CN112975147B - Process for cutting piezoelectric silicon dioxide by laser - Google Patents
Process for cutting piezoelectric silicon dioxide by laser Download PDFInfo
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- CN112975147B CN112975147B CN202110169035.8A CN202110169035A CN112975147B CN 112975147 B CN112975147 B CN 112975147B CN 202110169035 A CN202110169035 A CN 202110169035A CN 112975147 B CN112975147 B CN 112975147B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention provides a process for cutting piezoelectric silicon dioxide by laser, which comprises the following steps: placing a preset number of wafers to be cut in a wafer feeding device of a cutting machine body; starting a wafer feeding device, and sequentially conveying the wafers to be cut to a wafer feeding device by the wafer feeding device according to a preset beat; the wafer feeding device conveys the wafer to be cut to the wafer positioning device, and the wafer positioning device automatically clamps the wafer to be cut; starting the laser cutting device, and cutting the clamped wafer to be cut into a finished wafer product by the laser cutting device; after cutting, the wafer positioning device automatically loosens; and taking the finished wafer out of the wafer positioning device by using the wafer blanking device, and conveying the finished wafer into the wafer blanking box. In the invention, because the laser cutting mode is adopted, the laser cutting is non-contact processing, the problem that the wafer is damaged due to large contact pressure with the wafer when the wafer is cut can be avoided, and the cutting precision and the cutting efficiency are improved.
Description
Technical Field
The invention relates to the technical field of wafer manufacturing, in particular to a process for cutting piezoelectric silicon dioxide by laser.
Background
With the increasing development of the microelectronic industry, the demand of wafers for various chips is larger. The silicon dioxide is an excellent matrix material, and has the advantages of high thermal stability, chemical stability, high insulating property, transparency to visible light and the like.
At present, most of traditional methods for processing a silicon dioxide matrix to a specified size are contact mechanical multi-line cutting, the method has complicated processes, a cutting head needs to be in contact with a wafer during cutting, the wafer is easily damaged due to overlarge contact pressure, and the processing yield is low.
In order to solve the dilemma of the current industry, a process for cutting piezoelectric silicon dioxide by laser is provided.
Disclosure of Invention
The invention provides a process for cutting piezoelectric silicon dioxide by laser, which is used for solving the technical problems that contact type mechanical multi-line cutting is mainly used when a silicon dioxide substrate is cut at present, a cutting head needs to be in contact with a wafer during cutting, the wafer is easy to damage due to overlarge contact pressure, and the processing qualified rate is low.
In order to solve the technical problem, the invention discloses a process for cutting piezoelectric silicon dioxide by laser, which comprises the following steps:
step 1: placing a preset number of wafers to be cut in a wafer feeding device of a cutting machine body;
step 2: starting the wafer feeding device, and sequentially conveying the wafers to be cut to a wafer feeding device by the wafer feeding device according to a preset beat;
and step 3: the wafer feeding device conveys the wafer to be cut to a wafer positioning device, and the wafer positioning device automatically clamps the wafer to be cut;
and 4, step 4: starting a laser cutting device, wherein the laser cutting device cuts the clamped wafer to be cut into a finished wafer product;
and 5: after cutting, the wafer positioning device automatically loosens;
step 6: and taking the finished wafer out of the wafer positioning device by using a wafer blanking device, and conveying the finished wafer into a wafer blanking box.
Preferably, in step 1, a plurality of wafer feeders are provided, and the plurality of wafer feeders can automatically feed the wafer feeders at the same time.
Preferably, in step 3, a visual snapshot analysis device is further disposed in the cutting machine body, and the visual snapshot analysis device is disposed above the wafer positioning device and is used for identifying and analyzing the position and size of the wafer to be cut placed on the wafer positioning device and assisting the wafer positioning device in clamping the wafer to be cut.
Preferably, in step 4, the laser cutting device is provided with a plurality of laser cutting heads for simultaneously cutting a plurality of groups of wafers to be cut.
Preferably, this internal level of cutting machine sets up work platform, the work platform lateral wall with cutting machine body inner wall fixed connection, wafer feedway wafer loading attachment laser cutting device wafer positioner wafer unloader reaches wafer unloading box all sets up the work platform upper surface, the work platform below sets up circuit control device, set up electrical control part in the circuit control device, wafer feedway wafer loading attachment laser cutting device wafer positioner wafer unloader the vision snapshot analytical equipment respectively in electrical control part electric connection.
Preferably, the wafer positioning apparatus includes:
the base is arranged on the upper surface of the working platform;
the supporting seat is arranged on the upper surface of the base and is fixedly connected with the base;
the base is arranged at the center of the upper surface of the supporting seat and is fixedly connected with the supporting seat;
the positioning seat is arranged at the center of the upper surface of the base, the lower end of the positioning seat is fixedly connected with the upper surface of the base, and two side walls of one end of the positioning seat, which is far away from the base, are respectively provided with a first baffle plate and a second baffle plate;
the fixing table is arranged on the upper surface of the supporting seat and fixedly connected with the supporting seat, a sliding rail is horizontally arranged on the upper surface of the fixing table and is connected with a sliding block in a sliding mode, the sliding block faces towards one end of the positioning seat and is arranged in a Y shape, and the sliding block faces towards the side wall of one end of the positioning seat and can be attached to the side wall of the positioning seat.
Preferably, the supporting seat upper surface still is provided with the dust catcher, the dust absorption mouth and the connecting pipe one end of dust catcher can be dismantled and be connected, the connecting pipe other end sets up the suction hood, the suction hood sets up locating seat side top, the suction hood opening is aimed at the locating seat upper surface.
Preferably, the device further comprises an air blowing device, wherein the air blowing device comprises:
the compression box is arranged on the upper surface of the supporting seat;
the first sliding plate is arranged inside the compression box and is in sliding connection with the inner wall of the compression box, a first sliding rod is arranged on one side of the first sliding plate and is perpendicular to the first sliding plate, a sliding sleeve is arranged at one end, away from the first sliding plate, of the first sliding rod, the inner wall of one end of the sliding sleeve is in sliding connection with the outer wall of the first sliding rod, the other end of the sliding sleeve penetrates through the side wall of the compression box and extends to the outside of the compression box, and the sliding sleeve is in sliding connection with the side wall of the compression box;
the first spring is arranged inside the sliding sleeve, one end of the first spring is fixedly connected with one end, away from the first sliding plate, of the first sliding rod, and the other end of the first spring is fixedly connected with the inner wall of one end, away from the first sliding rod, of the sliding sleeve;
the first motor is arranged on the upper surface of the supporting seat, a first rotating shaft is arranged at the output end of the first motor, a rotating rod is arranged at one end of the first rotating shaft, which is far away from the first motor, and the rotating rod is perpendicular to the first rotating shaft and is fixedly connected with the first rotating shaft;
the first connecting rod is arranged at one end, away from the first rotating shaft, of the rotating rod, one end of the first connecting rod is rotatably connected with the rotating rod, and the other end of the first connecting rod is rotatably connected with one end, away from the first sliding rod, of the sliding sleeve;
the gas generating device is arranged on one side, far away from the positioning seat, of the compression box and fixedly connected with the side wall of the supporting seat, the gas generating device is used for storing auxiliary gas, a heater is further arranged in the gas generating device and used for heating the auxiliary gas, a first hose is arranged at the output end of the gas generating device, an air inlet pipe is arranged at one end, far away from the gas generating device, of the first hose, one end, far away from the first hose, of the air inlet pipe penetrates through the side wall of the compression box and the first sliding plate and is communicated with the interior of the compression box respectively, the air inlet pipe and the first sliding rod are positioned on the same side of the first sliding plate, one end, far away from the first hose, of the air inlet pipe is fixedly connected with the first sliding plate, and the air inlet pipe is connected with the side wall of the compression box in a sliding manner, a first one-way valve is arranged in the air inlet pipe;
the second sliding plate is arranged inside the compression box, the second sliding plate is positioned on one side, away from the first sliding rod, of the first sliding plate, the second sliding plate is connected with the inner wall of the compression box in a sliding mode, a second sliding rod is arranged on one side, away from the first sliding plate, of the second sliding plate, the second sliding rod is perpendicular to the second sliding plate, one end of the second sliding rod is fixedly connected with the side wall of the second sliding plate, one end, away from the second sliding plate, of the second sliding rod penetrates through the side wall of the compression box and extends to the outside of the compression box and is provided with a sliding frame, a rack is arranged on the inner wall of the sliding frame, a guide rail is connected to the bottom of the sliding frame in a sliding mode, and the guide rail is fixedly connected with the upper surface of the supporting seat;
the second motor is arranged inside the sliding frame, the bottom of the second motor is fixedly connected with the upper surface of the supporting seat, one side, away from the supporting seat, of the second motor is provided with an output shaft, the output shaft is provided with a first gear, the first gear is a semicircular gear, and the first gear is meshed with the rack;
the fixing block is arranged between the positioning seat and the compression box, the bottom of the fixing block is fixedly connected with the upper surface of the supporting seat, one end of the fixing block, far away from the supporting seat, is provided with an air blowing pipe, the outlet end of the air blowing pipe faces the upper surface of the positioning seat, one end of the air blowing pipe, far away from the positioning seat, is provided with a second hose, one end of the second hose, far away from the air blowing pipe, is provided with an air outlet pipe, the air outlet pipe sequentially penetrates through the side wall of the compression box, the second sliding plate and is communicated with the interior of the compression box, one end of the air outlet pipe, far away from the second hose, is fixedly connected with the second sliding plate, the air outlet pipe is connected;
the first air pressure sensor is arranged on one side wall, away from the first slide bar, of the first slide plate and used for detecting air pressure between the first slide plate and the second slide plate;
the first controller is arranged outside the compression box and is electrically connected with the first motor, the second motor and the first air pressure sensor respectively.
Preferably, the method further comprises the following steps:
the concentration sensor is arranged on the outer wall of the dust hood and aligned to the upper surface of the positioning seat and used for detecting the dust concentration above the positioning seat;
the flow velocity sensor is arranged on the inner wall of the connecting pipe and used for detecting the wind speed in the connecting pipe;
the air volume regulator is arranged on the upper surface of the supporting seat and is electrically connected with the dust collector, and the air volume regulator is used for regulating the dust collection air volume of the dust collector;
the second controller is arranged outside the dust collector and is respectively and electrically connected with the concentration sensor, the flow velocity sensor and the air volume regulator;
the second controller controls the work of the air volume regulator based on the concentration sensor and the flow rate sensor, and comprises the following steps:
wherein, F1The resistance of the dust above the positioning seat in the process of being sucked into the dust hood is represented by pi which is a circumferential rate and is 3.14, and rho1The dust concentration r above the positioning seat detected by the concentration sensor1Is the preset radius, v, of the dust particles above the positioning seat1For a predetermined flow velocity of dust above said positioning seat, C1The resistance coefficient of dust above the positioning seat when flowing in the air is shown as g, g is the gravity acceleration, and g is 9.8m/s2，D1Is the diameter of the opening of the dust hood, mu2Is the air density, mu is the dynamic viscosity of the dust above the positioning seat, v2The wind speed in the connecting pipe detected by the flow velocity sensor;
step 2: calculating the target air volume of the dust collector by a formula (2) based on the calculation result of the step 1 and the detection values of the concentration sensor and the flow velocity sensor:
wherein Q is1Is a target air volume of the dust collector, gamma is a preset dust collection efficiency of the dust collector, a1Is the linear distance r from the dust hood to the upper surface of the positioning seat3For the radius of the connecting tube, ln is a logarithmic function, ρ3The preset concentration of the dust above the positioning seat is obtained;
and step 3: and (3) controlling the air volume regulator to regulate the actual air volume of the dust collector to the target air volume of the dust collector by the second controller according to the calculation result of the step (2).
Preferably, in the step 4, the laser cutting device includes a laser, the laser is provided with a cutting head, the cutting head is used for cutting the wafer to be cut, the cutting head cuts the wafer to be cut according to a preset cutting path, and the width of the preset cutting path is calculated by a formula (3):
W1＝P1·tu·E·T·η·k (3)
wherein, W1For the width of the predetermined cutting path, P1Is the rated power of the laser, tuThe method comprises the steps of presetting laser pulse width of a laser, presetting laser pulse energy of the laser, T thickness of a wafer to be cut, eta presetting cutting efficiency of the laser, and k presetting heat dissipation coefficient when the wafer to be cut is cut by the laser.
The technical scheme of the invention has the following advantages: the invention provides a process for cutting piezoelectric silicon dioxide by laser, which comprises the following steps: placing a preset number of wafers to be cut in a wafer feeding device of a cutting machine body; starting a wafer feeding device, and sequentially conveying the wafers to be cut to a wafer feeding device by the wafer feeding device according to a preset beat; the wafer feeding device conveys the wafer to be cut to the wafer positioning device, and the wafer positioning device automatically clamps the wafer to be cut; starting the laser cutting device, and cutting the clamped wafer to be cut into a finished wafer product by the laser cutting device; after cutting, the wafer positioning device automatically loosens; and taking the finished wafer out of the wafer positioning device by using the wafer blanking device, and conveying the finished wafer into the wafer blanking box. In the invention, because the laser cutting mode is adopted, the laser cutting is non-contact processing, the problem that the wafer is damaged due to large contact pressure with the wafer when the wafer is cut can be avoided, and the cutting precision and the cutting efficiency are improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the apparatus particularly pointed out in the written description and drawings thereof.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view of the entire body of the cutting machine according to the present invention;
FIG. 3 is an enlarged view of the wafer positioning device of the present invention;
FIG. 4 is a schematic view of the arrangement of the vacuum cleaner of the present invention;
FIG. 5 is a schematic view of an air blowing device according to the present invention;
FIG. 6 is an enlarged view taken at A of FIG. 5 according to the present invention.
In the figure: 1. a cutter body; 2. a wafer supply device; 3. a wafer loading device; 4. a wafer positioning device; 5. a laser cutting device; 6. a wafer blanking device; 7. a wafer discharging box; 8. a visual snapshot analysis device; 9. a working platform; 10. a circuit control device; 11. a base; 12. a supporting seat; 13. a base; 14. positioning seats; 15. a first baffle plate; 16. a second baffle; 17. a fixed table; 18. a slide rail; 19. a slider; 20. a vacuum cleaner; 21. a connecting pipe; 22. a dust hood; 23. a compression box; 24. a first slide plate; 25. a first slide bar; 26. a sliding sleeve; 27. a first spring; 28. a first motor; 29. a first rotating shaft; 30. rotating the rod; 31. a first link; 32. a gas generating device; 33. a first hose; 34. an air inlet pipe; 35. a second slide plate; 36. a second slide bar; 37. a sliding frame; 38. a rack; 39. a guide rail; 40. a second motor; 41. an output shaft; 42. a first gear; 43. a fixed block; 44. an air blowing pipe; 45. a second hose; 46. and an air outlet pipe.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to an order or sequence, and do not limit the present invention, but only distinguish components or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions and technical features between various embodiments can be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not be within the protection scope of the present invention.
Example 1:
the embodiment of the invention provides a process for cutting piezoelectric silicon dioxide by laser, which comprises the following steps as shown in figures 1-6:
step 1: placing a preset number of wafers to be cut in a wafer feeding device 2 of a cutting machine body 1;
step 2: starting the wafer feeding device 2, and sequentially conveying the wafers to be cut to a wafer feeding device 3 by the wafer feeding device 2 according to a preset beat;
and step 3: the wafer feeding device 3 conveys the wafer to be cut to a wafer positioning device 4, and the wafer positioning device 4 automatically clamps the wafer to be cut;
and 4, step 4: starting a laser cutting device 5, wherein the laser cutting device 5 cuts the clamped wafer to be cut into a finished wafer product;
and 5: after the cutting is finished, the wafer positioning device 4 is automatically released;
step 6: and taking the finished wafer out of the wafer positioning device 4 by using a wafer blanking device 6, and conveying the finished wafer into a wafer blanking box 7.
The working principle and the beneficial effects of the technical scheme are as follows: the method comprises the steps of placing a preset number of wafers to be cut in a wafer feeding device 2 of a cutting machine body 1, wherein the wafers to be cut are wafers taking silicon dioxide as a base body, starting the wafer feeding device 2, sequentially conveying the wafers to be cut to a wafer feeding device 3 according to a preset beat, conveying the wafers to be cut to a wafer positioning device 4 by the wafer feeding device 3, placing the wafers to be cut on the wafer positioning device 4 manually or by a manipulator, automatically clamping the wafers to be cut by the wafer positioning device 4, starting a laser cutting device 5, cutting the clamped wafers to be cut into wafer finished products by the laser cutting device 5, cutting the wafers to be cut into the wafer finished products in a non-contact mode by the laser cutting device 5, cutting the silicon dioxide base bodies of the wafers to be cut to a specified size, and automatically loosening the wafer positioning device 4 after the cutting is finished, taking out the finished wafer from the wafer positioning device 4 by using the wafer blanking device 6, and finally conveying the finished wafer into the wafer blanking box 7, so as to finish the high-precision cutting of the silicon dioxide matrix of the wafer, wherein the laser cutting device 5 adopts a laser with specific wavelength and power, so as to realize the cutting process of the piezoelectric silicon dioxide, the laser reflects the laser by a plurality of reflectors, expands the light by a beam expander with specific times, and finally cuts the piezoelectric silicon dioxide of the wafer to be cut by a cutting head matched with the laser and the piezoelectric silicon dioxide, in the step 4, the laser cutting device 5 is started, and the parameter adjustment is carried out on the laser cutting device 5 according to the wafers to be cut with different thicknesses, wherein the parameter adjustment comprises the selection of laser wavelength, the control of power, the adjustment control of pulse width and pulse energy and the adjustment of the diameter of a facula transverse mode during the laser cutting, the wafer to be cut with different thicknesses is matched, so that accurate cutting of the piezoelectric silicon dioxide of the wafer to be cut is completed, the influence of huge energy generated in the moment when the wafer is cut on the piezoelectric silicon dioxide is reduced to the minimum, meanwhile, a part for supporting the wafer to be cut is made of a specific material, most of energy is concentrated on the piezoelectric silicon dioxide of the wafer to be cut when laser passes through, the material of the part absorbs less laser energy so that the service life of the part can be prolonged, due to the fact that a laser cutting mode is adopted, the laser cutting is in non-contact processing, the problem that the wafer is damaged due to the fact that the wafer is large in contact pressure with the wafer when the wafer is cut can be avoided, the cutting precision and the cutting efficiency are improved, the process is simple, and the applicability is strong.
Example 2
On the basis of the above embodiment 1, in step 1, a plurality of wafer feeding devices 2 are provided, and a plurality of wafer feeding devices 2 can automatically feed the wafer feeding devices 3 at the same time;
in step 4, the laser cutting device 5 is provided with a plurality of laser cutting heads for simultaneously cutting a plurality of groups of wafers to be cut.
The working principle and the beneficial effects of the technical scheme are as follows: wafer feedway 2 sets up to a plurality ofly, can be simultaneously for the 3 feeds of wafer loading attachment, has improved feed speed, simultaneously, is provided with a plurality of laser cutting heads in the laser cutting device 5, can treat the cutting wafer cutting simultaneously, great improvement cutting efficiency, increase the operation beat, increase output.
Example 3
On the basis of embodiment 1 or 2, as shown in fig. 2, in step 3, a visual snapshot analysis device 8 is further disposed in the cutter body 1, and the visual snapshot analysis device 8 is disposed above the wafer positioning device 4 and is used for identifying and analyzing the position size of the wafer to be cut placed on the wafer positioning device 4 and assisting the wafer positioning device 4 in clamping the wafer to be cut.
The working principle and the beneficial effects of the technical scheme are as follows: still be provided with vision snapshot analytical equipment 8 in wafer positioner 4 top, can treat the cutting wafer position size and carry out identification analysis to guarantee that laser cutting device 5 can be accurate cut the silica base member to predetermineeing the size, also can not damage the wafer, improved cutting accuracy.
Example 4
On the basis of embodiment 3, as shown in fig. 2, a working platform 9 is horizontally arranged in the cutting machine body 1, the side wall of the working platform 9 is fixedly connected with the inner wall of the cutting machine body 1, the wafer feeding device 2, the wafer feeding device 3, the laser cutting device 5, the wafer positioning device 4, the wafer blanking device 6 and the wafer blanking box 7 are arranged on the upper surface of the working platform 9, a circuit control device 10 is arranged below the working platform 9, an electric control component is arranged in the circuit control device 10, and the wafer feeding device 2, the wafer feeding device 3, the laser cutting device 5, the wafer positioning device 4, the wafer blanking device 6 and the visual snapshot analysis device 8 are respectively electrically connected with the electric control component.
The working principle and the beneficial effects of the technical scheme are as follows: the cutting machine body 1 is horizontally provided with a working platform 9, the wafer feeding device 2, the wafer feeding device 3, the laser cutting device 5, the wafer positioning device 4, the wafer blanking device 6 and the wafer blanking box 7 are all arranged on the working platform 9, the working platform 9 can provide support for the devices, the working platform 9 is made of marble material, and has the advantages of good rigidity, high hardness, strong wear resistance and small temperature deformation, a circuit control device 10 is arranged below the working platform 9, the circuit control device 10 is composed of a plurality of electric control components, the wafer feeding device 2, the wafer feeding device 3, the laser cutting device 5, the wafer positioning device 4, the wafer blanking device 6 and the visual snapshot analysis device 8 are all electrically connected with the corresponding electric control components, the device can be controlled to automatically operate through the electric control component, and the automation degree of the equipment is improved.
Example 5
On the basis of embodiment 4, as shown in fig. 3, the wafer positioning apparatus 4 includes:
the base 11 is arranged on the upper surface of the working platform 9;
the supporting seat 12 is arranged on the upper surface of the base 11, and the supporting seat 12 is fixedly connected with the base 11;
the base 13 is arranged at the center of the upper surface of the supporting seat 12, and the base 13 is fixedly connected with the supporting seat 12;
the positioning seat 14 is arranged at the center of the upper surface of the base 13, the lower end of the positioning seat 14 is fixedly connected with the upper surface of the base 13, and two side walls of one end, far away from the base 13, of the positioning seat 14 are respectively provided with a first baffle plate 15 and a second baffle plate 16;
fixed station 17, fixed station 17 sets up the supporting seat 12 upper surface, fixed station 17 with supporting seat 12 fixed connection, fixed station 17 upper surface level sets up slide rail 18, sliding connection has slider 19 on the slide rail 18, slider 19 orientation positioning seat 14 one end sets up to the Y type, slider 19 orientation positioning seat 14 one end lateral wall can with the laminating of positioning seat 14 lateral wall.
The working principle and the beneficial effects of the technical scheme are as follows: the wafer positioning device 4 takes the base 11 as the bottommost part, the base 11 is installed on the surface of a workbench, a supporting seat 12 is installed on the upper surface of the base 11, a base 13 is installed at the center position of the upper surface of the supporting seat 12, a positioning seat 14 is installed on the base 13, a wafer to be cut can be placed on the positioning seat 14, the positioning seat 13 is made of a specific material, so that most energy is concentrated on piezoelectric silicon dioxide of the wafer to be cut when laser passes through, the positioning seat 13 absorbs less laser energy so as to prolong the service life of the positioning seat 13, a first baffle 15 and a second baffle 16 are respectively installed on two side walls of the positioning seat 14, the positioning function can be achieved, meanwhile, a fixed table 17 is arranged on the upper surface of the supporting seat 12, a slide rail 18 is arranged on the fixed table 17, a slide block 19 is connected on the slide rail 18 in a sliding manner, the slide block 19 can be driven by electric control, and the slide block 19 can slide on the slide rail 18, when the wafer to be cut is placed on the positioning seat 14, the sliding block 19 is started, the Y-shaped side wall of the sliding block 19 can be in contact with two side walls of the wafer to be cut, and the wafer to be cut is fixed on the positioning seat 14 under the limiting action of the first baffle 15 and the second baffle 16, so that the wafer to be cut is more stable, and cannot shake during cutting, and the cutting precision is improved.
Example 6
On the basis of embodiment 5, as shown in fig. 4, a dust collector 20 is further disposed on the upper surface of the support base 12, a dust suction port of the dust collector 20 is detachably connected to one end of a connecting pipe 21, a dust suction hood 22 is disposed at the other end of the connecting pipe 21, the dust suction hood 22 is disposed above the side of the positioning seat 14, and an opening of the dust suction hood 22 is aligned with the upper surface of the positioning seat 14.
The working principle and the beneficial effects of the technical scheme are as follows: still be provided with dust catcher 20 at supporting seat 12 upper surface, dust catcher 20 is connected with suction hood 22 through connecting pipe 21, and the opening of suction hood 22 aims at positioning seat 14 upper surface, and when laser cutting, start dust catcher 20, dust that dust catcher 20 can produce when will cutting through suction hood 22 inhales inside dust catcher 20 to guarantee clean cutting environment, avoid the dust diffusion and influence the cutting precision.
Example 7
On the basis of embodiment 5 or 6, as shown in fig. 5 and 6, the air blowing device further comprises an air blowing device, wherein the air blowing device comprises:
a compression box 23, wherein the compression box 23 is arranged on the upper surface of the supporting seat 12;
the first sliding plate 24 is arranged inside the compression box 23, the first sliding plate 24 is connected with the inner wall of the compression box 23 in a sliding manner, one side of the first sliding plate 24 is provided with a first sliding rod 25, the first sliding rod 25 is perpendicular to the first sliding plate 24, one end, away from the first sliding plate 24, of the first sliding rod 25 is provided with a sliding sleeve 26, the inner wall of one end of the sliding sleeve 26 is connected with the outer wall of the first sliding rod 25 in a sliding manner, the other end of the sliding sleeve 26 penetrates through the side wall of the compression box 23 and extends to the outside of the compression box 23, and the sliding sleeve 26 is connected with the side wall of the compression box 23 in a sliding manner;
the first spring 27 is arranged inside the sliding sleeve 26, one end of the first spring 27 is fixedly connected with one end of the first sliding rod 25 far away from the first sliding plate 24, and the other end of the first spring 27 is fixedly connected with the inner wall of one end of the sliding sleeve 26 far away from the first sliding rod 25;
the first motor 28 is arranged on the upper surface of the support seat 12, a first rotating shaft 29 is arranged at the output end of the first motor 28, a rotating rod 30 is arranged at one end, far away from the first motor 28, of the first rotating shaft 29, and the rotating rod 30 is perpendicular to the first rotating shaft 29 and is fixedly connected with the first rotating shaft 29;
a first connecting rod 31, where the first connecting rod 31 is disposed at an end of the rotating rod 30 away from the first rotating shaft 29, one end of the first connecting rod 31 is rotatably connected to the rotating rod 30, and the other end of the first connecting rod 31 is rotatably connected to an end of the sliding sleeve 26 away from the first sliding rod 25;
the gas generating device 32 is arranged on one side, far away from the positioning seat 14, of the compression box 23, the gas generating device 32 is fixedly connected with the side wall of the supporting seat 12, the gas generating device 32 is used for storing auxiliary gas, a heater is further arranged in the gas generating device 32 and used for heating the auxiliary gas, a first hose 33 is arranged at the output end of the gas generating device 32, an air inlet pipe 34 is arranged at one end, far away from the gas generating device 32, of the first hose 33, one end, far away from the first hose 33, of the air inlet pipe 34 respectively penetrates through the side wall of the compression box 23, the first sliding plate 24 and is communicated with the interior of the compression box 23, the air inlet pipe 34 and the first sliding rod 25 are positioned on the same side of the first sliding plate 24, one end, far away from the first hose 33, of the air inlet pipe 34 is fixedly connected with the first sliding plate 24, the air inlet pipe 34 is connected with the side wall of the compression box 23 in a sliding manner, and a first one-way valve is arranged in the air inlet pipe 34;
the second sliding plate 35 is arranged inside the compression box 23, the second sliding plate 35 is positioned on one side of the first sliding plate 24, which is far away from the first sliding rod 25, the second sliding plate 35 is slidably connected with the inner wall of the compression box 23, a second sliding rod 36 is arranged on one side of the second sliding plate 35, which is far away from the first sliding plate 24, the second sliding rod 36 is perpendicular to the second sliding plate 35, one end of the second sliding rod 36 is fixedly connected with the side wall of the second sliding plate 35, one end of the second sliding rod 36, which is far away from the second sliding plate 35, penetrates through the side wall of the compression box 23, extends to the outside of the compression box 23 and is provided with a sliding frame 37, the inner wall of the sliding frame 37 is provided with a rack 38, the bottom of the sliding frame 37 is slidably connected with a guide rail 39, and the guide rail 39 is fixedly connected with the upper surface of the supporting seat 12;
the second motor 40 is arranged inside the sliding frame 37, the bottom of the second motor 40 is fixedly connected with the upper surface of the supporting seat 12, an output shaft 41 is arranged on one side, away from the supporting seat 12, of the second motor 40, a first gear 42 is arranged on the output shaft 41, the first gear 42 is a semicircular gear, and the first gear 42 is meshed with the rack 38;
the fixing block 43 is arranged between the positioning seat 14 and the compression box 23, the bottom of the fixing block 43 is fixedly connected with the upper surface of the supporting seat 12, one end of the fixing block 43, which is far away from the supporting seat 12, is provided with an air blowing pipe 44, the outlet end of the air blowing pipe 44 faces the upper surface of the positioning seat 14, one end of the air blowing pipe 44, which is far away from the positioning seat 14, is provided with a second hose 45, one end of the second hose 45, which is far away from the air blowing pipe 44, is provided with an air outlet pipe 46, the air outlet pipe 46 sequentially penetrates through the side wall of the compression box 23 and the second sliding plate 35 and is communicated with the interior of the compression box 23, one end of the air outlet pipe 46, which is far away from the second hose 45, is fixedly connected with the second sliding plate 35, the air outlet pipe 46 is slidably connected with the side wall of the compression box 23, and a second one-way valve is arranged in the air outlet pipe 46;
a first air pressure sensor, which is arranged on a side wall of the first sliding plate 24 away from the first slide bar 25, and is used for detecting air pressure between the first sliding plate 24 and the second sliding plate 35;
the first controller is arranged outside the compression box 23, and the first controller is respectively electrically connected with the first motor 28, the second motor 40 and the first air pressure sensor.
The working principle and the beneficial effects of the technical scheme are as follows: when cutting operation is performed, the first motor 28 and the second motor 40 are started, the first motor 28 rotates according to a preset rotating speed, the second motor 40 rotates according to a preset period, when cutting starts, the sliding frame 37 is located at a position close to the compression box 23, the first motor 28 rotates to drive the first rotating shaft 29 to rotate, the first rotating shaft 29 rotates to drive the rotating rod 30 to rotate, the rotating rod 30 rotates to drive the sliding sleeve 26 to slide back and forth in the compression box 23 through the first connecting rod 31, when the sliding sleeve 26 slides towards a direction close to the first motor 28, the sliding sleeve 26 drives the first sliding rod 25 to move through the first spring 27, the first sliding rod 25 drives the first sliding plate 24 to slide in the compression box 23, the second sliding plate 35 remains stationary, when the first sliding plate 24 slides towards the first motor 28, the pressure in the compression box 23 is reduced, the auxiliary gas in the gas generating device 32 enters the gas inlet pipe 34 from the first hose 33, then the gas enters the space between the first sliding plate 24 and the second sliding plate 35 of the compression box 23 from the gas inlet pipe 34, the auxiliary gas is inert gas, when the gas pressure inside the compression box 23 detected by the first gas pressure sensor reaches the preset gas pressure, the first connecting rod 31 drives the sliding sleeve 26 to slide towards the inside of the compression box 23, the sliding sleeve 26 drives the first sliding plate 24 to slide towards the second sliding plate 35 in the compression box 23 through the first spring 27, the distance between the first sliding plate 24 and the second sliding plate 35 gradually decreases, the auxiliary gas is discharged into the second hose 45 from the gas outlet pipe 46 on the second sliding plate 35 under the pressure effect, and then is blown out from the gas blowing pipe 44, the high-pressure inert gas is blown to the upper surface of the positioning seat 14 from the gas blowing pipe 44, so as to blow off large-particle impurities generated by cutting, prevent the impurities generated by cutting from attaching to the surface of the wafer to affect the quality of the wafer, the first one-way valve and the second one-way valve are respectively arranged in the gas inlet pipe 34 and the gas outlet pipe 46, prevent the gas from flowing freely, because laser cutting processing is hot working, can produce a large amount of heat gradually when cutting, because expend with heat and contract with cold effect, can make silicon dioxide base member and wafer expend with heat in the twinkling of an eye when cutting, contract with cold rapidly after the cutting, can make the wafer damage, consequently set up the heater in gas generation device 32, the heater can heat the auxiliary gas in gas generation device 32, then the gas that is blown out by gas blow pipe 44 is the steam, thereby for treating the cutting wafer on positioning seat 14 carries out the bulk heating, prevent that local temperature too high expend with heat and make the wafer damage when local cutting, simultaneously, along with the increase of cutting time, the impurity that the cutting produced is more and more, and the surface temperature of treating the cutting wafer also is higher and more, at this moment, second motor 40 rotates the preset angle, output shaft 41 drives first gear 42 and rotates the preset angle, first gear 42 meshes with the left side inner wall of sliding frame 37 and drives sliding frame 37 and upwards keeps away from compressing on guide rail 39 and compressing The box 23 slides, the sliding frame 37 drives the second sliding plate 35 to slide towards the direction far away from the first sliding plate 24 through the second sliding rod 36, the space between the first sliding plate 24 and the second sliding plate 35 is enlarged, the gas entering the compression box 23 is increased, the hot gas blown out by the gas blowing pipe 44 is also increased, the gas blowing amount can be increased, so that more cutting impurities can be blown off, and higher heat can be provided for the wafer to be cut, after the cutting is finished, the wafer to be cut needs to be cooled slowly, the first gear 42 rotates to the position meshed with the rack 38 on the inner wall of the right side of the sliding frame 37, and rotates for a preset angle according to a preset time interval, the second sliding plate 35 gradually approaches the first sliding plate 24, the hot gas blown out by the gas blowing pipe 44 is also gradually reduced, the purpose of slow cooling is achieved, the wafer is prevented from being deformed due to rapid cold shrinkage, and the gas blowing pipe 44 can not only gradually increase the gas blowing amount along with the increase of the cutting time through the arrangement of the gas blowing device, guarantee sufficient volume of blowing, the impurity that will cut the production blows off more thoroughly, but also can increase the heat along with the increase of cutting time, avoids the quick thermal expansion of wafer and breaks, simultaneously, continues to be the wafer heat supply after the cutting finishes, makes the wafer slow cooling, prevents the wafer rapid cooling to effectual wafer of having protected has improved the qualification rate of cutting.
Example 8
On the basis of embodiment 6, the method further comprises the following steps:
the concentration sensor is arranged on the outer wall of the dust hood 22 and is aligned to the upper surface of the positioning seat 14, so as to detect the dust concentration above the positioning seat 14;
the flow velocity sensor is arranged on the inner wall of the connecting pipe 21 and used for detecting the wind velocity in the connecting pipe 21;
the air volume regulator is arranged on the upper surface of the supporting seat 12, is electrically connected with the dust collector 20 and is used for regulating the dust collection air volume of the dust collector 20;
the second controller is arranged outside the dust collector 20 and is respectively and electrically connected with the concentration sensor, the flow velocity sensor and the air volume regulator;
the second controller controls the work of the air volume regulator based on the concentration sensor and the flow rate sensor, and comprises the following steps:
wherein, F1Is the resistance force of the dust above the positioning seat 14 in the process of being sucked into the dust hood 22, wherein pi is the circumferential rate, pi is 3.14, and rho is1The dust concentration r above the positioning seat 14 detected by the concentration sensor1Is the preset radius, v, of the dust particles above the positioning seat 141For a predetermined flow velocity of dust above said positioning seat 14, C1G is the gravity acceleration, g is the resistance coefficient of the dust above the positioning seat 14 when the dust flows in the air, and g is 9.8m/s2，D1Is the diameter, p, of the opening of the dust hood 222Is the air density, mu is the kinematic viscosity of the dust above the positioning seat 14, v2The wind speed in the connecting pipe 21 detected by the flow velocity sensor;
step 2: calculating the target air volume of the cleaner 20 by the formula (2) based on the calculation result of the step 1 and the detection values of the concentration sensor and the flow velocity sensor:
wherein Q is1A target air volume of the vacuum cleaner 20, γ is a predetermined suction efficiency of the vacuum cleaner 20, a1Is the linear distance r from the dust hood 22 to the upper surface of the positioning seat 143For the radius of the connecting tube 21 ln is a logarithmic function, p3The preset concentration of the dust above the positioning seat 14 is obtained;
and step 3: and according to the calculation result of the step 2, the second controller controls the air volume regulator to regulate the actual air volume of the dust collector 20 to the target air volume of the dust collector 20.
The working principle and the beneficial effects of the technical scheme are as follows: after the dust collector 20 is started, the concentration sensor arranged on the outer wall of the dust hood 22 can detect the dust concentration above the positioning seat 14, the flow velocity sensor detects the wind speed in the connecting pipe 21, the resistance force in the process that the dust above the positioning seat 14 is sucked into the dust hood 22 can be calculated through a formula (1) according to the detection values of the concentration sensor and the flow velocity sensor, in the calculation process, the resistance coefficient of the dust above the positioning seat 14 flowing in the air and the internal friction force, namely the dynamic viscosity, generated by the interaction of the dust in the flowing process are considered, wherein the resistance coefficient is in the range of 0.2-0.3, the calculation is carried out by combining the influence of the factors, so that the calculation result is more accurate, then the target air volume of the dust collector 20 can be calculated through the formula (2) according to the calculation result of the formula (1), and the dust collection efficiency of the dust collector 20 is in the range of 0.85-0.9, the influence of the linear distance between the dust hood 22 and the upper surface of the positioning seat 14 is considered in the calculation process, the target air volume of the dust collector 20 can be calculated more accurately, finally, the second controller controls the air volume regulator to work, the actual air volume of the dust collector 20 can be regulated to the target air volume of the dust collector 20 by the air volume regulator, the air volume of the dust collector 20 can be automatically regulated by the air volume regulator according to the dust concentration generated in cutting, the dust collector 20 can suck and remove dust generated in cutting more thoroughly under the target air volume, the dust is prevented from being diffused to the outside, a good operation environment is provided for operators, and meanwhile, the intelligent degree of the dust collector 20 is improved.
Example 9
On the basis of any one of embodiments 1 to 8, in step 4, the laser cutting device 5 includes a laser, the laser is provided with a cutting head, the cutting head is used for cutting the wafer to be cut, the cutting head cuts the wafer to be cut according to a preset cutting path, and the width of the preset cutting path is calculated by formula (3):
W1＝P1·tu·E·T·η·k (3)
wherein, W1For the width of the predetermined cutting path, P1Is the rated power of the laser, tuThe preset laser pulse width of the laser, the preset laser pulse energy of the laser, the thickness of the wafer to be cut and the eta of the laser are respectivelyAnd k is a preset heat dissipation coefficient when the laser cuts the wafer to be cut.
The working principle and the beneficial effects of the technical scheme are as follows: after the laser cutting device 5 is started, the laser starts to work, the thickness of the piezoelectric silicon dioxide substrate of the wafer to be cut is measured firstly, then various parameters of the laser are adjusted according to the thickness, when the wafer is cut, the thermal effect influence of the wafer to be cut is different due to the difference of the width of the cutting path, in order to reduce the edge explosion defect of the piezoelectric silicon dioxide substrate caused by cutting, and avoid the crack generated by the impact of the piezoelectric silicon dioxide substrate formed by cutting by laser energy, therefore, the wavelength of the laser needs to be adjusted according to the thickness of the wafer to be cut, if the wavelength is not proper, the piezoelectric silicon dioxide substrate of the wafer to be cut is not cut or directly burnt, after the wavelength is selected, the laser light path is designed, the laser needs to pass through a plurality of reflectors and to amplify the light beam through a beam expander, then the matched cutting head gathers the light beam to the preset spot size, then, the width of a preset cutting path of a cutting head is calculated according to a formula (3), the preset cutting efficiency of a laser and the preset heat dissipation coefficient when the laser cuts a wafer to be cut are comprehensively considered during calculation, wherein the value range of the preset cutting efficiency is 0.8-0.9, and the value range of the preset heat dissipation coefficient is 0.5-0.65, the width of the preset cutting path can be accurately calculated through the formula (3), then, the cutting head of the laser cuts the piezoelectric silicon dioxide substrate of the wafer to be cut according to the calculated width of the preset cutting path, so that the influence of the heat effect of the cutting path is reduced, the edge burst defect of the piezoelectric silicon dioxide substrate caused during cutting is reduced, cracks generated by impact of energy generated during cutting on the formed piezoelectric silicon dioxide substrate are avoided, the cutting yield is improved, and a part for supporting the piezoelectric silicon dioxide substrate adopts a specific material during cutting, when the piezoelectric silicon dioxide substrate is cut by laser, the bottom supporting material absorbs less energy, the influence of the material on the increase of the edge explosion or burning of the piezoelectric silicon dioxide substrate due to excessive heat absorption is avoided, the influence of the grinding and polishing roughness of the piezoelectric silicon dioxide substrate on cutting and visual snapshot is considered, the grinding and polishing are smoother, the laser penetrates more easily, the setting and control on each parameter of the laser are stricter, and the requirement on the visual snapshot is higher.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The process for cutting piezoelectric silicon dioxide by laser is characterized by comprising the following steps of:
step 1: placing a preset number of wafers to be cut in a wafer feeding device (2) of a cutting machine body (1);
step 2: starting the wafer feeding device (2), and sequentially conveying the wafers to be cut to a wafer feeding device (3) by the wafer feeding device (2) according to a preset beat;
and step 3: the wafer feeding device (3) conveys the wafer to be cut to a wafer positioning device (4), and the wafer positioning device (4) automatically clamps the wafer to be cut;
and 4, step 4: starting a laser cutting device (5), wherein the laser cutting device (5) cuts the clamped wafer to be cut into a finished wafer product;
and 5: after cutting, the wafer positioning device (4) is automatically released;
step 6: taking the finished wafer out of the wafer positioning device (4) by using a wafer blanking device (6), and conveying the finished wafer into a wafer blanking box (7);
a visual snapshot analysis device (8) is further arranged in the cutting machine body (1), and the visual snapshot analysis device (8) is arranged above the wafer positioning device (4) and is used for identifying and analyzing the position and the size of a wafer to be cut placed on the wafer positioning device (4) and assisting the wafer positioning device (4) in clamping the wafer to be cut;
a working platform (9) is horizontally arranged in the cutting machine body (1), the side wall of the working platform (9) is fixedly connected with the inner wall of the cutting machine body (1), the wafer feeding device (2), the wafer feeding device (3), the laser cutting device (5), the wafer positioning device (4), the wafer blanking device (6) and the wafer blanking box (7) are all arranged on the upper surface of the working platform (9), a circuit control device (10) is arranged below the working platform (9), an electric control component is arranged in the circuit control device (10), the wafer feeding device (2), the wafer feeding device (3), the laser cutting device (5), the wafer positioning device (4), the wafer blanking device (6) and the visual snapshot analysis device (8) are respectively electrically connected with the electric control component;
the wafer positioning device (4) comprises:
a base (11), wherein the base (11) is arranged on the upper surface of the working platform (9);
the supporting seat (12), the supporting seat (12) is arranged on the upper surface of the base (11), and the supporting seat (12) is fixedly connected with the base (11);
the base (13), the said base (13) is set up in the central position of upper surface of the said supporting seat (12), the said base (13) is fixedly connected with said supporting seat (12);
the positioning seat (14) is arranged at the center of the upper surface of the base (13), the lower end of the positioning seat (14) is fixedly connected with the upper surface of the base (13), and two side walls of one end, far away from the base (13), of the positioning seat (14) are respectively provided with a first baffle plate (15) and a second baffle plate (16);
the fixing table (17) is arranged on the upper surface of the supporting seat (12), the fixing table (17) is fixedly connected with the supporting seat (12), a sliding rail (18) is horizontally arranged on the upper surface of the fixing table (17), a sliding block (19) is connected onto the sliding rail (18) in a sliding manner, one end, facing the positioning seat (14), of the sliding block (19) is Y-shaped, and the side wall, facing the positioning seat (14), of the sliding block (19) can be attached to the side wall of the positioning seat (14);
still include gas blowing device, gas blowing device includes:
the compression box (23) is arranged on the upper surface of the supporting seat (12);
the first sliding plate (24) is arranged inside the compression box (23), the first sliding plate (24) is in sliding connection with the inner wall of the compression box (23), a first sliding rod (25) is arranged on one side of the first sliding plate (24), the first sliding rod (25) is perpendicular to the first sliding plate (24), a sliding sleeve (26) is arranged at one end, away from the first sliding plate (24), of the first sliding rod (25), the inner wall of one end of the sliding sleeve (26) is in sliding connection with the outer wall of the first sliding rod (25), the other end of the sliding sleeve (26) penetrates through the side wall of the compression box (23) and extends to the outside of the compression box (23), and the sliding sleeve (26) is in sliding connection with the side wall of the compression box (23);
the first spring (27) is arranged inside the sliding sleeve (26), one end of the first spring (27) is fixedly connected with one end, far away from the first sliding plate (24), of the first sliding rod (25), and the other end of the first spring (27) is fixedly connected with the inner wall of one end, far away from the first sliding rod (25), of the sliding sleeve (26);
the first motor (28) is arranged on the upper surface of the supporting seat (12), a first rotating shaft (29) is arranged at the output end of the first motor (28), a rotating rod (30) is arranged at one end, far away from the first motor (28), of the first rotating shaft (29), and the rotating rod (30) is perpendicular to the first rotating shaft (29) and is fixedly connected with the first rotating shaft (29);
the first connecting rod (31) is arranged at one end, away from the first rotating shaft (29), of the rotating rod (30), one end of the first connecting rod (31) is rotatably connected with the rotating rod (30), and the other end of the first connecting rod (31) is rotatably connected with one end, away from the first sliding rod (25), of the sliding sleeve (26);
gas generation device (32), gas generation device (32) set up compression case (23) are kept away from positioning seat (14) one side, gas generation device (32) with supporting seat (12) lateral wall fixed connection, gas generation device (32) are used for saving auxiliary gas, still set up the heater in gas generation device (32), the heater is used for right auxiliary gas heating, gas generation device (32) output is provided with first hose (33), first hose (33) are kept away from gas generation device (32) one end sets up intake pipe (34), intake pipe (34) are kept away from first hose (33) one end runs through respectively compression case (23) lateral wall, first slide (24) and with compression case (23) inside intercommunication, intake pipe (34) with first slide bar (25) are located same one side of first slide (24), one end, far away from the first hose (33), of the air inlet pipe (34) is fixedly connected with the first sliding plate (24), the air inlet pipe (34) is connected with the side wall of the compression box (23) in a sliding mode, and a first one-way valve is arranged inside the air inlet pipe (34);
a second sliding plate (35), the second sliding plate (35) is disposed inside the compression box (23), the second sliding plate (35) is located on one side of the first sliding plate (24) far away from the first sliding rod (25), the second sliding plate (35) is slidably connected with the inner wall of the compression box (23), the second sliding plate (35) is disposed on one side of the first sliding plate (24) far away from the second sliding plate (36), the second sliding rod (36) is perpendicular to the second sliding plate (35), one end of the second sliding rod (36) is fixedly connected with the side wall of the second sliding plate (35), one end of the second sliding rod (36) far away from the second sliding plate (35) penetrates through the side wall of the compression box (23) to extend to the outside of the compression box (23) and is provided with a sliding frame (37), the inner wall of the sliding frame (37) is provided with a rack (38), and the bottom of the sliding frame (37) is slidably connected with a guide rail (39), the guide rail (39) is fixedly connected with the upper surface of the supporting seat (12);
the second motor (40) is arranged inside the sliding frame (37), the bottom of the second motor (40) is fixedly connected with the upper surface of the supporting seat (12), one side, far away from the supporting seat (12), of the second motor (40) is provided with an output shaft (41), a first gear (42) is arranged on the output shaft (41), the first gear (42) is a semicircular gear, and the first gear (42) is meshed with the rack (38);
a fixing block (43), the fixing block (43) is arranged between the positioning seat (14) and the compression box (23), the bottom of the fixing block (43) is fixedly connected with the upper surface of the supporting seat (12), one end of the supporting seat (12) far away from the fixing block (43) is provided with an air blowing pipe (44), the outlet end of the air blowing pipe (44) faces the upper surface of the positioning seat (14), one end of the air blowing pipe (44) far away from the positioning seat (14) is provided with a second hose (45), one end of the second hose (45) far away from the air blowing pipe (44) is provided with an air outlet pipe (46), the air outlet pipe (46) sequentially penetrates through the side wall of the compression box (23), the second sliding plate (35) and is communicated with the interior of the compression box (23), one end of the second hose (45) is far away from the air outlet pipe (46) and is fixedly connected with the second sliding plate (35), the air outlet pipe (46) is connected with the side wall of the compression box (23) in a sliding mode, and a second one-way valve is arranged in the air outlet pipe (46);
a first air pressure sensor arranged on a side wall of the first slide plate (24) remote from the first slide bar (25) for detecting air pressure between the first slide plate (24) and the second slide plate (35);
the first controller is arranged outside the compression box (23), and is respectively electrically connected with the first motor (28), the second motor (40) and the first air pressure sensor.
2. The process for laser cutting piezoelectric silicon dioxide according to claim 1, wherein in step 1, a plurality of wafer feeding devices (2) are provided, and a plurality of wafer feeding devices (2) can automatically feed the wafer feeding devices (3) at the same time.
3. A process for laser cutting piezoelectric silica according to claim 1, wherein in step 4, the laser cutting device (5) is provided with a plurality of laser cutting heads for simultaneously cutting a plurality of groups of wafers to be cut.
4. The process for cutting piezoelectric silicon dioxide by laser according to claim 1, wherein a dust collector (20) is further disposed on the upper surface of the supporting base (12), a dust suction port of the dust collector (20) is detachably connected to one end of a connecting pipe (21), a dust suction hood (22) is disposed at the other end of the connecting pipe (21), the dust suction hood (22) is disposed above the side of the positioning base (14), and an opening of the dust suction hood (22) is aligned with the upper surface of the positioning base (14).
5. The process of claim 4, further comprising:
the concentration sensor is arranged on the outer wall of the dust hood (22), is aligned with the upper surface of the positioning seat (14) and is used for detecting the dust concentration above the positioning seat (14);
the flow velocity sensor is arranged on the inner wall of the connecting pipe (21) and used for detecting the wind speed in the connecting pipe (21);
the air volume regulator is arranged on the upper surface of the supporting seat (12), is electrically connected with the dust collector (20), and is used for regulating the dust collection air volume of the dust collector (20);
and the second controller is arranged outside the dust collector (20), and is respectively and electrically connected with the concentration sensor, the flow velocity sensor and the air volume regulator.
6. The process of claim 1 for laser cutting piezoelectric silica, wherein: in the step 4, the laser cutting device (5) includes a laser, the laser is provided with a cutting head, the cutting head is used for cutting the wafer to be cut, the cutting head cuts the wafer to be cut according to a preset cutting path, and the width of the preset cutting path is calculated by a formula (3):
wherein the content of the first and second substances,
is the width of the preset cutting path,
is the rated power of the laser and is,
is a preset laser pulse width of the laser,
is the preset laser pulse energy of the laser,
for the thickness of the wafer to be cut,
for a preset cutting efficiency of the laser,
and presetting a heat dissipation coefficient when the laser cuts the wafer to be cut.
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Effective date of registration: 20211202 Address after: 518000 floor 3, building 7, hongrongyuan Hongye Industrial Park, Xixiang, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen xinyijing Technology Co.,Ltd. Address before: 518000 northwest side of building 502, building 2, hongrongyuan Hongye Industrial Park, huangmabu community, Hangcheng street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAITE LIANKE TECHNOLOGY CO.,LTD. |