CN112981473B - 一种电解铜箔及其制备方法 - Google Patents
一种电解铜箔及其制备方法 Download PDFInfo
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- CN112981473B CN112981473B CN202110161468.9A CN202110161468A CN112981473B CN 112981473 B CN112981473 B CN 112981473B CN 202110161468 A CN202110161468 A CN 202110161468A CN 112981473 B CN112981473 B CN 112981473B
- Authority
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- Prior art keywords
- copper foil
- concentration
- electrolytic copper
- electrolyte
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000011889 copper foil Substances 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000460 chlorine Substances 0.000 claims abstract description 25
- 239000003792 electrolyte Substances 0.000 claims abstract description 23
- 238000005406 washing Methods 0.000 claims abstract description 19
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 15
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 6
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 claims abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000002202 Polyethylene glycol Substances 0.000 claims description 13
- 229920002873 Polyethylenimine Polymers 0.000 claims description 13
- 229920001223 polyethylene glycol Polymers 0.000 claims description 13
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 11
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 11
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 11
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229920002907 Guar gum Polymers 0.000 claims description 10
- 229910021389 graphene Inorganic materials 0.000 claims description 10
- 239000000665 guar gum Substances 0.000 claims description 10
- 229960002154 guar gum Drugs 0.000 claims description 10
- 235000010417 guar gum Nutrition 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052746 lanthanum Inorganic materials 0.000 claims description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 5
- 235000002639 sodium chloride Nutrition 0.000 claims description 5
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 2
- 239000001110 calcium chloride Substances 0.000 claims description 2
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 2
- 239000001103 potassium chloride Substances 0.000 claims description 2
- 235000011164 potassium chloride Nutrition 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 abstract description 6
- 229910001416 lithium ion Inorganic materials 0.000 abstract description 6
- 239000006259 organic additive Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 12
- 239000010410 layer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- -1 lanthanum ions Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- VQEHIYWBGOJJDM-UHFFFAOYSA-H lanthanum(3+);trisulfate Chemical compound [La+3].[La+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VQEHIYWBGOJJDM-UHFFFAOYSA-H 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- LVSITDBROURTQX-UHFFFAOYSA-H samarium(3+);trisulfate Chemical compound [Sm+3].[Sm+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O LVSITDBROURTQX-UHFFFAOYSA-H 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electrolytic Production Of Metals (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110161468.9A CN112981473B (zh) | 2021-02-05 | 2021-02-05 | 一种电解铜箔及其制备方法 |
| DE102021214877.8A DE102021214877A1 (de) | 2021-02-05 | 2021-12-22 | Elektrolytische Kupferfolie und Verfahren zur Herstellung der elektrolytischen Kupferfolie |
| KR1020210185081A KR102696641B1 (ko) | 2021-02-05 | 2021-12-22 | 전해동박 및 그 제작방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110161468.9A CN112981473B (zh) | 2021-02-05 | 2021-02-05 | 一种电解铜箔及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112981473A CN112981473A (zh) | 2021-06-18 |
| CN112981473B true CN112981473B (zh) | 2021-11-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110161468.9A Active CN112981473B (zh) | 2021-02-05 | 2021-02-05 | 一种电解铜箔及其制备方法 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102696641B1 (de) |
| CN (1) | CN112981473B (de) |
| DE (1) | DE102021214877A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990641B (zh) * | 2022-06-02 | 2023-10-17 | 山东金宝电子有限公司 | 一种载体超薄铜箔及其制备方法 |
| DE102022122200A1 (de) | 2022-09-01 | 2024-03-07 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Herstellen einer Kupferfolie für einen elektrochemischen Speicher, Kupferfolie und Verwendung einer Kupferfolie |
| CN115928159B (zh) * | 2023-01-30 | 2023-10-24 | 灵宝宝鑫电子科技有限公司 | 一种生产多孔铜箔的装置及其使用方法 |
| CN118186516B (zh) * | 2024-05-13 | 2024-08-20 | 湖南龙智新材料科技有限公司 | 一种高延伸率低轮廓电解铜箔添加剂及其应用 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5834140A (en) * | 1995-09-22 | 1998-11-10 | Circuit Foil Japan Co., Ltd. | Electrodeposited copper foil for fine pattern and method for producing the same |
| CN104651884A (zh) * | 2014-04-28 | 2015-05-27 | 雷磊 | 一种电解铜箔用复配添加剂 |
| CN105483764A (zh) * | 2015-12-04 | 2016-04-13 | 广东嘉元科技股份有限公司 | 一种电解铜箔添加剂 |
| CN107604197A (zh) * | 2016-07-12 | 2018-01-19 | 古河电气工业株式会社 | 电解铜箔 |
| CN109208041A (zh) * | 2018-09-18 | 2019-01-15 | 山东金宝电子股份有限公司 | 一种高性能超薄双面光铜箔制备用添加剂 |
| CN110760897A (zh) * | 2019-10-11 | 2020-02-07 | 广州盛门新材料科技有限公司 | 一种铜基石墨烯导热散热膜及其制备方法 |
| CN111058078A (zh) * | 2019-12-30 | 2020-04-24 | 中国科学院青海盐湖研究所 | 一种表面覆设有石墨烯薄膜的铜箔及其制备方法 |
| CN111254464A (zh) * | 2020-01-17 | 2020-06-09 | 广东嘉元科技股份有限公司 | 一种高抗拉强度锂离子电池用极薄电解铜箔的制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253345A (ja) * | 2005-03-10 | 2006-09-21 | Furukawa Circuit Foil Kk | 高純度電解銅箔及びその製造方法 |
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
-
2021
- 2021-02-05 CN CN202110161468.9A patent/CN112981473B/zh active Active
- 2021-12-22 KR KR1020210185081A patent/KR102696641B1/ko active IP Right Grant
- 2021-12-22 DE DE102021214877.8A patent/DE102021214877A1/de active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5834140A (en) * | 1995-09-22 | 1998-11-10 | Circuit Foil Japan Co., Ltd. | Electrodeposited copper foil for fine pattern and method for producing the same |
| CN104651884A (zh) * | 2014-04-28 | 2015-05-27 | 雷磊 | 一种电解铜箔用复配添加剂 |
| CN105483764A (zh) * | 2015-12-04 | 2016-04-13 | 广东嘉元科技股份有限公司 | 一种电解铜箔添加剂 |
| CN107604197A (zh) * | 2016-07-12 | 2018-01-19 | 古河电气工业株式会社 | 电解铜箔 |
| CN109208041A (zh) * | 2018-09-18 | 2019-01-15 | 山东金宝电子股份有限公司 | 一种高性能超薄双面光铜箔制备用添加剂 |
| CN110760897A (zh) * | 2019-10-11 | 2020-02-07 | 广州盛门新材料科技有限公司 | 一种铜基石墨烯导热散热膜及其制备方法 |
| CN111058078A (zh) * | 2019-12-30 | 2020-04-24 | 中国科学院青海盐湖研究所 | 一种表面覆设有石墨烯薄膜的铜箔及其制备方法 |
| CN111254464A (zh) * | 2020-01-17 | 2020-06-09 | 广东嘉元科技股份有限公司 | 一种高抗拉强度锂离子电池用极薄电解铜箔的制备方法 |
Non-Patent Citations (3)
| Title |
|---|
| Influence of titanium oxide films on copper nucleation during electrodeposition;Hyun K.Chang等;《Materials Science and Engineering: A》;20051005;第409卷(第1-2期);317-328 * |
| 何田.添加剂对电解铜箔组织性能的影响及优化.《中国优秀博硕士学位论文全文数据库(硕士) 工程科技Ⅰ辑》.2012,(第04期),B015-58. * |
| 添加剂对电解铜箔组织性能的影响及优化;何田;《中国优秀博硕士学位论文全文数据库(硕士) 工程科技Ⅰ辑》;20120415(第04期);B015-58 * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220113251A (ko) | 2022-08-12 |
| DE102021214877A1 (de) | 2022-08-11 |
| KR102696641B1 (ko) | 2024-08-21 |
| CN112981473A (zh) | 2021-06-18 |
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Application publication date: 20210618 Assignee: Jiangxi Jiayuan Technology Co.,Ltd. Assignor: GUANGDONG FINE YUAN SCIENCE TECHNOLOGY Co.,Ltd. Contract record no.: X2024980000403 Denomination of invention: An electrolytic copper foil and its preparation method Granted publication date: 20211123 License type: Common License Record date: 20240110 |
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