CN105127053A - Dispensing mechanism of chip assembling machine - Google Patents

Dispensing mechanism of chip assembling machine Download PDF

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Publication number
CN105127053A
CN105127053A CN201510653186.5A CN201510653186A CN105127053A CN 105127053 A CN105127053 A CN 105127053A CN 201510653186 A CN201510653186 A CN 201510653186A CN 105127053 A CN105127053 A CN 105127053A
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China
Prior art keywords
glue
point
dispensing
installing plate
point glue
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Application number
CN201510653186.5A
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Chinese (zh)
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CN105127053B (en
Inventor
刘俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongxiang City, Zhou Quan Jia plastic products factory
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Suzhou Daenke Precision Machinery Co Ltd
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Priority to CN201510653186.5A priority Critical patent/CN105127053B/en
Publication of CN105127053A publication Critical patent/CN105127053A/en
Application granted granted Critical
Publication of CN105127053B publication Critical patent/CN105127053B/en
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Abstract

The invention discloses a dispensing mechanism of a chip assembling machine. The dispensing mechanism of the chip assembling machine comprises a dispensing fixing plate, a dispensing device and a glue supplying device; the dispensing device and the glue supplying device are arranged on the upper surface of the dispensing fixing plate; a dispensing mechanical arm of the dispensing device is located above a dispensing disc of the glue supplying device; the dispensing device further comprises a dispensing installing plate, a dispensing air cylinder, a dispensing clamping connector, a clamping connector support, a dispensing connecting strip, dispensing buffers, a dispensing buffer support, a dispensing sliding block and a dispensing sliding rail; a piston rod of the dispensing air cylinder is connected with the dispensing clamping connector; the dispensing clamping connector is connected with one end of the dispensing connecting strip through the clamping connector support, and the other end of the dispensing connecting strip is fixed to the side face of a dispensing connecting plate of the dispensing mechanical arm; the dispensing installing plate is connected to the rear side face of the dispensing connecting plate through the dispensing sliding block and the dispensing sliding rail. In this way, manual work can be replaced, automatic glue injection is achieved, the production efficiency is improved, and the production cost is reduced.

Description

The glue applying mechanism of chipset installation
Technical field
The present invention relates to field of machinery automation, particularly relate to the glue applying mechanism of a kind of chipset installation.
Background technology
Along with the development of semiconductor technology, the chip that more and more can realize difference in functionality is used to the such as electronic goods such as mobile phone and computer, make the life of people more and more convenient, except the people's livelihood, outside Military Electronics industry, energy aspect such as solar energy industry and Lighting Industry all have sizable association with semiconductor, the chip that semiconductor technology is produced can be used in above-mentioned field widely, the qualification rate of chip directly determines the quality of end product, chip can be subject to different External Force Actings in an assembling process, easily make the die stress place of concentrating produce slight crack and even cause chip rupture, in view of this, be necessary that the glue applying mechanism to existing chipset is installed is improved.
Summary of the invention
The technical problem that the present invention mainly solves is to provide the glue applying mechanism of a kind of chipset installation, can substitute artificial injecting glue automatically, enhance productivity, reduce production cost.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide the glue applying mechanism that a kind of chipset is installed, the glue applying mechanism of this chipset installation comprises a glue fixed head, point glue equipment and colloid feeding device, on described some glue fixed head, plane is provided with point glue equipment and colloid feeding device, the point gum machine tool hand of point glue equipment is positioned at above the some lacquer disk(-sc) of colloid feeding device, described point glue equipment also comprises a glue installing plate, point glue cylinder, point glue clamping joint, clamping joint support, point glue connection strap, point glue buffer, point glue bumper support, point glue slide block and some glue slide rail, described some glue installing plate trailing flank is installed a glue cylinder, the piston rod of some glue cylinder is connected to a glue clamping joint, point glue clamping joint is fixedly connected with clamping joint support, clamping joint support is connected to one end of glue connection strap, the other end of some glue connection strap is fixed on the some glue connecting plate side of point gum machine tool hand, point glue connecting plate both sides are provided with a glue buffer, point glue buffer is all fixed on a glue installing plate by some glue bumper support, point glue connecting plate trailing flank fixedly has a glue slide block, point glue installing plate leading flank fixedly has a glue slide rail, point glue slide block coordinates with some glue slide rail,
Preferably, described point gum machine tool hand also comprises a glue motor, point glue driving wheel, point glue odontoid belt, point glue driven pulley, driven pulley support, point glue tooth belt metalwork, point glue lifting slider, point glue lifting slider installing plate, point glue lifting sliding rail, point glue induction iron, point glue inductor, point glue spring, point glue spring support, fixed block connecting plate, point plastic pin and some plastic pin fixed block, described some glue connecting plate side is installed a glue motor, the motor shaft of some glue motor is installed and has a glue driving wheel, on some glue driving wheel, cover has a glue odontoid belt, point glue odontoid belt is connected to a glue driven pulley, point glue driven pulley is fixed on a glue connecting plate side by driven pulley support, the two ends of some glue odontoid belt are connected to a glue tooth belt metalwork, point glue tooth belt metalwork is connected to a glue lifting slider installing plate, point glue lifting slider installing plate trailing flank fixedly has a glue lifting slider, point glue connecting plate leading flank is installed a glue lifting sliding rail, point glue lifting slider coordinates with some glue lifting sliding rail, fixedly there is a glue induction iron point glue lifting slider installing plate upper edge, a glue inductor is provided with above some glue induction iron, point glue inductor is fixed on a glue connecting plate upper edge, point glue lifting slider installing plate leading flank right-hand member is connected by screw the one end of putting glue spring, the other end of some glue spring is connected to a glue connecting plate by some glue spring support, point glue lifting slider installing plate leading flank left end is connected to fixed block connecting plate, fixed block connecting plate leading flank is connected to a plastic pin fixed block, point plastic pin fixed block is fitted with four point plastic pins,
Preferably, described colloid feeding device also comprises colloid stopping means, point lacquer disk(-sc) installing plate, point lacquer disk(-sc) support, micromachine, " ┗ " shape motor mounting plate, driving pulley, colloid odontoid belt, colloid driven pulley, connecting axle and bearing, described some lacquer disk(-sc) installing plate lower plane is provided with a lacquer disk(-sc) support, point lacquer disk(-sc) installing plate lower plane is connected to " ┗ " shape motor mounting plate upper edge, " ┗ " shape motor mounting plate lower plane is provided with micromachine, the motor shaft of micromachine is provided with driving pulley, on driving pulley, cover has colloid odontoid belt, colloid odontoid belt is connected to colloid driven pulley, colloid driven pulley is installed on connecting axle lower end, in the middle of connecting axle, bearing is installed, bearing is plugged in a lacquer disk(-sc) installing plate, connecting axle upper end is plugged in bottom a lacquer disk(-sc), glue is provided with in some lacquer disk(-sc), the banking stop of colloid stopping means is provided with above glue,
Preferably, described colloid stopping means also comprises banking stop installing plate, position limiting slide block, spacing slide rail, slide rail mounting bracket, limit spring, limit spring support, micrometer head, micrometer head mounting clamp and micrometer head connecting plate, described banking stop is fixed on banking stop installing plate, banking stop installing plate side is provided with position limiting slide block, slide rail mounting bracket side is provided with spacing slide rail, position limiting slide block coordinates with spacing slide rail, slide rail mounting bracket is fixed on plane on a lacquer disk(-sc) installing plate, slide rail mounting bracket side is connected to limit spring support, limit spring support is connected to one end of limit spring, the other end of limit spring is connected to banking stop installing plate upper edge, banking stop installing plate side is provided with micrometer head connecting plate, micrometer head connecting plate lower end is provided with micrometer head, micrometer head and micrometer head mounting clamp are fixed, micrometer head mounting clamp is fixed on a lacquer disk(-sc) installing plate side edge.
The invention has the beneficial effects as follows: the glue applying mechanism of a kind of chipset installation of the present invention, can substitute artificial injecting glue automatically, enhance productivity, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the glue applying mechanism of chipset of the present invention installation;
Fig. 2 is the structural representation of the point glue equipment of the glue applying mechanism of chipset of the present invention installation;
Fig. 3 is the structural representation of the colloid feeding device of the glue applying mechanism of chipset of the present invention installation.
Detailed description of the invention
Below in conjunction with accompanying drawing, present pre-ferred embodiments is described in detail, to make the advantage of invention and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Refer to Fig. 1 to Fig. 3, the embodiment of the present invention comprises:
A kind of glue applying mechanism of chipset installation, the glue applying mechanism of this chipset installation comprises a glue fixed head 31, point glue equipment 32 and colloid feeding device 33, on described some glue fixed head 31, plane is provided with point glue equipment 32 and colloid feeding device 33, the point gum machine tool hand 326 of point glue equipment 32 is positioned at above the some lacquer disk(-sc) 331 of colloid feeding device 33, described point glue equipment 32 also comprises a glue installing plate 321, point glue cylinder 322, point glue clamping joint 323, clamping joint support 324, point glue connection strap 325, point glue buffer 327, point glue bumper support 328, point glue slide block 329 and some glue slide rail 3210, described some glue installing plate 321 trailing flank is installed a glue cylinder 322, the piston rod of some glue cylinder 322 is connected to a glue clamping joint 323, point glue clamping joint 323 is fixedly connected with clamping joint support 324, clamping joint support 324 is connected to one end of glue connection strap 325, the other end of some glue connection strap 325 is fixed on some glue connecting plate 3261 side of point gum machine tool hand 326, point glue connecting plate 3261 both sides are provided with a glue buffer 327, point glue buffer 327 is all fixed on a glue installing plate 321 by some glue bumper support 328, point glue connecting plate 3261 trailing flank fixedly has a glue slide block 329, point glue installing plate 321 leading flank fixedly has a glue slide rail 3210, point glue slide block 329 coordinates with some glue slide rail 3210,
Described point gum machine tool hand 326 also comprises a glue motor 3262, point glue driving wheel 3263, point glue odontoid belt 3264, point glue driven pulley 3265, driven pulley support 3266, point glue tooth belt metalwork 3267, point glue lifting slider 3268, point glue lifting slider installing plate 3269, point glue lifting sliding rail 32610, point glue induction iron 32611, point glue inductor 32612, point glue spring 32613, point glue spring support 32614, fixed block connecting plate 32615, point plastic pin 32616 and some plastic pin fixed block 32617, described some glue connecting plate 3261 side is installed a glue motor 3262, the motor shaft of some glue motor 3262 is installed and has a glue driving wheel 3263, on some glue driving wheel 3263, cover has a glue odontoid belt 3264, point glue odontoid belt 3264 is connected to a glue driven pulley 3265, point glue driven pulley 3265 is fixed on glue connecting plate 3261 side by driven pulley support 3266, the two ends of some glue odontoid belt 3264 are connected to a glue tooth belt metalwork 3267, point glue tooth belt metalwork 3267 is connected to a glue lifting slider installing plate 3269, point glue lifting slider installing plate 3269 trailing flank fixedly has a glue lifting slider 3268, point glue connecting plate 3261 leading flank is installed a glue lifting sliding rail 32610, point glue lifting slider 3268 coordinates with some glue lifting sliding rail 32610, fixedly there is a glue induction iron 32611 point glue lifting slider installing plate 3269 upper edge, a glue inductor 32612 is provided with above some glue induction iron 32611, point glue inductor 32612 is fixed on glue connecting plate 3261 upper edge, point glue lifting slider installing plate 3269 leading flank right-hand member is connected by screw the one end of putting glue spring 32613, the other end of some glue spring 32613 is connected to a glue connecting plate 3261 by some glue spring support 32614, point glue lifting slider installing plate 3269 leading flank left end is connected to fixed block connecting plate 32615, fixed block connecting plate 32615 leading flank is connected to a plastic pin fixed block 32617, point plastic pin fixed block 32617 is fitted with four point plastic pins 32616,
Described colloid feeding device 33 also comprises colloid stopping means 332, point lacquer disk(-sc) installing plate 333, point lacquer disk(-sc) support 334, micromachine 335, " ┗ " shape motor mounting plate 336, driving pulley 337, colloid odontoid belt 338, colloid driven pulley 339, connecting axle 3310 and bearing 3311, described some lacquer disk(-sc) installing plate 333 lower plane is provided with a lacquer disk(-sc) support 334, point lacquer disk(-sc) installing plate 333 lower plane is connected to " ┗ " shape motor mounting plate 336 upper edge, " ┗ " shape motor mounting plate 336 lower plane is provided with micromachine 335, the motor shaft of micromachine 335 is provided with driving pulley 337, on driving pulley 337, cover has colloid odontoid belt 338, colloid odontoid belt 338 is connected to colloid driven pulley 339, colloid driven pulley 339 is installed on connecting axle 3310 lower end, in the middle of connecting axle 3310, bearing 3311 is installed, bearing 3311 is plugged in a lacquer disk(-sc) installing plate 333, connecting axle 3310 upper end is plugged in bottom a lacquer disk(-sc) 331, point lacquer disk(-sc) 331 li is provided with glue, the banking stop 3321 of colloid stopping means 332 is provided with above glue,
Described colloid stopping means 332 also comprises banking stop installing plate 3322, position limiting slide block 3323, spacing slide rail 3324, slide rail mounting bracket 3325, limit spring 3326, limit spring support 3327, micrometer head 3328, micrometer head mounting clamp 3329 and micrometer head connecting plate 33210, described banking stop 3321 is fixed on banking stop installing plate 3322, banking stop installing plate 3322 side is provided with position limiting slide block 3323, slide rail mounting bracket 3325 side is provided with spacing slide rail 3324, position limiting slide block 3323 coordinates with spacing slide rail 3324, slide rail mounting bracket 3325 is fixed on plane on a lacquer disk(-sc) installing plate 333, slide rail mounting bracket 3325 side is connected to limit spring support 3327, limit spring support 3327 is connected to one end of limit spring 3326, the other end of limit spring 3326 is connected to banking stop installing plate 3322 upper edge, banking stop installing plate 3322 side is provided with micrometer head connecting plate 33210, micrometer head connecting plate 33210 lower end is provided with micrometer head 3328, micrometer head 3328 is fixed with micrometer head mounting clamp 3329, micrometer head mounting clamp 3329 is fixed on a lacquer disk(-sc) installing plate 333 side edge.
The glue applying mechanism of chipset installation of the present invention, can substitute artificial injecting glue automatically, enhance productivity, reduce production cost.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. the glue applying mechanism of a chipset installation, it is characterized in that: the glue applying mechanism of this chipset installation comprises a glue fixed head, point glue equipment and colloid feeding device, on described some glue fixed head, plane is provided with point glue equipment and colloid feeding device, the point gum machine tool hand of point glue equipment is positioned at above the some lacquer disk(-sc) of colloid feeding device, described point glue equipment also comprises a glue installing plate, point glue cylinder, point glue clamping joint, clamping joint support, point glue connection strap, point glue buffer, point glue bumper support, point glue slide block and some glue slide rail, described some glue installing plate trailing flank is installed a glue cylinder, the piston rod of some glue cylinder is connected to a glue clamping joint, point glue clamping joint is fixedly connected with clamping joint support, clamping joint support is connected to one end of glue connection strap, the other end of some glue connection strap is fixed on the some glue connecting plate side of point gum machine tool hand, point glue connecting plate both sides are provided with a glue buffer, point glue buffer is all fixed on a glue installing plate by some glue bumper support, point glue connecting plate trailing flank fixedly has a glue slide block, point glue installing plate leading flank fixedly has a glue slide rail, point glue slide block coordinates with some glue slide rail.
2. the glue applying mechanism of chipset installation according to claim 1, it is characterized in that: described point gum machine tool hand also comprises a glue motor, point glue driving wheel, point glue odontoid belt, point glue driven pulley, driven pulley support, point glue tooth belt metalwork, point glue lifting slider, point glue lifting slider installing plate, point glue lifting sliding rail, point glue induction iron, point glue inductor, point glue spring, point glue spring support, fixed block connecting plate, point plastic pin and some plastic pin fixed block, described some glue connecting plate side is installed a glue motor, the motor shaft of some glue motor is installed and has a glue driving wheel, on some glue driving wheel, cover has a glue odontoid belt, point glue odontoid belt is connected to a glue driven pulley, point glue driven pulley is fixed on a glue connecting plate side by driven pulley support, the two ends of some glue odontoid belt are connected to a glue tooth belt metalwork, point glue tooth belt metalwork is connected to a glue lifting slider installing plate, point glue lifting slider installing plate trailing flank fixedly has a glue lifting slider, point glue connecting plate leading flank is installed a glue lifting sliding rail, point glue lifting slider coordinates with some glue lifting sliding rail, fixedly there is a glue induction iron point glue lifting slider installing plate upper edge, a glue inductor is provided with above some glue induction iron, point glue inductor is fixed on a glue connecting plate upper edge, point glue lifting slider installing plate leading flank right-hand member is connected by screw the one end of putting glue spring, the other end of some glue spring is connected to a glue connecting plate by some glue spring support, point glue lifting slider installing plate leading flank left end is connected to fixed block connecting plate, fixed block connecting plate leading flank is connected to a plastic pin fixed block, point plastic pin fixed block is fitted with four point plastic pins.
3. the glue applying mechanism of chipset installation according to claim 1, it is characterized in that: described colloid feeding device also comprises colloid stopping means, point lacquer disk(-sc) installing plate, point lacquer disk(-sc) support, micromachine, " ┗ " shape motor mounting plate, driving pulley, colloid odontoid belt, colloid driven pulley, connecting axle and bearing, described some lacquer disk(-sc) installing plate lower plane is provided with a lacquer disk(-sc) support, point lacquer disk(-sc) installing plate lower plane is connected to " ┗ " shape motor mounting plate upper edge, " ┗ " shape motor mounting plate lower plane is provided with micromachine, the motor shaft of micromachine is provided with driving pulley, on driving pulley, cover has colloid odontoid belt, colloid odontoid belt is connected to colloid driven pulley, colloid driven pulley is installed on connecting axle lower end, in the middle of connecting axle, bearing is installed, bearing is plugged in a lacquer disk(-sc) installing plate, connecting axle upper end is plugged in bottom a lacquer disk(-sc), glue is provided with in some lacquer disk(-sc), the banking stop of colloid stopping means is provided with above glue.
4. the glue applying mechanism of chipset installation according to claim 3, it is characterized in that: described colloid stopping means also comprises banking stop installing plate, position limiting slide block, spacing slide rail, slide rail mounting bracket, limit spring, limit spring support, micrometer head, micrometer head mounting clamp and micrometer head connecting plate, described banking stop is fixed on banking stop installing plate, banking stop installing plate side is provided with position limiting slide block, slide rail mounting bracket side is provided with spacing slide rail, position limiting slide block coordinates with spacing slide rail, slide rail mounting bracket is fixed on plane on a lacquer disk(-sc) installing plate, slide rail mounting bracket side is connected to limit spring support, limit spring support is connected to one end of limit spring, the other end of limit spring is connected to banking stop installing plate upper edge, banking stop installing plate side is provided with micrometer head connecting plate, micrometer head connecting plate lower end is provided with micrometer head, micrometer head and micrometer head mounting clamp are fixed, micrometer head mounting clamp is fixed on a lacquer disk(-sc) installing plate side edge.
CN201510653186.5A 2015-10-12 2015-10-12 The glue applying mechanism of chip kludge Active CN105127053B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106624477A (en) * 2016-10-26 2017-05-10 上海睿通机器人自动化股份有限公司 Full-automatic hollow coil winding spot welding machine
CN107583819A (en) * 2017-09-22 2018-01-16 广东晶科电子股份有限公司 A kind of LED dropping glue of die bonder system
CN109420592A (en) * 2017-08-29 2019-03-05 耐落螺丝(昆山)有限公司 Multi-shaft precise transfers glue stations
CN112992772A (en) * 2021-02-09 2021-06-18 新一代半导体研究所(深圳)有限公司 Semiconductor chip fixing and processing equipment and processing technology

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CN204338424U (en) * 2014-11-19 2015-05-20 苏州博众精工科技有限公司 A kind of Full-automatic quantitative glue applying mechanism
CN204486137U (en) * 2015-02-03 2015-07-22 苏州博众精工科技有限公司 A kind of some adhesive curing mechanism for assembling electronic product finding
CN204486142U (en) * 2014-12-23 2015-07-22 深圳市鹏创达自动化有限公司 Double end rotates point gum machine
CN205056385U (en) * 2015-10-12 2016-03-02 苏州达恩克精密机械有限公司 Point gum machine of chip mounting machine constructs

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Publication number Priority date Publication date Assignee Title
US20140041583A1 (en) * 2012-08-07 2014-02-13 Morgan Donohue Single axis applicator
CN203459239U (en) * 2013-09-18 2014-03-05 广州新视界光电科技有限公司 Dispensing machine
CN104275274A (en) * 2014-09-28 2015-01-14 吴长江 Glue applicator for manufacturing LED sets and automatic assembling machine for LED sets
CN204338424U (en) * 2014-11-19 2015-05-20 苏州博众精工科技有限公司 A kind of Full-automatic quantitative glue applying mechanism
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106624477A (en) * 2016-10-26 2017-05-10 上海睿通机器人自动化股份有限公司 Full-automatic hollow coil winding spot welding machine
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CN107583819A (en) * 2017-09-22 2018-01-16 广东晶科电子股份有限公司 A kind of LED dropping glue of die bonder system
CN112992772A (en) * 2021-02-09 2021-06-18 新一代半导体研究所(深圳)有限公司 Semiconductor chip fixing and processing equipment and processing technology
CN112992772B (en) * 2021-02-09 2021-12-10 晋城市国科半导体研究所 Semiconductor chip fixing and processing equipment and processing technology

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