CN112908921A - Anti-drop type chip packaging equipment - Google Patents
Anti-drop type chip packaging equipment Download PDFInfo
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- CN112908921A CN112908921A CN202110079171.8A CN202110079171A CN112908921A CN 112908921 A CN112908921 A CN 112908921A CN 202110079171 A CN202110079171 A CN 202110079171A CN 112908921 A CN112908921 A CN 112908921A
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- pipe
- clamping
- rod
- supporting
- tube
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention relates to anti-drop chip packaging equipment which comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is installed at the bottom end of the connecting pipe, a vacuum device is arranged in the connecting pipe, a clamping mechanism and a cleaning mechanism are arranged on the connecting pipe, the clamping mechanism comprises a supporting pipe, an electromagnet, a moving plate, two reset components and two clamping components, each reset component comprises a supporting block, a limiting block, a transmission rod and a reset spring, each clamping component comprises a rack, a gear, a rotating shaft, a first bearing, a lead screw, a sliding block, a clamping rod, a guide rod and a round hole, and the anti-drop chip packaging equipment improves the stability of the chip driven by the suction nozzle through the clamping mechanism, not only does the anti-drop chip packaging equipment realize the function of cleaning a substrate through the cleaning mechanism.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to anti-drop chip packaging equipment.
Background
The chip is a product of semiconductor devices, which is also called microcircuits, microchips, and integrated circuits. In the packaging process of the chip, the suction nozzle is required to suck the wafer through the suction device and move the wafer to the substrate for mounting.
Present wafer is pasting the dress in-process, when having impurity on the base plate, can influence the chip and paste dress effect, moreover, the suction nozzle adsorbs the wafer at the translation in-process, in order to improve work efficiency, translation speed is very fast, and the wafer easily drops from the suction nozzle under the windage effect, has reduced stability.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the anti-falling chip packaging equipment is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: an anti-drop chip packaging device comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is installed at the bottom end of the connecting pipe, a vacuum device is arranged in the connecting pipe, and a clamping mechanism and a cleaning mechanism are arranged on the connecting pipe;
the clamping mechanism comprises a supporting tube, an electromagnet, a moving plate, two reset components and two clamping components, the supporting tube and the connecting tube are coaxially arranged, the top end of the connecting tube is inserted into the bottom end of the supporting tube, the connecting tube is in sliding and sealing connection with the supporting tube, the moving plate is arranged in the connecting tube and is perpendicular to the connecting tube, the moving plate is fixed on the inner wall of the connecting tube, the electromagnet is arranged in the moving tube, the electromagnet is fixed on the inner wall of the moving tube, the electromagnet is arranged opposite to the moving plate, the connecting tube is located between the electromagnet and a suction nozzle, a gap is formed between the connecting tube and the electromagnet, the moving plate is made of iron, the reset components are uniformly distributed by taking the axis of the supporting tube as a central axis, and the;
the reset assembly comprises a supporting block, a limiting block, a transmission rod and a reset spring, the supporting block is fixed on the inner wall of the supporting tube, a gap is formed between the supporting block and the connecting tube, a round hole is formed in the supporting block, the transmission rod is parallel to the connecting tube, the transmission rod penetrates through the round hole, the transmission rod is in sliding connection with the inner wall of the round hole, the limiting block is fixed at the top end of the transmission rod, the bottom end of the transmission rod is fixedly connected with the inner wall of the connecting tube, the limiting block abuts against the supporting block, and the bottom of the supporting block is;
the clamping assembly comprises a rack, a gear, a rotating shaft, a first bearing, a screw rod, a sliding block, a clamping rod, a guide rod and a round hole, the round hole is formed in the supporting tube, the axis of the rotating shaft is perpendicular to and intersected with the axis of the supporting tube, the rotating shaft penetrates through the round hole, the rotating shaft is connected with the inner wall of the round hole in a sliding and sealing mode, the supporting block is located between the rotating shaft and the connecting tube, the gear is located in the connecting tube, the gear is installed at one end of the rotating shaft, the screw rod is fixed to the other end of the rotating shaft, the screw rod and the rotating shaft are coaxially arranged, the rack is meshed with the gear, the rack is fixed on the moving plate, the inner ring of the first bearing is installed on the rotating shaft, the outer ring of the first bearing is fixedly connected with the supporting, the clamping rod is parallel to the connecting pipe, the clamping rod is fixed at the bottom of the sliding block, the clamping rod is positioned between the sliding block and the suction nozzle, a gap is formed between the clamping rod and the supporting pipe, the guide rod is parallel to the rotating shaft, the guide rod is fixed on the outer wall of the supporting pipe, a guide hole is formed in the clamping rod, the guide rod penetrates through the guide hole, and the guide rod is in sliding connection with the inner wall of the guide hole;
the cleaning mechanism comprises two cleaning components, the cleaning components correspond to the clamping rods one by one, and the cleaning components are arranged on one side, far away from the supporting tube, of the clamping rods;
the cleaning component comprises an air pipe, a second bearing, a connecting shaft, fan blades, a connecting wire and a torsion spring, the air pipe is parallel to the clamping rod, the air pipe is fixed on the clamping rod and is positioned between the suction nozzle and the sliding block, the connecting shaft and the air pipe are coaxially arranged, the fan blades are arranged in the air pipe, the fan blades are arranged at the bottom end of the connecting shaft, the inner ring of the second bearing is arranged on the connecting shaft, the outer ring of the second bearing is fixed on the inner wall of the air pipe, the torsion spring is positioned between the fan blade and the second bearing, the fan blade is connected with the outer ring of the second bearing through the torsion spring, one end of the connecting wire is fixed on the connecting shaft, the other end of the connecting wire is positioned on one side of the connecting shaft far away from the supporting tube, one end of the connecting wire, which is far away from the connecting shaft, is fixedly connected with the guide rod, and the connecting wire is wound on the connecting shaft.
Preferably, in order to reduce a gap between the inner wall of the support tube and the connection tube, the inner wall of the support tube is coated with a sealing grease.
Preferably, in order to facilitate the installation of the rotating shaft, both ends of the rotating shaft are provided with chamfers.
Preferably, in order to realize buffering and vibration reduction, the limiting block is made of rubber.
Preferably, the connection line is a steel wire rope in order to improve the reliability of the connection line.
Preferably, the guide bar is coated with a lubricating oil in order to reduce friction between the guide bar and the inner wall of the guide hole.
Preferably, in order to prolong the service life of the air pipe, the air pipe is provided with an anti-corrosion zinc coating.
Preferably, in order to increase the friction between the clamping rod and the chip, the clamping rod is provided with anti-slip threads.
Preferably, for noise reduction, the inner wall of the support tube is provided with a sound absorption plate.
Preferably, the slider and the clamping rod are integrally formed in order to improve the reliability of the connection between the slider and the clamping rod.
The anti-drop chip packaging equipment has the advantages that the clamping mechanism improves the stability of the suction nozzle driving the chip to move, compared with the existing clamping mechanism, the clamping mechanism can reduce the impact force generated when the suction nozzle is abutted to the chip through the elastic action of the reset spring, realizes buffering and vibration reduction, has stronger practicability, realizes the function of cleaning the substrate through the cleaning mechanism, prevents impurities on the substrate from influencing the mounting of a wafer, and compared with the existing cleaning mechanism, the cleaning mechanism enables the fan blades to rotate by taking the movement of the clamping rod as the driving force, realizes an integrated linkage structure with the clamping mechanism, and has stronger practicability.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural view of an anti-drop type chip packaging apparatus of the present invention;
FIG. 2 is a schematic structural view of a reset assembly of the drop-off prevention type chip packaging apparatus of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 1;
FIG. 4 is a schematic structural view of a cleaning assembly of the drop-off preventing type chip packaging apparatus of the present invention;
in the figure: 1. the air suction device comprises a connecting pipe, 2 suction nozzles, 3 support pipes, 4 electromagnets, 5 moving plates, 6 supporting blocks, 7 limiting blocks, 8 transmission rods, 9 return springs, 10 racks, 11 gears, 12 rotating shafts, 13 first bearings, 14 lead screws, 15 sliding blocks, 16 clamping rods, 17 guide rods, 18 air pipes, 19 second bearings, 20 connecting shafts, 21 fan blades, 22 connecting wires, 23 torsion springs and 24 sound absorption plates.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1-3, an anti-drop chip packaging device comprises a connecting pipe 1 and a suction nozzle 2, wherein the connecting pipe 1 is vertically arranged, the suction nozzle 2 is installed at the bottom end of the connecting pipe 1, a vacuum device is arranged in the connecting pipe 1, and a clamping mechanism and a cleaning mechanism are arranged on the connecting pipe 1;
the clamping mechanism comprises a supporting tube 3, an electromagnet 4, a moving plate 5, two resetting components and two clamping components, wherein the supporting tube 3 is coaxially arranged with a connecting tube 1, the top end of the connecting tube 1 is inserted into the bottom end of the supporting tube 3, the connecting tube 1 is in sliding and sealing connection with the supporting tube 3, the moving plate 5 is arranged in the connecting tube 1, the moving plate 5 is perpendicular to the connecting tube 1, the moving plate 5 is fixed on the inner wall of the connecting tube 1, the electromagnet 4 is arranged in the moving tube, the electromagnet 4 is fixed on the inner wall of the moving tube, the electromagnet 4 is just opposite to the moving plate 5, the connecting tube 1 is positioned between the electromagnet 4 and a suction nozzle 2, a gap is arranged between the connecting tube 1 and the electromagnet 4, the moving plate 5 is made of iron, and the resetting components are uniformly distributed by taking, the clamping assemblies correspond to the reset assemblies one to one;
the reset assembly comprises a supporting block 6, a limiting block 7, a transmission rod 8 and a reset spring 9, the supporting block 6 is fixed on the inner wall of the supporting tube 3, a gap is formed between the supporting block 6 and the connecting tube 1, a round hole is formed in the supporting block 6, the transmission rod 8 is parallel to the connecting tube 1, the transmission rod 8 penetrates through the round hole, the transmission rod 8 is connected with the inner wall of the round hole in a sliding mode, the limiting block 7 is fixed at the top end of the transmission rod 8, the bottom end of the transmission rod 8 is fixedly connected with the inner wall of the connecting tube 1, the limiting block 7 abuts against the supporting block 6, and the bottom of the supporting block 6 is;
the clamping assembly comprises a rack 10, a gear 11, a rotating shaft 12, a first bearing 13, a screw rod 14, a slider 15, a clamping rod 16, a guide rod 17 and a round hole, the round hole is formed in the support tube 3, the axis of the rotating shaft 12 is perpendicular to and intersected with the axis of the support tube 3, the rotating shaft 12 penetrates through the round hole, the rotating shaft 12 is connected with the inner wall of the round hole in a sliding and sealing mode, the support block 6 is located between the rotating shaft 12 and the connecting tube 1, the gear 11 is located in the connecting tube 1, the gear 11 is installed at one end of the rotating shaft 12, the screw rod 14 is fixed at the other end of the rotating shaft 12, the screw rod 14 and the rotating shaft 12 are arranged coaxially, the rack 10 is meshed with the gear 11, the rack 10 is fixed on the moving plate 5, the inner ring of the first bearing 13 is installed on the, the sliding block 15 is sleeved on the screw rod 14, a thread matched with the screw rod 14 is arranged at the joint of the sliding block 15 and the screw rod 14, the clamping rod 16 is parallel to the connecting pipe 1, the clamping rod 16 is fixed at the bottom of the sliding block 15, the clamping rod 16 is positioned between the sliding block 15 and the suction nozzle 2, a gap is arranged between the clamping rod 16 and the support pipe 3, the guide rod 17 is parallel to the rotating shaft 12, the guide rod 17 is fixed on the outer wall of the support pipe 3, a guide hole is arranged on the clamping rod 16, the guide rod 17 penetrates through the guide hole, and the guide rod 17 is in sliding connection with the inner wall of the;
during the use of the device, the top end of the supporting tube 3 is connected with an external moving device, the supporting tube 3 is moved by the moving device, the chip is driven to move by the movement of the supporting tube 3 through the connecting tube 1, and the bottom of the suction nozzle 2 is abutted against the wafer, then the wafer is adsorbed by the suction nozzle 2 through a vacuum device, the wafer is driven to move to the substrate through the moving device by the suction nozzle 2, so that the wafer is pasted, wherein in the process that the wafer is driven to move by the suction nozzle 2, the electromagnet 4 is electrified to generate the mutual attraction acting force between the electromagnet 4 and the iron moving plate 5, so that the moving plate 5 drives the connecting tube 1 to move upwards, the upward movement of the connecting tube 1 drives the transmission rod 8 to move synchronously, the reset spring 9 is compressed, the movement of the connecting tube 5 drives the gear 11 to rotate through the rack 10, and the moving plate can drive the screw rod 14 to rotate, can make slider 15 move towards being close to the direction of stay tube 3 on lead screw 14 promptly, slider 15's removal drives and presss from both sides tight pole 16 and realizes the synchronous motion on guide arm 17, upward movement through connecting pipe 1 and the removal of being close to of two clamp poles 16, then can make clamp pole 16 support with the chip and lean on, thereby can make clamp pole 16 clip the chip, prevent that the chip from droing, the stability is improved, after suction nozzle 2 drives the wafer and removes to the top of base plate, electro-magnet 4 cuts off the power supply, elastic action through reset spring 9 makes connecting pipe 1 remove downwards, and make two clamp poles 16 keep away from the removal, prevent that clamp pole 16 from supporting with the base plate and leaning on and influence the subsides dress of wafer.
As shown in fig. 4, the cleaning mechanism includes two cleaning assemblies, the cleaning assemblies correspond to the clamping rods 16 one by one, and the cleaning assemblies are arranged on one side of the clamping rods 16 far away from the support pipe 3;
the cleaning assembly comprises an air pipe 18, a second bearing 19, a connecting shaft 20, fan blades 21, a connecting wire 22 and a torsion spring 23, the air pipe 18 is parallel to the clamping rod 16, the air pipe 18 is fixed on the clamping rod 16, the air pipe 18 is located between the suction nozzle 2 and the sliding block 15, the connecting shaft 20 is coaxially arranged with the air pipe 18, the fan blades 21 are arranged in the air pipe 18, the fan blades 21 are installed at the bottom end of the connecting shaft 20, the inner ring of the second bearing 19 is installed on the connecting shaft 20, the outer ring of the second bearing 19 is fixed on the inner wall of the air pipe 18, the torsion spring 23 is located between the fan blades 21 and the second bearing 19, the fan blades 21 are connected with the outer ring of the second bearing 19 through the torsion spring 23, one end of the connecting wire 22 is fixed on the connecting shaft 20, the other end of the connecting wire 22 is located on the side, far away from the supporting, the connection line 22 is wound around the connection shaft 20.
When the clamping rod 16 moves towards the direction close to the support tube 3, the clamping rod can be used for driving the air tube 18 to vertically and synchronously move, the connecting shaft 20 is pulled by the connecting wire 22 to rotate under the supporting action of the second bearing 19, the rotating of the connecting shaft 20 drives the fan blades 21 to rotate, the torsion spring 23 is deformed, when the clamping rod 16 moves towards the direction far away from the support tube 3, the connecting wire 22 can be loosened, the connecting shaft 20 reversely rotates and winds the connecting wire 22 under the elastic action of the torsion spring 23, the reverse rotation of the connecting shaft 20 drives the fan blades 21 to rotate, so that air in the air tube 18 is discharged from the bottom end of the air tube 18 and acts on the substrate, impurities can be separated from the substrate under the action of air flow, and the function of cleaning the substrate is realized.
Preferably, in order to reduce the gap between the inner wall of the support tube 3 and the connection tube 1, the inner wall of the support tube 3 is coated with a sealing grease.
The sealing grease has the function of reducing the gap between the inner wall of the support tube 3 and the connecting tube 1, and the sealing performance is improved.
Preferably, both ends of the rotating shaft 12 are chamfered to facilitate the installation of the rotating shaft 12.
The chamfer serves to reduce the diameter of the rotating shaft 12 when passing through the circular hole, and the effect of convenient installation is achieved.
Preferably, in order to achieve buffering and vibration reduction, the limiting block 7 is made of rubber.
The rubber texture is comparatively soft, can reduce stopper 7 and supporting shoe 6 and support the impact force that produces when leaning on, has realized buffering and damping.
Preferably, the connection line 22 is a steel wire rope in order to improve the reliability of the connection line 22.
The steel wire rope has the characteristics of high strength, difficulty in breaking and the like, so that the reliability of the connecting wire 22 can be improved.
Preferably, in order to reduce the friction between the guide rod 17 and the inner wall of the guide hole, the guide rod 17 is coated with a lubricating oil.
The lubricating oil has the functions of reducing the friction force between the guide rod 17 and the inner wall of the guide hole and improving the flow property of the movement of the clamping rod 16
Preferably, in order to prolong the service life of the air pipe 18, the air pipe 18 is provided with an anti-corrosion zinc coating.
The function of the anti-corrosion zinc coating is to improve the anti-rust capability of the air pipe 18 and prolong the service life of the air pipe 18.
Preferably, the clamping bar 16 is provided with anti-slip threads in order to increase the friction between the clamping bar 16 and the chip.
The anti-slip lines are used for improving the friction force between the clamping rod 16 and the chip, preventing slipping and improving the stability of the chip.
Preferably, sound-absorbing panels 24 are provided on the inner wall of the support tube 3 for noise reduction.
The sound-absorbing panel 24 can absorb noise, achieving noise reduction.
Preferably, in order to improve the reliability of the connection between the slider 15 and the clamp rod 16, the slider 15 and the clamp rod 16 are integrally formed.
The integral molding structure has the characteristic of high strength, so that the reliability of connection between the sliding block 15 and the clamping rod 16 can be improved.
During the use of the device, the top end of the supporting tube 3 is connected with an external moving device, the supporting tube 3 is moved by the moving device, the chip is driven to move by the movement of the supporting tube 3 through the connecting tube 1, and the bottom of the suction nozzle 2 is abutted against the wafer, then the wafer is adsorbed by the suction nozzle 2 through a vacuum device, the wafer is driven to move to the substrate through the moving device by the suction nozzle 2, so that the wafer is pasted, wherein in the process that the wafer is driven to move by the suction nozzle 2, the electromagnet 4 is electrified to generate the mutual attraction acting force between the electromagnet 4 and the iron moving plate 5, so that the moving plate 5 drives the connecting tube 1 to move upwards, the upward movement of the connecting tube 1 drives the transmission rod 8 to move synchronously, the reset spring 9 is compressed, the movement of the connecting tube 5 drives the gear 11 to rotate through the rack 10, and the moving plate can drive the screw rod 14 to rotate, namely, the slide block 15 can move on the screw rod 14 towards the direction close to the support tube 3, the movement of the slide block 15 drives the clamping rods 16 to realize synchronous movement on the guide rod 17, the clamping rods 16 can be abutted against the chip through the upward movement of the connecting tube 1 and the approaching movement of the two clamping rods 16, so that the clamping rods 16 can clamp the chip to prevent the chip from falling off, the stability is improved, after the suction nozzle 2 drives the wafer to move to the upper side of the substrate, the electromagnet 4 is powered off, the connecting tube 1 moves downwards through the elastic action of the reset spring 9, the two clamping rods 16 are kept away from moving, the clamping rods 16 are prevented from abutting against the substrate to influence the mounting of the wafer, when the clamping rods 16 move towards the direction close to the support tube 3, the air tube 18 can be driven to vertically move synchronously, and the connecting shaft 20 is pulled to rotate under the supporting action of the second bearing 19, the rotation of the connecting shaft 20 drives the fan blades 21 to rotate, the torsion spring 23 is deformed, when the clamping rod 16 moves towards the direction far away from the supporting tube 3, the connecting wire 22 can be loosened, the connecting shaft 20 rotates reversely through the elastic action of the torsion spring 23 and winds the connecting wire 22, the fan blades 21 are driven to rotate through the reverse rotation of the connecting shaft 20, air in the air pipe 18 is discharged from the bottom end of the air pipe 18 and acts on the substrate, impurities can be separated from the substrate under the action of air flow, and the function of cleaning the substrate is achieved.
Compared with the prior art, this anti-drop type chip packaging equipment has improved the stability that suction nozzle 2 drove the chip and removed through clamping mechanism, compare with current clamping mechanism, this clamping mechanism passes through reset spring 9's elastic action, can also reduce the suction nozzle 2 and the chip and lean on the impact force that produces when leaning on, buffering and damping have been realized, therefore, the practicality is stronger, moreover, the function of clean base plate has still been realized through clean mechanism, prevent that impurity from influencing the subsides dress of wafer on the base plate, compare with current clean mechanism, this clean mechanism makes flabellum 21 rotate as drive power through the removal of clamping lever 16, integral type linkage structure has been realized with clamping mechanism, the practicality is stronger.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. An anti-drop type chip packaging device comprises a connecting pipe (1) and a suction nozzle (2), wherein the connecting pipe (1) is vertically arranged, the suction nozzle (2) is installed at the bottom end of the connecting pipe (1), a vacuum device is arranged in the connecting pipe (1), and the anti-drop type chip packaging device is characterized in that a clamping mechanism and a cleaning mechanism are arranged on the connecting pipe (1);
the clamping mechanism comprises a supporting pipe (3), an electromagnet (4), a moving plate (5), two reset components and two clamping components, the supporting pipe (3) and a connecting pipe (1) are coaxially arranged, the top end of the connecting pipe (1) is inserted into the bottom end of the supporting pipe (3), the connecting pipe (1) and the supporting pipe (3) are in sliding and sealing connection, the moving plate (5) is arranged in the connecting pipe (1), the moving plate (5) is perpendicular to the connecting pipe (1), the moving plate (5) is fixed on the inner wall of the connecting pipe (1), the electromagnet (4) is arranged in the moving pipe, the electromagnet (4) is fixed on the inner wall of the moving pipe, the electromagnet (4) and the moving plate (5) are just arranged, the connecting pipe (1) is positioned between the electromagnet (4) and a suction nozzle (2), a gap is arranged between the connecting pipe (1) and the electromagnet (4), the moving plate (5) is made of iron, the reset components are uniformly distributed by taking the axis of the supporting tube (3) as a central axis, and the clamping components correspond to the reset components one to one;
the reset assembly comprises a supporting block (6), a limiting block (7), a transmission rod (8) and a reset spring (9), the supporting block (6) is fixed on the inner wall of the supporting tube (3), a gap is formed between the supporting block (6) and the connecting tube (1), a round hole is formed in the supporting block (6), the transmission rod (8) is parallel to the connecting tube (1), the transmission rod (8) penetrates through the round hole, the transmission rod (8) is in sliding connection with the inner wall of the round hole, the limiting block (7) is fixed at the top end of the transmission rod (8), the bottom end of the transmission rod (8) is fixedly connected with the inner wall of the connecting tube (1), the limiting block (7) abuts against the supporting block (6), and the bottom of the supporting block (6) is connected with the bottom end of the transmission rod (8) through;
the clamping assembly comprises a rack (10), a gear (11), a rotating shaft (12), a first bearing (13), a screw rod (14), a sliding block (15), a clamping rod (16), a guide rod (17) and a round hole, wherein the round hole is formed in the supporting pipe (3), the axis of the rotating shaft (12) is perpendicular to and intersected with the axis of the supporting pipe (3), the rotating shaft (12) penetrates through the round hole, the rotating shaft (12) is connected with the inner wall of the round hole in a sliding and sealing mode, the supporting block (6) is located between the rotating shaft (12) and the connecting pipe (1), the gear (11) is located in the connecting pipe (1), the gear (11) is installed at one end of the rotating shaft (12), the screw rod (14) is fixed to the other end of the rotating shaft (12), the screw rod (14) and the rotating shaft (12) are coaxially arranged, and the rack (10) is, the rack (10) is fixed on the moving plate (5), the inner ring of the first bearing (13) is installed on the rotating shaft (12), the outer ring of the first bearing (13) is fixedly connected with the supporting tube (3), the sliding block (15) is sleeved on the screw rod (14), a thread matched with the screw rod (14) is arranged at the joint of the sliding block (15) and the screw rod (14), the clamping rod (16) is parallel to the connecting tube (1), the clamping rod (16) is fixed at the bottom of the sliding block (15), the clamping rod (16) is positioned between the sliding block (15) and the suction nozzle (2), a gap is arranged between the clamping rod (16) and the supporting tube (3), the guide rod (17) is parallel to the rotating shaft (12), the guide rod (17) is fixed on the outer wall of the supporting tube (3), a guide hole is arranged on the clamping rod (16), and the guide rod (17) passes through the guide hole, the guide rod (17) is connected with the inner wall of the guide hole in a sliding manner;
the cleaning mechanism comprises two cleaning components, the cleaning components correspond to the clamping rods (16) one by one, and the cleaning components are arranged on one side, far away from the supporting tube (3), of the clamping rods (16);
the cleaning assembly comprises an air pipe (18), a second bearing (19), a connecting shaft (20), fan blades (21), a connecting wire (22) and a torsion spring (23), the air pipe (18) is parallel to the clamping rod (16), the air pipe (18) is fixed on the clamping rod (16), the air pipe (18) is located between a suction nozzle (2) and a sliding block (15), the connecting shaft (20) is coaxially arranged with the air pipe (18), the fan blades (21) are arranged in the air pipe (18), the fan blades (21) are installed at the bottom end of the connecting shaft (20), the inner ring of the second bearing (19) is installed on the connecting shaft (20), the outer ring of the second bearing (19) is fixed on the inner wall of the air pipe (18), the torsion spring (23) is located between the fan blades (21) and the second bearing (19), the fan blades (21) are connected with the outer ring of the second bearing (19) through the torsion spring (23), one end of the connecting wire (22) is fixed on the connecting shaft (20), the other end of the connecting wire (22) is located on one side, far away from the supporting tube (3), of the connecting shaft (20), one end, far away from the connecting shaft (20), of the connecting wire (22) is fixedly connected with the guide rod (17), and the connecting wire (22) is wound on the connecting shaft (20).
2. The drop-proof type chip packaging apparatus as claimed in claim 1, wherein the inner wall of the support tube (3) is coated with a sealing grease.
3. The drop-proof type chip packaging apparatus as claimed in claim 1, wherein both ends of the rotation shaft (12) are chamfered.
4. The drop-preventing type chip packaging apparatus according to claim 1, wherein the stopper (7) is made of rubber.
5. The anti-drop type chip packaging apparatus according to claim 1, wherein the connection line (22) is a wire rope.
6. The drop-preventing type chip packaging apparatus according to claim 1, wherein the guide bar (17) is coated with a lubricating oil.
7. The drop-proof type chip packaging apparatus according to claim 1, wherein the gas pipe (18) is provided with an anti-corrosion zinc plating layer.
8. The drop-off prevention type chip packaging apparatus according to claim 1, wherein the clamping bar (16) is provided with an anti-slip pattern.
9. The drop-preventing type chip packaging apparatus according to claim 1, wherein a sound-absorbing plate (24) is provided on an inner wall of the support pipe (3).
10. The drop-off prevention type chip packaging apparatus according to claim 1, wherein the slider (15) and the clamping bar (16) are of an integrally molded structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079171.8A CN112908921A (en) | 2021-01-21 | 2021-01-21 | Anti-drop type chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079171.8A CN112908921A (en) | 2021-01-21 | 2021-01-21 | Anti-drop type chip packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112908921A true CN112908921A (en) | 2021-06-04 |
Family
ID=76117541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110079171.8A Withdrawn CN112908921A (en) | 2021-01-21 | 2021-01-21 | Anti-drop type chip packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112908921A (en) |
-
2021
- 2021-01-21 CN CN202110079171.8A patent/CN112908921A/en not_active Withdrawn
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20210604 |