CN112996257A - 一种振子表面金属化方法及金属化振子 - Google Patents

一种振子表面金属化方法及金属化振子 Download PDF

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CN112996257A
CN112996257A CN201911275278.9A CN201911275278A CN112996257A CN 112996257 A CN112996257 A CN 112996257A CN 201911275278 A CN201911275278 A CN 201911275278A CN 112996257 A CN112996257 A CN 112996257A
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layer
copper layer
vibrator
electroplating
tin
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刘水平
孔胜伟
廖瑞康
张晨昭
唐丹黎
马超
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ZTE Corp
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ZTE Corp
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Priority to CN201911275278.9A priority Critical patent/CN112996257A/zh
Priority to KR1020227023725A priority patent/KR20220114021A/ko
Priority to PCT/CN2020/134557 priority patent/WO2021115261A1/zh
Priority to EP20899980.5A priority patent/EP4071281A4/en
Publication of CN112996257A publication Critical patent/CN112996257A/zh
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Abstract

本申请提出一种振子表面金属化方法及金属化振子。该方法包括：采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层；对所述振子本体进行蚀刻处理，以去除所述振子本体非电镀区的镍层；在所述电镀区的薄铜层上进行电镀铜处理，形成厚铜层；在所述电镀区的厚铜层上进行电镀锡处理，形成锡层，并对所述锡层进行锡保护处理。

Description

一种振子表面金属化方法及金属化振子
技术领域
本申请涉及表面电镀技术领域，具体涉及一种振子表面金属化及金属化振子。
背景技术
金属化工艺是指在注塑成型的塑料壳体上制作有电气功能的导线、图形、或安装元器件，形成三维模塑互连器件。其设计方面的优势有：三维电路载体可供利用的空间增加；器件更小，更轻，功能更多，设计自由度更大。制造方面的优势有：制造流程短，直接用壳体作为互连载体，投入制造的材料数量和种类都有所下降，环境友好性好；出料容易且有害物质排放少。现有的金属化工艺会在进行电镀时会产生溢镀现象从而影响电路电气性能。
发明内容
本申请提供用于一种振子表面金属化方法及金属化振子，可以避免溢镀现象，从而提高电路电器性能。
本申请实施例提供一种表面金属化方法，包括：
采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层；
对所述振子本体进行蚀刻处理，以去除所述振子本体非电镀区的镍层；
在所述电镀区的薄铜层上进行电镀铜处理，形成厚铜层；
在所述电镀区的厚铜层上进行电镀锡处理，形成锡层，并对所述锡层进行锡保护处理。
本申请实施例提供一种振子本体，包括：
注塑成形的载体以及在所述载体表面的电镀区和非电镀区。
附图说明
图1为本申请实施例中的一种振子表面金属化方法的流程图；
图2为本申请实施例中的另一种振子表面金属化方法的流程图
图3为本申请实施例中的一种金属化振子的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚明白，下文中将结合附图对本申请的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在一个实施例中，图1是本申请实施例中的一种振子表面金属化方法的流程图，该方法可以用于对塑料及陶瓷等载体表面进行金属化的情况。如图1所示，该方法包括S110-S140。
步骤110，采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在电镀区形成薄铜层。
步骤120，对振子本体进行蚀刻处理，以去除振子本体非电镀区的镍层。
步骤130，在电镀区的薄铜层上进行电镀铜处理，形成厚铜层。
步骤140，在电镀区的厚铜层上进行电镀锡处理，形成锡层，并对锡层进行锡保护处理。
在一个实施例中，在采用酸铜在振子本体的电镀区的镍层上进行电镀铜处理，在电镀区形成薄铜层之前，还包括如下步骤：通过注塑工艺获得振子本体；对振子本体进行物理粗化处理，并对物理粗化处理后的振子本体进行清洗；对振子本体进行化学粗化处理，并对化学粗化处理后的振子本体进行清洗；在化学粗化处理后振子本体表面沉积钯离子；对振子本体进行镀镍处理，在振子本体的表面形成镍层；在镍层上进行激光镭射形成阻隔线，以在振子本体表面分割出电镀区和非电镀区。
其中，振子本体的材料可以是塑料或陶瓷。在一个实施例中，可以采用含金属粒子的增强型聚苯硫醚或者使用PPS改性料(PPS+40％玻纤)通过注塑工艺得到相应的振子本体，此材料成品良率高，注塑稳定，不易出现缺料等注塑缺陷。
在一个实施例中，对振子本体的表面进行物理粗化处理的方式可以是采用60#～80#的白刚玉对振子本体表面进行机械粗化处理，增加其表面粗糙度。通过调节喷砂设备的喷射速度和气压等参数，使振子本体表面粗糙度满足使用要求，提高后续镀层附着力，防止出现镀层起皮、脱落等不良现象。
在一个实施例中，对物理粗化处理后的振子本体进行清洗的方式可以是：依次采用超声波、清水及膨胀剂对理粗化处理后的振子本体进行清洗。可以是采用超声波和清水对振子本体进行清洗，或者采用超声波、清水及膨胀剂对振子本体进行清洗。先采用超声波清洗，然后采用清水清洗，最后用膨胀剂进行清洗。其中，膨胀剂可以引入更多的空隙，使得金属离子可以渗透到这些空隙中，与振子本体紧密结合，进一步增加金属的附着力。对对物理粗化处理后的振子本体进行清洗可以增加其表面的亲水性，以确保表面能均匀的进行金属表面活化。
在一个实施例中，对振子本体进行化学粗化处理，并对化学粗化处理后的振子本体进行清洗的过程可以是：将振子本体放入含有铬酸和硫酸的化学池中进行弱酸微蚀粗化；并采用碱性药水对化学粗化处理后的振子本体进行清洗。
其中，铬酸中和，将六价铬还原成一价铬。化学药水可以增加金属吸附力，利于钯离子的沉积。
在一个实施例中，可以采用解胶工艺振子本体表面沉积钯离子。
在一个实施例中，镍层小于或等于1um。
在一个实施例中，在镍层上进行激光镭射时，在阻隔性所要形成的位置上进行激光镭雕，去除阻隔线所要形成的位置上的镍层，形成阻隔线，从而将振子本体表面分割成电镀区和非电镀区。阻隔线宽至少0.5mm，主要落在非电镀区，以不破坏或减小电镀区的预定形状或面积。
在一个实施例中，激光镭雕时，可采用配有机械手3D激光镭雕设备，可以完成振子本体上多个需要激光镭雕的表面，转角镭雕线能联动完成，不会出现错位的情况。
在一个实施例中，采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层。酸铜可以溶解侧面多余的镍，防止溢镀现象，减小表面线路粗糙度，提高金属走线的侧面平整度，区别于传统工艺采用的碱性的焦铜，金属上镀时会发生溢镀问题，太厚会造成镀出来的铜与还没有退镀的镍层导通，导致产品连线，产品报废。
在一个实施例中，对振子本体进行蚀刻处理时，对振子本体的所有表面进行蚀刻，在将1um厚度的镍层退除的同时也将薄铜层大概1um的表层去除。
在一个实施例中，在电镀区的薄铜层上进行电镀铜处理，形成厚铜层，的过程可以是：在电镀区的薄铜层依次电镀亮焦铜和焦铜，形成亮焦铜层和焦铜层，亮焦铜层和焦铜层组成厚铜层。
其中，所述厚铜层的厚度大于或等于8um。
在一个实施例中，在电镀区的厚铜层上进行电镀锡处理，形成锡层，的方式可以是：在电镀区的厚铜层上电镀亮锡，形成亮锡层；在亮锡层上电镀亚锡，形成亚锡层。
在一个实施例中，对锡层进行锡保护处理的过程可以是：对亚锡层进行钝化处理，形成钝化膜，使得钝化膜对振子本体进行锡保护。
在一个实施例中，在对锡层进行锡保护处理之后，还包括如下步骤：钝化的振子本体进行烘干和二次复烘。
在一个实施例中，作为对上述实施例的进一步解释，该方法包括如下步骤：
S201，采用注塑工艺对塑料或陶瓷进行注塑成形，获得振子本体。
S202，对振子本体的表面进行粗化处理，并采用超声波、清洗及膨胀剂进行清洗。
S203，对振子本体的表面在含有铬酸和硫酸的化学池中进行弱酸微腐蚀粗化，并采用碱性药水对振子本体进行清洗。
S204，对振子本体进行镀镍处理，在振子本体的表面形成小于或等于1um的镍层。
S205，在镍层上进行激光镭射形成阻隔线，以在振子本体表面分割出电镀区和非电镀区。
S206，采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在电镀区形成厚度大于1um且小于3um薄铜层。
S207，对振子本体进行蚀刻处理，以去除振子本体非电镀区的镍层。
S208，在电镀区的薄铜层依次电镀亮焦铜和焦铜，形成亮焦铜层和焦铜层，组成厚度大于或等于8um的厚铜层。
S209，在电镀区的厚铜层上电镀亮锡，形成亮锡层；在亮锡层上电镀亚锡，形成亚锡层，并对亚锡层进行钝化处理，形成钝化膜。
S210，钝化的振子本体进行烘干和二次复烘，获得金属化振子。
本申请实施例提供的表面金属化方法，采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层。酸铜可以溶解侧面多余的镍，防止溢镀现象，减小表面线路粗糙度，提高金属走线的侧面平整度，区别于传统工艺采用的碱性的焦铜，金属上镀时会发生溢镀问题，太厚会造成镀出来的铜与还没有退镀的镍层导通，导致产品连线，产品报废。
在一个实施例中，图3是本申请实施例中的一种金属化振子的结构示意图，该金属化振子采用上述表面金属化方法获得，如图3所示，该金属化振子包括：注塑成形的振子本体以及在振子本体表面的电镀区和非电镀区。
在一个实施例中，电镀区从内到外依次包括镍层、薄铜层、厚铜层、亮锡层、亚锡层及钝化膜；
在一个实施例中，镍层的厚度小于或等于1um；薄铜层由在镍层上电镀酸铜形成，厚度大于1um且小于3um；厚铜层包括亮焦铜层和焦铜层，厚度大于或等于8um；钝化膜由对亚锡层钝化处理形成，以对振子本体进行锡保护。
以上所述，仅为本申请的示例性实施例而已，并非用于限定本申请的保护范围。
通过示范性和非限制性的示例，上文已提供了对本申请的示范实施例的详细描述。但结合附图和权利要求来考虑，对以上实施例的多种修改和调整对本领域技术人员来说是显而易见的，但不偏离本发明的范围。因此，本发明的恰当范围将根据权利要求确定。

Claims (12)

1.一种振子表面金属化方法，其特征在于，包括：
采用酸铜在振子本体电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层；
对所述振子本体进行蚀刻处理，以去除所述振子本体非电镀区的镍层；
在所述电镀区的薄铜层上进行电镀铜处理，形成厚铜层；
在所述电镀区的厚铜层上进行电镀锡处理，形成锡层，并对所述锡层进行锡保护处理。
2.根据权利要求1所述的方法，其特征在于，在所述电镀区的薄铜层上进行电镀铜处理，形成厚铜层，包括：
在所述电镀区的薄铜层依次电镀亮焦铜和焦铜，形成亮焦铜层和焦铜层，所述亮焦铜层和焦铜层组成厚铜层；其中，所述厚铜层的厚度大于或等于8um。
3.根据权利要求1所述的方法，其特征在于，在所述电镀区的厚铜层上进行电镀锡处理，形成锡层，包括：
在所述电镀区的厚铜层上电镀亮锡，形成亮锡层；
在所述亮锡层上电镀亚锡，形成亚锡层。
4.根据权利要求3所述的方法，其特征在于，对所述锡层进行锡保护处理，包括：
对所述亚锡层进行钝化处理，形成钝化膜，使得所述钝化膜对振子本体进行锡保护。
5.根据权利要求1所述的方法，其特征在于，所述薄铜层的厚度大于1um且小于3um。
6.根据权利要求1所述的方法，其特征在于，在采用酸铜在振子本体的电镀区的镍层上进行电镀铜处理，在所述电镀区形成薄铜层之前，还包括：
通过注塑工艺获得振子本体；
对所述振子本体的表面进行物理粗化处理，并对物理粗化处理后的振子本体进行清洗；
对所述振子本体的表面进行化学粗化处理，并对化学粗化处理后的振子本体进行清洗；
在化学粗化处理后振子本体表面沉积钯离子；
对所述振子本体进行镀镍处理，在所述振子本体的表面形成镍层；
在所述镍层上进行激光镭射形成阻隔线，以在所述振子本体表面分割出电镀区和非电镀区。
7.根据权利要求6所述的方法，其特征在于，对物理粗化处理后的振子本体进行清洗，包括：
依次采用超声波、清水及膨胀剂对物理粗化处理后的振子本体进行清洗。
8.根据权利要求6所述的方法，其特征在于，对所述振子本体进行化学粗化处理，并对化学粗化处理后的振子本体进行清洗，包括：
将振子本体放入含有铬酸和硫酸的化学池中进行弱酸微蚀粗化；
并采用碱性药水对化学粗化处理后的振子本体进行清洗。
9.根据权利要求1-8任一所述的方法，其特征在于，所述镍层小于或等于1um。
10.一种金属化振子，其特征在于，包括：
注塑成形的振子本体以及在所述振子本体表面的电镀区和非电镀区。
11.根据权利要求10所述的振子，其特征在于，所述电镀区从内到外依次包括镍层、薄铜层、厚铜层、亮锡层、亚锡层及钝化膜。
12.根据权利要求11所述的振子，其特征在于，所述镍层的厚度小于或等于1um；所述薄铜层由在所述镍层上电镀酸铜形成，厚度大于1um且小于3um；所述厚铜层包括亮焦铜层和焦铜层，厚度大于或等于8um；所述钝化膜由对所述亚锡层钝化处理形成，以对振子本体进行锡保护。
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