CN213353868U

CN213353868U - IC chip separator after UV pad pasting cutting

Info

Publication number: CN213353868U
Application number: CN202021840008.6U
Authority: CN
Inventors: 向菊
Original assignee: Shenzhen Yifeng Technology Co ltd
Current assignee: Shenzhen Yifeng Technology Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-06-04
Anticipated expiration: 2030-08-28

Abstract

The utility model belongs to the technical field of IC chip production, a IC chip separator after UV pad pasting cutting is provided, which comprises a fixing plate and i, the top of fixed plate is equipped with first bracing piece and is used for driving the first actuating mechanism that first bracing piece goes up and down, first actuating mechanism and fixed plate fixed connection, first actuating mechanism is connected with first bracing piece drive, first actuating mechanism's one end fixed mounting is kept away from to first bracing piece has first backup pad, the below of first backup pad is equipped with IC chip fixed establishment and is used for driving IC chip fixed establishment horizontal migration's second actuating mechanism, second actuating mechanism and first backup pad fixed connection, second actuating mechanism and IC chip fixed establishment drive are connected. The utility model discloses a UV pad pasting cutting back IC chip separator not only can adjust IC chip's fixed position, moreover, is convenient for adjust the absorption position of UV membrane.

Description

IC chip separator after UV pad pasting cutting

Technical Field

The utility model relates to a IC chip production technical field, concretely relates to IC chip separator behind UV pad pasting cutting.

Background

In the IC chip production process, one of the important links is to put the IC chip on the UV membrane, is favorable to keeping the stability of IC chip in the cutting, makes the IC chip can not produce the displacement and take place the condition that drops, simultaneously, guarantees the integrality of IC chip in the cutting, reduces the breakage that produces in the cutting. After the dicing is completed, the IC chip needs to be separated from the UV film.

In the traditional process of separating the IC chip from the UV film, the IC chip suction mechanism only has the function of sucking the IC chip, and the IC chip after suction is still positioned right above the original IC chip placement position, so that the IC chip is inconvenient to place at other positions; in addition, the suction position of the UV film by the UV film suction mechanism cannot be adjusted, and there is no flexibility, and therefore, improvement of the conventional IC chip separation apparatus is required.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model provides a pair of IC chip separator behind UV pad pasting cutting not only can adjust IC chip's fixed position, moreover, is convenient for adjust the absorption position of UV membrane.

In order to solve the technical problem, the utility model provides a following technical scheme:

a separation device for an IC chip after UV film sticking cutting comprises a fixed plate, wherein a first supporting rod and a first driving mechanism used for driving the first supporting rod to ascend and descend are arranged above the fixed plate, the first driving mechanism is fixedly connected with the fixed plate, the first driving mechanism is in driving connection with the first supporting rod, a first supporting plate is fixedly installed at one end, away from the first driving mechanism, of the first supporting rod, an IC chip fixing mechanism and a second driving mechanism used for driving the IC chip fixing mechanism to horizontally move are arranged below the first supporting plate, the second driving mechanism is fixedly connected with the first supporting plate, and the second driving mechanism is in driving connection with the IC chip fixing mechanism; the utility model discloses a UV film absorption device, including fixed plate, UV film absorption mechanism, IC chip fixed establishment and UV film absorption mechanism, the below of fixed plate is equipped with the second bracing piece and is used for driving the third actuating mechanism that the second bracing piece goes up and down, the one end fixed mounting that third actuating mechanism was kept away from to the second bracing piece has the second backup pad, the top of second backup pad is equipped with UV film absorption mechanism and is used for driving UV film absorption mechanism horizontal migration's fourth actuating mechanism, fourth actuating mechanism and second backup pad fixed connection, fourth actuating mechanism and UV film absorption mechanism drive are connected, first actuating mechanism, the second actuating mechanism, the third actuating mechanism, the fourth actuating mechanism, IC chip fixed establishment and UV film absorption mechanism all are connected with the PLC controller.

Further, IC chip fixed establishment includes the U template, U template and second actuating mechanism's drive end fixed connection, and fixed mounting has the fixture that is used for fixed IC chip on the U template inside wall, and fixture's quantity is two, and two fixture symmetries set up, and two fixture are connected with the PLC controller electricity.

Furthermore, fixture includes the catch plate and is used for promoting the fifth actuating mechanism of catch plate, and fifth actuating mechanism and the inside wall fixed connection of U template, fifth actuating mechanism and catch plate drive are connected, and fifth actuating mechanism is connected with the PLC controller electricity.

Furthermore, a limiting groove matched with the IC chip is formed in the center of the pushing plate.

Further, UV membrane suction means includes driving motor and dwang, driving motor and fourth driving mechanism's drive end fixed connection, dwang and driving motor's output shaft coaxial coupling, and driving motor's one end is kept away from to the dwang articulates there is vacuum chuck, and vacuum chuck passes through the hose connection vacuum pump, and driving motor and vacuum pump all are connected with the PLC controller electricity.

According to the above technical scheme, the beneficial effects of the utility model are that: the PLC controller controls the first driving mechanism and the second driving mechanism to work to drive the IC chip fixing mechanism to adjust the position in the horizontal direction and the vertical direction, so that the IC chip fixing mechanism can adjust different fixing positions of the IC chip; through the work of PLC controller control third actuating mechanism and fourth actuating mechanism, drive UV membrane suction means and carry out position control on horizontal direction and vertical direction, realize UV membrane suction means and absorb UV membrane different positions, not only can adjust the fixed position of IC chip, and, be convenient for adjust the suction position of UV membrane, in addition, PLC controller control first actuating mechanism shortens to drive IC chip fixed establishment and rises, and simultaneously, PLC controller control third actuating mechanism shortens to drive and falls under the UV membrane, realize that IC chip and UV membrane separate mutually, then, PLC controller control second actuating mechanism is at horizontal direction and first actuating mechanism position migration on the vertical direction, thereby realize moving the IC chip to the position that needs to place and place, be convenient for handle on next step to the IC chip after the UV membrane separation.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a right side view of the present invention.

Reference numerals:

1-fixing the plate;

11-a first support bar; 12-a first support plate; 13-a first drive mechanism; 14-a second drive mechanism; 15-a second support bar; 16-a second support plate; 17-a third drive mechanism; 18-a fourth drive mechanism;

141-U type plate; 142-a fifth drive mechanism; 143-a push plate; 181-drive motor; 182-rotating rod; 183-vacuum chuck;

1431-limiting groove.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

Referring to fig. 1-2, the IC chip separation device after UV film cutting provided in this embodiment includes a fixing plate 1, a first support rod 11 and a first driving mechanism 13 for driving the first support rod 11 to ascend and descend are disposed above the fixing plate 1, the first driving mechanism 13 is fixedly connected to the fixing plate 1, the first driving mechanism 13 is connected to the first support rod 11 in a driving manner, a first support plate 12 is fixedly mounted at one end of the first support rod 11 away from the first driving mechanism 13, an IC chip fixing mechanism and a second driving mechanism 14 for driving the IC chip fixing mechanism to move horizontally are disposed below the first support plate 12, the second driving mechanism 14 is fixedly connected to the first support plate 12, and the second driving mechanism 14 is connected to the IC chip fixing mechanism in a driving manner; a second support rod 15 and a third driving mechanism 17 for driving the second support rod 15 to ascend and descend are arranged below the fixing plate 1, a second support plate 16 is fixedly installed at one end, far away from the third driving mechanism 17, of the second support rod 15, a UV film suction mechanism and a fourth driving mechanism 18 for driving the UV film suction mechanism to horizontally move are arranged above the second support plate 16, the fourth driving mechanism 18 is fixedly connected with the second support plate 16, the fourth driving mechanism 18 is in driving connection with the UV film suction mechanism, the first driving mechanism 13, the second driving mechanism 14, the third driving mechanism 17, the fourth driving mechanism 18, the IC chip fixing mechanism and the UV film suction mechanism are all electrically connected with a PLC (programmable logic controller), the first driving mechanism 13 and the third driving mechanism 17 can be selected to be electric telescopic rods or electric poles, the second driving mechanism 14 and the fourth driving mechanism 18 both comprise a lead screw and a first driving motor, first driving motor and lead screw drive are connected, and servo motor is chooseed for use to first driving motor, and servo motor is connected with the PLC controller electricity.

In practical use, the PLC controller controls the first driving mechanism 13 and the second driving mechanism 14 to work to drive the IC chip fixing mechanism to adjust the position in the horizontal direction and the vertical direction, so that the IC chip fixing mechanism can adjust different fixing positions of the IC chip; through the work of PLC controller control third actuating mechanism 17 and fourth actuating mechanism 18, drive UV membrane suction means and carry out position control on horizontal direction and vertical direction, realize that UV membrane suction means absorbs UV membrane different positions, not only can adjust the fixed position of IC chip, and, be convenient for adjust the suction position of UV membrane, in addition, PLC controller control first actuating mechanism 13 shortens and drives IC chip fixed establishment and rise, simultaneously, PLC controller control third actuating mechanism 17 shortens and drives UV membrane and descend, realize that IC chip and UV membrane separate mutually, then, PLC controller control second actuating mechanism 14 is at horizontal direction and first actuating mechanism 13 position migration on the vertical direction, thereby realize moving the IC chip to the position that needs to place and place, be convenient for handle on next step the IC chip after the UV membrane separation.

In this embodiment, the IC chip fixing mechanism includes a U-shaped plate 141, the U-shaped plate 141 is fixedly connected to the driving end of the second driving mechanism 14, two clamping mechanisms for fixing the IC chip are fixedly mounted on the inner side wall of the U-shaped plate 141, the two clamping mechanisms are symmetrically arranged, and the two clamping mechanisms are electrically connected to the PLC controller.

In actual use, when first actuating mechanism 13 and second actuating mechanism 14 drive U template 141 and reach predetermined position, two fixture work of PLC controller control, press from both sides the both sides of IC chip and get fixedly, control first actuating mechanism 13 simultaneously and shorten, U template 141 and fixture drive IC chip rise, then, PLC controller control second actuating mechanism 14 is at horizontal direction and first actuating mechanism 13 displacement on the vertical direction, thereby realize moving the IC chip to the position that needs to place and place, be convenient for handle on next step to the IC chip after the UV membrane separation.

In this embodiment, the clamping mechanism includes a pushing plate 143 and a fifth driving mechanism 142 for pushing the pushing plate 143, the fifth driving mechanism 142 is fixedly connected to the inner side wall of the U-shaped plate 141, the fifth driving mechanism 142 is in driving connection with the pushing plate 143, and the fifth driving mechanism 142 is electrically connected to the PLC controller.

In practical use, when the U-shaped plate 141 reaches a predetermined position, the PLC controller controls the fifth driving mechanism 142 to push the pushing plate 143 to approach and contact with both sides of the IC chip, so as to clamp and fix the IC chip, and the fifth driving mechanism 142 selects an electric telescopic rod or an electric cylinder.

In this embodiment, a limit groove 1431 adapted to the IC chip is formed in the center of the push plate 143, and the IC chip is disposed in the limit groove 1431, so as to enhance the fixing property of the push plate 143 to the IC chip.

In this embodiment, UV membrane suction means includes driving motor 181 and dwang 182, driving motor 181 and fourth driving mechanism 18's drive end fixed connection, dwang 182 and driving motor 181's output shaft coaxial coupling, the one end that driving motor 181 was kept away from to dwang 182 articulates there is vacuum chuck 183, vacuum chuck 183 passes through the hose connection vacuum pump, driving motor 181 and vacuum pump all are connected with the PLC controller electricity, driving motor 181 chooses for use gear motor.

In actual use, through the rotation of PLC controller control driving motor 181, driving motor 181's output shaft drives dwang 182 and rotates, adjusts vacuum chuck 183 on the dwang 182 and absorbs the border position of UV membrane, keeps dwang 182 to be in the position of slope simultaneously, avoids dwang 182 and UV membrane to absorb in the vertical direction, makes the separation of IC chip and UV membrane more laborsaving.

Articulated between dwang 182 and vacuum chuck 183, when the angle of dwang 182 changes, when contact between vacuum chuck 183 and the UV membrane, the angle of vacuum chuck 183 also correspondingly changes, improves the suitability that vacuum chuck 183 used, then, the PLC controller control vacuum pump carries out work extraction vacuum, adsorbs vacuum chuck 183 on the UV membrane.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. The utility model provides a UV pad pasting cutting back IC chip separator which characterized in that: the fixing device comprises a fixing plate (1), wherein a first supporting rod (11) and a first driving mechanism (13) used for driving the first supporting rod (11) to ascend and descend are arranged above the fixing plate (1), the first driving mechanism (13) is fixedly connected with the fixing plate (1), the first driving mechanism (13) is in driving connection with the first supporting rod (11), a first supporting plate (12) is fixedly installed at one end, far away from the first driving mechanism (13), of the first supporting rod (11), an IC chip fixing mechanism and a second driving mechanism (14) used for driving the IC chip fixing mechanism to horizontally move are arranged below the first supporting plate (12), the second driving mechanism (14) is fixedly connected with the first supporting plate (12), and the second driving mechanism (14) is in driving connection with the IC chip fixing mechanism; the utility model discloses a solar cell module, including fixed plate (1), the below of fixed plate (1) is equipped with second bracing piece (15) and is used for driving third actuating mechanism (17) that second bracing piece (15) go up and down, the one end fixed mounting that third actuating mechanism (17) were kept away from in second bracing piece (15) has second backup pad (16), the top of second backup pad (16) is equipped with UV membrane suction means and is used for driving fourth actuating mechanism (18) of UV membrane suction means horizontal migration, fourth actuating mechanism (18) and second backup pad (16) fixed connection, fourth actuating mechanism (18) and UV membrane suction means drive connection, first actuating mechanism (13), second actuating mechanism (14), third actuating mechanism (17), fourth actuating mechanism (18), IC chip fixed establishment and UV membrane suction means all are connected with the PLC controller electricity.

2. The device for separating IC chips after UV film cutting as claimed in claim 1, wherein: IC chip fixed establishment includes U template (141), and U template (141) and the drive end fixed connection of second actuating mechanism (14), fixed mounting has the fixture that is used for fixed IC chip on U template (141) inside wall, and fixture's quantity is two, and two fixture symmetries set up, and two fixture are connected with the PLC controller electricity.

3. The device for separating IC chips after UV film cutting as claimed in claim 2, wherein: the clamping mechanism comprises a pushing plate (143) and a fifth driving mechanism (142) used for pushing the pushing plate (143), the fifth driving mechanism (142) is fixedly connected with the inner side wall of the U-shaped plate (141), the fifth driving mechanism (142) is in driving connection with the pushing plate (143), and the fifth driving mechanism (142) is electrically connected with the PLC.

4. The device for separating IC chips after UV film cutting as claimed in claim 3, wherein: the central position of the pushing plate (143) is provided with a limit groove (1431) matched with the IC chip.

5. The device for separating IC chips after UV film cutting as claimed in claim 1, wherein: UV membrane suction means includes driving motor (181) and dwang (182), driving motor (181) and the drive end fixed connection of fourth actuating mechanism (18), the output shaft coaxial coupling of dwang (182) and driving motor (181), the one end that driving motor (181) were kept away from in dwang (182) articulates there is vacuum chuck (183), vacuum chuck (183) pass through the hose connection vacuum pump, driving motor (181) and vacuum pump all are connected with the PLC controller electricity.