CN118099179A - Sensor packaging method and sensor packaging structure - Google Patents

Abstract

The invention provides a sensor packaging method and a sensor packaging structure, and relates to the technical field of sensor packaging. The sensor packaging method comprises the following steps: providing a first substrate provided with a photosensitive chip; a second substrate is attached to the first substrate. The second substrate comprises a surrounding and blocking part and a cover part which are connected, the surrounding and blocking part is attached to the first substrate, and the photosensitive chip is positioned in a surrounding frame formed by the surrounding and blocking part; the cover part is positioned at one side of the enclosing part away from the first substrate. And forming a plastic package body on the first substrate, wherein the plastic package body is positioned outside the enclosure frame. Removing the cover part before or after the step of forming the plastic package body; forming a first adhesive layer on the enclosing part; pasting a light-transmitting plate on the first adhesive layer; the light-transmitting plate, the enclosing part and the first substrate enclose the photosensitive chip in the closed space. The method is beneficial to improving the packaging quality of the sensor, has simpler process and avoids adverse effects caused by laser grooving.

Description

Sensor packaging method and sensor packaging structure

Technical Field

The invention relates to the technical field of semiconductors, in particular to a sensor packaging method and a sensor packaging structure.

Background

With the rapid development of the semiconductor industry, the image sensor packaging technology mainly comprises a charge coupled device image sensor (CCD, charge couple device for short), a CMOS chip image processor and a photoelectric sensor (CIS, contactimage sensor for short), so that the image sensor can be used for receiving optical signals and converting the optical signals into electrical signals, and the image sensor can be applied to various electronic products such as digital cameras, image sensing modules for vehicles, monitoring cameras and the like. With the improvement of the functions and performance of the image sensor, the processing performance of the image sensor is required to be improved, so that more chips, such as flash memory and DRAM chips, are required to be arranged on the image sensor to obtain an enhanced memory capacity to improve the performance of the image sensor.

The current sensor packaging structure adopts a glass cover plate for packaging so that the sensor can receive optical signals. When the glass cover plate is installed, a groove structure is formed on the surface of the sensor chip by a laser grooving mode or a die pressing mode, and the glass cover plate is installed in the groove structure. The slotting mode is easy to cause too deep slotting due to uncontrollable laser slotting power, so that the photosensitive area of the sensor chip is damaged, and the performance and quality of the sensor are affected.

Disclosure of Invention

The invention aims at providing a sensor packaging method and a sensor packaging structure, which can facilitate the installation of a light-transmitting plate and improve the performance and quality of the sensor packaging structure.

Embodiments of the invention may be implemented as follows:

In a first aspect, the present invention provides a sensor packaging method, including:

Providing a first substrate provided with a first chip; wherein the first chip comprises a photosensitive chip;

Attaching a second substrate to the first substrate; the second substrate comprises a surrounding and blocking part and a cover part which are connected, the surrounding and blocking part is attached to the first substrate, and the photosensitive chip is positioned in a surrounding frame formed by the surrounding and blocking part; the cover part is positioned at one side of the enclosing part far away from the first substrate;

forming a plastic package body on the first substrate; wherein the plastic package body is positioned outside the surrounding frame;

removing the cover part before or after the step of forming the plastic package body;

forming a first adhesive layer on the enclosing part;

Attaching a light-transmitting plate on the first adhesive layer; the light-transmitting plate, the enclosing part and the first substrate enclose the photosensitive chip in the airtight space.

In an alternative embodiment, the step of forming a first glue layer on the enclosure portion includes:

The rubber is scratched on one side of the surrounding baffle part far away from the first substrate along the circumferential direction; the starting point of the glue drawing and the end point of the glue drawing are not overlapped, and a preset distance is reserved between the starting point and the end point to form an exhaust gap.

In an alternative embodiment, the photosensitive chip adopts a front-mounted chip, and a connecting wire arc is arranged between the front-mounted chip and the first substrate; the exhaust gap is positioned at one side of the photosensitive chip, which is provided with the connecting wire arc.

In an optional embodiment, a filling glue covering the connecting wire arcs is arranged in the closed space, and the filling glue is arranged outside the sensing area of the photosensitive chip.

In an optional embodiment, before or after the step of attaching the second substrate to the first substrate, the method further includes:

Attaching a second chip and/or a component to the first substrate; wherein the second chip and/or the component is/are arranged on the side without the exhaust gap.

In an alternative embodiment, the step of removing the cover portion includes:

And removing the cover part by means of de-bonding.

In an alternative embodiment, bonding glue is arranged between the surrounding and blocking part and the cover part;

After the step of forming the plastic package body, irradiating the bonding glue by ultraviolet light, and separating and removing the cover part and the bonding glue to form a first groove with the same thickness as the bonding glue and a second groove with the same thickness as the cover part;

and forming the first adhesive layer in the first groove.

In an alternative embodiment, after the step of separating and removing the cover portion and the bonding adhesive, the method further includes:

and filling plastic packaging materials and/or a second adhesive layer in the second groove.

In an alternative embodiment, the thickness of the first adhesive layer is equal to the depth of the first groove, and the thickness of the light-transmitting plate is not greater than the depth of the second groove.

In an alternative embodiment, the size of the light-transmitting plate is adapted to the size of the second recess.

In an alternative embodiment, after the step of attaching the light-transmitting plate to the first adhesive layer, the method further includes:

Cutting the plastic package to form a single product; wherein the cutting line is positioned in the second groove.

In an alternative embodiment, the edge of the light-transmitting plate is flush with the enclosure; or the edge of the light-transmitting plate extends beyond the enclosure.

In an alternative embodiment, the cover part comprises a cover plate and a protruding part arranged on the cover plate, the protruding part is connected with the enclosure part, and the cover plate is positioned on one side of the protruding part away from the enclosure part; the height of the protruding part is equal to the thickness of the light-transmitting plate.

In an alternative embodiment, after the step of forming the plastic package body, the cover portion is removed separately to form a third groove having a thickness equal to the protruding portion and a fourth groove having a thickness equal to the cover plate;

Forming the first adhesive layer in the third groove;

Attaching the light-transmitting plate on the first adhesive layer; wherein, the surface of the light-transmitting plate is flush with the bottom of the fourth groove.

In an alternative embodiment, in the step of forming a plastic package on the first substrate, the plastic package wraps the sidewall of the cover portion.

In an alternative embodiment, the plastic package body wrapping the side wall of the cover portion forms a buffer portion, and a fifth groove is formed on the buffer portion.

In an alternative embodiment, after the step of attaching the light-transmitting plate to the first adhesive layer, the method further includes:

cutting the plastic package to form a single product; wherein the cutting line is positioned in the fifth groove.

In a second aspect, the present invention provides a sensor package structure, made by the sensor packaging method according to any of the preceding embodiments.

The sensor packaging method and the sensor packaging structure provided by the embodiment of the invention have the beneficial effects that:

In the sensor packaging method and the sensor packaging structure provided by the embodiment of the invention, in the packaging method, the second substrate with the enclosing part and the cover part is firstly attached to the first substrate, then the cover part is removed, the light-transmitting plate is adhered to the enclosing part, the photosensitive chip is positioned in the enclosing frame formed by the enclosing part, the photosensitive area of the photosensitive chip is ensured not to be polluted or influenced by the outside, and the working performance of the photosensitive chip is improved. And the light-transmitting plate adopts a pasting mode, is convenient to install, does not need processes such as laser grooving and the like, avoids the defect of laser grooving, is beneficial to improving the reliability of the whole sensor packaging structure, and improves the packaging quality and the product performance.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic block diagram of steps of a sensor packaging method according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a method of packaging a sensor according to a first embodiment of the present invention;

Fig. 3 is a schematic drawing illustrating a first adhesive layer in a sensor packaging method according to a first embodiment of the present invention;

FIG. 4 is a schematic view of a first sensor package according to a first embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a method of packaging a sensor according to a second embodiment of the present invention;

FIG. 6 is a schematic diagram of a first sensor package according to a second embodiment of the present invention;

FIG. 7 is a schematic diagram of a second sensor package according to a second embodiment of the present invention;

FIG. 8 is a schematic diagram of a third sensor package structure and a manufacturing process according to a second embodiment of the present invention;

FIG. 9 is a schematic diagram of a fourth sensor package structure according to a second embodiment of the present invention;

FIG. 10 is a schematic diagram illustrating a method of packaging a sensor according to a third embodiment of the present invention;

Fig. 11 is a schematic view of another sensor package structure according to a third embodiment of the present invention.

Icon: 100-sensor package structure; 110-a first substrate; 120-a first chip; 121-a photosensitive region; 123-connecting wire arcs; 125-filling protective glue; 131-components; 133-a second chip; 140-a second substrate; 141-a fence; 143-a cover; 145-cover plate; 147-projections; 148-bonding glue; 150-a first adhesive layer; 151-exhaust gap; 161-first groove; 163-second groove; 165-a third groove; 167-fourth groove; 170-a light-transmitting plate; 171-a second glue layer; 180-plastic package body; 181-a buffer part; 183-fifth groove; 190-tin balls; 191-cutting line.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

First embodiment

Referring to fig. 1 and 2, the present embodiment provides a sensor packaging method, which generally includes the following steps:

Step S1: a first substrate 110 provided with a first chip 120 is provided. The first chip 120 includes, but is not limited to, a photosensitive chip, and the photosensitive chip has a photosensitive area 121, and the photosensitive area 121 is used for receiving the sensing identification light signal. The first chip 120 may be pre-integrated on the first substrate 110, or may be mounted on the first substrate 110 after the first substrate 110 is manufactured. In this embodiment, the first chip 120 is a front-mounted chip.

Optionally, in addition to the first chip 120, some components 131, such as a capacitor, a resistor, and an inductor, may be disposed on the first substrate 110. And the first substrate 110 may further be provided with a second chip 133, i.e., a non-photosensitive chip, such as a memory chip and a radio frequency chip. The second chip 133 may be a front-mounted or flip-chip, or a part of the second chip 133 may be a front-mounted chip, and another part of the second chip 133 may be a flip-chip.

Step S2: the second substrate 140 is mounted on the first substrate 110. The second substrate 140 includes a surrounding portion 141 and a cover portion 143, wherein the surrounding portion 141 is attached to the first substrate 110, and the photosensitive chip is located in a surrounding frame formed by the surrounding portion 141; the cover 143 is located on a side of the enclosure 141 away from the first substrate 110. Optionally, the enclosure portion 141 is adhered and fixed on the first substrate 110 by using an adhesive layer. Fig. 2 shows a structure of the second substrate 140 with the cover portion 143 removed. The structure of the completed second substrate 140 can be seen in fig. 5.

Step S3: a plastic package 180 is formed on the first substrate 110, and the plastic package 180 is located outside the enclosure.

Step S4: the cover 143 is removed before or after the step of forming the molding body 180.

Step S5: a first adhesive layer 150 is formed on the enclosure portion 141.

Step S6: a light-transmitting plate 170 is attached to the first adhesive layer 150. Alternatively, the transparent plate 170 is made of glass or other transparent material.

It will be appreciated that, after the cover 143 is removed, the enclosure portion 141 is exposed, and the glue is applied to the enclosure portion 141 to adhere the light-transmitting plate 170 to the enclosure portion 141. The light-transmitting plate 170, the enclosing part 141 and the first substrate 110 enclose the photosensitive chip in the enclosed space. The projection of the light-transmitting plate 170 on the first substrate 110 covers at least the photosensitive area 121 of the photosensitive chip. Optionally, the projection of the light-transmitting plate 170 on the first substrate 110 completely covers the projection area of the photosensitive chip on the first substrate 110.

In the sensor packaging method, a second substrate 140 with a surrounding part 141 and a cover part 143 is firstly attached to a first substrate 110, then the cover part 143 is removed, a light-transmitting plate 170 is attached to the surrounding part 141, and a photosensitive chip is positioned in a surrounding frame formed by the surrounding part 141, so that the photosensitive area 121 of the photosensitive chip is ensured not to be polluted or influenced by the outside, and the working performance of the photosensitive chip is improved. And the light-transmitting plate 170 is mounted in a pasting mode, so that the mounting is convenient, the process is simple, the processes such as laser grooving and the like are not needed, adverse effects caused by the laser grooving are avoided, the reliability of the whole sensor packaging structure 100 is improved, and the packaging quality and the product performance are improved.

Optionally, the step of forming the first adhesive layer 150 on the enclosure portion 141 includes:

Referring to fig. 3, the sealant is dispensed on a side of the enclosure portion 141 away from the first substrate 110 in the circumferential direction; wherein, the starting point of the glue and the end point of the glue do not coincide, and a preset distance is formed between the starting point and the end point to form an exhaust gap 151. The arrangement of the exhaust gap 151 is beneficial to exhausting the gas in the first adhesive layer 150 when the light-transmitting plate 170 is installed, and improves bonding reliability. While preventing the influence of the gas in the first adhesive layer 150 on the performance of the photosensitive chip. It will be appreciated that the exhaust gap 151 may be one or more, and is not specifically limited herein. In this embodiment only one exhaust gap 151 is shown, in other embodiments two, three or more exhaust gaps 151 are possible.

The photosensitive chip adopts a forward chip, and a connecting wire arc 123 is arranged between the photosensitive chip and the first substrate 110 to realize the electric connection between the first substrate 110 and the photosensitive chip. The exhaust gap 151 is located at one side of the photosensitive chip where the connecting wire loop 123 is located. Optionally, the photosensitive chip is rectangular and has four sides. The connecting wire arcs 123 are arranged on two opposite sides of the photosensitive chip. The exhaust gap 151 may be located on either side of the connecting wire loop 123. Alternatively, if there are two exhaust gaps 151, the two exhaust gaps 151 may be located on the same side, or may be located on two sides provided with the connecting wire arcs 123, which is not particularly limited herein.

Referring to fig. 4, optionally, a filling protection glue 125 covering the connecting wire loop 123 is disposed in the closed space, and the filling protection glue 125 is disposed outside the sensing area of the photosensitive chip. Namely, the connecting wire arc 123 is wrapped by the filling glue, so that the electrical connection reliability is improved, and the connecting wire arc 123 is protected, so long as the filling glue does not interfere with the photosensitive area 121 of the photosensitive chip. The filling of the protective adhesive 125 also prevents light from entering the photosensitive area 121 from the side, and plays a role of shading, thereby improving the recognition rate of optical signals. It should be noted that the filling protection glue 125 may be disposed only on the upper surface of the photosensitive chip, i.e., on the periphery of the photosensitive region 121. Of course, the light-sensitive chip can be further arranged around the light-sensitive chip to better protect the connecting wire arcs 123. Or the filling protection glue 125 may also fill the whole enclosed space without interfering with the photosensitive region 121 of the photosensitive chip, which is not particularly limited herein.

Optionally, before or after the step of mounting the second substrate 140 on the first substrate 110, the method further includes mounting the second chip 133 and/or the component 131 on the first substrate 110. It will be appreciated that only the second chip 133 may be selectively provided, or only the component 131 may be selectively provided. Or both the component 131 and the second chip 133. Wherein the second chip 133 and/or the component 131 is arranged at a side without the exhaust gap 151. Referring to fig. 3, if there is only one exhaust gap 151, i.e., one side of the photosensitive chip has the exhaust gap 151, the second chip 133 and the component 131 may be disposed on at least one of the remaining three sides of the photosensitive chip. In the present embodiment, the second chip 133 and the component 131 are disposed on opposite sides without the exhaust gap 151, respectively. This provides the following advantages:

When the light-transmitting plate 170 is mounted, the gas in the first adhesive layer 150 is pressed and discharged along the discharge gap 151. And during the baking process, the colloidal volatiles, residues, etc. in the first adhesive layer 150 are discharged from the exhaust gap 151. Because the connecting wire arc 123 and the exhaust gap 151 are located at the same side, the connecting wire arc 123 has a certain blocking effect on the gas, and the gas, the colloid volatile matters and the like cannot enter the photosensitive area 121 of the photosensitive chip to influence the working performance of the photosensitive chip. In addition, the second chip 133 and the component 131 are respectively located at different sides from the exhaust gap 151, so that the gas, the colloid volatile matters and residues during baking, and the like can be prevented from entering the bottom of the second chip 133 or the bottom of the component 131, and the function of the second chip 133 or the component 131 is prevented from being disabled. It will be appreciated that the gases and the colloidal volatiles may easily cause contamination of the bumps of the second chip 133 or the pads of the second chip 133 or the bottom bumps of the component 131 to affect the electrical conductivity, or cause the circuit layer of the second chip 133 to collect residues to affect the electrical conductivity, thereby disabling the second chip 133 or the component 131.

It should be noted that, during the extrusion and baking curing process of the light-transmitting plate 170, the air-discharging gap 151 is gradually closed, and finally becomes a closed annular adhesive layer, so as to perform better adhesion and fixing functions.

In this embodiment, a first substrate 110 is provided, and a first chip 120, a second chip 133 and a component 131 are respectively mounted on the first substrate 110. A second substrate 140 having a surrounding portion 141 and a cover portion 143 is attached to the first substrate 110. The enclosure portion 141 encloses the first chip 120, that is, the first chip 120 is located in an enclosure frame formed by the enclosure portion 141. The cover 143 is removed by the de-bonding method, and only the enclosure 141 remains on the first substrate 110. It can be understood that the cover 143 is removed by a de-bonding method, so as to prevent dust, powder, etc. generated in the grinding process from entering the photosensitive area 121 to affect the recognition performance of the photosensitive chip, or prevent dust powder generated by grinding from accumulating on the bonding pads of the first chip 120, the second chip 133, the bonding pads or the bumps of the component 131 to affect the electrical connection performance.

The first adhesive layer 150 is marked on the enclosure portion 141, and the light-transmitting plate 170 is mounted on the enclosure portion 141 by using the first adhesive layer 150. Optionally, the light-transmitting plate 170 is flush with the enclosure 141 or extends beyond the enclosure 141. In this embodiment, the edge of the light-transmitting plate 170 is flush with the edge of the enclosure 141. A molding body 180 is formed on the first substrate 110, the molding body 180 molds the second chip 133 and the component 131, and the molding body 180 wraps the sidewall of the light-transmitting plate 170. The surface of the light-transmitting plate 170 is flush with the surface of the plastic package 180. Because the enclosure portion 141 and the light-transmitting plate 170 block, no plastic package 180 enters the enclosed space, so that the first chip 120 is not interfered by the plastic package 180, and normal operation of the photosensitive chip can be ensured. Solder balls 190 are formed on the side of the first substrate 110 away from the plastic package 180, and the solder balls 190 may be at least one or more of tin, silver, gold, and nickel. Then cutting process is carried out, and single packaged products are formed through separation.

The plastic package body 180 wraps the side wall of the light-transmitting plate 170, so that the sealing performance is good, light can only vertically enter the photosensitive area 121 from the right above through the light-transmitting plate 170, and cannot enter from the side wall of the light-transmitting plate 170, the ghost or double image phenomenon is prevented, and the recognition rate of the photosensitive chip is improved.

Second embodiment

Optionally, the step of removing the cover portion 143 includes removing the cover portion 143 by a de-bonding method.

Referring to fig. 5, an optional bonding adhesive 148 is provided between the enclosure portion 141 and the cover portion 143. After the step of forming the molding compound 180, the bonding paste 148 is irradiated with ultraviolet light, the cover 143 and the bonding paste 148 are separated and removed, only the enclosure portion 141 remains on the first substrate 110, and a first groove 161 having a thickness equal to that of the bonding paste 148 and a second groove 163 having a thickness equal to that of the cover 143 are formed. A first adhesive layer 150 is formed in the first groove 161, and the light-transmitting plate 170 is adhered and fixed on the enclosure portion 141 by using the first adhesive layer 150. Alternatively, the transparent plate 170 is made of glass or other transparent material.

Alternatively, when the molding body 180 is formed, the molding body 180 wraps the sidewall of the cover 143, and the surface of the molding body 180 is flush with the surface of the cover 143. The liquid molding compound may be injected onto the first substrate 110 by pressure injection molding or steel screen printing. Optionally, the size of the second substrate 140 is smaller than that of the first substrate 110, so that the liquid molding compound is convenient to enter the bottom of the cover 143 from the periphery of the second substrate 140 to mold the enclosure 141, the components 131, the second chip 133, and the like on the first substrate 110, and then baked, dehumidified, cured, and the like to form the molding body 180.

The plastic package body 180 wraps the side wall of the cover portion 143, so as to protect the cover portion 143, for example, the plastic package body 180 can protect the second substrate 140 from being extruded by external force and falling during the moving process of the bonding process after the plastic package process.

It is to be easily understood that, when forming the plastic package 180, the second substrate 140 may be completely covered, and then the plastic package 180 may be ground and thinned, so that the cover 143 is exposed from the plastic package 180, which is not particularly limited herein. And then the cover 143 is detached from the adhesive 148 between the cover 143 and the enclosure 141.

Optionally, the thickness of the first adhesive layer 150 is equal to the depth of the first groove 161, and the thickness of the light-transmitting plate 170 is equal to the depth of the second groove 163. The first adhesive layer 150 is marked on the enclosure portion 141, that is, the first adhesive layer 150 is formed in the first groove 161, and the light-transmitting plate 170 is mounted on the enclosure portion 141 by using the first adhesive layer 150. Or in some embodiments, the thickness of the light-transmitting plate 170 is less than the depth of the second recess 163, i.e., the surface of the light-transmitting plate 170 is lower than the surface of the plastic package 180. By means of the arrangement, when the first substrate 110 is turned over to implant balls, the plastic package body 180 is in contact with the bottom machine, contact friction and abrasion of the light-transmitting plate 170 and the bottom machine can be avoided, and the light-transmitting plate 170 is better protected.

Optionally, the dimensions of the light-transmitting plate 170 are adapted to the dimensions of the enclosure 141, i.e. the edges of the light-transmitting plate 170 are flush with the edges of the enclosure 141, as shown in fig. 5. Or the edge of the light-transmitting plate 170 extends beyond the enclosure 141, i.e., the edge of the light-transmitting plate 170 extends a certain length beyond the edge of the enclosure 141, as shown in fig. 6. Or the size of the light-transmitting plate 170 is adapted to the size of the second recess 163, i.e. the light-transmitting plate 170 substantially fills the second recess 163, as shown in fig. 7. The size of the light-transmitting plate 170 may be designed according to practical needs, and is not particularly limited herein.

It will be appreciated that if the edge of the light-transmitting plate 170 and the edge of the enclosure 141 are flush, it is necessary to fill the second groove 163 with the molding compound or the second adhesive layer 171, or fill both the molding compound and the second adhesive layer 171. The plastic molding compound or the second adhesive layer 171 needs to cover the sidewall of the light-transmitting plate 170, so as to prevent light from entering the photosensitive area 121 from the sidewall of the light-transmitting plate 170. If the edge of the light-transmitting plate 170 exceeds the edge of the surrounding barrier 141 by a certain length, the surrounding barrier 141 can prevent light from entering from the side, and the plastic molding compound or the second adhesive layer 171 in the second groove 163 can be omitted. In other words, whether the molding compound or the second adhesive layer 171 in the second groove 163 is disposed, and how much the second adhesive layer is disposed can be flexibly adjusted according to actual needs, which is not specifically limited herein. The second recess 163 is also beneficial to release the plastic package stress and to alleviate the buckling deformation of the plastic package body 180.

Optionally, after the steps of attaching the light-transmitting plate 170 and scribing the second adhesive layer 171, cutting the plastic package 180 to form a single product; wherein the cutting line 191 is located in the second groove 163. Thus, the plastic package 180 at the edge of the second recess 163 can be removed, and the weight and volume of the plastic package 180 can be reduced. Of course, the cutting line 191 may be disposed outside the second groove 163, which is not particularly limited herein.

Referring to fig. 5, a first substrate 110 is provided, and a first chip 120, a second chip 133 and a component 131 are respectively mounted on the first substrate 110. A second substrate 140 having a surrounding portion 141 and a cover portion 143 is attached to the first substrate 110. The first chip 120 is located in the enclosure frame formed by the enclosure part 141. After the second chip 133, the component 131 and the second substrate 140 are molded to form the molded body 180, the cover portion 143 and the enclosure portion 141 are unbonded, and the cover portion 143 is separated and removed. The light-transmitting plate 170 is mounted on the enclosure portion 141 using the first adhesive layer 150. The edge of the enclosure part 141 is flush with the edge of the light-transmitting plate 170, and the second groove 163 is filled with a second adhesive layer 171, and the second groove 163 is filled with the second adhesive layer 171. The surface of the second adhesive layer 171, the surface of the light-transmitting plate 170 and the surface of the plastic package 180 are flush. The first substrate 110 is turned over to implant balls, and finally cut and separated into single products.

Alternatively, referring to fig. 8, after the cover 143 is removed, the light-transmitting plate 170 is mounted on the enclosure 141 by the first adhesive layer 150. The light-transmitting plate 170 extends beyond the enclosure portion 141, and the second adhesive layer 171 is not required to be filled in the second groove 163. The first substrate 110 is turned over to implant balls, and finally cut and separated into single products. Alternatively, when the second adhesive layer 171 is not required, cutting separation may be performed along the cutting line 191 inside the second groove 163, so that the edge of the single product has no protruding structure of the plastic package 180.

Referring to fig. 9, before the second substrate 140 is attached, the connection wire arcs 123 of the first chip 120 are first protected by the filling protection glue 125, and the filling protection glue 125 does not interfere with the photosensitive area 121 of the first chip 120. And then the second substrate 140 is attached, encapsulated, de-bonded and the light-transmitting plate 170 is attached, so that a structure without filling the second adhesive layer 171 is formed.

Other parts of the content not mentioned in the present embodiment are similar to those described in the first embodiment, and will not be described here again.

Third embodiment

Referring to fig. 10, optionally, the cover 143 includes a cover 145 and a protrusion 147 provided on the cover 145, the protrusion 147 is connected to the enclosure 141, and the cover 145 is located on a side of the protrusion 147 away from the enclosure 141; the height of the protrusion 147 is equal to the thickness of the light-transmitting plate 170.

Optionally, after the step of forming the molding body 180, the cover 143 is removed separately to form the third groove 165 having the same thickness as the protrusion 147 and the fourth groove 167 having the same thickness as the cover 145. A first glue layer 150 is formed within the third recess 165. A light-transmitting plate 170 is attached to the first adhesive layer 150; wherein the surface of the light-transmitting plate 170 is flush with the bottom of the fourth groove 167. The edge of the light-transmitting plate 170 is flush with the edge of the enclosure 141. The fourth groove 167 is not required to be filled with colloid or plastic packaging material.

Optionally, in the step of forming the plastic package body 180 on the first substrate 110, the plastic package body 180 wraps the sidewall of the cover 143. Thus, the surface of the light-transmitting plate 170 is lower than the surface of the plastic package body 180, and the plastic package body 180 with the protruding edge can effectively protect the light-transmitting plate 170 when the first substrate 110 is turned over to carry the ball or the gripper. Before the step of de-bonding, the plastic package body 180 with the protruding edge can also protect the cover 143, so as to prevent the cover 143 from being extruded by external force and falling off during the transferring process.

Referring to fig. 11, alternatively, the plastic package 180 wrapping the sidewall of the cover 143 forms a buffer portion 181, i.e., an edge of the plastic package 180. The buffer portion 181 is provided with a fifth groove 183. The fifth groove 183 can release the plastic package stress and alleviate the buckling deformation of the plastic package body 180, so that the extrusion of the plastic package stress to the light-transmitting plate 170 is reduced, and the light-transmitting plate 170 is prevented from being damaged. And the fifth groove 183 can improve heat dissipation performance, reduce thermal stress in the steps of baking, dehumidifying, ball-planting reflow and the like, and improve packaging quality. In addition, in the step of moving the plastic package body 180 picked up by the gripper, the fifth groove 183 can play a role in positioning the gripper, and the gripper cannot directly contact the light-transmitting plate 170, so that the risk of damage to the light-transmitting plate 170 is reduced.

Alternatively, in the subsequent cutting process, the cutting line 191 may be disposed in the fifth groove 183, that is, cut along the inner side of the fifth groove 183, so that the cut single product has a smoother surface, and the concave-convex structure of the surface is reduced.

It should be noted that the features of the fifth groove 183 may be provided in any of the foregoing packaging methods. Of course, the features of the different embodiments described above may also be combined with each other to form new alternative embodiments, which are not specifically limited herein.

Other parts of the content not mentioned in this embodiment are similar to those described in the first embodiment and the second embodiment, and will not be described here again.

The embodiment of the invention also provides a sensor packaging structure 100, which is manufactured by adopting the sensor packaging method in any one of the previous embodiments. The sensor has the advantages of good performance, rich and various functions, high identification rate of the photosensitive chip, reliable packaging quality and the like. The sensor package 100 may be used in the fields of image recognition, photo-sensing, etc.

In summary, the sensor packaging method and the sensor packaging structure 100 provided in the embodiments of the present invention have the following beneficial effects:

In the sensor packaging method and the sensor packaging structure 100 provided in the embodiments of the present invention, in the packaging method, a second substrate 140 having a surrounding portion 141 and a covering portion 143 is firstly attached to a first substrate 110, then the covering portion 143 is removed, a light-transmitting plate 170 is adhered to the surrounding portion 141, and a photosensitive chip is located in a surrounding frame formed by the surrounding portion 141, so that a photosensitive area 121 of the photosensitive chip is ensured not to be polluted or affected by the outside, and the working performance of the photosensitive chip is improved. And the light-transmitting plate 170 adopts a pasting mode, is convenient to install, does not need processes such as laser grooving and the like, avoids the defect of laser grooving, is beneficial to improving the reliability of the whole sensor packaging structure 100, and improves the packaging quality and the product performance.

The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (18)

1. A method of packaging a sensor, comprising:

Providing a first substrate provided with a first chip; wherein the first chip comprises a photosensitive chip;

Attaching a second substrate to the first substrate; the second substrate comprises a surrounding and blocking part and a cover part which are connected, the surrounding and blocking part is adhered to the first substrate, and the photosensitive chip is positioned in a surrounding frame formed by the surrounding and blocking part; the cover part is positioned at one side of the enclosing part far away from the first substrate;

forming a plastic package body on the first substrate; wherein the plastic package body is positioned outside the surrounding frame;

removing the cover part before or after the step of forming the plastic package body;

forming a first adhesive layer on the enclosing part;

Attaching a light-transmitting plate on the first adhesive layer; the light-transmitting plate, the enclosing part and the first substrate enclose the photosensitive chip in the airtight space.

2. The sensor packaging method of claim 1, wherein the step of forming a first glue layer on the enclosure comprises:

The rubber is scratched on one side of the surrounding baffle part far away from the first substrate along the circumferential direction; the starting point of the glue drawing and the end point of the glue drawing are not overlapped, and a preset distance is reserved between the starting point and the end point to form an exhaust gap.

3. The sensor packaging method according to claim 2, wherein the photosensitive chip is a front-mounted chip, and a connecting wire loop is arranged between the front-mounted chip and the first substrate; the exhaust gap is positioned at one side of the photosensitive chip, which is provided with the connecting wire arc.

4. The sensor packaging method according to claim 3, wherein a filling glue covering the connecting wire arcs is arranged in the closed space, and the filling glue is arranged outside the sensing area of the photosensitive chip.

5. The sensor packaging method according to claim 2, characterized in that before or after the step of mounting a second substrate on the first substrate, further comprising:

Attaching a second chip and/or a component to the first substrate; wherein the second chip and/or the component is/are arranged on the side without the exhaust gap.

6. The sensor packaging method of claim 1, wherein the step of removing the cover portion comprises:

And removing the cover part by means of de-bonding.

7. The sensor packaging method according to claim 1, wherein bonding glue is provided between the enclosure portion and the cover portion;

After the step of forming the plastic package body, irradiating the bonding glue by ultraviolet light, and separating and removing the cover part and the bonding glue to form a first groove with the same thickness as the bonding glue and a second groove with the same thickness as the cover part;

and forming the first adhesive layer in the first groove.

8. The sensor packaging method according to claim 7, further comprising, after the step of separating and removing the cover portion and the bonding paste:

and filling plastic packaging materials and/or a second adhesive layer in the second groove.

9. The sensor packaging method of claim 7, wherein the thickness of the first glue layer and the depth of the first groove are equal, and the thickness of the light-transmitting plate is not greater than the depth of the second groove.

10. The sensor packaging method of claim 7, wherein the size of the transparent plate is adapted to the size of the second recess.

11. The method of claim 7, further comprising, after the step of attaching a light transmissive plate to the first glue layer:

Cutting the plastic package to form a single product; wherein the cutting line is positioned in the second groove.

12. The sensor packaging method of claim 1, wherein an edge of the light-transmitting plate is flush with the enclosure; or the edge of the light-transmitting plate extends beyond the enclosure.

13. The sensor packaging method according to claim 1, wherein the cover portion includes a cover plate and a protruding portion provided on the cover plate, the protruding portion is connected to the enclosure portion, and the cover plate is located on a side of the protruding portion away from the enclosure portion; the height of the protruding part is equal to the thickness of the light-transmitting plate.

14. The sensor packaging method according to claim 13, wherein after the step of forming the plastic package, the cover portion is separated and removed to form a third groove having a thickness equal to the protruding portion and a fourth groove having a thickness equal to the cover plate;

Forming the first adhesive layer in the third groove;

Attaching the light-transmitting plate on the first adhesive layer; wherein, the surface of the light-transmitting plate is flush with the bottom of the fourth groove.

15. The sensor packaging method according to any one of claims 1 to 14, wherein in the step of forming a plastic package on the first substrate, the plastic package wraps a side wall of the cap portion.

16. The sensor package method of claim 15, wherein the plastic package wrapping the sidewall of the cap forms a buffer portion, and the buffer portion is provided with a fifth groove.

17. The method of claim 16, further comprising, after the step of attaching a light transmissive plate to the first glue layer:

cutting the plastic package to form a single product; wherein the cutting line is positioned in the fifth groove.

18. A sensor package structure, characterized in that it is manufactured by the sensor package method according to any one of claims 1 to 17.