CN112864077A - Chip production equipment with impurity removal function - Google Patents
Chip production equipment with impurity removal function Download PDFInfo
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- CN112864077A CN112864077A CN202110084009.5A CN202110084009A CN112864077A CN 112864077 A CN112864077 A CN 112864077A CN 202110084009 A CN202110084009 A CN 202110084009A CN 112864077 A CN112864077 A CN 112864077A
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- pipe
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- connecting pipe
- transmission shaft
- adsorption
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems
- F16L55/02—Energy absorbers; Noise absorbers
- F16L55/033—Noise absorbers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L58/00—Protection of pipes or pipe fittings against corrosion or incrustation
- F16L58/02—Protection of pipes or pipe fittings against corrosion or incrustation by means of internal or external coatings
- F16L58/04—Coatings characterised by the materials used
- F16L58/08—Coatings characterised by the materials used by metal
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention relates to a chip production device with an impurity removal function, which comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is arranged at the bottom end of the connecting pipe, the suction nozzle is provided with an adsorption hole, the adsorption hole and the connecting pipe are coaxially arranged, the aperture of the adsorption hole is smaller than the inner diameter of the connecting pipe, it is characterized in that the connecting pipe is provided with an adsorption mechanism, the suction nozzle is provided with an auxiliary mechanism, the adsorption mechanism comprises an adsorption component and a wind power component, the adsorption component comprises a power unit and two adsorption units, the power component comprises a driving motor, a sealing ring, a transmission shaft and a connecting ring, this chip production facility with edulcoration function has realized the function that the suction nozzle adsorbs the wafer through adsorption mechanism not only, has still realized cleaing away the function of adsorbing downthehole impurity through complementary unit, prevents to adsorb the hole jam.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to chip production equipment with an impurity removal function.
Background
The chip is a product of semiconductor devices, which is also called microcircuits, microchips, and integrated circuits. In the packaging process of the chip, the suction nozzle is required to suck the wafer through the suction device and move the wafer to the substrate for mounting.
The chip pastes dress effect can be influenced when there is impurity on the base plate to current wafer pastes the dress in-process, moreover, the suction nozzle is after long-term work, can produce more impurity in the adsorption hole on the suction nozzle, easily causes the adsorption hole to block up and make the unable normal absorption wafer of suction nozzle, has reduced the practicality.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the chip production equipment with the impurity removal function is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chip production device with an impurity removing function comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is installed at the bottom end of the connecting pipe, an adsorption hole is formed in the suction nozzle, the adsorption hole and the connecting pipe are coaxially arranged, and the aperture of the adsorption hole is smaller than the inner diameter of the connecting pipe;
the adsorption mechanism comprises an adsorption component and a wind power component;
the adsorption assembly comprises a power unit and two adsorption units, the power unit is arranged in the connecting pipe, and the adsorption units are circumferentially and uniformly distributed by taking the axis of the connecting pipe as a center;
the power assembly comprises a driving motor, a sealing ring, a transmission shaft and a connecting ring, wherein the sealing ring, the transmission shaft and the connecting ring are coaxially arranged with the connecting pipe, the outer diameter of the sealing ring is equal to the inner diameter of the connecting pipe, the inner diameter of the sealing ring is equal to the diameter of the transmission shaft, the transmission shaft penetrates through the sealing ring, the transmission shaft is in sliding and sealing connection with the sealing ring, the sealing ring is in sealing and fixed connection with the inner wall of the connecting pipe, the connecting ring is positioned between the driving motor and the sealing ring, the inner diameter of the connecting ring is smaller than the inner diameter of the connecting pipe, the inner diameter of the connecting ring is equal to the diameter of the transmission shaft, the driving motor is in transmission connection with the bottom end of the transmission shaft;
the adsorption unit comprises an air pipe, a moving disc, a first connecting rod, a supporting rod, a sliding block, a spring, a second connecting rod and a ball, wherein the axis of the air pipe is perpendicular to and intersected with the axis of the connecting pipe, the air pipe is positioned between the sealing ring and the connecting ring, one end of the air pipe close to the transmission shaft is fixed on the connecting pipe, the air pipe is communicated with the connecting pipe, the moving disc is coaxially arranged with the air pipe, the moving disc is in sliding and sealing connection with the inner wall of the air pipe, the first connecting rod is obliquely arranged, one side of the moving disc close to the transmission shaft is hinged with the top of the connecting ring through the first connecting rod, the distance between one end of the first connecting rod close to the connecting ring and the transmission shaft is smaller than the distance between the other end of the connecting rod and the transmission shaft, the supporting rod is parallel, the sliding block is sleeved on the supporting rod and abutted against the transmission shaft, the sliding block is connected with one end, far away from the transmission shaft, of the supporting rod through a spring, an annular groove is formed in the bottom of the connecting ring, the annular groove and the transmission shaft are coaxially arranged, the spherical center of the ball is arranged in the annular groove, the ball is matched with the annular groove, the ball is in sliding connection with the inner wall of the annular groove, the spherical diameter of the ball is larger than the width of a groove opening of the annular groove, the second connecting rod is obliquely arranged, one end of the second connecting rod is fixed on the ball, the other end of the second connecting rod is hinged with the sliding block, and the distance between one end, close to the sliding block, of the second connecting rod and the transmission shaft;
the wind power assembly comprises a fan blade, a support ring and a fixed pipe, the fan blade is arranged in the connecting pipe, the fan blade is installed at the top end of the transmission shaft, the support ring and the fixed pipe are coaxially arranged with the connecting pipe, the inner diameter of the fixed pipe is larger than the outer diameter of the connecting pipe, the connecting pipe penetrates through the support ring, the support ring is located between the fan blade and the sealing ring, the connecting pipe is hermetically and fixedly connected with the support ring, the top end of the fixed pipe is hermetically and fixedly connected with the support ring, the air pipe is located in the fixed pipe, at least two air holes are formed in the connecting pipe, the air holes correspond to the air pipe one by;
the auxiliary mechanism comprises an extrusion disc and two transmission assemblies, the extrusion disc is arranged in the adsorption hole, the diameter of the extrusion disc is equal to the aperture of the adsorption hole, the extrusion disc and the adsorption hole are coaxially arranged, the extrusion disc is in sliding and sealing connection with the inner wall of the adsorption hole, the transmission assemblies are arranged in the connecting pipe, the transmission assemblies are positioned between the suction nozzle and the connecting ring, and the transmission assemblies are in one-to-one correspondence with the support rods;
the transmission assembly comprises a supporting block and a transmission rod, the supporting block is fixed on the inner wall of the connecting pipe, a guide hole is formed in the supporting block, the transmission rod vertically penetrates through the guide hole, the transmission rod is in sliding connection with the inner wall of the guide hole, the top end of the guide rod is fixed on the connecting ring, and the top end of the guide rod is fixedly connected with the extrusion disc.
Preferably, the drive motor is a servo motor in order to increase the drive force of the drive motor.
Preferably, in order to reduce the gap between the inner wall of the air tube and the moving plate, the inner wall of the air tube is coated with sealing grease.
Preferably, in order to facilitate the installation of the transmission rod, both ends of the transmission rod are provided with chamfers.
Preferably, the driving rod is coated with a lubricating oil in order to reduce the friction between the driving rod and the inner wall of the guide hole.
Preferably, the slider is made of rubber for achieving buffering and vibration reduction.
Preferably, in order to prolong the service life of the connecting pipe, an anti-corrosion zinc coating is arranged on the connecting pipe.
Preferably, in order to reduce noise, two sound-absorbing plates are arranged on the inner wall of the fixing pipe and correspond to the air pipes one by one.
Preferably, in order to realize the function of purifying air, a filter screen is arranged in each of the two air holes.
Preferably, the support ring and the fixing tube are integrally formed to improve the reliability of the connection between the support ring and the fixing tube.
The chip production equipment with the impurity removal function has the advantages that the function of adsorbing a wafer by the suction nozzle is realized through the adsorption mechanism, compared with the existing adsorption mechanism, the adsorption mechanism can also generate air flow and act on the substrate to blow off impurities on the substrate, the function of cleaning the substrate is realized, in addition, the heat dissipation of the suction nozzle can be realized by accelerating the flow velocity of the air, the practicability is stronger, not only is the function of removing the impurities in the adsorption hole realized through the auxiliary mechanism, and the blockage of the adsorption hole is prevented.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a chip production apparatus having an impurity removal function according to the present invention;
FIG. 2 is a schematic structural diagram of an adsorption mechanism of the chip production apparatus having an impurity removal function according to the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a schematic structural diagram of an auxiliary mechanism of the chip production apparatus having an impurity removal function according to the present invention;
in the figure: 1. the air suction device comprises a connecting pipe, 2 suction nozzles, 3 a driving motor, 4 a sealing ring, 5 a transmission shaft, 6 a connecting ring, 7 an air pipe, 8 a moving disc, 9 a first connecting rod, 10 a supporting rod, 11 a sliding block, 12 a second connecting rod, 13 balls, 14 fan blades, 15 a supporting ring, 16 a fixed pipe, 17 an extrusion disc, 18 a supporting block, 19 a transmission rod, 20 a sound absorption plate, 21 a filter screen and 22 a spring.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1-3, a chip production apparatus with impurity removal function comprises a connecting pipe 1 and a suction nozzle 2, wherein the connecting pipe 1 is vertically arranged, the suction nozzle 2 is installed at the bottom end of the connecting pipe 1, the suction nozzle 2 is provided with an adsorption hole, the adsorption hole is coaxially arranged with the connecting pipe 1, and the aperture of the adsorption hole is smaller than the inner diameter of the connecting pipe 1, and is characterized in that an adsorption mechanism is arranged on the connecting pipe 1, and an auxiliary mechanism is arranged on the suction nozzle 2;
the adsorption mechanism comprises an adsorption component and a wind power component;
the adsorption assembly comprises a power unit and two adsorption units, the power unit is arranged in the connecting pipe 1, and the adsorption units are circumferentially and uniformly distributed by taking the axis of the connecting pipe 1 as a center;
the power assembly comprises a driving motor 3, a sealing ring 4, a transmission shaft 5 and a connecting ring 6, wherein the sealing ring 4, the transmission shaft 5 and the connecting ring 6 are coaxially arranged with the connecting pipe 1, the outer diameter of the sealing ring 4 is equal to the inner diameter of the connecting pipe 1, the inner diameter of the sealing ring 4 is equal to the diameter of the transmission shaft 5, the transmission shaft 5 penetrates through the sealing ring 4, the transmission shaft 5 is in sliding and sealing connection with the sealing ring 4, the sealing ring 4 is in sealing and fixed connection with the inner wall of the connecting pipe 1, the connecting ring 6 is positioned between the driving motor 3 and the sealing ring 4, the inner diameter of the connecting ring 6 is smaller than the inner diameter of the connecting pipe 1, the inner diameter of the connecting ring 6 is equal to the diameter of the transmission shaft 5, the driving motor 3 is in transmission connection with the bottom end of the transmission, the connecting ring 6 is connected with the transmission shaft 5 in a sliding way;
the adsorption unit comprises an air pipe 7, a moving disc 8, a first connecting rod 9, a supporting rod 10, a sliding block 11, a spring 22, a second connecting rod 12 and balls 13, wherein the axis of the air pipe 7 is perpendicular to and intersected with the axis of the connecting pipe 1, the air pipe 7 is positioned between the sealing ring 4 and the connecting ring 6, one end, close to the transmission shaft 5, of the air pipe 7 is fixed on the connecting pipe 1, the air pipe 7 is communicated with the connecting pipe 1, the moving disc 8 and the air pipe 7 are coaxially arranged, the moving disc 8 is in sliding and sealing connection with the inner wall of the air pipe 7, the first connecting rod 9 is obliquely arranged, one side, close to the transmission shaft 5, of the moving disc 8 is hinged to the top of the connecting ring 6 through the first connecting rod 9, the distance between one end, close to the connecting ring 6, of the first connecting rod 9 and the transmission shaft 5 is smaller than the distance between the, the air pipe 7 is positioned between the connecting ring 6 and the driving motor 3, the supporting rod 10 is fixed on the transmission shaft 5, the slide block 11 is sleeved on the support rod 10, the slide block 11 is abutted against the transmission shaft 5, the slide block 11 is connected with one end of the support rod 10 far away from the transmission shaft 5 through a spring 22, the bottom of the connecting ring 6 is provided with an annular groove which is coaxial with the transmission shaft 5, the center of the ball 13 is arranged in the annular groove, the ball 13 is matched with the annular groove, the ball 13 is connected with the inner wall of the annular groove in a sliding way, the ball diameter of the ball 13 is larger than the width of the notch of the annular groove, the second connecting rod 12 is obliquely arranged, one end of the second connecting rod 12 is fixed on the ball 13, the other end of the second connecting rod 12 is hinged with the sliding block 11, the distance between one end of the second connecting rod 12 close to the sliding block 11 and the transmission shaft 5 is smaller than the distance between the other end of the second connecting rod 12 and the transmission shaft 5;
the wind power assembly comprises a fan blade 14, a support ring 15 and a fixing tube 16, wherein the fan blade 14 is arranged in a connecting tube 1, the fan blade 14 is installed at the top end of a transmission shaft 5, the support ring 15 and the fixing tube 16 are coaxially arranged with the connecting tube 1, the inner diameter of the fixing tube 16 is larger than the outer diameter of the connecting tube 1, the connecting tube 1 penetrates through the support ring 15, the support ring 15 is positioned between the fan blade 14 and a sealing ring 4, the connecting tube 1 is hermetically and fixedly connected with the support ring 15, the top end of the fixing tube 16 is hermetically and fixedly connected with the support ring 15, an air tube 7 is positioned in the fixing tube 16, at least two air holes are formed in the connecting tube 1, the air holes correspond to the air tubes 7 one by one, and the;
during the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, the bottom of the suction nozzle 2 driven by the connecting pipe 1 can be abutted against a wafer by the moving device, then the driving motor 3 is started to rotate the transmission shaft 5, the rotation of the transmission shaft 5 drives the ball 13 to slide in the annular groove through the support rod 10, the slide block 11 and the second connecting rod 12, and the slide block 11 moves towards the direction far away from the transmission shaft 5 under the action of centrifugal force and compresses the spring 22, the slide block 11 moves to drive the connecting ring 6 to move upwards through the second connecting rod 12 and the ball 13, the connecting ring 6 moves upwards to drive the moving disk 8 to move towards the direction far away from the transmission shaft 5 in the air pipe 7 through the first connecting rod 9, namely, the air in the connecting pipe 1 can be sucked into the air pipe 7, so that the air pressure in the suction hole can be reduced, the suction nozzle 2, then, the moving pipe drives the suction nozzle 2 to move through the moving device, so that the suction nozzle 2 drives the wafer to move to the substrate, then the driving motor 3 stops starting, the slider 11 is reset under the elastic action of the spring 22, so that the connecting ring 6 can be reset, the reset of the connecting ring 6 drives the moving disc 8 to reset through the first connecting rod 9, so that the suction nozzle 2 stops adsorbing the wafer, and the wafer is attached to the substrate, here, the rotation of the transmission shaft 5 drives the fan blades 14 to rotate, so that the air in the connecting pipe 1 can be conveyed into the fixed pipe 16 from the air holes, the air in the fixed pipe 16 is discharged from the bottom end of the fixed pipe 16 and acts on the substrate, the impurities on the substrate can be blown to be separated from the substrate under the action of the air flow, and the function of cleaning the impurities on the substrate is realized.
As shown in fig. 4, the auxiliary mechanism includes an extrusion disc 17 and two transmission assemblies, the extrusion disc 17 is disposed in the adsorption hole, the diameter of the extrusion disc 17 is equal to the aperture of the adsorption hole, the extrusion disc 17 and the adsorption hole are coaxially disposed, the extrusion disc 17 and the inner wall of the adsorption hole are slidably and hermetically connected, the transmission assemblies are disposed in the connection pipe 1, the transmission assemblies are located between the suction nozzle 2 and the connection ring 6, and the transmission assemblies are in one-to-one correspondence with the support rods 10;
the transmission assembly comprises a supporting block 18 and a transmission rod 19, the supporting block 18 is fixed on the inner wall of the connecting pipe 1, a guide hole is formed in the supporting block 18, the transmission rod 19 vertically penetrates through the guide hole, the transmission rod 19 is in sliding connection with the inner wall of the guide hole, the top end of the guide rod is fixed on the connecting ring 6, and the top end of the guide rod is fixedly connected with the extrusion disc 17.
During the go-between 6 rebound, then can drive transfer line 19 and realize synchronous motion on supporting shoe 18, and make extrusion dish 17 rebound to connecting pipe 1 in, and through calculating, can make extrusion dish 17 and absorption hole separation, during the shift ring rebound, then drive extrusion dish 17 through transfer line 19 and remove to in the absorption hole, through the removal of extrusion dish 17 in the absorption hole, can make the impurity in the absorption hole release, prevent that impurity from blockking up the absorption hole, and extrusion dish 17 can make the air in the absorption hole follow the bottom discharge in absorption hole in the rebound in the absorption hole, under the effect of air current, can promote the effect of cleaing away of the downthehole impurity of absorption.
Preferably, the driving motor 3 is a servo motor in order to increase the driving force of the driving motor 3.
The servo motor has a characteristic of strong overload capability, so that the driving force of the driving motor 3 can be improved.
Preferably, in order to reduce the gap between the inner wall of the air tube 7 and the moving plate 8, the inner wall of the air tube 7 is coated with sealing grease.
The sealing grease has the function of reducing the gap between the inner wall of the air pipe 7 and the moving disc 8, and the sealing performance is improved.
Preferably, in order to facilitate the installation of the driving rod 19, both ends of the driving rod 19 are provided with chamfers.
The chamfer serves to reduce the diameter of the transmission rod 19 when passing through the guide hole, and has the effect of facilitating installation.
Preferably, the driving rod 19 is coated with a lubricating oil in order to reduce the friction between the driving rod 19 and the inner wall of the guide hole.
The lubricating oil has the function of reducing the friction force between the transmission rod 19 and the inner wall of the guide hole, and the moving fluency of the transmission rod 19 is improved.
Preferably, the material of the slider 11 is rubber for achieving cushioning and vibration reduction.
The rubber texture is softer, can reduce the slider 11 and the transmission shaft 5 and lean on the impact force that produces when leaning on, has realized buffering and damping.
Preferably, in order to prolong the service life of the connecting pipe 1, the connecting pipe 1 is provided with an anti-corrosion zinc coating.
The function of anticorrosive galvanizing coat is to promote the rust-resistant ability of connecting pipe 1, prolongs the life of connecting pipe 1.
Preferably, two sound-absorbing plates 20 are arranged on the inner wall of the fixed pipe 16 for reducing noise, and the sound-absorbing plates 20 correspond to the air pipes 7 one by one.
The sound-absorbing plate 20 can absorb noise, achieving noise reduction.
Preferably, in order to achieve the function of purifying air, a filter screen 21 is installed in each of the two air holes.
The screen 21 functions to trap dust in the air and prevent the dust from falling onto the substrate.
Preferably, in order to improve the reliability of the connection between the support ring 15 and the fixing tube 16, the support ring 15 and the fixing tube 16 are integrally formed.
The integrally formed structure has a high strength characteristic, so that the reliability of the connection of the support ring 15 and the fixing tube 16 can be improved.
During the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, the bottom of the suction nozzle 2 driven by the connecting pipe 1 can be abutted against a wafer by the moving device, then the driving motor 3 is started to rotate the transmission shaft 5, the rotation of the transmission shaft 5 drives the ball 13 to slide in the annular groove through the support rod 10, the slide block 11 and the second connecting rod 12, and the slide block 11 moves towards the direction far away from the transmission shaft 5 under the action of centrifugal force and compresses the spring 22, the slide block 11 moves to drive the connecting ring 6 to move upwards through the second connecting rod 12 and the ball 13, the connecting ring 6 moves upwards to drive the moving disk 8 to move towards the direction far away from the transmission shaft 5 in the air pipe 7 through the first connecting rod 9, namely, the air in the connecting pipe 1 can be sucked into the air pipe 7, so that the air pressure in the suction hole can be reduced, the suction nozzle 2, then, the moving pipe drives the suction nozzle 2 to move through the moving device, so that the suction nozzle 2 drives the wafer to move to the substrate, then the driving motor 3 stops starting, the slider 11 is reset under the elastic action of the spring 22, so that the connection ring 6 is reset, the reset of the connection ring 6 drives the moving disk 8 to reset through the first connecting rod 9, so that the suction nozzle 2 stops adsorbing the wafer, so that the wafer is attached to the substrate, here, the rotation of the transmission shaft 5 drives the fan blades 14 to rotate, so that the air in the connection pipe 1 can be conveyed into the fixed pipe 16 from the air holes, the air in the fixed pipe 16 is discharged from the bottom end of the fixed pipe 16 and acts on the substrate, the impurities on the substrate can be blown under the action of the air flow to separate from the substrate, the function of cleaning the impurities on the substrate is realized, during the upward movement of the connection ring 6, the transmission rod 19 can be driven to realize the synchronous movement on the supporting block 18, and make the extrusion dish 17 upwards move to connecting pipe 1 in, and through calculating, can make extrusion dish 17 and absorption hole separation, during the shift ring downstream, then drive extrusion dish 17 through transfer line 19 and remove to in the absorption hole, through the removal of extrusion dish 17 in the absorption hole, can make the downthehole impurity of absorption release, prevent that impurity from blockking up the absorption hole, and the downthehole downstream of extrusion dish 17 in the absorption can make the downthehole air of absorption follow the bottom discharge of absorption hole, under the effect of air current, can promote the effect of cleing away of the downthehole impurity of absorption.
Compared with the prior art, this chip production facility with edulcoration function has realized the function that suction nozzle 2 adsorbs the wafer through adsorption mechanism, compare with current adsorption mechanism, this adsorption mechanism can also produce the air current and use on the base plate, make impurity on the base plate blow off, realize the function of clean base plate, and, through the velocity of flow of accelerating the air, can also realize the heat dissipation to suction nozzle 2, the practicality is stronger, moreover, still realize the function of cleaing away the downthehole impurity of absorption through complementary unit, prevent that the absorption hole from blockking up, compare with current complementary unit, this complementary unit drives extrusion disc 17 through the removal of shift ring and removes, integral type linkage structure has been realized with adsorption mechanism, the practicality is stronger.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The chip production equipment with the impurity removing function comprises a connecting pipe (1) and a suction nozzle (2), wherein the connecting pipe (1) is vertically arranged, the suction nozzle (2) is installed at the bottom end of the connecting pipe (1), an adsorption hole is formed in the suction nozzle (2), the adsorption hole and the connecting pipe (1) are coaxially arranged, the aperture of the adsorption hole is smaller than the inner diameter of the connecting pipe (1), the chip production equipment is characterized in that an adsorption mechanism is arranged on the connecting pipe (1), and an auxiliary mechanism is arranged on the suction nozzle (2);
the adsorption mechanism comprises an adsorption component and a wind power component;
the adsorption assembly comprises a power unit and two adsorption units, the power unit is arranged in the connecting pipe (1), and the adsorption units are circumferentially and uniformly distributed by taking the axis of the connecting pipe (1) as a center;
the power assembly comprises a driving motor (3), a sealing ring (4), a transmission shaft (5) and a connecting ring (6), wherein the sealing ring (4), the transmission shaft (5) and the connecting ring (6) are coaxially arranged with the connecting pipe (1), the outer diameter of the sealing ring (4) is equal to the inner diameter of the connecting pipe (1), the inner diameter of the sealing ring (4) is equal to the diameter of the transmission shaft (5), the transmission shaft (5) penetrates through the sealing ring (4), the transmission shaft (5) and the sealing ring (4) are in sliding and sealing connection, the sealing ring (4) is in sealing and fixed connection with the inner wall of the connecting pipe (1), the connecting ring (6) is positioned between the driving motor (3) and the sealing ring (4), the inner diameter of the connecting ring (6) is smaller than the inner diameter of the connecting pipe (1), and the inner diameter of the connecting ring (6) is equal, the driving motor (3) is in transmission connection with the bottom end of the transmission shaft (5), the driving motor (3) is fixed on the inner wall of the connecting pipe (1), the transmission shaft (5) penetrates through the connecting ring (6), and the connecting ring (6) is in sliding connection with the transmission shaft (5);
the adsorption unit comprises an air pipe (7), a movable disc (8), a first connecting rod (9), a supporting rod (10), a sliding block (11), a spring (22), a second connecting rod (12) and balls (13), wherein the axis of the air pipe (7) is perpendicular to and intersected with the axis of the connecting pipe (1), the air pipe (7) is positioned between a sealing ring (4) and a connecting ring (6), one end of the air pipe (7) close to the transmission shaft (5) is fixed on the connecting pipe (1), the air pipe (7) is communicated with the connecting pipe (1), the movable disc (8) and the air pipe (7) are coaxially arranged, the movable disc (8) and the inner wall of the air pipe (7) are in sliding and sealing connection, the first connecting rod (9) is obliquely arranged, one side, close to the transmission shaft (5), of the movable disc (8) is hinged to the top of the connecting ring (6) through the first connecting rod (9), the distance between one end, close to the connecting ring (6), of the first connecting rod (9) and the transmission shaft (5) is smaller than the distance between the other end of the connecting rod and the transmission shaft (5), the supporting rod (10) is parallel to the air pipe (7), the air pipe (7) is located between the connecting ring (6) and the driving motor (3), the supporting rod (10) is fixed on the transmission shaft (5), the sliding block (11) is sleeved on the supporting rod (10), the sliding block (11) is abutted against the transmission shaft (5), the sliding block (11) is connected with one end, far away from the transmission shaft (5), of the supporting rod (10) through a spring (22), an annular groove is formed in the bottom of the connecting ring (6), the annular groove is coaxially arranged with the transmission shaft (5), the center of the ball (13) is arranged in the annular groove, the ball (13) is matched with the annular groove, and the ball (13) is connected with the inner wall, the ball diameter of the ball (13) is larger than the width of the notch of the annular groove, the second connecting rod (12) is obliquely arranged, one end of the second connecting rod (12) is fixed on the ball (13), the other end of the second connecting rod (12) is hinged with the sliding block (11), and the distance between one end, close to the sliding block (11), of the second connecting rod (12) and the transmission shaft (5) is smaller than the distance between the other end of the second connecting rod (12) and the transmission shaft (5);
the wind power assembly comprises fan blades (14), a support ring (15) and a fixed pipe (16), wherein the fan blades (14) are arranged in a connecting pipe (1), the fan blades (14) are arranged on the top end of a transmission shaft (5), the support ring (15) and the fixed pipe (16) are coaxially arranged with the connecting pipe (1), the inner diameter of the fixed pipe (16) is larger than the outer diameter of the connecting pipe (1), the connecting pipe (1) penetrates through the support ring (15), the support ring (15) is positioned between the fan blades (14) and a sealing ring (4), the connecting pipe (1) is sealed and fixedly connected with the support ring (15), the top end of the fixed pipe (16) is sealed and fixedly connected with the support ring (15), a gas pipe (7) is positioned in the fixed pipe (16), at least two gas holes are arranged on the connecting pipe (1), and the gas holes correspond to gas pipes (7) one by one, the air hole is positioned between the support ring (15) and the sealing ring (4);
as shown in fig. 4, the auxiliary mechanism includes an extrusion disc (17) and two transmission assemblies, the extrusion disc (17) is disposed in the adsorption hole, the diameter of the extrusion disc (17) is equal to the aperture of the adsorption hole, the extrusion disc (17) and the adsorption hole are coaxially disposed, the extrusion disc (17) and the inner wall of the adsorption hole are slidably and hermetically connected, the transmission assemblies are disposed in the connection pipe (1), the transmission assemblies are located between the suction nozzle (2) and the connection ring (6), and the transmission assemblies are in one-to-one correspondence with the support rods (10);
the transmission assembly comprises a supporting block (18) and a transmission rod (19), the supporting block (18) is fixed on the inner wall of the connecting pipe (1), a guide hole is formed in the supporting block (18), the transmission rod (19) vertically penetrates through the guide hole, the transmission rod (19) is in sliding connection with the inner wall of the guide hole, the top end of the guide rod is fixed on the connecting ring (6), and the top end of the guide rod is fixedly connected with the extrusion disc (17).
2. The chip production equipment with impurity removal function according to claim 1, wherein the driving motor (3) is a servo motor.
3. The chip production apparatus with impurity removal function according to claim 1, wherein the inner wall of the air tube (7) is coated with a sealing grease.
4. The chip production apparatus with impurity removal function according to claim 1, wherein both ends of the transmission rod (19) are provided with chamfers.
5. The chip production apparatus with an impurity removing function according to claim 1, wherein the transmission rod (19) is coated with a lubricating oil.
6. The chip production equipment with impurity removal function according to claim 1, wherein the slide block (11) is made of rubber.
7. The chip production equipment with impurity removal function according to claim 1, wherein the connecting pipe (1) is provided with an anti-corrosion zinc coating.
8. The chip production equipment with impurity removal function according to claim 1, wherein two sound-absorbing plates (20) are arranged on the inner wall of the fixing pipe (16), and the sound-absorbing plates (20) correspond to the air pipes (7) one by one.
9. The chip production apparatus with impurity removal function according to claim 1, wherein a filter screen (21) is installed in each of the two air holes.
10. The apparatus for producing chips with impurity removing function according to claim 1, wherein the supporting ring (15) and the fixing tube (16) are of an integrally formed structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110084009.5A CN112864077A (en) | 2021-01-21 | 2021-01-21 | Chip production equipment with impurity removal function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110084009.5A CN112864077A (en) | 2021-01-21 | 2021-01-21 | Chip production equipment with impurity removal function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112864077A true CN112864077A (en) | 2021-05-28 |
Family
ID=76009077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110084009.5A Withdrawn CN112864077A (en) | 2021-01-21 | 2021-01-21 | Chip production equipment with impurity removal function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112864077A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114701177A (en) * | 2022-03-30 | 2022-07-05 | 无锡红光微电子股份有限公司 | Heating device for be used for mounting process |
-
2021
- 2021-01-21 CN CN202110084009.5A patent/CN112864077A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114701177A (en) * | 2022-03-30 | 2022-07-05 | 无锡红光微电子股份有限公司 | Heating device for be used for mounting process |
| CN114701177B (en) * | 2022-03-30 | 2023-09-08 | 无锡红光微电子股份有限公司 | Heating device for be used for dress piece process |
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Application publication date: 20210528 |
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