CN112992772B - Semiconductor chip fixing and processing equipment and processing technology - Google Patents
Semiconductor chip fixing and processing equipment and processing technology Download PDFInfo
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- CN112992772B CN112992772B CN202110177461.6A CN202110177461A CN112992772B CN 112992772 B CN112992772 B CN 112992772B CN 202110177461 A CN202110177461 A CN 202110177461A CN 112992772 B CN112992772 B CN 112992772B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention provides a semiconductor chip fixing and processing device and a processing technology, comprising a fixing frame, a rotating unit, a limiting unit, a glue dripping unit and an executing unit; the invention can solve the problems that the bonding effect between the pins and the silicon wafer is reduced because glue solution mainly existing in the process of bonding between the pins and the silicon wafer is solidified in advance in the flowing process, so that the pins are easy to loosen after bonding to influence the conductivity of the pins, the pins are easy to deflect in the bonding process between the pins and the silicon wafer to influence the connection effect between the silicon wafer and the pins, the pins are small, the bonding efficiency of the existing pin bonding technology is low, and the like.
Description
Technical Field
The invention relates to the technical field of electronic engineering, in particular to a semiconductor chip fixing and processing device and a processing technology.
Background
A semiconductor chip is a semiconductor device which is manufactured by etching and wiring a semiconductor wafer and can realize a certain function. The semiconductor chip mainly relates to raw materials including a silicon chip and pins, the pins are required to be fixed on the silicon chip through welding of a spot welding machine or adhesion of an adhesive machine, but the following problems mainly exist in the process of adhesion between the pins and the silicon chip at present:
the glue solution is solidified in advance in the flowing process, so that the bonding effect between the pins and the silicon wafer is reduced, the pins are easy to loosen after being bonded, the conductivity of the pins is influenced, the pins are easy to deflect in the bonding process between the pins and the silicon wafer, the connection effect between the silicon wafer and the pins is influenced, the pins are small, and the bonding efficiency of the existing pin bonding technology is low.
Therefore, in order to improve the bonding efficiency between the silicon chip and the pins; the connection effect between the silicon wafer and the pins is ensured; the invention provides a semiconductor chip fixing and processing device and a processing technology.
Disclosure of Invention
In order to achieve the above object, the present invention adopts the following technical scheme that a semiconductor chip fixing and processing device comprises a fixing frame, a rotating unit, a limiting unit, a glue dripping unit and an executing unit; the inner wall of the bottom end of the fixing frame is provided with a rotating unit, the inner wall of the top end of the fixing frame is provided with a limiting unit, the glue dripping unit is arranged on the inner wall of the side of the fixing frame, and the glue dripping unit is sleeved on the outer wall of the limiting unit and is positioned right above the rotating unit; the side wall of the fixed frame is provided with a rectangular through hole, the inner wall of the rectangular through hole of the fixed frame is provided with an execution unit, and the execution unit is positioned above the rotating unit; wherein:
the limiting unit comprises an adjusting cylinder, a pressing clamping plate, a pressing claw, a pressing spring and a limiting block; the pressing clamping plate is arranged at the top end of the adjusting cylinder through a bearing, fixing holes are uniformly formed in the lower end face of the pressing clamping plate, a pressing spring is arranged on the inner wall of the top end of the fixing hole of the pressing clamping plate, the lower end of the pressing spring is connected to the pressing clamping jaw, the pressing clamping jaw is arranged on the side wall of the fixing hole of the pressing clamping plate through a pin shaft, balls are arranged on the outer wall of the bottom end of the pressing clamping jaw in a movable connection mode, and the limiting block is arranged on the inner wall of the fixing hole of the pressing clamping plate and is matched with the pressing clamping jaw in a movable connection mode; the arranged limiting unit ensures the stability of the silicon wafer pins in the welding process, ensures the welding effect between the pins and the silicon wafer and prevents the silicon wafer pins from deflecting; the connection effect between the silicon chip and the pins is ensured.
The glue dripping unit comprises an installation rod sleeve, a fixed cover, a hot drying lamp, a clamping sleeve, a feeding pipe, an adjusting motor, a stirring rod, an upper clamping sleeve, a material leaking cover and a material limiting ball; the lower end of the mounting rod sleeve is provided with a fixed cover, and a hot drying lamp is arranged at the left side position of the inner wall of the fixed cover; the clamping sleeve is arranged on the right side of the inner wall of the fixed cover; an adjusting motor is arranged in the clamping sleeve through a motor base, an output shaft of the adjusting motor is provided with a stirring rod through a coupler, and the upper clamping sleeve is arranged on the inner wall of the clamping sleeve and is connected with the outer wall of the output shaft of the adjusting motor through a bearing; the lower end of the upper cutting sleeve is provided with a material leaking cover which is sleeved on the outer wall of the stirring rod; the inner wall of the bottom end of the material leakage cover is provided with a material limiting ball in a movable connection mode; one end of the feeding pipe sequentially penetrates through the fixing cover, the clamping sleeve and the upper clamping sleeve and is arranged in the material leakage cover; connecting a feeding pipe with an external glue solution storage device, introducing the glue solution into the leaking cover through the feeding pipe, and fully stirring the glue solution in the leaking cover under the condition that a stirring rod is driven by a regulating motor to rotate so as to prevent the glue solution from being solidified; thereby ensuring the bonding effect of the glue solution; the bonding effect between the pins and the silicon wafer is ensured.
The execution unit comprises an execution plate, an electric execution sliding block, an execution sleeve disc, a fixed sleeve, an execution spring, an auxiliary push head, a clamping spring and a limiting chuck; the lower end surface of the execution plate is provided with an electric execution sliding block in a sliding fit mode, the lower end of the electric execution sliding block is provided with an execution sleeve disc, the lower end of the execution sleeve disc is provided with a fixed sleeve in a threaded connection mode, and the lower end of the fixed sleeve is of an inclined structure; the inner part of the fixed sleeve is provided with an auxiliary push head in a sliding fit mode, the upper end of the auxiliary push head is provided with an execution spring, the upper end of the execution spring is in contact fit with the outer wall of the lower end of the execution sleeve disc, the inner wall of the fixed sleeve is provided with a limiting chuck in a sliding fit mode, and the limiting chuck is connected with the inner wall of the fixed sleeve through a clamping spring; the arranged execution unit fixes the piled pins, the fixed sleeve is moved to a position to be installed on the silicon wafer under the action of the electric execution sliding block, the pins are butted with the silicon wafer under the action of the auxiliary pushing head, and the bonding efficiency between the silicon wafer and the pins is improved; the pins are mounted on the silicon wafer without the need for a single manual operation of the clip.
Preferably; the rotating unit comprises a limiting column, a limiting spring, a limiting clamping rod, a rotating motor, a movable table disc and a moving module; the limiting posts are uniformly arranged on the inner wall of the bottom end of the fixing frame, the outer wall of each limiting post is sleeved with a limiting spring, the limiting clamping rods are sleeved on the outer wall of each limiting post in a sliding fit mode and are arranged on the inner wall of the bottom end of the fixing frame, and the side wall of the top end of each limiting clamping rod is provided with a ball in a movable connection mode; the rotary motor is arranged in the middle of the inner wall of the bottom end of the fixed frame through a motor base, a movable table plate is arranged on an output shaft of the rotary motor through a flange, and the outer wall of the lower end of the movable table plate is matched with the top end of the limiting clamping rod in a movable connection mode; the upper end of the movable table plate is provided with a movable module in a sliding fit mode; the silicon chip with the fixed upper end can be conveniently switched in position through the arranged rotating unit, so that the silicon chip position can be automatically switched effectively, the pins of the silicon chip can be bonded, and the bonding efficiency of the pins of the silicon chip can be improved.
Preferably; the moving module comprises an electric moving sliding block, a supporting rod, a chip fixing disc, an auxiliary spring, an ejection chuck and a rubber pressure pad; the upper end of the electric movable sliding block is provided with a supporting rod, the top end of the supporting rod is provided with a chip fixing disc, the middle part of the upper end of the chip fixing disc is provided with a mounting hole, the inner wall of the bottom end of the mounting hole at the upper end of the chip fixing disc is uniformly provided with an auxiliary spring, the upper end of the auxiliary spring is connected to the outer wall of the bottom end of the ejection chuck, and the ejection chuck is arranged in the mounting hole of the chip fixing disc in a sliding fit mode; the outer wall of the mounting hole at the upper end of the chip fixing disc is provided with an annular groove with a triangular section; arc-shaped grooves are uniformly formed in the upper end of the annular groove of the chip fixing disc, and rubber pressure pads are symmetrically arranged on the inner walls of the arc-shaped grooves in the chip fixing disc; the moving module is convenient for the silicon chip in the upper end chip fixing disc to move under the action of the electric moving sliding block, so that the silicon chip is convenient to place and take.
Preferably; the outer wall of the stirring rod is of a spiral convex structure; set up the stirring rod outer wall into heliciform protruding structure and be convenient for the stirring rod to stir the glue solution of inside and prevent that the glue solution from solidifying, on the other hand sets into helical structure and is convenient for the glue solution to feed.
Preferably; the outer wall of the material limiting ball is provided with an annular groove, and the outer wall of the annular groove of the material limiting ball is of a uniform convex structure; the outer wall of the annular groove of the material limiting ball is arranged to be of a uniform convex structure, so that the inner glue solution is conveniently sealed and prevented from leaking when the material limiting ball does not rotate; on the other hand, when the colloid is pushed, the rotation of the material limiting ball is effective to ensure the uniform discharging of the colloid.
In addition, the invention also provides a semiconductor chip fixing and processing device, which specifically comprises the following processing steps:
s1: the processed silicon wafer is manually placed in the ejection chuck, and the upper end surface of the silicon wafer is matched and fixed through the pressing claw under the action of the adjusting cylinder; thereby keeping the stability of the silicon chip;
s2: a pin to be welded and fixed is placed in the fixed sleeve; the lower end of the fixed sleeve is moved to the position right above the silicon chip under the action of the electric execution slide block, and the pins are pushed to the proper positions on the silicon chip under the action of the auxiliary push head; fixing the pins at the upper end of the silicon wafer under the action of the glue dripping unit, and drying and fixing the bonded pins by a hot drying lamp;
s3: the pins are bonded and dried and fixed at different positions of the silicon wafer at the upper end by rotating the motor; after the bonding of the silicon wafer pins is finished; the silicon chip is loosened through the limiting unit and is moved out of the fixing cover through the action of the electric moving slide block to be taken down manually.
The invention has the beneficial effects that:
according to the invention, the feeding pipe is connected with the external glue solution storage equipment, the glue solution is introduced into the material leaking cover through the feeding pipe, and the glue solution in the material leaking cover is fully stirred under the condition that the stirring rod is driven by the adjusting motor to rotate, so that the glue solution is prevented from being solidified; thereby ensuring the bonding effect of the glue solution; the bonding effect between the pins and the silicon wafer is ensured;
the silicon wafer pin welding device has the advantages that the stability of the silicon wafer pin in the welding process is guaranteed through the arranged limiting unit, the welding effect between the pin and the silicon wafer is guaranteed, and the silicon wafer is prevented from deviating from the pin; the connection effect between the silicon wafer and the pins is ensured;
the execution unit fixes the stacked pins, moves the fixed sleeve to a position to be mounted on the silicon wafer under the action of the electric execution sliding block, and realizes butt joint of the pins and the silicon wafer under the action of the auxiliary pushing head, so that the bonding efficiency between the silicon wafer and the pins is improved; the pins are installed on the silicon chip without manually operating a clamp;
the silicon chip with the fixed upper end can be switched conveniently through the arranged rotating unit, so that the silicon chip can be switched automatically to bond pins of the silicon chip, and the bonding efficiency of the silicon chip pins is improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a front view in section view of the present invention;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 3 is an enlarged view of a portion of the invention at B in FIG. 1;
FIG. 4 is an enlarged view of a portion of the invention at C in FIG. 1;
FIG. 5 is a schematic perspective view of a stir bar according to the present invention;
fig. 6 is a schematic perspective view of the pouch of the present invention;
fig. 7 is a schematic perspective view of the material-limiting ball of the present invention.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. In this process, the width of the lines or the size of the components in the drawings may be exaggerated for clarity and convenience of description.
In addition, the following terms are defined based on the functions of the present invention, and may be different depending on the intention of the user or the operator or the convention; therefore, these terms are defined based on the entire contents of the present specification.
As shown in fig. 1 to 7, a semiconductor chip fixing and processing apparatus includes a fixing frame 1, a rotating unit 2, a limiting unit 3, a glue dripping unit 4 and an executing unit 5; the inner wall of the bottom end of the fixed frame 1 is provided with a rotating unit 2, the inner wall of the top end of the fixed frame 1 is provided with a limiting unit 3, the glue dripping unit 4 is arranged on the inner wall of the side of the fixed frame 1, and the glue dripping unit 4 is sleeved on the outer wall of the limiting unit 3 and is positioned right above the rotating unit 2; the side wall of the fixed frame 1 is provided with a rectangular through hole, the inner wall of the rectangular through hole of the fixed frame 1 is provided with an execution unit 5, and the execution unit 5 is positioned above the rotating unit 2; wherein:
the rotating unit 2 comprises a limiting column 21, a limiting spring 22, a limiting clamping rod 23, a rotating motor 24, a movable table disc 25 and a moving module 26; the limiting columns 21 are uniformly arranged on the inner wall of the bottom end of the fixing frame 1, the limiting springs 22 are sleeved on the outer wall of the limiting columns 21, the limiting clamping rods 23 are sleeved on the outer wall of the limiting columns 21 in a sliding fit mode and are arranged on the inner wall of the bottom end of the fixing frame 1, and the side wall of the top ends of the limiting clamping rods 23 is provided with balls in a movable connection mode; the rotating motor 24 is arranged in the middle of the inner wall of the bottom end of the fixed frame 1 through a motor base, a movable table disc 25 is arranged on an output shaft of the rotating motor 24 through a flange, and the outer wall of the lower end of the movable table disc 25 is matched with the top end of the limiting clamping rod 23 in a movable connection mode; the upper end of the movable table disc 25 is provided with a movable module 26 in a sliding fit manner; the silicon chip with the fixed upper end can be conveniently switched in position through the rotating unit 2, so that the silicon chip can be automatically switched in position effectively, pins of the silicon chip can be bonded, and the bonding efficiency of the pins of the silicon chip can be improved.
The moving module 26 comprises an electric moving slide block 261, a support rod 262, a chip fixing disc 263, an auxiliary spring 264, an ejection chuck 265 and a rubber pressure pad 266; the upper end of the electric movable sliding block 261 is provided with a supporting rod 262, the top end of the supporting rod 262 is provided with a chip fixing disc 263, the middle part of the upper end of the chip fixing disc 263 is provided with a mounting hole, the inner wall of the bottom end of the mounting hole at the upper end of the chip fixing disc 263 is uniformly provided with an auxiliary spring 264, the upper end of the auxiliary spring 264 is connected with the outer wall of the bottom end of the ejection chuck 265, and the ejection chuck 265 is arranged in the mounting hole of the chip fixing disc 263 in a sliding fit manner; an annular groove with a triangular section is formed in the outer wall of the mounting hole in the upper end of the chip fixing disc 263; arc-shaped grooves are uniformly formed in the upper end of the annular groove of the chip fixing disk 263, and rubber pressure pads 266 are symmetrically arranged on the inner wall of the arc-shaped groove of the chip fixing disk 263; the moving module 26 is convenient for the silicon chip in the upper chip fixing disc 263 to move under the action of the electric moving slide block 261, so that the silicon chip can be placed and taken conveniently.
The limiting unit 3 comprises an adjusting cylinder 31, a pressing clamping plate 32, a pressing claw 33, a pressing spring 34 and a limiting block 35; the top end of the adjusting cylinder 31 is provided with a pressing clamping plate 32 through a bearing, the lower end face of the pressing clamping plate 32 is uniformly provided with a fixed hole, the inner wall of the top end of the fixed hole of the pressing clamping plate 32 is provided with a pressing spring 34, the lower end of the pressing spring 34 is connected to a pressing claw 33, the pressing claw 33 is arranged on the side wall of the fixed hole of the pressing clamping plate 32 through a pin shaft, the outer wall of the bottom end of the pressing claw 33 is provided with a ball in a movable connection mode, and the limiting block 35 is arranged on the inner wall of the fixed hole of the pressing clamping plate 32 and is matched with the pressing claw 33 in a movable connection mode; the arranged limiting unit 3 ensures the stability of the silicon wafer pins in the welding process, ensures the welding effect between the pins and the silicon wafer and prevents the silicon wafer pins from deflecting; the connection effect between the silicon chip and the pins is ensured.
The glue dripping unit 4 comprises an installation rod sleeve 41, a fixed cover 42, a hot drying lamp 43, a clamping sleeve 44, a feeding pipe 45, an adjusting motor 46, a stirring rod 47, an upper clamping sleeve 48, a material leaking cover 49 and a material limiting ball 40; the lower end of the mounting rod sleeve 41 is provided with a fixed cover 42, and a hot drying lamp 43 is arranged at the left side position of the inner wall of the fixed cover 42; the clamping sleeve 44 is arranged on the right side of the inner wall of the fixed cover 42; an adjusting motor 46 is arranged in the clamping sleeve 44 through a motor base, an output shaft of the adjusting motor 46 is provided with a stirring rod 47 through a coupler, and the outer wall of the stirring rod 47 is of a spiral protruding structure; the outer wall of the stirring rod 47 is arranged to be in a spiral convex structure, so that the stirring rod 47 can stir the glue solution in the stirring rod to prevent the glue solution from being solidified, and the spiral structure is arranged to facilitate the glue solution feeding; the upper clamping sleeve 48 is arranged on the inner wall of the clamping sleeve 44 and is connected with the outer wall of the output shaft of the adjusting motor 46 through a bearing; the lower end of the upper cutting sleeve 48 is provided with a material leaking cover 49, and the material leaking cover 49 is sleeved on the outer wall of the stirring rod 47; the inner wall of the bottom end of the material leakage cover 49 is provided with a material limiting ball 40 in a movable connection mode; the outer wall of the material limiting ball 40 is provided with an annular groove, and the outer wall of the annular groove of the material limiting ball 40 is of a uniform convex structure; the outer wall of the annular groove of the material limiting ball 40 is arranged to be of a uniform convex structure, so that the inner glue solution is conveniently sealed and prevented from leaking when the material limiting ball 40 does not rotate; on the other hand, when the colloid is pushed, the rotation of the material limiting ball 40 effectively ensures the uniform discharging of the colloid; one end of the feed pipe 45 sequentially penetrates through the fixing cover 42, the clamping sleeve 44 and the upper clamping sleeve 48 and is arranged in the material leakage cover 49; connecting a feed pipe 45 with an external glue solution storage device, introducing the glue solution into the material leaking cover 49 through the feed pipe 45, and fully stirring the glue solution in the material leaking cover under the condition that an adjusting motor 46 drives a stirring rod 47 to rotate so as to prevent the glue solution from being solidified; thereby ensuring the bonding effect of the glue solution; the bonding effect between the pins and the silicon wafer is ensured.
The execution unit 5 comprises an execution plate 51, an electric execution sliding block 52, an execution sleeve disc 53, a fixed sleeve 54, an execution spring 55, an auxiliary push head 56, a clamping spring 57 and a limiting clamping head 58; an electric execution sliding block 52 is arranged on the lower end surface of the execution plate 51 in a sliding fit mode, an execution sleeve disc 53 is arranged at the lower end of the electric execution sliding block 52, a fixed sleeve 54 is arranged at the lower end of the execution sleeve disc 53 in a threaded connection mode, and the lower end of the fixed sleeve 54 is of an inclined structure; an auxiliary push head 56 is arranged in the fixed sleeve 54 in a sliding fit mode, an execution spring 55 is arranged at the upper end of the auxiliary push head 56, the upper end of the execution spring 55 is in contact fit with the outer wall of the lower end of the execution sleeve disc 53, a limiting chuck 58 is arranged on the inner wall of the fixed sleeve 54 in a sliding fit mode, and the limiting chuck 58 is connected with the inner wall of the fixed sleeve 54 through a clamping spring 57; the arranged execution unit 5 fixes the stacked pins, moves the fixing sleeve 54 to the position to be installed on the silicon wafer under the action of the electric execution slide block 52, and realizes the butt joint of the pins and the silicon wafer under the action of the auxiliary push head 56, so that the bonding efficiency between the silicon wafer and the pins is improved; the pins are mounted on the silicon wafer without the need for a single manual operation of the clip.
In addition, the invention also provides a semiconductor chip fixing and processing device, which specifically comprises the following processing steps:
s1: the processed silicon wafer is manually placed in the ejection chuck 265, and the upper end face of the silicon wafer is matched and fixed through the pressing claw 33 under the action of the adjusting cylinder 31; thereby keeping the stability of the silicon chip;
s2: pins to be welded and fixed are placed inside the fixing sleeve 54; the lower end of the fixed sleeve 54 is moved to the position right above the silicon wafer through the action of the electric execution slide block 52, and the pins are pushed to the proper positions on the silicon wafer through the action of the auxiliary push head 56; then, the pins are fixed at the upper end of the silicon wafer under the action of the glue dripping unit 4, and the bonded pins are dried and fixed through a hot drying lamp 43;
s3: the pins are bonded and dried and fixed at different positions of the silicon wafer at the upper end by rotating the motor 24; after the bonding of the silicon wafer pins is finished; the silicon chip is loosened by the limiting unit 3 and is moved out of the fixed cover 42 by the action of the electric movable sliding block 261 to be manually taken down.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A semiconductor chip fixing and processing device comprises a fixing frame (1), a rotating unit (2), a limiting unit (3), a glue dripping unit (4) and an executing unit (5); the method is characterized in that: the inner wall of the bottom end of the fixed frame (1) is provided with a rotating unit (2), the inner wall positioned at the top end of the fixed frame (1) is provided with a limiting unit (3), the glue dripping unit (4) is arranged on the inner wall of the side of the fixed frame (1), and the glue dripping unit (4) is sleeved on the outer wall of the limiting unit (3) and is positioned right above the rotating unit (2); the side wall of the fixed frame (1) is provided with a rectangular through hole, the inner wall of the rectangular through hole positioned on the fixed frame (1) is provided with an execution unit (5), and the execution unit (5) is positioned above the rotating unit (2); wherein:
the limiting unit (3) comprises an adjusting cylinder (31), a pressing clamping plate (32), a pressing claw (33), a pressing spring (34) and a limiting block (35); the adjusting mechanism is characterized in that a pressing clamping plate (32) is mounted at the top end of the adjusting cylinder (31) through a bearing, fixing holes are uniformly formed in the lower end face of the pressing clamping plate (32), a pressing spring (34) is arranged on the inner wall of the top end of the fixing hole of the pressing clamping plate (32), the lower end of the pressing spring (34) is connected to a pressing clamping jaw (33), the pressing clamping jaw (33) is mounted on the side wall of the fixing hole of the pressing clamping plate (32) through a pin shaft, balls are arranged on the outer wall of the bottom end of the pressing clamping jaw (33) in a movable connection mode, and a limiting block (35) is arranged on the inner wall of the fixing hole of the pressing clamping plate (32) and is matched with the pressing clamping jaw (33) in a movable connection mode;
the glue dripping unit (4) comprises an installation rod sleeve (41), a fixed cover (42), a hot drying lamp (43), a clamping sleeve (44), a feeding pipe (45), an adjusting motor (46), a stirring rod (47), an upper clamping sleeve (48), a material leaking cover (49) and a material limiting ball (40); the lower end of the mounting rod sleeve (41) is provided with a fixed cover (42), and a hot baking lamp (43) is arranged at the left side position of the inner wall of the fixed cover (42); a clamping sleeve (44) is arranged on the right side of the inner wall of the fixed cover (42); an adjusting motor (46) is installed in the clamping sleeve (44) through a motor base, an output shaft of the adjusting motor (46) is provided with a stirring rod (47) through a coupler, and the upper clamping sleeve (48) is installed on the inner wall of the clamping sleeve (44) and connected with the outer wall of the output shaft of the adjusting motor (46) through a bearing; the lower end of the upper cutting sleeve (48) is provided with a material leaking cover (49), and the material leaking cover (49) is sleeved on the outer wall of the stirring rod (47); the inner wall of the bottom end of the material leakage cover (49) is provided with a material limiting ball (40) in a movable connection mode; one end of the feed pipe (45) sequentially penetrates through the fixed cover (42), the clamping sleeve (44) and the upper clamping sleeve (48) and is arranged in the material leakage cover (49);
the execution unit (5) comprises an execution plate (51), an electric execution sliding block (52), an execution sleeve disc (53), a fixed sleeve (54), an execution spring (55), an auxiliary push head (56), a clamping spring (57) and a limiting clamping head (58); an electric execution sliding block (52) is arranged on the lower end face of the execution plate (51) in a sliding fit mode, an execution sleeve disc (53) is arranged at the lower end of the electric execution sliding block (52), a fixed sleeve (54) is arranged at the lower end of the execution sleeve disc (53) in a threaded connection mode, and the lower end of the fixed sleeve (54) is of an inclined structure; the inside of fixed cover (54) is provided with supplementary pusher (56) through sliding fit, supplementary pusher (56) upper end install executive spring (55), just executive spring (55) upper end and the inconsistent cooperation of the lower extreme outer wall of carrying out set dish (53), the inner wall that is located fixed cover (54) is provided with spacing dop (58) through sliding fit, just the inner wall of spacing dop (58) and fixed cover (54) between be connected through joint spring (57).
2. A semiconductor chip mounting process apparatus according to claim 1; it is characterized in that; the rotating unit (2) comprises a limiting column (21), a limiting spring (22), a limiting clamping rod (23), a rotating motor (24), a movable table disc (25) and a moving module (26); the limiting columns (21) are uniformly arranged on the inner wall of the bottom end of the fixing frame (1), limiting springs (22) are sleeved on the outer wall of the limiting columns (21), limiting clamping rods (23) are sleeved on the outer wall of the limiting columns (21) in a sliding fit mode and are arranged on the inner wall of the bottom end of the fixing frame (1), and balls are arranged on the side wall of the top end of each limiting clamping rod (23) in a movable connection mode; the rotary motor (24) is arranged in the middle of the inner wall of the bottom end of the fixed frame (1) through a motor base, a movable table plate (25) is arranged on an output shaft of the rotary motor (24) through a flange, and the outer wall of the lower end of the movable table plate (25) is matched with the top end of the limiting clamping rod (23) in a movable connection mode; the upper end of the movable table plate (25) is provided with a movable module (26) in a sliding fit mode.
3. A semiconductor chip mounting process apparatus according to claim 2; it is characterized in that; the moving module (26) comprises an electric moving sliding block (261), a supporting rod (262), a chip fixing disc (263), an auxiliary spring (264), an ejection chuck (265) and a rubber pressure pad (266); the upper end of the electric movable sliding block (261) is provided with a supporting rod (262), the top end of the supporting rod (262) is provided with a chip fixing disc (263), the middle part of the upper end of the chip fixing disc (263) is provided with a mounting hole, the inner wall of the bottom end of the mounting hole at the upper end of the chip fixing disc (263) is uniformly provided with an auxiliary spring (264), the upper end of the auxiliary spring (264) is connected to the outer wall of the bottom end of the ejection chuck (265), and the ejection chuck (265) is arranged in the mounting hole of the chip fixing disc (263) in a sliding fit mode; an annular groove with a triangular section is formed in the outer wall of the mounting hole in the upper end of the chip fixing disc (263); and the upper end of the annular groove of the chip fixed disk (263) is uniformly provided with an arc-shaped groove, and the inner wall of the arc-shaped groove positioned on the chip fixed disk (263) is symmetrically provided with rubber pressure pads (266).
4. A semiconductor chip mounting process apparatus according to claim 1; it is characterized in that; the outer wall of the stirring rod (47) is of a spiral convex structure.
5. A semiconductor chip mounting process apparatus according to claim 1; it is characterized in that; the outer wall of the material limiting ball (40) is provided with an annular groove, and the outer wall of the annular groove of the material limiting ball (40) is of a uniform protruding structure.
6. The semiconductor chip mounting process apparatus according to any one of claims 1 to 5, wherein: the processing technology of the semiconductor chip fixing and processing equipment comprises the following steps:
s1: the processed silicon wafer is manually placed in an ejection chuck (265) and the upper end surface of the silicon wafer is matched and fixed through a pressing claw (33) through the action of an adjusting cylinder (31); thereby keeping the stability of the silicon chip;
s2: a pin to be welded and fixed is placed in the fixed sleeve (54); the lower end of the fixed sleeve (54) is moved to the position right above the silicon chip under the action of the electric execution slide block (52), and the pins are pushed to the proper positions on the silicon chip under the action of the auxiliary push head (56); then, the pins are fixed at the upper end of the silicon wafer under the action of the glue dripping unit (4), and the bonded pins are dried and fixed through a hot drying lamp (43);
s3: the pins are bonded and dried and fixed at different positions of the silicon wafer at the upper end by rotating the motor (24); after the bonding of the silicon wafer pins is finished; the silicon chip is loosened through the limiting unit (3) and is moved out of the fixing cover (42) through the action of the electric moving slide block (261) to be manually taken down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110177461.6A CN112992772B (en) | 2021-02-09 | 2021-02-09 | Semiconductor chip fixing and processing equipment and processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110177461.6A CN112992772B (en) | 2021-02-09 | 2021-02-09 | Semiconductor chip fixing and processing equipment and processing technology |
Publications (2)
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| JPH10313083A (en) * | 1997-05-14 | 1998-11-24 | Toshiba Chem Corp | Manufacture of semiconductor device |
| KR20120048437A (en) * | 2010-11-05 | 2012-05-15 | 리드텍(주) | Having glue suppl controller semiconductor die bonding apparatus |
| CN105127053A (en) * | 2015-10-12 | 2015-12-09 | 苏州达恩克精密机械有限公司 | Dispensing mechanism of chip assembling machine |
| US9281339B1 (en) * | 2014-09-17 | 2016-03-08 | Sunasic Technologies, Inc. | Method for mounting chip on printed circuit board |
| CN106733487A (en) * | 2016-12-12 | 2017-05-31 | 北京中电科电子装备有限公司 | A kind of chip glue spreading apparatus and method |
| CN111952236A (en) * | 2020-08-22 | 2020-11-17 | 洛阳师范学院 | Fixed processing equipment of computer display card chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10313083A (en) * | 1997-05-14 | 1998-11-24 | Toshiba Chem Corp | Manufacture of semiconductor device |
| KR20120048437A (en) * | 2010-11-05 | 2012-05-15 | 리드텍(주) | Having glue suppl controller semiconductor die bonding apparatus |
| US9281339B1 (en) * | 2014-09-17 | 2016-03-08 | Sunasic Technologies, Inc. | Method for mounting chip on printed circuit board |
| CN105127053A (en) * | 2015-10-12 | 2015-12-09 | 苏州达恩克精密机械有限公司 | Dispensing mechanism of chip assembling machine |
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