaning gas injected to either one of the first solid surface 51 and the second solid surface 52 cannot penetrate through the first solid surface 51 or the second solid surface 52 to reach the carrier shown in fig. 5.
Thus, for example, the portion of the purge line 55 is disposed toward the space between adjacent carrier plates or toward the carrier plates so that the purge gas can smoothly reach the interior of the carrier (not shown).
The photovoltaic coating system of some embodiments of the present invention comprises at least one tubular cleaning device and at least one coating deposition chamber, wherein the tubular cleaning device and the coating deposition chamber are stacked in a vertical direction.
Fig. 6 is a schematic structural view of a photovoltaic coating system according to some embodiments of the present invention.
Referring to fig. 6, in the photovoltaic coating system 6, the cylindrical cavity 11 is disposed above a plurality of coating deposition cavities 61 arranged in a stacked manner, and the cylindrical cavity 11 and each coating deposition cavity 61 are correspondingly provided with one transmission device 160; a plurality of coating deposition chambers 61 arranged in a stack share the same pumping device 62 to control the pressure in each coating deposition chamber 61. Each of the coating deposition chambers 61 is used for coating deposition of a substrate.
In some embodiments of the present invention, the cylindrical chamber 11 and the plurality of film deposition chambers 61 arranged in a stacked manner share the same pumping device 62.
In some embodiments of the present invention, the coating deposition chamber 61 is a tubular PECVD chamber.
In some embodiments of the present invention, the cylindrical chamber 11 only performs a cleaning function in the photovoltaic coating system 6. That is, after the coating deposition is completed in the coating deposition chamber 61, the carrier loaded with the substrate is carried out of the cylindrical chamber 11 by the transfer device 160, and the substrate is unloaded, and then carried into the cylindrical chamber 11 by the transfer device 160 for cleaning.
In some embodiments of the present invention, the cylindrical cavity 11 can perform not only a cleaning function but also a deposition function in the photovoltaic coating system 6. That is, after entering the cylindrical cavity 11, the carrier loaded with the substrate is subjected to film deposition, and then is transported out of the cylindrical cavity 11 by the transport device 160, and the substrate is unloaded, and then is transported into the cylindrical cavity 11 by the transport device 160 for cleaning.
The tubular cleaning equipment provided by the embodiment of the invention is used for carrying out gas phase cleaning treatment on a device to be cleaned entering the cylindrical cavity, and the gas phase cleaning treatment specifically refers to that a pollution layer is stripped from the surface of the device to be cleaned through chemical reaction between a gaseous substance and the pollution layer so as to realize a cleaning function. Compared with the cleaning treatment by using acid liquor in the prior art, the gas-phase cleaning treatment is carried out in a closed space, and polluting waste liquid cannot be generated. In addition, thorough cleaning can be achieved without disassembling and assembling the device to be cleaned.
The invention isIn some embodiments, HF and F are introduced through the main cleaning pipeline and the auxiliary cleaning pipeline simultaneously2、Cl2、ClF3Any one of the above is used as a single cleaning gas, and is matched with the temperature of 200-600 ℃ and the pressure control of 0.1-67 kilopascal to carry out gas phase cleaning treatment through chemical reaction so as to remove pollutants mainly comprising silicon oxide and silicon oxynitride.
In some embodiments of the invention, NF is simultaneously introduced through the main cleaning pipeline and the auxiliary cleaning pipeline3、SF6、CF4、CHF3And C2F6At least one of them is used as a single cleaning gas, the temperature is 300-.
In some embodiments of the present invention, the main purge line and the sub purge line are used to introduce a purge gas and a carrier gas, respectively, to perform the gas phase purge process.
The beneficial effects of the pipe cleaning apparatus according to the embodiments of the present invention will be described below by referring to fig. 1 to 5 through specific examples.
In embodiment 1 of the present invention, a carrier loaded with a substrate is fixed in the cylindrical cavity 11, when the reaction temperature and the reaction pressure in the cylindrical cavity 11 are reached, a deposition gas is introduced into the cylindrical cavity 11 through the deposition gas pipeline 131, and the main cleaning pipeline 122 and the auxiliary cleaning pipeline 121 are controlled to be in a closed state, the plasma generation device 140 in the carrier is started to control the radio frequency power, and since the plasma generation device 140 in the carrier is opposite to the deposition gas pipeline 131, the deposition gas is uniformly diffused in the cylindrical cavity 11 and then becomes a plasma, which is beneficial to uniform excitation, and uniform distribution of the plasma gas at each part in the carrier is ensured, thereby ensuring uniformity of the deposition reaction.
In embodiment 2 of the present invention, a carrier to be cleaned is fixed in the cylindrical cavity 11. Controlling the deposition gas pipeline 131 and the secondary cleaning pipeline 121 to be in a closed state, when the temperature and pressure required for plasma chemical vapor cleaning in the cylindrical cavity 11 are reached, introducing a cleaning gas into the cylindrical cavity 11 through the primary cleaning pipeline 122, and controlling the radio frequency power through the plasma generation device 140 in the carrier, thereby realizing the plasma chemical vapor cleaning in the carrier.
The difference between embodiment 3 and embodiment 2 of the present invention is that: cleaning gas is introduced through the main cleaning pipeline 122, and simultaneously the cleaning gas is injected to the main injection track formed in the process of introducing the gas to the main cleaning pipeline 122 through the auxiliary cleaning pipeline 121 in a pulse gas supply mode, so that turbulent flow is formed, remixing of the cleaning gas in the cylindrical cavity 11 is realized, and the contact area between the device to be cleaned and the cleaning gas is increased, so that the cleaning efficiency is improved.
Especially, in the case that the secondary cleaning pipeline 121 includes the plurality of circumferential pipelines 42 shown in fig. 4 or consists of the plurality of circumferential pipelines 42, since the secondary cleaning pipeline is disposed at the plurality of circumferential pipelines 42 from the air outlet and faces the adjacent carrier plate 53 of the carrier, turbulence and cleaning gas concentration disturbance can be formed at different positions in the pulse-type air supply process, thereby further enhancing the cleaning effect; in addition, the cleaning effect from the middle part to the part close to the second cavity door 112 in the carrier can be enhanced.
The difference between embodiment 4 and embodiment 3 of the present invention is that: continuously supplying a carrier gas as a shielding gas through the main purge line 122 to prevent an exhaust gas generated during the purge from entering any one of the sub purge line 121 and the deposition gas line 131 and flowing back to the outside of the cylindrical chamber 11; the cleaning gas is supplied from the cleaning pipeline 121 at different time intervals to enhance the cleaning effect on the carrier.
In example 5 of the present invention, the interior of the carrier was cleaned by the same operation as in example 2, then, after the in-carrier plasma generating device 140 is turned off, the rf power is controlled by the concentrated plasma generating device shown in fig. 2, which is composed of the concentrated plasma power source 210, the first collecting electrode 211, the second collecting electrode 212, and the conducting wires (not shown) connecting the concentrated plasma power source 210 and the first collecting electrode 211, to further clean the outer surface of the carrier and other locations or components inside the cylindrical cavity 11, such as the inner wall of the cylindrical cavity 11 and the rotary drive 340, therefore, the carrier and the inside of the cylindrical cavity 11 can be thoroughly cleaned at the same time, which is beneficial to improving the stability of the subsequent deposition reaction in the cylindrical cavity 11 and ensuring the mechanical transmission stability of the rotary drive 340.
The difference between example 6 and example 5 of the present invention is that: when the cleaning gas is introduced into the cylindrical cavity 11 through the main cleaning pipeline 122, the cleaning gas is injected to the main injection track formed in the process of introducing the cleaning gas into the main cleaning pipeline 122 through the auxiliary cleaning pipeline 121 in a pulse gas supply manner, so that turbulent flow is formed, remixing of the cleaning gas in the cylindrical cavity 11 is realized, the contact area between a device to be cleaned and the cleaning gas is increased, the cleaning efficiency is improved, and the cleaning effect is further enhanced.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (13)
1. A tubular cleaning device is characterized by comprising a cylindrical cavity, wherein the cylindrical cavity is provided with a cleaning gas supply part for supplying cleaning gas into the cylindrical cavity;
the cleaning air supply part comprises a plurality of air outlets, the plurality of air outlets comprise a main air outlet and a secondary air outlet, the main air outlet is arranged towards the same component of the cylindrical cavity so that the provided cleaning air forms a main injection track, and the secondary air outlet is arranged towards the main injection track;
the cylindrical cavity is formed by two opposite cavity doors and a cylindrical side wall positioned between the two cavity doors in an enclosing manner;
the cleaning air supply part also comprises a main cleaning pipeline which penetrates through any one of the two cavity doors and is arranged in an extending way along the axial direction of the cylindrical cavity, and the main air outlet is arranged in the main cleaning pipeline and positioned in the cylindrical cavity;
the cleaning air supply part also comprises a secondary cleaning pipeline extending from any one of the two cavity doors to the cylindrical cavity, the secondary cleaning pipeline extends along the axial direction of the cylindrical cavity and is provided with a plurality of mutually communicated branch pipelines, each branch pipeline is provided with the secondary air outlet, and one end of each branch pipeline penetrates through the cylindrical side wall so that the secondary air outlet is arranged towards the cylindrical side wall;
the number of the secondary air outlets is at least 1, and the secondary air outlets are arranged at intervals along the axial direction or the circumferential direction of the cylindrical cavity.
2. The tubular cleaning apparatus according to claim 1, wherein a carrier fixing portion is disposed in the cylindrical chamber for detachably fixing a carrier comprising a plurality of carrier plates, and the main air outlet and the auxiliary air outlet are both disposed toward the grooved surface of the carrier.
3. The pipe cleaning apparatus according to claim 1, wherein the vertical distance from the gas outlet to the inner side wall of the cylindrical chamber is not less than 25% of the inner diameter of the cylindrical chamber.
4. The pipe cleaning apparatus according to claim 1, wherein the vertical distance from the gas outlet port to either of the two chamber doors is no less than 25% of the length of the cylindrical chamber.
5. The pipe cleaning apparatus according to claim 1, further comprising a heating device disposed in the cylindrical sidewall to control a temperature within the cylindrical cavity.
6. The pipe cleaning apparatus according to claim 5, further comprising a vacuum device disposed at a different chamber door than the main air outlet to control the pressure within the cylindrical chamber.
7. The pipe cleaning apparatus according to claim 6, further comprising a concentrated plasma generating device disposed at the same chamber door as the main gas outlet.
8. The pipe cleaning apparatus according to claim 7, further comprising a deposition gas line disposed at the same chamber door as the main gas outlet to supply a deposition gas.
9. The tubular cleaning apparatus according to claim 7, further comprising an in-carrier plasma generating device disposed opposite the centralized plasma generating device to facilitate exciting a gas plasmatization in the carrier.
10. The tubular cleaning apparatus of claim 1, further comprising a transport device to move the carrier into and out of the cylindrical chamber.
11. The tubular cleaning apparatus according to claim 1, wherein the cleaning gas supply portion further comprises a gas supply control portion, and the gas supply control portion independently controls the plurality of gas outlets or cooperatively controls at least some of the plurality of gas outlets to adjust the flow rate and the gas supply time of the gas ejected from different gas outlets.
12. A photovoltaic coating system comprising a coating deposition chamber and a tubular cleaning apparatus according to any one of claims 1 to 11.
13. The photovoltaic coating system of claim 12, further comprising a carrier, wherein the tubular cleaning device comprises a carrier fixing portion and a deposition gas outlet, and when the carrier is detachably and fixedly connected to the carrier fixing portion, the deposition gas outlet and the plurality of gas outlets are not less than 5 cm from the outer surface of the carrier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110205996.XA CN113000487B (en) | 2021-02-24 | 2021-02-24 | Tubular cleaning equipment and photovoltaic coating system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110205996.XA CN113000487B (en) | 2021-02-24 | 2021-02-24 | Tubular cleaning equipment and photovoltaic coating system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113000487A CN113000487A (en) | 2021-06-22 |
CN113000487B true CN113000487B (en) | 2022-04-26 |
Family
ID=76385611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110205996.XA Active CN113000487B (en) | 2021-02-24 | 2021-02-24 | Tubular cleaning equipment and photovoltaic coating system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113000487B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116251803B (en) * | 2023-04-12 | 2023-09-22 | 东莞市晟鼎精密仪器有限公司 | Graphite boat cleaning equipment for cleaning silicon nitride coating based on microwave plasma dry method |
CN118411803B (en) * | 2024-07-01 | 2024-08-30 | 山西辉能科技有限公司 | Sulfur hexafluoride gas online leakage alarm system |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001002452A (en) * | 1999-06-18 | 2001-01-09 | Toray Ind Inc | Production of glass substrate |
CN102397859A (en) * | 2011-11-22 | 2012-04-04 | 镇江大全太阳能有限公司 | Graphite boat (frame) dry-type cleaning machine |
CN207723144U (en) * | 2017-12-08 | 2018-08-14 | 海力达汽车系统(常熟)有限公司 | High-efficiency cleaning device |
CN110468391A (en) * | 2019-09-20 | 2019-11-19 | 理想晶延半导体设备(上海)有限公司 | Tubular type depositing device |
CN110643974A (en) * | 2019-09-23 | 2020-01-03 | 苏州迈正科技有限公司 | Tray return cleaning mechanism and method for cleaning tray |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013074078A (en) * | 2011-09-28 | 2013-04-22 | Japan Pionics Co Ltd | Cleaning device and cleaning method for component of vapor deposition device |
CN102856150B (en) * | 2012-09-29 | 2015-08-26 | 中微半导体设备(上海)有限公司 | Plasm reaction cavity cleaning device and plasm reaction cavity cleaning method thereof |
CN109837526A (en) * | 2017-11-24 | 2019-06-04 | 北京北方华创微电子装备有限公司 | A kind of film deposition equipment and cleaning method |
-
2021
- 2021-02-24 CN CN202110205996.XA patent/CN113000487B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001002452A (en) * | 1999-06-18 | 2001-01-09 | Toray Ind Inc | Production of glass substrate |
CN102397859A (en) * | 2011-11-22 | 2012-04-04 | 镇江大全太阳能有限公司 | Graphite boat (frame) dry-type cleaning machine |
CN207723144U (en) * | 2017-12-08 | 2018-08-14 | 海力达汽车系统(常熟)有限公司 | High-efficiency cleaning device |
CN110468391A (en) * | 2019-09-20 | 2019-11-19 | 理想晶延半导体设备(上海)有限公司 | Tubular type depositing device |
CN110643974A (en) * | 2019-09-23 | 2020-01-03 | 苏州迈正科技有限公司 | Tray return cleaning mechanism and method for cleaning tray |
Also Published As
Publication number | Publication date |
---|---|
CN113000487A (en) | 2021-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113000487B (en) | Tubular cleaning equipment and photovoltaic coating system | |
US11710623B2 (en) | Vacuum pump protection against deposition byproduct buildup | |
CN100353488C (en) | Method for producing semiconductor device and cleaning device for resist stripping | |
US9418831B2 (en) | Method for precision cleaning and drying flat objects | |
CN110468391B (en) | Tubular deposition apparatus | |
US20110124144A1 (en) | Substrate processing system and substrate processing method | |
CN110643974B (en) | Tray return cleaning mechanism and method for cleaning tray | |
CN112725766A (en) | Production method applied to tubular PECVD deposition equipment | |
US9275849B2 (en) | Single-chamber apparatus for precision cleaning and drying of flat objects | |
CN108453084A (en) | Nozzle cleaning and wafer cleaning equipment | |
KR20150014625A (en) | Steam cleaning apparatus | |
CN102211097B (en) | Ultrasonic cleaning device for film coated graphite frame | |
KR101314162B1 (en) | Multi-functional apparatus and method for cleaning workpiece | |
CN210073787U (en) | Pre-cleaning device | |
CN117206274A (en) | Graphite boat plasma cleaning device and cleaning method | |
CN112670377A (en) | Heterojunction solar cell processing technology | |
CN112813413B (en) | Production process applied to tubular PECVD deposition equipment | |
WO1995008406A1 (en) | Process and apparatus for the treatment of semiconductor wafers in a fluid | |
CN114930506B (en) | Method and apparatus for wet processing integrated circuit substrates using a mixture of chemical vapor and chemical gas | |
CN112795904A (en) | Production process applied to tubular equipment | |
CN112725768A (en) | Processing method applied to tubular PECVD deposition equipment | |
KR100219414B1 (en) | A cleaning apparatus for semiconductor process | |
CN117286479A (en) | Tubular film plating equipment | |
KR100573359B1 (en) | Continuous Automatic Facilities for Electrochemical Indirect Etching of Aluminium Plate | |
CN112813412A (en) | Processing method applied to coating equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |