CN214351403U - Silicon disc chamfering device - Google Patents

Abstract

The utility model relates to a silicon dish chamfer device relates to semiconductor silicon dish processing technology field. A silicon disc chamfering device comprises a frame main body, a workpiece rotating mechanism, a clamping mechanism, a pressing mechanism and a workpiece polishing mechanism. The workpiece rotating mechanism penetrates through the frame main body from the lower part of the frame main body and is in driving connection with the clamping mechanism. The hold-down mechanism passes through the frame body from above the frame body. The workpiece polishing mechanism is arranged on the side part of the frame main body. The workpiece rotating mechanism penetrates through the lower layer frame of the frame main body to drive the clamping mechanism fixed with the workpiece rotating mechanism to rotate, and then the silicon disc to be polished clamped by the clamping mechanism is driven to rotate. And a pressing mechanism which penetrates through the upper layer frame of the frame main body presses the silicon disc in the vertical direction. Compared with the prior art, the operation is simple and the use is convenient. Meanwhile, the installation is convenient, and labor is saved while the chamfering time of the silicon disc is greatly prolonged.

Description

Silicon disc chamfering device

Technical Field

The utility model relates to a semiconductor silicon dish processing technology field especially relates to a silicon dish chamfer device.

Background

In the multi-wire cutting production process of the silicon disc, after the silicon disc is subjected to multi-wire cutting, edge breakage, damage and the like can occur in links of detection, transportation and the like of the silicon disc. Therefore, it is necessary to chamfer the edge of the cut silicon disk.

The existing chamfering method is manual chamfering, and 30-40 minutes is needed for averaging one silicon disc after chamfering, a large amount of manpower is needed, and the time consumption is longer. However, the existing chamfering machine on the market is mainly designed for iron pieces, glass and quartz other materials, the chamfering in the monocrystalline silicon industry is limited, the existing chamfering machine on the market has low machining precision and cannot be directly used for chamfering a silicon disc, and modification to a certain degree is required to adapt to the chamfering of the silicon disc.

The above technical problems need to be solved.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the above shortcoming, the not enough of prior art, the utility model provides a silicon dish chamfer device, it has solved current artifical chamfer and has consumeed the big and current beveler of manpower and can't directly carry out the technical problem of accurate processing chamfer to the silicon dish.

(II) technical scheme

In order to achieve the above object, the utility model discloses a main technical scheme include:

a silicon disc chamfering device comprises a frame main body, a workpiece rotating mechanism, a clamping mechanism, a pressing mechanism and a workpiece polishing mechanism;

the workpiece rotating mechanism penetrates through the frame main body from the lower part of the frame main body and is in driving connection with the clamping mechanism so as to drive the clamping mechanism for clamping the silicon disc to rotate in a horizontal plane;

the pressing mechanism penetrates through the frame main body from the upper part of the frame main body to press the silicon disc clamped by the clamping mechanism;

the workpiece polishing mechanism is arranged on the side part of the frame main body, and the front end of the workpiece polishing mechanism rotates in a vertical plane to polish the silicon disc;

an inclined strut is provided on the frame body to form a triangular structure.

Optionally, the clamping mechanism comprises a clamp base plate, a mould and a plurality of clamping jaws for clamping the mould;

the fixture chassis is connected with the workpiece rotating mechanism, and a plurality of sliding chutes for the clamping jaws to move radially relative to the fixture chassis are arranged on the fixture chassis at intervals;

a silicon disc is placed in the mould and used for positioning the silicon disc;

the clamping jaws are arranged on the clamp chassis at intervals, and each clamping jaw is provided with a horizontal end face and a protruding part integrally arranged on the extending part.

Optionally, the pressing mechanism comprises a pressing plate in contact with the silicon disc, a threaded lead screw fixedly connected above the pressing plate, a rotating structural member arranged above the lead screw and integrally formed with the lead screw, and a fixing nut;

the pressure plate is arranged below the upper layer frame of the frame main body and at a position right opposite to the silicon plate;

the screw rod is matched and connected with a threaded hole formed in the upper-layer frame, and the screw rod is driven to rotate through a rotating structural part, so that the pressure plate moves up and down on the upper-layer frame;

the fixed nut is used for limiting the lead screw to rotate relative to the upper layer frame.

Optionally, the workpiece polishing mechanism comprises a polishing device and an adjusting bracket for supporting the polishing device;

the grinding device comprises a grinding wheel and a motor;

the adjusting bracket comprises a fixed support rod arranged above the silicon disc, a movable support rod arranged with the fixed support rod in a sliding way and a fixing bolt used for fixing the movable support rod on the fixed support rod;

the fixed end of the motor is fixedly connected with the movable support rod, and the output end of the motor drives the grinding wheel to rotate so that the grinding wheel rotates in a vertical plane to polish the silicon disc;

one end of the fixed supporting rod is movably connected with the side part of the upper-layer frame up and down, a horizontal sliding rail is arranged on the front side of the fixed supporting rod, a sliding block is arranged in the horizontal sliding rail in a sliding mode, the sliding block is fixedly connected with one end of the movable supporting rod to drive the movable supporting rod to slide left and right in the horizontal sliding rail, and the other end of the movable supporting rod is fixed with the motor through a bolt;

the movable supporting rod is fixed with the fixed supporting rod through a fixing bolt.

Optionally, a support frame is arranged below the lower-layer frame of the frame main body, one end of the support frame is connected with the upper-layer frame, the other end of the support frame is connected with the lower-layer frame and used for fixing a workpiece rotating mechanism, and the workpiece rotating mechanism penetrates through the lower-layer frame and is fixedly connected with the clamp chassis;

the screw rod penetrates through the upper layer frame to be movably connected with the pressure plate silicon disc.

Optionally, the upper frame includes a frame main board and a support leg integrally formed with the frame main board and disposed at the left and right ends of the middle portion of the bottom surface of the frame main board, a vertical guide rail is disposed on a side surface of the support leg close to the silicon tray, a guide rail block is slidably disposed in the vertical guide rail, and the guide rail block is fixedly connected with one end of the fixed support rod to drive the fixed support rod to slide up and down in the vertical guide rail, and the fixed support rod is fixed with the support leg through a positioning bolt.

Optionally, the lower frame comprises a horizontal panel;

the four corners of the bottom surface of the horizontal panel are uniformly provided with supporting columns in a forming mode, the four supporting columns are fixedly connected with the horizontal panel, the middle of the horizontal panel is a plane, and the workpiece rotating mechanism penetrates through the horizontal panel and is fixed on the plane through a bearing seat.

Optionally, the workpiece rotating mechanism includes a speed reduction motor fixedly mounted on the support frame, and a coupler connected to an output end of the speed reduction motor, and the coupler passes through the plane through a transmission shaft and is fixedly connected to the fixture chassis.

Optionally, the grinding wheel is a profiled grinding wheel.

Optionally, the support frame includes a horizontal support and a vertical support, one end of the horizontal support is fixedly mounted with one of the support legs, the other end of the horizontal support is fixedly mounted with one end of the vertical support, the other end of the vertical support is fixed with the horizontal plate, and the vertical support is fixed with the gear motor.

(III) advantageous effects

The utility model has the advantages that: the utility model discloses a silicon disc chamfering device, through installing work piece slewing mechanism in frame main part below, this work piece slewing mechanism passes the lower floor's frame of frame main part and drives rather than fixed clamping mechanism and rotate, and then drives the clamping mechanism centre gripping be equipped with treat that the silicon disc of polishing is rotatory. And a pressing mechanism which penetrates through the upper layer frame of the frame main body presses the silicon disc in the vertical direction. That is to say, through work piece grinding mechanism to the tight silicon dish that compresses tightly with vertical direction of horizontal direction clamp polish the chamfer, for prior art, its easy operation, convenient to use. Meanwhile, the installation is convenient, and labor is saved while the chamfering time of the silicon disc is greatly prolonged.

Drawings

FIG. 1 is a schematic perspective view of a silicon disk chamfering apparatus according to the present invention;

FIG. 2 is a schematic sectional view of a silicon disk chamfering apparatus according to the present invention;

FIG. 3 is a schematic perspective view of a connecting portion between an adjusting bracket and a first frame of a workpiece polishing mechanism of the silicon disc chamfering apparatus according to the present invention;

FIG. 4 is a top cross-sectional view of a connecting portion of an adjustment bracket and a first frame of the workpiece sharpening mechanism of FIG. 3;

FIG. 5 is a left side schematic cross-sectional view of a portion of an adjustment bracket of the workpiece sharpening mechanism of FIG. 3 coupled to a first frame;

FIG. 6 is a schematic partially cross-sectional top view of an adjustment bracket of the workpiece sharpening mechanism of FIG. 3;

FIG. 7 is a left side cross-sectional view of an adjustment bracket of the workpiece sharpening mechanism of FIG. 3;

FIG. 8 is a schematic front sectional view of a horizontal panel of a second frame of the silicon disk chamfering apparatus according to the present invention;

fig. 9 is a schematic top view of the clamping mechanism of the silicon disk chamfering apparatus according to the present invention;

FIG. 10 is a schematic front cross-sectional view of FIG. 9;

fig. 11 is a schematic top view of a frame main plate of the silicon disk chamfering apparatus of the present invention, which does not show the first frame;

fig. 12 is a schematic partial front sectional view of a polishing device of a silicon disc chamfering device according to the present invention.

[ description of reference ]

100: a first frame; 101: a frame main board; 102: a support leg; 103: a vertical guide rail; 104: a guide rail block; 105: positioning the bolt;

200: a workpiece rotating mechanism; 201: a reduction motor; 202: a coupling; 203: a bearing; 204: a pedestal bearing; 205: a tilting bracket;

300: a clamping mechanism; 301: a clamp chassis; 302: a clamping jaw; 302-1: a horizontal end face; 302-2: a protrusion; 303: a chute;

400: a hold-down mechanism; 401: a platen; 402: a lead screw; 403: rotating the structural member; 404: fixing a nut;

500: a workpiece polishing mechanism; 510: a polishing device; 511: a grinding wheel; 512: a motor; 520: adjusting the bracket; 521: fixing the supporting rod; 522: a movable strut; 523: fixing the bolt; 524: a horizontal slide rail; 525: a slider;

600: a mold;

700: a second frame; 701: a horizontal panel; 702: a baffle plate; 703: a pillar; 704: a waste liquid discharge port;

800: a support frame; 801: a horizontal support; 802: a vertical support;

900: and a silicon disc.

Detailed Description

For a better understanding of the present invention, reference will now be made in detail to the present invention, examples of which are illustrated in the accompanying drawings. Where directional terms such as "upper", "lower", "front" and "rear" are used herein, reference is made to the orientation of FIG. 1.

Referring to fig. 1, 2 and 11, a silicon disc chamfering apparatus according to an embodiment of the present invention includes a frame main body, a workpiece rotating mechanism 200, a clamping mechanism 300, a pressing mechanism 400 and a workpiece polishing mechanism 500;

the workpiece rotating mechanism 200 passes through the frame body from the lower part of the frame body to be in driving connection with the clamping mechanism 300 so as to drive the clamping mechanism 300 for clamping the silicon disc 900 to rotate in the horizontal plane;

the pressing mechanism 400 penetrates through the frame body from the upper part of the frame body to press the silicon disc 900 clamped by the clamping mechanism 300;

the workpiece polishing mechanism 500 is disposed on a side portion of the frame body, and a front end of the workpiece polishing mechanism 500 rotates in a vertical plane to polish the silicon disk 900.

The utility model discloses an install work piece slewing mechanism 200 in frame main part below, this work piece slewing mechanism 200 passes the lower floor's frame 700 drive of frame main part and rotates rather than fixed clamping mechanism 300, and then drives clamping mechanism 300 and be equipped with the silicon dish 900 rotations of waiting to polish of centre gripping. The pressing mechanism 400 on the upper frame 100 passing through the frame body presses the silicon disk 900 in the vertical direction. That is to say, the silicon disc 900 clamped in the horizontal direction and pressed in the vertical direction is polished and chamfered by the workpiece polishing mechanism 500, and compared with the prior art, the silicon disc polishing mechanism is simple to operate and convenient to use. Meanwhile, the installation is convenient, and labor is saved while the chamfering time of the silicon disc 900 is greatly prolonged.

Referring to fig. 1, 2, 9 and 10, further, the clamping mechanism 300 includes a clamp base 301, a mold 600 and a plurality of clamping jaws 302 for clamping the mold 600.

The fixture base plate 301 is connected with the workpiece rotating mechanism 200, and a plurality of sliding grooves 303 for the clamping jaws 302 to move radially relative to the fixture base plate 301 are arranged on the fixture base plate 301 at intervals.

A silicon disk is placed in the mold 600 for positioning the silicon disk 900.

The jaws 302 are spaced apart on the clamp base 301, the jaws 302 having horizontal end faces 302-1 and integrally formed projections 302-2 on the extension.

In this embodiment, the clamping jaws 302 with a diameter of about 100mm-150mm are selected to be suitable for chamfering silicon disks 900 with a diameter of 200mm-500 mm. The matched mold 600 is selected according to the size of the silicon disc 900, then the mold 600 is placed on the horizontal end face 302-1, the position of the clamping jaw 302 in the sliding groove 303 is adjusted according to the size of the mold, and then the mold is fixed through bolts, so that the protruding portion 302-2 and the mold 600 are clamped exactly, the mold 600 is fixed on the horizontal section, and the mold 600 is prevented from moving on the horizontal position.

Referring to fig. 1 and 2, further, the pressing mechanism 400 includes a platen 401 contacting the silicon disc 900, a threaded lead screw 402 fixedly connected to an upper portion of the platen 401, a rotary structure 403 integrally formed with the lead screw 402 and a fixing nut 404 disposed above the lead screw 402.

The platen 401 is disposed under the upper frame 100 of the frame body at a position directly opposite to the silicon disk 900.

The screw 402 is connected to a threaded hole provided in the upper frame 100, and the screw 402 is driven to rotate by rotating the rotating structure 403, so that the platen 401 moves up and down on the frame main board 101 of the upper frame 100. Wherein, the diameter of the screw 402 is selected from M20-M35.

The fixing nut 404 is used to limit the rotation of the screw 402 relative to the upper frame 100.

In this embodiment, the rotating structure 403 rotates to further drive the screw 402 to rotate downward in the threaded hole on the frame main board 101, until the bottom surface of the platen 401 is pressed and attached to the silicon disc 900 in the mold 600, the rotating structure 403 stops rotating, and the screw 402 is fixed on the frame main board 101 through the fixing nut 404. Wherein the diameter M30 of the lead screw 402.

Referring to fig. 1, 3, 6 and 7, further, the workpiece grinding mechanism 500 includes a grinding device 510 and an adjusting bracket 520 supporting the grinding device 510;

the grinding device 510 comprises a grinding wheel 511 and a motor 512;

the adjusting bracket 520 comprises a fixed strut 521 arranged above the silicon disc 900, a movable strut 522 slidably mounted with the fixed strut 521, and a fixing bolt 523 used for fixing the movable strut 522 on the fixed strut 521;

the fixed end of the motor 512 is fixedly connected with the movable support rod 522, and the output end of the motor 512 drives the grinding wheel 511 to rotate so that the grinding wheel rotates in a vertical plane to grind the silicon disc 900;

one end of the fixed support rod 521 is movably connected with the side part of the upper frame 100 up and down, a horizontal slide rail 524 is arranged on the front side of the fixed support rod 521, a slide block 525 is slidably mounted in the horizontal slide rail 524, the slide block 525 is fixedly connected with one end of the movable support rod 522 so as to drive the movable support rod 522 to slide left and right in the horizontal slide rail 524, and the other end of the movable support rod 522 is fixed with the motor 512 through a bolt;

the movable strut 522 is fixed to the fixed strut 521 by a fixing bolt 523.

In this embodiment, the guide rail block 104 is connected to one end of the fixed support rod 521 of the adjusting bracket 520, so that the guide rail block 104 can be adjusted to move up and down in the vertical direction, and further the fixed support rod 521 fixedly connected to the guide rail block 104 is driven to move up and down, so that the movable support rod 522 connected to the fixed support rod 521 moves, and the motor 512 and the grinding wheel 511 connected to the movable support rod 522 through bolts move up and down on the support leg 102; the sliding block 525 slides left and right on the horizontal guide rail 524 to drive the movable support rod 522 connected with the sliding block 525 to slide left and right, and the motor 512 connected with the movable support rod 522 through a bolt and the grinding wheel 511 move left and right on the fixed support rod 521; the two movements are used to change the position of the grinding wheel 511 in the vertical direction of the supporting leg 102 and the position of the fixing strut 521 in the horizontal direction, so as to match the silicon disc 900 on the mold 600 for grinding.

It should be noted that the above-mentioned two structures for realizing the change of the position of the grinding wheel 511 in the vertical direction of the supporting leg 102 and the change of the position of the fixing strut 521 in the horizontal direction are the simplest structures, and the adjustment of each position is completely performed by manual operation, which is economically practical, simple in structure and relatively easy to operate and maintain. The adjustment in the horizontal direction and the vertical direction can be finished in a pneumatic or hydraulic mode, and the structure is simple and reliable.

Referring to fig. 1 and 2, further, a supporting frame 800 is arranged below the lower frame 700 of the frame body, one end of the supporting frame 800 is connected to the upper frame 100, the other end of the supporting frame 800 is connected to the lower frame 700 for fixing the workpiece rotating mechanism 200, and the workpiece rotating mechanism 200 passes through the lower frame 700 and is fixedly connected to the clamp chassis 301;

the screw 402 passes through the upper frame 100 and is movably connected with the silicon disc 900 of the pressure plate 401.

Referring to fig. 1, 3, 4 and 5, further, the upper frame 100 includes a frame main board 101 and support legs 102 integrally formed with the frame main board 101 and disposed at the left and right ends of the middle of the bottom surface of the frame main board 101, a vertical guide rail 103 is disposed on one side surface of the support leg 102 close to the silicon tray 900, a guide rail block 104 is slid in the vertical guide rail 103, the guide rail block 104 is fixedly connected with one end of the fixing strut 521 to drive the fixing strut 521 to slide up and down in the vertical guide rail 103, and the fixing strut 521 is fixed with the support leg 102 through a positioning bolt 105.

Referring to fig. 1, 2 and 8, further, the lower frame 700 includes a horizontal panel 701;

the four corners of the bottom surface of the horizontal panel 701 are provided with the pillars 703 integrally, the four pillars 703 are fixedly connected with the horizontal panel 701, the middle part of the horizontal panel 701 is a plane, and the workpiece rotating mechanism 200 penetrates through the horizontal panel 701 and is fixed on the plane through the bearing seat 204. The four corners of the bottom surface of the horizontal panel 701 are integrally provided with pillars 703, and the four pillars 703 are fixedly connected with the horizontal panel 701. The horizontal panel 701 is spaced from the ground by about 1 meter so that the operator can normally stand for operation. The middle of the horizontal plate 701 is flat to facilitate the installation of bearings and to ensure that the upper jaw 302 and the mold 600 are horizontal. The workpiece rotating mechanism 200 is fixed on the plane through the horizontal panel 701 by the bearing 204 with a seat.

In this embodiment, a grinding wheel or a grinding head is used to grind off part of the material on the silicon disc 900, and during the grinding process, heat is generated due to friction, so that water is required to be used for cooling at any time, and the water also plays a role in flushing away the ground waste impurities so as to prevent the influence on the subsequent chamfering effect. In order to prevent the waste liquid after cooling and flushing from splashing. To this end, the second frame 700 further includes a baffle 702 surrounding the peripheral edge of the horizontal plate 701. The horizontal plate 701 is provided with a waste liquid outlet 704 for discharging waste liquid. Meanwhile, the edge of the horizontal panel 701 is lower than the middle of the horizontal panel 701, so that the waste liquid discharge effect is better.

Further, the workpiece rotating mechanism 200 includes a speed reducing motor 201 fixedly mounted with the supporting frame 800, and a coupling 202 connected with an output end of the speed reducing motor 201. The coupling 202 passes through the plane through the transmission shaft 203 and is fixedly connected with the clamp chassis 301. One end of the coupler 202 far away from the speed reducing motor 201 is fixedly connected with the clamp chassis 301.

In this embodiment, the gear motor 201 rotates to drive the coupler 202 to rotate, and the coupler 202 drives the fixture chassis 301 to rotate through the transmission shaft 203, so that the mold 600 clamped by the clamping jaws 302 is rotatably matched with the chamfer in the horizontal direction.

It should be noted that when the speed reduction motor 201 drives the silicon disc 900 pressed by the pressure disc 401 to rotate, the pressure disc 401 also rotates along with the silicon disc, and a rotation bearing is further disposed in the threaded hole of the frame main board 101 to ensure the operation.

Referring to fig. 12, further, the grinding wheel 511 is a profiled grinding wheel. Wherein, the outer edge of the special-shaped grinding wheel is a truncated cone, and a concave surface is formed from top to bottom.

In this embodiment, when the silicon disc 900 has an irregular shape during processing, the silicon disc 900 is damaged, and even if an abnormality occurs during the processing operation, the processing damage of the silicon disc 900 can be reduced as much as possible by the irregular-shaped grinding wheel because the shape of the irregular-shaped grinding wheel is matched with that of the lower die 600.

Referring to fig. 1 and 2, further, the supporting frame 800 includes a horizontal bracket 801 and a vertical bracket 802, one end of the horizontal bracket 801 is fixedly installed with one of the legs 102, the other end of the horizontal bracket 801 is fixedly installed with one end of the vertical bracket 802, the other end of the vertical bracket 802 is fixed with the horizontal panel 701, and the vertical bracket 802 is fixed with the reduction motor 201. Inclined struts 205 are provided between the horizontal panel 701 and the legs 102 to form a triangular structure, increasing the stability of the horizontal panel 701.

In the present embodiment, the reduction motor 512 is installed below the horizontal panel 701, so that the vibration can be reduced to some extent.

In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.

In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present invention have been shown and described, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that modifications, alterations, substitutions and variations may be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A silicon disc chamfering device is characterized in that: comprises a frame body, a workpiece rotating mechanism (200), a clamping mechanism (300), a pressing mechanism (400) and a workpiece polishing mechanism (500);

the workpiece rotating mechanism (200) penetrates through the frame body from the lower part of the frame body to be in driving connection with the clamping mechanism (300) so as to drive the clamping mechanism (300) for clamping the silicon disc (900) to rotate in a horizontal plane;

the pressing mechanism (400) presses the silicon disc (900) clamped by the clamping mechanism (300) from above the frame body through the frame body;

the workpiece polishing mechanism (500) is arranged on the side part of the frame main body, and the front end of the workpiece polishing mechanism (500) rotates in a vertical plane to polish the silicon disc (900);

inclined struts (205) are provided on the frame body to form a triangular structure.

2. The silicon disk chamfering apparatus according to claim 1, wherein: the clamping mechanism (300) comprises a clamp chassis (301), a mould (600) and a plurality of clamping jaws (302) for clamping the mould (600);

the clamp chassis (301) is connected with the workpiece rotating mechanism (200), and a plurality of sliding grooves (303) for the clamping jaws (302) to move radially relative to the clamp chassis (301) are arranged on the clamp chassis (301) at intervals;

placing the silicon disc in the mould (600) for positioning the silicon disc (900);

the clamping jaws (302) are arranged on the clamp chassis (301) at intervals, and the clamping jaws (302) are provided with horizontal end faces (302-1) and protruding portions (302-2) integrally arranged on the extending portions.

3. The silicon disk chamfering apparatus according to claim 2, wherein: the pressing mechanism (400) comprises a pressing plate (401) contacted with the silicon plate (900), a threaded lead screw (402) fixedly connected above the pressing plate (401), a rotating structural part (403) arranged above the lead screw (402) and integrally formed with the lead screw (402), and a fixing nut (404);

the pressing disc (401) is arranged below the upper layer frame (100) of the frame body and at a position right opposite to the silicon disc (900);

the screw rod (402) is matched and connected with a threaded hole formed in the upper-layer frame (100), and the rotating structural part (403) is rotated to drive the screw rod (402) to rotate, so that the pressing plate (401) moves up and down on the upper-layer frame (100);

the fixing nut (404) is used for limiting the lead screw (402) to rotate relative to the upper layer frame (100).

4. The silicon disk chamfering apparatus according to claim 3, wherein: the workpiece polishing mechanism (500) comprises a polishing device (510) and an adjusting bracket (520) for supporting the polishing device (510);

the grinding device (510) comprises a grinding wheel (511) and a motor (512);

the adjusting bracket (520) comprises a fixed support rod (521) arranged above the silicon disc (900), a movable support rod (522) in sliding installation with the fixed support rod (521), and a fixing bolt (523) for fixing the movable support rod (522) on the fixed support rod (521);

the fixed end of the motor (512) is fixedly connected with the movable support rod (522), and the output end of the motor (512) drives the grinding wheel (511) to rotate so as to enable the grinding wheel to rotate in a vertical plane to grind the silicon disc (900);

one end of the fixed support rod (521) is movably connected with the side portion of the upper-layer frame (100) up and down, a horizontal sliding rail (524) is arranged on the front side of the fixed support rod (521), a sliding block (525) is installed in the horizontal sliding rail (524) in a sliding mode, the sliding block (525) is fixedly connected with one end of the movable support rod (522) so as to drive the movable support rod (522) to slide left and right in the horizontal sliding rail (524), and the other end of the movable support rod (522) is fixed with the motor (512) through a bolt;

the movable supporting rod (522) is fixed with the fixed supporting rod (521) through the fixing bolt (523).

5. The silicon disk chamfering apparatus according to claim 4, wherein: a support frame (800) is arranged below a lower layer frame (700) of the frame main body, one end of the support frame (800) is connected with the upper layer frame (100), the other end of the support frame (800) is connected with the lower layer frame (700) and used for fixing the workpiece rotating mechanism (200), and the workpiece rotating mechanism (200) penetrates through the lower layer frame (700) and is fixedly connected with the clamp chassis (301);

the lead screw (402) penetrates through the upper layer frame (100) and is movably connected with the silicon disc (900) of the pressing disc (401).

6. The silicon disk chamfering apparatus according to claim 5, wherein: upper frame (100) include frame mainboard (101) and with frame mainboard (101) integrated into one piece ground, and set up landing leg (102) at both ends about frame mainboard (101) bottom surface middle part, landing leg (102) are close to vertical guide rail (103) have been seted up on one side of silicon disc (900), it has guide rail piece (104) to slide in vertical guide rail (103), guide rail piece (104) with the one end fixed connection of fixed branch (521), in order to drive fixed branch (521) are in slide from top to bottom in vertical guide rail (103), fixed branch (521) pass through positioning bolt (105) with landing leg (102) are fixed mutually.

7. The silicon disk chamfering apparatus according to claim 6, wherein: the lower frame (700) comprises a horizontal panel (701);

the four corners of the bottom surface of the horizontal panel (701) are uniformly provided with support columns (703) in a forming mode, the four support columns (703) are fixedly connected with the horizontal panel (701), the middle of the horizontal panel (701) is a plane, and the workpiece rotating mechanism (200) penetrates through the horizontal panel (701) and is fixed on the plane through a bearing seat (204).

8. The silicon disk chamfering apparatus according to claim 7, wherein: the workpiece rotating mechanism (200) comprises a speed reducing motor (201) fixedly mounted on the support frame (800) and a coupler (202) connected with the output end of the speed reducing motor (201), wherein the coupler (202) penetrates through the plane through a transmission shaft (203) and is fixedly connected with the clamp chassis (301).

9. The silicon disk chamfering apparatus according to claim 4, wherein: the grinding wheel is a special-shaped grinding wheel (511).

10. The silicon disk chamfering apparatus according to claim 8, wherein: the supporting frame (800) comprises a horizontal support (801) and a vertical support (802), one end of the horizontal support (801) is fixedly mounted with one of the supporting legs (102), the other end of the horizontal support (801) is fixedly mounted with one end of the vertical support (802), the other end of the vertical support (802) is fixed with the horizontal panel (701), and the vertical support (802) is fixed with the speed reduction motor (201).

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