CN107583819A - A kind of LED dropping glue of die bonder system - Google Patents
A kind of LED dropping glue of die bonder system Download PDFInfo
- Publication number
- CN107583819A CN107583819A CN201710865955.7A CN201710865955A CN107583819A CN 107583819 A CN107583819 A CN 107583819A CN 201710865955 A CN201710865955 A CN 201710865955A CN 107583819 A CN107583819 A CN 107583819A
- Authority
- CN
- China
- Prior art keywords
- lacquer disk
- subregion
- dispensing
- scraper
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000003292 glue Substances 0.000 title claims abstract description 83
- 239000004922 lacquer Substances 0.000 claims abstract description 77
- 235000003140 Panax quinquefolius Nutrition 0.000 claims abstract description 15
- 240000005373 Panax quinquefolius Species 0.000 claims abstract description 15
- 230000000712 assembly Effects 0.000 claims abstract description 15
- 238000000429 assembly Methods 0.000 claims abstract description 15
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 230000009194 climbing Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Abstract
The present invention discloses a kind of dispenser system of LED bonders, including lacquer disk(-sc) component, dispensing head assembly and doctor assemblies；The lacquer disk(-sc) component includes lacquer disk(-sc) rotating shaft, lacquer disk(-sc)；The lacquer disk(-sc) fixed cover is located at lacquer disk(-sc) rotating shaft periphery；It is provided around on the lacquer disk(-sc) in the peripheral and opening up Sheng rubber ring groove of the lacquer disk(-sc) rotating shaft；It is described to contain in rubber ring groove at least provided with an annular projection for being surrounded on the lacquer disk(-sc) rotating shaft periphery, the Sheng rubber ring groove is divided at least two subregions；The dispensing head assembly includes at least two dispensing arms, at least two Glue dripping heads, dispensing arm controller；Each Glue dripping head is respectively vertically on each dispensing arm；The dispensing arm controller electrically connects with each dispensing arm, to control each Glue dripping head respectively in and out of each subregion；The doctor assemblies can be matched in and out of each subregion.The present invention can carry out die bond using different glue by same lacquer disk(-sc) to different LED chips, be advantageous to improve production efficiency.
Description
Technical field
The invention belongs to light emitting diode (LED) manufacturing technology field, and in particular to a kind of dispensing system of LED bonders
System.
Background technology
As LED performances are constantly lifted, it is widely used in the different fields such as illumination, backlight.But different
It is different to the demand of LED packing forms in application field.Such as situation as often occurring：Inside same lamp bead
It is required that place different types of LED chip, and different types of LED chip typically requires using different types of glue or
It is required that different glue shapes and dosage.At present, Normal practice is：A kind of glue is first pointed out using bonder to a kind of LED cores
Piece is fixed, then artificial to change another lacquer disk(-sc) equipped with different glue, changes or cleans Glue dripping head, then to different LED
Chip is fixed, and technique is extremely complex, production efficiency is extremely low.
Based on this, the Chinese invention patent of Application No. 200920205873.0 discloses a kind of dispensing device for die bonder,
It includes fixed plate, is fixed in fixed plate the first drive dynamic control device and the second drive dynamic control device, respectively with first
The the first dispensing arm and the second dispensing arm and the confession for being fixed on fixed plate that drive dynamic control device connects with the second drive dynamic control device
The point of first lacquer disk(-sc) and second point lacquer disk(-sc) that first dispensing arm and the second dispensing arm use, the first dispensing arm and the second dispensing arm
Glue position is in same point, in practical work process, two kinds of different glue can be individually positioned in first according to production requirement
On point lacquer disk(-sc) and second point lacquer disk(-sc), two kinds of different sizes and different glue can be pointed out by the first dispensing arm and the second dispensing arm
Glue point.Although the dispensing device for die bonder improves production efficiency to a certain extent, but exist device structure it is complicated,
Bulky, many defects such as manufacturing cost is high, are unfavorable for the requirement of the modern productions such as cost efficiency.
The content of the invention
The present invention is to make up the deficiencies in the prior art, there is provided a kind of dispensing of the LED bonders of brand new
System, it not only can carry out die bond to different LED chips using different glue by same lacquer disk(-sc), be advantageous to improve production
Efficiency, and structure is extremely simple, small volume, advantageously reduces equipment manufacturing costs.
For the present invention to reach its purpose, the technical scheme of use is as follows：
A kind of dispenser system of LED bonders, it is characterised in that：
Include lacquer disk(-sc) component, dispensing head assembly and doctor assemblies；
The lacquer disk(-sc) component includes lacquer disk(-sc) rotating shaft, lacquer disk(-sc)；The lacquer disk(-sc) fixed cover is located at lacquer disk(-sc) rotating shaft periphery；Institute
State and be provided around on lacquer disk(-sc) in the peripheral and opening up Sheng rubber ring groove of the lacquer disk(-sc) rotating shaft；In the Sheng rubber ring groove at least provided with
One is surrounded on the annular projection of the lacquer disk(-sc) rotating shaft periphery, and the Sheng rubber ring groove is divided into at least two subregions；
The dispensing head assembly includes at least two dispensing arms, at least two Glue dripping heads, dispensing arm controller；It is each described
Glue dripping head is respectively vertically on each dispensing arm；The dispensing arm controller electrically connects with each dispensing arm, with control
Each Glue dripping head is made respectively in and out of each subregion；
The doctor assemblies can be matched in and out of each subregion.
Further, at least provided with a ring-shaped step for being surrounded on the lacquer disk(-sc) rotating shaft periphery in each subregion.
Further, the doctor assemblies include connecting plate, multiple scrapers, multiple adjusting rods, multiple adjusting knobs；
The connecting plate is laterally movable to be connected in the lacquer disk(-sc) rotating shaft but not with the lacquer disk(-sc) axis of rotation；
Each scraper is flexibly connected with the connecting plate；Each adjusting rod is vertically on the connecting plate
And it can move up and down；Each adjusting knob is respectively arranged on the upper end of each adjusting rod, and each scraper is respectively positioned at each
The lower end of the adjusting rod；
By rotating each adjusting knob, the controllable corresponding adjusting rod moves up and down, so as to control correspondingly
The scraper match in and out of corresponding each subregion.
Further, the side for adjoining the lacquer disk(-sc) rotating shaft of each scraper is equipped with scraper jut.
Further, the quantity of the scraper corresponding to each subregion than with the annular in each subregion
The quantity of step is more one.
Further, the doctor assemblies also include multiple push rods and multiple springs；
Each push rod is vertically on the connecting plate；Each scraper is equipped with a connector, each described
Connector, each spring are movably set on each push rod respectively, and each spring is respectively positioned at the company corresponding to it
Between joint and the connecting plate；
A land plateau is equipped with each scraper, the lower end of each adjusting rod can hold out against each scraper respectively
On the land plateau.
Further, each adjusting knob includes fixed part, the rotating part with the corresponding adjusting rod connection；
Vertical graduation mark is equipped with each rotating part, scale line of reference is equipped with each fixed part.
Further, the subregion, the dispensing arm, the Glue dripping head are two, described in each subregion
Ring-shaped step is one；
The width of each subregion is 2 times of the width of the ring-shaped step on its interior, each annular
The width of step is identical with the width of the corresponding scraper.
Further, the height of the ring-shaped step in each subregion is the outer peripheral height of the Sheng rubber ring groove
The 1/2 of degree；
The width all same of each subregion, the outward flange of the height of each annular projection with the Sheng rubber ring groove
Height it is identical, the thickness of each annular projection is identical with the outer peripheral thickness of the Sheng rubber ring groove.
Further, each mutually nested setting of dispensing arm.
Relative to prior art, the present invention has following advantageous effects：
(1) dispenser system of a kind of LED bonders provided by the invention, containing annular projection is set to incite somebody to action in rubber ring groove
Contain rubber ring groove and carry out subregion, so as to which not only different glue can be used to different LED by same bonder (i.e. same lacquer disk(-sc))
Chip carries out die bond, optimizes production technology, is advantageous to improve production efficiency, and the overall structure of device systems is extremely simple
Single, compact is easily fabricated, is very beneficial for reducing the manufacturing cost of equipment, meets modern production to drop originally well
The high request of synergy.
(2) dispenser system of a kind of LED bonders provided by the invention, is provided with ring-shaped step in each subregion, so as to
So that the glue quantity in lacquer disk(-sc) can be reduced in the case where reaching identical glue thickness, so effectively reduce glue because
The bad phenomenon such as need to scrap more than usage time, effectively reduce the waste of glue, be very beneficial for reducing LED productions
Cost.
Brief description of the drawings
Fig. 1 is the top view of dispensing head assembly of the present invention (not including dispensing arm controller)；
Fig. 2 is a kind of structural representation of the dispenser system of LED bonders of the present invention；
Fig. 3 is Fig. 2 A-A sectional views.
Description of symbols：
1st, lacquer disk(-sc) component；11st, lacquer disk(-sc) rotating shaft；12nd, lacquer disk(-sc)；121st, rubber ring groove is contained；122nd, annular projection；123rd, subregion；
1231st, ring-shaped step；2nd, dispensing head assembly；21st, dispensing arm；22nd, Glue dripping head；23rd, dispensing arm controller；3rd, doctor assemblies；31、
Connecting plate；32nd, scraper；321st, scraper jut；322nd, connector；323rd, land plateau；33rd, adjusting rod；34th, adjusting knob；
341st, fixed part；3411st, scale line of reference；342nd, rotating part；3421st, vertical graduation mark；35th, push rod；36th, spring.
Embodiment
Many details are elaborated in the following description in order to fully understand the present invention.But the present invention can be with
Much implement different from the other modes of this description, those skilled in the art can be in the case of without prejudice to intension of the present invention
Similar popularization is done, therefore the present invention is not limited by following public specific embodiment.
The invention discloses a kind of dispenser system of LED bonders, as shown in Figures 1 to 3, include lacquer disk(-sc) component 1, dispensing
Head assembly 2 and doctor assemblies 3.
Lacquer disk(-sc) component 1 includes lacquer disk(-sc) rotating shaft 11, lacquer disk(-sc) 12；The fixed cover of lacquer disk(-sc) 12 is located at the periphery of lacquer disk(-sc) rotating shaft 11；Lacquer disk(-sc)
The Sheng rubber ring groove 121 peripheral and opening up in lacquer disk(-sc) rotating shaft 11 is provided around on 12；Contain in rubber ring groove 121 at least provided with one
The annular projection 122 of the periphery of lacquer disk(-sc) rotating shaft 11 is surrounded on, rubber ring groove 121 will be contained and be divided at least two subregions 123；
Dispensing head assembly 2 is loaded into LED bonders, and it includes at least two dispensing arms 21, at least two Glue dripping heads
22nd, dispensing arm controller 23；Each Glue dripping head 22 is respectively vertically on each dispensing arm 21；Dispensing arm controller 23 and each dispensing
Arm 21 is electrically connected to control each dispensing arm 21 to work independently, so as to control each Glue dripping head 22 respectively in and out of each subregion 123；
Doctor assemblies 3 can be matched in and out of each subregion 123, and the glue plane of each subregion 123 can be adjusted to smooth
It is smooth.
Based on above-mentioned structure design, in same LED bonders, different types of glue can be contained in rubber ring groove
In 121 different subregions 123, then by operating dispensing arm controller 23 individually to control each Glue dripping head 22 respectively from each right
Glue is taken in the subregion 123 answered, so as to carry out die bond to different types of LED chip, production technology is greatly optimized, raw
Production efficiency is effectively improved, moreover, simple in construction, small volume of the invention, easily fabricated, be very beneficial for reduction and be manufactured into
This.
LED die bond glue has certain viscosity, it is necessary to which certain glue thickness and width can just be rotated in lacquer disk(-sc) 12 and scraper
The effect of component 3 is lower to produce smooth glue plane, the uniformity of glue amount is taken during ensureing LED die bonds every time, so as to ensure
LED die bond qualities；Also, LED die bond glue is generally silica gel or elargol, occur for a long time after exposure at room temperature slight
Solidify phenomenon, it will the mobility and glue performance of glue are had a strong impact on, so as to influence LED die bond quality.It is normal at present based on this
The way of rule is：A large amount of glue are disposably added in lacquer disk(-sc) 12, so that glue reaches required thickness, then setting glue makes
With the time, reach to scrap glue after usage time and re-replace new glue, can so cause a large amount of glue to waste, increase life
Produce cost.
In addition, LED, during die bond, most important anomaly is that more glue, few glue and dispensing are uneven, is not only influenceed outer
See, and have a strong impact on LED lamp bead quality and reliability.Main ameliorative way is at present：Adjustment dispensing head shapes, adjustment take
Glue time, adjustment take glue depth etc., it is apparent that, it is improved in terms of glue is taken.But cause more glue, few glue
With the factor of the unequal bad phenomenon of dispensing except from glue in itself, also from gluing disk structure in itself.
Based on above-mentioned present situation, inventor is studied by long-term production practices, and great dash forward has been done to the structure of lacquer disk(-sc) 12
The improvement of broken property, specifically, as shown in figures 2 and 3, is surrounded on outside lacquer disk(-sc) rotating shaft 11 in each subregion 123 at least provided with one
The ring-shaped step 1231 enclosed, then in each subregion 123, the region residing for other than ring type step is the effective operation area of lacquer disk(-sc) 12
Domain.
Therefore, the dispenser system of LED bonders of the present invention has the following advantages that：(1) die bond glue is reduced
Waste, i.e.,：Glue quantity in the case where reaching identical glue depth information in lacquer disk(-sc) tails off, so as to effectively reduce because more than use
Time and need the glue quantity scrapped, reduce production cost；(2) die bond dispensing stability is improved, i.e.,：Glue region is taken to become
It is small, so as to reduce a problem that taking band glue, degumming after glue, be advantageous to take the uniformity of glue；(3) it is provided with ring-shaped step
1231 this structure can also increase the difficulty for climbing glue, substantially avoided the influence for climbing glue to lacquer disk(-sc) rotating shaft 11 so that rotate speed
Rate keeps stable, advantageously ensures that the uniformity for taking glue.
As a kind of embodiment, as shown in Fig. 2 doctor assemblies 3 include connecting plate 31, multiple scrapers being set up in parallel
32nd, multiple adjusting rods 33 being set up in parallel, multiple adjusting knobs 34；
Laterally movable be connected in lacquer disk(-sc) rotating shaft 11 but not with lacquer disk(-sc) rotating shaft 11 of connecting plate 31 rotates, wherein it is possible to pass through
This mode of bearing is set between connecting plate 31 and lacquer disk(-sc) rotating shaft 11 to be connected with each other, but the present invention is not limited thereto；
Each scraper 32 is flexibly connected with connecting plate 31；Each adjusting rod 33 vertically on the connecting plate 31 and can on
Lower movement (for example can be attached adjusting rod 33 and connecting plate 31 by screw thread mating connection mode, but the present invention is not
It is limited to this)；Each adjusting knob 34 is respectively arranged on the upper end of each adjusting rod 33, and each scraper 32 is located under each adjusting rod 33 respectively
End；
By rotating each adjusting knob 34, controllable corresponding adjusting rod 33 moves up and down, so as to control corresponding scrape
Knife 32 is matched in and out of corresponding each subregion 123.
Because glue has certain surface tension force, easily occurring climbing glue phenomenon, i.e. the inwall of lacquer disk(-sc) 12, which often occurs, climbs glue,
And when glue climbs to lacquer disk(-sc) rotating shaft 11, it on the one hand can increase the pivoting friction resistance of lacquer disk(-sc) rotating shaft 11 and influence the rotation of lacquer disk(-sc) 12
Speed, so as to cause the appearance of more glue, few glue or the unequal bad phenomenon of dispensing, it on the other hand can increase lacquer disk(-sc) rotating shaft 11
Abrasion, so as to reduce the service life of lacquer disk(-sc) component 1.Therefore, in the above-described embodiments, as shown in figures 2 and 3, each scraper 32
The side for adjoining lacquer disk(-sc) rotating shaft 11 be equipped with scraper jut 321, so as to：(1) difficulty for climbing glue is considerably increased, is contributed to
Avoid climbing influence of the glue to lacquer disk(-sc) rotating shaft 11, its slewing rate is kept stable, be favorably improved the uniformity for taking glue；(2) subtract
Lack and climbed glue phenomenon, avoided the inordinate wear of lacquer disk(-sc) rotating shaft 11, be advantageous to improve the service life of lacquer disk(-sc) component 1；(3) can keep away
The colloid for exempting from different subregions 123 mutually pollutes, to ensure the reliability of the quality of LED die bonds and LED lamp bead.
The number of scraper 32 is according to subregion 123 and the quantity set of ring-shaped step 1231, specifically, in above-described embodiment
In, as shown in Fig. 2 the quantity of scraper 32 corresponding to each subregion 123 is than the number with the ring-shaped step 1231 in each subregion 123
Amount is more one, to ensure that scraper 32 and subregion 123 are able to matched well in shape.
More specifically, in the above-described embodiments, as shown in Fig. 2 doctor assemblies 3 also include multiple push rods 35, Yi Jiduo
Individual spring 36；
Each push rod 35 is vertically on connecting plate 31；Each scraper 32 is equipped with a connector 322, each connector
322nd, each spring 36 is movably set on each push rod 35 respectively, and each spring 36 is respectively positioned at its corresponding connector 322 and connection
Between plate 31；
A land plateau 323 is equipped with each scraper 32, the lower end of each adjusting rod 33 can be held out against on each scraper 32 respectively
Land plateau 323.
Based on above-mentioned structure design, by rotation of adjustment knob 34, controllable corresponding adjusting rod 33 moves up and down, from
And adjust corresponding to scraper 32 height to match in and out of corresponding each subregion 123, and then effectively ensure LED die bonds when it is every
The secondary uniformity for taking glue amount, ensure LED die bond qualities.
In the above-described embodiments, as shown in Fig. 2 each adjusting knob 34 include fixed part 341, with corresponding adjusting rod
The rotating part 342 of 33 connections；Vertical graduation mark 3421 is equipped with each rotating part 342, is equipped with each fixed part 341
Scale line of reference 3411, so that the height regulation of scraper 32 is able to digitize, refined, when advantageously ensuring that LED die bonds
The uniformity of glue amount is taken every time, ensures LED die bond qualities.
More specifically, in the above-described embodiments, as shown in Figure 2,3, subregion 123, dispensing arm 21, Glue dripping head 22 are two
Individual, the ring-shaped step 1231 in each subregion 123 is one, then scraper 32, adjusting rod 33, adjusting knob 34, push rod 35,
Spring 36 is four；
The width of each subregion 123 is 2 times of the width of ring-shaped step 1231 on its interior, i.e., each subregion 123
Interior effective operation region and non-operating area are consistent on area, are easy to manufacture whole lacquer disk(-sc) 12；Each ring
The width of shape step 1231 is identical with the width of corresponding scraper 32, ensures that scraper 32 is able to essence with corresponding subregion 123
Really matching.
In the above-described embodiments, as shown in Figure 2,3, the height of the ring-shaped step 1231 in each subregion 123 is to contain rubber ring
The 1/2 of the outer peripheral height of groove 121；The width all same of each subregion 123, the height of each annular projection 122 is with containing glue
Outer peripheral highly identical, the outer peripheral thickness of the thickness of each annular projection 122 with containing rubber ring groove 121 of annular groove 121
It is identical, it is easy to manufacture whole lacquer disk(-sc) 12.
In the above-described embodiments, as shown in Figure 1, 2, each 21 mutually nested setting of dispensing arm so that whole LED die bond dispensings
The structure of system is extremely compact, advantageously reduces small product size.
It is last it should be noted that：Other contents of the dispenser system of LED bonders of the present invention are referring to existing skill
Art, it will not be repeated here.
The above described is only a preferred embodiment of the present invention, any formal limitation not is done to the present invention, therefore
All contents without departing from technical solution of the present invention, the technical spirit according to the present invention any are simply repaiied to made for any of the above embodiments
Change, equivalent variations and modification, in the range of still falling within technical solution of the present invention.
Claims (10)
- A kind of 1. dispenser system of LED bonders, it is characterised in that：Include lacquer disk(-sc) component, dispensing head assembly and doctor assemblies；The lacquer disk(-sc) component includes lacquer disk(-sc) rotating shaft, lacquer disk(-sc)；The lacquer disk(-sc) fixed cover is located at lacquer disk(-sc) rotating shaft periphery；The glue It is provided around on disk in the peripheral and opening up Sheng rubber ring groove of the lacquer disk(-sc) rotating shaft；At least provided with a ring in the Sheng rubber ring groove The annular projection of the lacquer disk(-sc) rotating shaft periphery is around in, the Sheng rubber ring groove is divided at least two subregions；The dispensing head assembly includes at least two dispensing arms, at least two Glue dripping heads, dispensing arm controller；Each dispensing Head is respectively vertically on each dispensing arm；The dispensing arm controller electrically connects with each dispensing arm, each to control The Glue dripping head is respectively in and out of each subregion；The doctor assemblies can be matched in and out of each subregion.
- 2. the dispenser system of LED bonders according to claim 1, it is characterised in that：In each subregion at least Provided with a ring-shaped step for being surrounded on the lacquer disk(-sc) rotating shaft periphery.
- 3. the dispenser system of LED bonders according to claim 2, it is characterised in that：The doctor assemblies include connecting plate, multiple scrapers, multiple adjusting rods, multiple adjusting knobs；The connecting plate is laterally movable to be connected in the lacquer disk(-sc) rotating shaft but not with the lacquer disk(-sc) axis of rotation；Each scraper is flexibly connected with the connecting plate；Each adjusting rod is vertically on the connecting plate and equal It can move up and down；Each adjusting knob is respectively arranged on the upper end of each adjusting rod, and each scraper is respectively positioned at each described The lower end of adjusting rod；By rotating each adjusting knob, the controllable corresponding adjusting rod moves up and down, so as to control corresponding institute Scraper matching is stated in and out of corresponding each subregion.
- 4. the dispenser system of LED bonders according to claim 3, it is characterised in that：Each scraper adjoins institute The side for stating lacquer disk(-sc) rotating shaft is equipped with scraper jut.
- 5. the dispenser system of LED bonders according to claim 3, it is characterised in that：The quantity of the scraper corresponding to each subregion is more than with the quantity of the ring-shaped step in each subregion One.
- 6. the dispenser system of LED bonders according to claim 5, it is characterised in that：The doctor assemblies also include multiple push rods and multiple springs；Each push rod is vertically on the connecting plate；Each scraper is equipped with a connector, each connection Head, each spring are movably set on each push rod respectively, and each spring is respectively positioned at the connector corresponding to it Between the connecting plate；A land plateau is equipped with each scraper, the lower end of each adjusting rod can be held out against on each scraper respectively The land plateau.
- 7. the dispenser system of LED bonders according to claim 3, it is characterised in that：Each adjusting knob includes fixed part, the rotating part with the corresponding adjusting rod connection；Each rotation Vertical graduation mark is equipped with portion, scale line of reference is equipped with each fixed part.
- 8. the dispenser system of LED bonders according to claim 3, it is characterised in that：The subregion, the dispensing arm, the Glue dripping head are two, and the ring-shaped step in each subregion is one It is individual；The width of each subregion is 2 times of the width of the ring-shaped step on its interior, each ring-shaped step Width it is identical with the width of the corresponding scraper.
- 9. the dispenser system of the LED bonders according to any one of claim 2~7, it is characterised in that：The height of the ring-shaped step in each subregion is the 1/2 of the outer peripheral height of the Sheng rubber ring groove；The width all same of each subregion, the outer peripheral height of the height of each annular projection with the Sheng rubber ring groove Spend identical, the thickness of each annular projection is identical with the outer peripheral thickness of the Sheng rubber ring groove.
- 10. the dispenser system of the LED bonders according to any one of claim 1~7, it is characterised in that：Each dispensing The mutually nested setting of arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710865955.7A CN107583819A (en) | 2017-09-22 | 2017-09-22 | A kind of LED dropping glue of die bonder system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710865955.7A CN107583819A (en) | 2017-09-22 | 2017-09-22 | A kind of LED dropping glue of die bonder system |
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| CN107583819A true CN107583819A (en) | 2018-01-16 |
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ID=61048671
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710865955.7A Pending CN107583819A (en) | 2017-09-22 | 2017-09-22 | A kind of LED dropping glue of die bonder system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115234852A (en) * | 2022-07-05 | 2022-10-25 | 浙江星科电子有限公司 | LED electronic candle lamp manufacturing system and method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1190507B (en) * | 1985-04-23 | 1988-02-16 | Hermann Kronseder | GLUE APPLICATION DEVICE FOR LABELING MACHINES |
| US20100083491A1 (en) * | 2008-10-06 | 2010-04-08 | Panasonic Corporation | Electonic component mounting apparatus |
| US8397785B2 (en) * | 2009-11-17 | 2013-03-19 | Asm Assembly Automation Ltd | Transfer apparatus for multiple adhesives |
| CN204088354U (en) * | 2014-09-02 | 2015-01-07 | 木林森股份有限公司 | A kind of bonder lacquer disk(-sc) of improvement |
| CN105127053A (en) * | 2015-10-12 | 2015-12-09 | 苏州达恩克精密机械有限公司 | Dispensing mechanism of chip assembling machine |
| CN205291395U (en) * | 2015-11-25 | 2016-06-08 | 北京瑞京乳胶制品有限公司 | Multi -functional gluey groove in latex glove production line |
| CN206122097U (en) * | 2016-08-31 | 2017-04-26 | 安徽芯瑞达科技股份有限公司 | A scraper mechanism for LED wafer fixing glue dish |
| CN206340526U (en) * | 2016-12-22 | 2017-07-18 | 中山市同立盛自动化设备有限公司 | Glue storage device of die bonder |
| CN207308235U (en) * | 2017-09-22 | 2018-05-04 | 广东晶科电子股份有限公司 | A kind of dispenser system of LED bonders |
-
2017
- 2017-09-22 CN CN201710865955.7A patent/CN107583819A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1190507B (en) * | 1985-04-23 | 1988-02-16 | Hermann Kronseder | GLUE APPLICATION DEVICE FOR LABELING MACHINES |
| GB2174021B (en) * | 1985-04-23 | 1989-09-13 | Hermann Kronseder | Gluing apparatus for labelling machines |
| US20100083491A1 (en) * | 2008-10-06 | 2010-04-08 | Panasonic Corporation | Electonic component mounting apparatus |
| US8397785B2 (en) * | 2009-11-17 | 2013-03-19 | Asm Assembly Automation Ltd | Transfer apparatus for multiple adhesives |
| CN204088354U (en) * | 2014-09-02 | 2015-01-07 | 木林森股份有限公司 | A kind of bonder lacquer disk(-sc) of improvement |
| CN105127053A (en) * | 2015-10-12 | 2015-12-09 | 苏州达恩克精密机械有限公司 | Dispensing mechanism of chip assembling machine |
| CN205291395U (en) * | 2015-11-25 | 2016-06-08 | 北京瑞京乳胶制品有限公司 | Multi -functional gluey groove in latex glove production line |
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| CN206340526U (en) * | 2016-12-22 | 2017-07-18 | 中山市同立盛自动化设备有限公司 | Glue storage device of die bonder |
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Address after: 511458 33 Nansha District City Road South, Nansha District, Guangzhou, Guangdong Applicant after: APT ELECTRONICS Co.,Ltd. Address before: 511458 No. 33, South Ring Road, Nansha District, Guangzhou, Guangdong. Applicant before: APT ELECTRONICS Co.,Ltd. |
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Application publication date: 20180116 |