CN112951855A - Packaging method and packaging piece of image sensor chip - Google Patents
Packaging method and packaging piece of image sensor chip Download PDFInfo
- Publication number
- CN112951855A CN112951855A CN201911255123.9A CN201911255123A CN112951855A CN 112951855 A CN112951855 A CN 112951855A CN 201911255123 A CN201911255123 A CN 201911255123A CN 112951855 A CN112951855 A CN 112951855A
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- China
- Prior art keywords
- image sensor
- sensor chip
- support frame
- cover plate
- packaging
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 abstract description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 231100000719 pollutant Toxicity 0.000 abstract description 3
- 239000000356 contaminant Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a packaging method and a packaging part of an image sensor chip, wherein a non-photosensitive area of the image sensor chip is bonded with a supporting frame, so that the image sensor chip, the supporting frame and a light-transmitting cover plate form a cavity, the risk of pollutants entering the photosensitive area is reduced, the imaging quality is improved, and the overall performance of the image sensor chip is improved.
Description
Technical Field
The invention relates to a packaging method and a packaging piece of an image sensor chip.
Background
As shown in fig. 1, in the field of image sensor chip manufacturing, in the conventional image sensor chip packaging method, an image sensor chip (including a photosensitive region 101 and a non-photosensitive region 102) is generally die-bonded onto a substrate 103, then bonding wires are performed, and finally a support frame 104 is bonded to the substrate 103, so that the image sensor chip is integrally packaged in a cavity 106 formed by the substrate 103, the support frame 104, and a transparent cover plate 105.
However, this packaging method packages the photosensitive region 101 and the non-photosensitive region 102 of the image sensor chip in the same sealed cavity 106, and there is a risk that contaminants outside the photosensitive region 101 (e.g., contaminants from the substrate 103 or the edge of the chip) enter the photosensitive region 101, thereby affecting the imaging quality and reducing the overall performance of the image sensor chip.
Disclosure of Invention
The invention aims to provide a packaging method and a packaging piece of an image sensor chip, which can reduce the risk of pollutants entering a photosensitive area, improve the imaging quality and improve the overall performance of the image sensor chip.
In view of the above considerations, an aspect of the present invention provides a method for packaging an image sensor chip, in which a non-photosensitive region of the image sensor chip is bonded to a support frame, so that the image sensor chip, the support frame and a transparent cover plate form a cavity.
Preferably, the support frame at least partially covers the non-photosensitive area of the image sensor chip.
Preferably, the non-photosensitive area of the image sensor chip is bonded to the support frame by glue.
Preferably, the method for packaging an image sensor chip further includes: heating and curing the glue, and discharging the gas in the cavity from the reserved air holes.
Preferably, the method for packaging an image sensor chip further includes: and after the gas is exhausted, the gas hole is closed, so that the image sensor chip, the supporting frame and the light-transmitting cover plate form a closed cavity.
Preferably, the air hole is located between the support frame and the light-transmitting cover plate, or between the support frame and the image sensor chip.
Preferably, the support frame has a platform, and the light-transmitting cover plate is fixedly placed on the platform.
Preferably, the material of the light-transmitting cover plate is glass or resin.
Another aspect of the present invention provides a package of an image sensor chip, including: the device comprises an image sensor chip, a supporting frame and a light-transmitting cover plate; the non-photosensitive area of the image sensor chip is bonded with the support frame, so that the image sensor chip, the support frame and the light-transmitting cover plate form a cavity.
Preferably, the support frame at least partially covers the non-photosensitive area of the image sensor chip.
Preferably, the non-photosensitive area of the image sensor chip is bonded to the support frame by glue.
Preferably, the package of the image sensor chip further includes a reserved air hole, and the reserved air hole is used for exhausting air in the cavity from the air hole when the glue is heated and cured, and closing the air hole after the air is exhausted so that the image sensor chip, the support frame and the light-transmitting cover plate form a closed cavity.
Preferably, the air hole is located between the support frame and the light-transmitting cover plate, or between the support frame and the image sensor chip.
Preferably, the support frame has a platform for fixedly placing the light-transmitting cover plate.
Preferably, the material of the light-transmitting cover plate is glass or resin.
According to the packaging method and the packaging piece of the image sensor chip, the non-photosensitive area of the image sensor chip is bonded with the supporting frame, so that the image sensor chip, the supporting frame and the light-transmitting cover plate form a cavity, the risk of pollutants entering the photosensitive area is reduced, the imaging quality is improved, and the overall performance of the image sensor chip is improved.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a package of an image sensor chip according to the prior art;
fig. 2 is a schematic structural diagram of a package of an image sensor chip according to the present invention.
In the drawings, like or similar reference numbers indicate like or similar devices (modules) or steps throughout the different views.
Detailed Description
In order to solve the problems in the prior art, the invention provides a packaging method and a packaging piece of an image sensor chip.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
The present invention will be described in detail with reference to specific examples.
As shown in fig. 2, the present invention provides a method for packaging an image sensor chip, the image sensor chip includes a photosensitive area 201 and a non-photosensitive area 202, a supporting frame 204 preferably has a platform 209, a transparent cover plate 205 (e.g. glass or resin) is fixedly disposed on the platform 209, and the non-photosensitive area 202 of the image sensor chip is bonded to the supporting frame 204, so that the image sensor chip, the supporting frame 204 and the transparent cover plate 205 form a cavity 206, thereby avoiding the problem in the prior art that contaminants from the edge of the substrate or the chip enter the photosensitive area 201, reducing the risk of contaminants entering the photosensitive area 201, improving the imaging quality, and improving the overall performance of the image sensor chip.
The supporting frame 204 at least partially covers the non-photosensitive area 202 of the image sensor chip, the non-photosensitive area 202 of the image sensor chip and the supporting frame 204 can be bonded at the contact position of the supporting frame 204 and the non-photosensitive area 202 of the image sensor chip by glue 208, then the glue 208 is heated and cured, the gas in the cavity 206 is exhausted from the reserved gas hole 207 after being heated and expanded, and the gas hole 207 is sealed after the gas is exhausted, so that the image sensor chip, the supporting frame 204 and the light-transmitting cover plate 205 form a sealed cavity 206.
In the preferred embodiment shown in fig. 2, the air holes 207 are located between the support frame 204 and the light-transmissive cover plate 205, and in other preferred embodiments not shown, the air holes 207 may also be located between the support frame 204 and the image sensor chip.
The present invention also provides a package of an image sensor chip, comprising: an image sensor chip, a support frame 204, a light-transmissive cover plate 205; the non-photosensitive area 202 of the image sensor chip is bonded to the support frame 204, so that the image sensor chip, the support frame 204 and the transparent cover plate 205 form a cavity 206. Preferably, the support frame 204 has a platform 209, and the transparent cover plate 205 is fixedly placed on the platform 209.
Preferably, the support frame 204 at least partially covers the non-photosensitive area 202 of the image sensor chip and is bonded by glue 208. The package of the image sensor chip further includes a reserved air hole 207, which is used for exhausting air in the cavity 206 from the air hole 207 when the glue 208 is heated and cured, and closing the air hole 207 after the air is exhausted, so that the image sensor chip, the support frame 204 and the light-transmitting cover plate 205 form a closed cavity 206.
In the preferred embodiment shown in fig. 2, the air holes 207 are located between the support frame 204 and the light-transmissive cover plate 205, and in other preferred embodiments not shown, the air holes 207 may also be located between the support frame 204 and the image sensor chip.
In summary, according to the packaging method and the packaging piece of the image sensor chip of the present invention, the non-photosensitive region of the image sensor chip is bonded to the supporting frame, so that the image sensor chip, the supporting frame and the transparent cover plate form a cavity, thereby reducing the risk of contaminants entering the photosensitive region, improving the imaging quality, and improving the overall performance of the image sensor chip.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it will be obvious that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Several elements recited in the apparatus claims may also be implemented by one element. The terms first, second, etc. are used to denote names, but not any particular order.
Claims (15)
1. A method for packaging an image sensor chip,
and bonding the non-photosensitive area of the image sensor chip with the support frame to ensure that the image sensor chip, the support frame and the light-transmitting cover plate form a cavity.
2. The method of packaging an image sensor die of claim 1, wherein the support frame at least partially covers the non-photosensitive area of the image sensor die.
3. The method of packaging an image sensor die of claim 1, wherein the non-photosensitive area of the image sensor die is bonded to the support frame by glue.
4. The method of packaging an image sensor chip of claim 3, further comprising: heating and curing the glue, and discharging the gas in the cavity from the reserved air holes.
5. The method of packaging an image sensor chip of claim 4, further comprising: and after the gas is exhausted, the gas hole is closed, so that the image sensor chip, the supporting frame and the light-transmitting cover plate form a closed cavity.
6. The method of packaging an image sensor chip as claimed in claim 4, wherein the air holes are located between the support frame and the light-transmissive cover plate or between the support frame and the image sensor chip.
7. The method of packaging an image sensor chip as claimed in claim 1, wherein the supporting frame has a platform, and the transparent cover plate is fixedly placed on the platform.
8. The method for packaging an image sensor chip as claimed in claim 1, wherein the transparent cover plate is made of glass or resin.
9. A package for an image sensor chip,
the method comprises the following steps: the device comprises an image sensor chip, a supporting frame and a light-transmitting cover plate; the non-photosensitive area of the image sensor chip is bonded with the support frame, so that the image sensor chip, the support frame and the light-transmitting cover plate form a cavity.
10. The package for an image sensor chip of claim 9, wherein the support frame at least partially covers a non-photosensitive area of the image sensor chip.
11. The package for an image sensor chip of claim 9, wherein the non-photosensitive region of the image sensor chip is bonded to the support frame by glue.
12. The package of image sensor chip as claimed in claim 11, further comprising a predetermined air hole for exhausting air in the cavity through the air hole when the glue is cured by heating, and closing the air hole after the air is exhausted to form a sealed cavity with the image sensor chip, the supporting frame and the transparent cover plate.
13. The package for an image sensor chip of claim 12, wherein the air holes are located between the support frame and the light transmissive cover plate or between the support frame and the image sensor chip.
14. The image sensor chip package of claim 9, wherein the support frame has a platform for fixedly placing the light transmissive cover plate.
15. The package of an image sensor chip as claimed in claim 9, wherein the transparent cover is made of glass or resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911255123.9A CN112951855A (en) | 2019-12-10 | 2019-12-10 | Packaging method and packaging piece of image sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911255123.9A CN112951855A (en) | 2019-12-10 | 2019-12-10 | Packaging method and packaging piece of image sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112951855A true CN112951855A (en) | 2021-06-11 |
Family
ID=76225284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911255123.9A Pending CN112951855A (en) | 2019-12-10 | 2019-12-10 | Packaging method and packaging piece of image sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112951855A (en) |
-
2019
- 2019-12-10 CN CN201911255123.9A patent/CN112951855A/en active Pending
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