CN112994734A - K-band radio frequency front-end four-channel antenna interface unit board - Google Patents
K-band radio frequency front-end four-channel antenna interface unit board Download PDFInfo
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- CN112994734A CN112994734A CN202110183883.4A CN202110183883A CN112994734A CN 112994734 A CN112994734 A CN 112994734A CN 202110183883 A CN202110183883 A CN 202110183883A CN 112994734 A CN112994734 A CN 112994734A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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Abstract
The invention discloses a K-band radio frequency front end four-channel antenna interface unit board which is realized based on a system-in-package technology and aims to reduce the volume and weight of an antenna interface unit. The invention is realized by the following scheme: a receiving double-channel SiP module and a receiving double-channel SiP module of K frequency band secondary frequency conversion are integrated on the front surface of the multilayer composite PCB, an SMP connector assembly is adopted for input and output, and three-channel receiving down-conversion and one-channel transmitting up-conversion from the K frequency band to the L frequency band are realized; and the back surface is integrated with a high and low local oscillator power divider, a high and low local oscillator phase-locked loop (SiP) module which realize the radio frequency vertical interconnection through BGA or printed board through holes. Reference signals are input to the high and low local oscillator phase-locked loop (SiP) modules from the three parallel radio frequency connectors to generate two local oscillator signals, and the two local oscillator signals are supplied to the receiving and receiving dual-channel SiP modules through the high and low local oscillator power dividers respectively to complete receiving and transmitting secondary frequency conversion of the K-band four-channel frequency conversion channels.
Description
Technical Field
The invention relates to a four-channel antenna interface unit board capable of being widely applied to a K-band radio frequency front end, in particular to a K-band radio frequency front end four-channel antenna interface unit board based on a System In Package (SiP) technology.
Background
With the continuous development of electronic equipment towards informatization, networking and intellectualization, the information quantity borne by the electronic equipment is larger and larger, the information types are more and more, and the functions of light weight, miniaturization and low cost of the electronic equipment are more and more obvious. The traditional integration mode is close to the technical limit in the aspects of volume, weight, cost, power consumption and the like, and the requirements of more strict miniaturization, low cost and large-batch equipment of electronic equipment under the informatization condition cannot be met.
The multi-channel antenna interface unit is an important part in radar and communication systems, is a connection junction of an antenna array and a terminal data processing board, and mainly realizes frequency conversion between a baseband signal and a high-frequency signal generated by the terminal data processing board DA, so that modulation of the signal is realized, and the anti-interference capability of the signal is improved. According to the required communication frequency band and working mode, the antenna interface unit mainly completes the functions of frequency conversion, low-noise amplification, filtering, power amplification, numerical control attenuation and the like. The antenna interface unit can well complete the transmission and the reception of four-channel signals, but the receiving channels of the antenna interface unit have high consistency, otherwise, the amplitude phase inconsistency among the channels seriously affects the digital beam pointing and the system angle and direction measuring performance.
The antenna interface unit mainly adopts the traditional two-dimensional plane integration method at present, a radio frequency circuit and a low-frequency circuit are arranged in a layered mode, the radio frequency circuit adopts a PTFE substrate, the low-frequency circuit adopts an FR4 board, low-frequency components are arranged on a PCB during circuit layout, a radio frequency chip is arranged on a soft substrate, the chip and a transmission line are connected through gold wire bonding, the connection between the low frequency and the radio frequency is realized through a microwave insulator, finally, modules with different functions are placed in a metal cavity, and are connected through cables and the like, the radio frequency front end is large in size due to the design mode, and the requirement for miniaturization of a modern electronic system is difficultly met. The traditional four-channel secondary frequency conversion antenna interface unit board is assembled by adopting discrete devices in a large number, the number of main components is as large as 100 (except for resistance-capacitance sensing elements), a large number of human uncontrollable factors are introduced into the assembly of the discrete devices, the amplitude phase consistency between channels is difficult to ensure, the batch production performance is poor, and meanwhile, the large number of discrete devices are used, so that the radio frequency front end is large in volume, low in integration level, large in debugging amount and complex in assembly, and the development requirement of modern electronic equipment can not be met.
System in package sip (system in package) is a concept of a package in which all or most of electronic functions of a system or a subsystem are disposed in an integrated substrate, and a chip is mounted on the integrated substrate in a 2D or 3D manner. The SiP not only can assemble a plurality of chips, but also can be installed on the same substrate as a special processor, DRAM, flash memory, resistor, capacitor, connector, antenna, etc., and simply speaking, the SiP integrates a plurality of functional chips, including functional chips such as processor, memory, etc., into one package, thereby realizing a substantially complete function, and the mainstream package form is BGA. The SiP module can be automatically assembled by adopting a machine, the efficiency is high, the assembly process can be strictly controlled, the manual intervention is less, the assembly can ensure good consistency among channels in the module and among modules, and the SiP module is more and more widely applied to electronic systems at present.
Disclosure of Invention
The invention aims to overcome the defects of large volume, low integration level, complex connection and large debugging amount of the traditional antenna interface unit plate, and aims to reduce the volume of an antenna interface unit and reduce the weight of the antenna interface unit so as to provide a four-channel antenna interface unit plate which has the advantages of compact structure, small volume, light weight, high integration level, good consistency among channels, easiness in whole-machine debugging and based on the SiP technology.
The above object of the present invention can be achieved by the following technical solutions, wherein a K-band rf front-end four-channel antenna interface unit board includes: the system comprises a multilayer composite PCB (printed circuit board) 1 serving as a signal transmission and device carrier, a receiving double-channel SiP module 2, a receiving and transmitting double-channel SiP module 3, double parallel SMP (symmetrical multi-processing) radio frequency connectors 4, three parallel SMP (symmetrical multi-processing) radio frequency connectors 5, a first radio frequency SMP connector 6, a second radio frequency SMP connector 7, a third radio frequency SMP connector 8, a fourth radio frequency SMP connector 9 and a low-frequency J63A connector 10, wherein the receiving double-channel SiP module 2, the receiving and transmitting double-channel SiP module 3, the double parallel SMP radio frequency connectors 4 and the three parallel SMP radio frequency connectors 5 are distributed on two sides of the; distribute and be in high local oscillator merit on the PCB board back divides ware 11, high local oscillator phase-locked loop SiP module 12, low local oscillator merit to divide ware 13, low local oscillator phase-locked loop SiP module 14 and a plurality of resistance, electric capacity, inductance element, its characterized in that: the receiving double-channel SiP module 2 and the receiving and transmitting double-channel SiP module 3 are arranged on the front surface of the multilayer composite PCB board 1 in parallel in a high-density BGA welding mode, the input and output ends of the receiving double-channel SiP module and the receiving and transmitting double-channel SiP module are connected with SMP radio frequency connectors through PCB wiring, and the local oscillation ends are connected with a high local oscillation power divider 11 and a low local oscillation power divider 13 which are distributed on the back surface of the PCB board through printed board via holes; the high local oscillator phase-locked loop (SiP) module 12 and the low local oscillator phase-locked loop module 14 are arranged on two sides of the back surface of the multilayer composite Printed Circuit Board (PCB), the input of the high local oscillator phase-locked loop module and the output of the low local oscillator phase-locked loop module are connected with three parallel radio frequency connectors 5, and the output of the high local oscillator phase-locked loop module and the output of the low local oscillator phase-locked; reference signals are input to a high local oscillator phase-locked loop (SiP) module 12 and a low local oscillator phase-locked loop (SiP) module 14 from the three parallel radio frequency connectors 5, two local oscillator signals for frequency conversion are generated, and the two local oscillator signals are transmitted to a receiving double-channel SiP module 2 and a receiving double-channel SiP module 3 through a high local oscillator power divider 11 and a low local oscillator power divider 13 respectively, so that receiving and transmitting secondary frequency conversion of a K-frequency-band four-channel frequency conversion channel is completed.
The invention has the following beneficial effects: compact structure, small volume and light weight. The invention abandons the discrete device integration mode of the traditional scheme, the integrated carrier selects a multilayer composite PCB board, a plurality of double-channel frequency conversion function chips and phase-locked loop discrete components are respectively integrated in 12 and 14 of a receiving double-channel frequency conversion SiP module 2, a receiving and transmitting double-channel SiP module 3 and a high and low local oscillator phase-locked loop SiP module by adopting a micro-assembly process, the SiP module is connected with a microstrip line of a printed board by adopting a high-density BGA radio frequency vertical interconnection mode, meanwhile, the connection among all components is realized by wiring and via holes of the printed board, the connection of insulators or cables among the function modules is avoided, and the structure is more compact; meanwhile, the integration level is improved, components are reduced, debugging parameters are reduced, and debugging is more convenient and faster. The antenna interface unit board adopting the SiP technology can effectively utilize the limited space in the electronic equipment, increase the longitudinal assembly density of components, further achieve the purposes of reducing the volume and weight of the electronic equipment and improving integration, and can reduce the volume of the antenna interface unit by more than 70 percent compared with the traditional design mode. The circuit board of the embodiment of the invention has the size of only 62mm multiplied by 43mm, and has obvious advantages on platforms with high miniaturization requirements, such as avionics and the like.
The reliability is high. According to different working frequencies and functions of elements, the receiving dual-channel SiP module 2 and the receiving dual-channel SiP module 3 are arranged on the front surface of the multilayer composite PCB in a parallel and centered manner; the high local oscillator power divider 11, the high local oscillator phase-locked loop SiP module 12, the low local oscillator power divider 13 and the low local oscillator phase-locked loop SiP module 14 are arranged on two sides of the back face of the multilayer composite PCB, and the radio frequency connector and the components are interconnected through a 50 omega microstrip line and a strip line to realize radio frequency transmission of microwave signals, so that the isolation is improved, and the interference of signals with different frequencies is avoided. The SiP is sealed in a parallel seam welding mode, airtight packaging of the whole SiP module is achieved, external environment adaptability is improved, the multilayer composite PCB is subjected to three-proofing by adopting DC1-2577, and reliability of the antenna interface unit board is improved.
The channel consistency is good. The channel SiP module and the local oscillator SiP module are arranged on two sides of the PCB, so that the volume of the antenna interface unit can be greatly reduced, and the isolation of the channel is improved. Main components of each receiving and transmitting channel are integrated in the SiP module, the SiP module is automatically assembled by adopting a machine, the man-made interference factors are few, the assembling process is strictly controlled, and the amplitude phase consistency of each channel in the SiP module can be ensured.
The debugging is convenient. According to the invention, the SiP module is installed on the printed board in a high-density BGA (ball grid array) connection mode, and good electrical performance vertical interconnection of the microstrip line and the strip line is realized in the printed board through optimizing via hole design, so that radio frequency signal transmission of a main channel is realized, the number of main components on the printed board is reduced to 6, the integration level is greatly improved, and the components are remarkably reduced. The SiP is equivalent to a black box, debugging parameters are reduced, debugging cost is reduced, debugging is more convenient and faster, and the defect that the number of main components of a traditional four-channel secondary frequency conversion antenna interface unit board is as large as 100 (except for resistance-capacitance sensing) is overcome.
The invention is very suitable for batch production and can be suitable for platforms with high miniaturization requirements, such as airborne platforms and the like.
Drawings
Fig. 1 is a front view of a K-band rf front end four-channel antenna interface unit board according to the present invention.
Fig. 2 is a rear view of fig. 1.
Fig. 3 is a working schematic diagram of an interface board of a K-band four-channel antenna interface unit.
In the figure: 1. the multi-layer composite PCB comprises a multi-layer composite PCB, 2. a receiving double-channel SiP module, 3. a receiving double-channel SiP module, 4. a double-parallel SMP (symmetrical multi-processing) radio frequency connector, 5. a three-parallel SMP radio frequency connector, 6. a first radio frequency SMP connector, 7. a second radio frequency SMP connector, 8. a third radio frequency SMP connector, 9. a fourth radio frequency SMP connector, 10. a low frequency connector J63A, 11. a high local oscillation power divider, 12. a high local oscillation phase-locked loop SiP module, 13. a low local oscillation power divider and 14. a low local oscillation phase-locked loop SiP module.
Detailed Description
The invention is further illustrated by the following figures and examples.
Refer to fig. 1 and 2. In the following described embodiments, a K-band rf front-end four-channel antenna interface unit board includes: the system comprises a multilayer composite PCB (printed circuit board) 1 serving as a signal transmission and device carrier, a receiving double-channel SiP module 2, a receiving and transmitting double-channel SiP module 3, double parallel SMP (symmetrical multi-processing) radio frequency connectors 4, three parallel SMP (symmetrical multi-processing) radio frequency connectors 5, a first radio frequency SMP connector 6, a second radio frequency SMP connector 7, a third radio frequency SMP connector 8, a fourth radio frequency SMP connector 9 and a low-frequency J63A connector 10, wherein the receiving double-channel SiP module 2, the receiving and transmitting double-channel SiP module 3, the double parallel SMP radio frequency connectors 4 and the three parallel SMP radio frequency connectors 5 are distributed on two sides of the; the high local oscillator power divider 11, the high local oscillator phase-locked loop SiP module 12, the low local oscillator power divider 13, the low local oscillator phase-locked loop SiP module 14 and a plurality of resistors, capacitors and inductance elements that are distributed on the back of the PCB, wherein: the receiving double-channel SiP module 2 and the receiving and transmitting double-channel SiP module 3 are arranged on the front surface of the multilayer composite PCB board 1 in parallel in a high-density BGA welding mode, the input and output ends of the receiving double-channel SiP module and the receiving and transmitting double-channel SiP module are connected with SMP radio frequency connectors through PCB wiring, and the local oscillation ends are connected with a high local oscillation power divider 11 and a low local oscillation power divider 13 which are distributed on the back surface of the PCB board through printed board via holes; the high local oscillator phase-locked loop (SiP) module 12 and the low local oscillator phase-locked loop module 14 are arranged on two sides of the back surface of the multilayer composite Printed Circuit Board (PCB), the input of the high local oscillator phase-locked loop module and the output of the low local oscillator phase-locked loop module are connected with three parallel radio frequency connectors 5, and the output of the high local oscillator phase-locked loop module and the output of the low local oscillator phase-locked; reference signals are input to a high local oscillator phase-locked loop (SiP) module 12 and a low local oscillator phase-locked loop (SiP) module 14 from the three parallel radio frequency connectors 5, two local oscillator signals for frequency conversion are generated, and the two local oscillator signals are transmitted to a receiving double-channel SiP module 2 and a receiving double-channel SiP module 3 through a high local oscillator power divider 11 and a low local oscillator power divider 13 respectively, so that receiving and transmitting secondary frequency conversion of a K-frequency-band four-channel frequency conversion channel is completed.
The receiving dual-channel SiP module 2 and the receiving dual-channel SiP module 3 integrate four receiving and transmitting frequency conversion channels from a K frequency band to an L frequency band, the four frequency conversion channels comprise two receiving channels arranged in the receiving dual-channel SiP module 2, a third receiving channel and a channel transmitting channel arranged in the receiving dual-channel SiP module 3, signal flows from a dual-parallel radio frequency connector 4 to a fourth radio frequency SMP connector 9 are first receiving channels, the dual-parallel radio frequency connector 4 to a third radio frequency SMP connector 8 are second receiving channels, the three-parallel radio frequency connector 5 to a second radio frequency SMP connector 7 are third receiving channels, and the first radio frequency SMP connector 6 to the three-parallel radio frequency connector 5 are transmitting channels.
Besides the main devices, the antenna interface unit board also comprises a small number of elements such as resistors, capacitors, inductors and the like, and the high performance of the antenna interface unit board can be realized by the common elements on the market.
See fig. 3. In the interface board of the K-band four-channel antenna interface unit, a first receiving channel and a second receiving channel of a receiving double-channel SiP module 2 are arranged in a pairwise symmetrical mode to form a secondary frequency conversion mixer group, a third receiving channel in a receiving and sending double-channel SiP module 3 is completely the same as the first receiving channel and the second receiving channel in the receiving double-channel SiP module 2 in circuit layout, and the receiving secondary frequency conversion mixer group realizes down conversion from the K frequency band to the L frequency band. And a secondary frequency conversion mixer group consisting of transmitting channels in the receiving and transmitting two-channel SIP module 3 realizes up-conversion from the L frequency band to the K frequency band. High local oscillator phase-locked loop (SiP) module 12, be equipped with phase discriminator and voltage controlled oscillator VCO in the low local oscillator phase-locked loop (SiP) module 14, reference signal input produces the high low local oscillator signal that is used for the frequency conversion for high local oscillator phase-locked loop (SiP) module 12 and low local oscillator phase-locked loop (SiP) module 14, high local oscillator power divider 11 and low local oscillator power divider 13 send the local oscillator signal into the secondary frequency conversion mixer group in receiving binary channels SiP module 2 and the receiving and dispatching binary channels SiP module 3 and carry out the secondary frequency mixing, K frequency channel or L frequency channel signal frequency and local oscillator signal frequency carry out addition or subtraction operation through the secondary frequency mixer group, thereby realized the frequency and moved.
The foregoing is illustrative of the present invention and is not to be construed as limiting thereof, but rather as follows is intended to cover all modifications, equivalents and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A K-band radio frequency front end four-channel antenna interface unit board comprises: the system comprises a multilayer composite PCB (1) used as a signal transmission and device carrier, a receiving double-channel SiP module (2) distributed in the middle of the front surface of the PCB and based on a system-in-package SiP technology, a receiving double-channel SiP module (3), a transmitting and receiving double-channel SiP module, double parallel SMP radio frequency connectors (4) distributed on two sides of the front surface of the PCB, three parallel SMP radio frequency connectors (5), a first radio frequency SMP connector (6), a second radio frequency SMP connector (7), a third radio frequency SMP connector (8), a fourth radio frequency SMP connector ()9 and a low-frequency J63A connector (10) used for controlling transmitting, receiving, switching and power supply; distribute and be in high local oscillator merit on the PCB board back divides ware (11), high local oscillator phase-locked loop SiP module (12), low local oscillator merit divides ware (13), low local oscillator phase-locked loop SiP module (14) and a plurality of resistance, electric capacity, inductance element, its characterized in that: the receiving double-channel SiP module (2) and the receiving and transmitting double-channel SiP module (3) are arranged on the front surface of the multilayer composite PCB (1) in parallel in a high-density BGA welding mode, the input and output ends of the receiving double-channel SiP module are connected with SMP radio frequency connectors through PCB wiring, and the local oscillation ends are connected with a high local oscillation power divider (11) and a low local oscillation power divider (13) which are distributed on the back surface of the PCB through printed board via holes; the high local oscillator phase-locked loop (SiP) module (12) and the low local oscillator phase-locked loop (14) are arranged on two sides of the back face of the multilayer composite PCB, the input of the high local oscillator phase-locked loop is connected with three parallel radio frequency connectors (5), and the output of the high local oscillator phase-locked loop is respectively connected with a high local oscillator power divider (11) and a low local oscillator power divider (13); reference signals are input to a high local oscillator phase-locked loop (SiP) module (12) and a low local oscillator phase-locked loop (SiP) module (14) from three parallel radio frequency connectors (5), two local oscillator signals for frequency conversion are generated, the two local oscillator signals are respectively transmitted to a receiving double-channel SiP module (2) and a receiving double-channel SiP module (3) through a high local oscillator power divider (11) and a low local oscillator power divider (13), and receiving and transmitting secondary frequency conversion of a K-frequency-band four-channel frequency conversion channel is completed.
2. The K-band rf front-end four-channel antenna interface unit board of claim 1, wherein: the receiving double-channel SiP module (2) and the receiving and transmitting double-channel SiP module (3) integrate four receiving and transmitting frequency conversion channels from a K frequency band to an L frequency band.
3. The K-band radio frequency front end four-channel antenna interface unit board of claim 1, wherein: the receiving double-channel SiP module (2) and the receiving and transmitting double-channel SiP module (3) can be a K frequency band secondary frequency conversion receiving double-channel SiP module (2) and a K frequency band secondary frequency conversion receiving and transmitting double-channel SiP module (3) which are integrated on the front surface of the multilayer composite PCB (1).
4. The K-band radio frequency front end four-channel antenna interface unit board of claim 1, wherein: a K-frequency-band secondary frequency conversion receiving double-channel SiP module (2) and a K-frequency-band secondary frequency conversion receiving and transmitting double-channel SiP module (3) are integrated on the front surface of the multilayer composite PCB (1); a high local oscillator power divider (11), a high local oscillator phase-locked loop (SiP) module (12), a low local oscillator power divider (13) and a low local oscillator phase-locked loop (SiP) module (14) are integrated on the back surface of the multilayer composite PCB (1), and radio frequency vertical interconnection can be realized through BGA or printed board via holes between the high local oscillator power divider and the low local oscillator phase-locked loop; the radio frequency, the intermediate frequency and the reference signal input and output adopt SMP connectors, and the core component frequency conversion channel SiP module and the local oscillator SiP module adopt a parallel seam welding packaging form, so that high-reliability airtightness is realized.
5. The K-band radio frequency front end four-channel antenna interface unit board of claim 2, wherein: the four frequency conversion channels comprise two receiving channels arranged in the receiving double-channel SiP module (2), a third receiving channel and a channel transmitting channel arranged in the receiving and transmitting double-channel SiP module (3).
6. The K-band radio frequency front end four-channel antenna interface unit board of claim 3, wherein: the signal flow from the double parallel radio frequency connector (4) to the fourth radio frequency SMP connector (9) is a first receiving channel, the double parallel radio frequency connector (4) to the third radio frequency SMP connector (8) is a second receiving channel, the third parallel radio frequency connector (5) to the second radio frequency SMP connector (7) is a third receiving channel, and the first radio frequency SMP connector (6) to the third parallel radio frequency connector (5) are transmitting channels.
7. The K-band radio frequency front end four-channel antenna interface unit board of claim 1, wherein: in an interface board of a K-band four-channel antenna interface unit, a first receiving channel and a second receiving channel of a receiving double-channel SiP module (2) are arranged in a pairwise symmetrical mode to form a secondary frequency conversion mixer group, a third receiving channel in a receiving and transmitting double-channel SiP module (3) is completely the same as the first receiving channel and the second receiving channel in a receiving double-channel SiP module ()2 in circuit layout, and the receiving secondary frequency conversion mixer group realizes down conversion from the K frequency band to the L frequency band.
8. The K-band radio frequency front end four-channel antenna interface unit board of claim 1, wherein: and a secondary frequency conversion mixer group consisting of transmitting channels in the transceiving double-channel SiP module (3) realizes up-conversion from an L frequency band to a K frequency band.
9. The K-band radio frequency front end four-channel antenna interface unit board of claim 1, wherein: a phase discriminator and a voltage controlled oscillator VCO are arranged in the high local oscillator phase-locked loop SiP module (12) and the low local oscillator phase-locked loop SiP module (14).
10. The K-band radio frequency front end four-channel antenna interface unit board of claim 8, wherein: a reference signal is input to a high local oscillator phase-locked loop (SiP) module (12) and a low local oscillator phase-locked loop (SiP) module (14) to generate high and low local oscillator signals for frequency conversion, the high local oscillator power divider (11) and the low local oscillator power divider (13) send the local oscillator signals to a secondary frequency conversion mixer group in a receiving double-channel SiP module (2) and a receiving double-channel SiP module (3) to carry out secondary frequency mixing, and the frequency of a signal in a K frequency band or an L frequency band and the frequency of the local oscillator signals are subjected to addition or subtraction operation through the secondary mixer group, so that frequency shifting is realized.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116938277A (en) * | 2023-09-15 | 2023-10-24 | 中科海高(成都)电子技术有限公司 | Multichannel radio frequency front end and composite substrate |
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