CN111554605A - Chip mounting equipment with impurity removal function - Google Patents
Chip mounting equipment with impurity removal function Download PDFInfo
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- CN111554605A CN111554605A CN202010432526.2A CN202010432526A CN111554605A CN 111554605 A CN111554605 A CN 111554605A CN 202010432526 A CN202010432526 A CN 202010432526A CN 111554605 A CN111554605 A CN 111554605A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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Abstract
The invention relates to a chip mounting device with an impurity removing function, which comprises a connecting pipe and a suction nozzle, the suction nozzle is arranged at one end of the connecting pipe, an adsorption mechanism is arranged in the connecting pipe, two heat dissipation mechanisms are arranged on the connecting pipe, the heat dissipation mechanisms are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe as the center, the adsorption mechanism comprises a sealing disc, an extrusion disc, a rubber ring, an electromagnet, a magnet block, a moving rod, a supporting block, a first spring and two limiting blocks, the heat dissipation mechanism comprises a mounting hole, an air pipe, a sealing block, a guide pipe, a magnet disc, a wind power assembly and two reset assemblies, wherein the air pipe is parallel to the connecting pipe and fixed on the outer wall of the connecting pipe, this chip pastes dress equipment with impurity removal function has realized the function of adsorbing the chip through adsorption mechanism, and not only, has still realized the radiating function of suction nozzle through heat dissipation mechanism.
Description
Technical Field
The invention relates to the field of IC packaging equipment, in particular to chip mounting equipment with an impurity removing function.
Background
The IC package type is a package for mounting a semiconductor integrated circuit chip, which not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also is connected to pins of the package through contacts on the chip by wires, and the pins are connected to other devices through wires on a printed circuit board, thereby realizing the connection between an internal chip and an external circuit, wherein the chip mounting is one of the IC package processes, and the chip mounting is a process of sucking one of the chips on a wafer by a suction nozzle and then adhering the chip to a die pad.
In the chip pastes dress in-process, prior art all directly makes the suction hole on the suction nozzle form the vacuum through vacuum device, in order to realize the suction nozzle to the absorption of chip, although chip pastes dress and all accomplishes in dust-free workshop, but it has impurity to drop on the wafer to avoid to have, when the suction nozzle supports with the chip and supports and adsorb, the impurity of pressing from both sides in the middle can make chip surface atress too big and scrap, the practicality has been reduced, moreover, when the suction nozzle frequently adsorbs the chip, the mechanical energy of the production of suction nozzle can change the heat into, lead to the suction nozzle temperature to rise, because the suction nozzle is mostly rubber material, high temperature can shorten the life of suction nozzle, and, during chip pastes dress, need the temperature and the humidity in the dust-free workshop of strict control, when the suction nozzle temperature risees and transmits to the chip on, easily make the chip scrap, the practicality has been reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the chip mounting equipment with the impurity removing function is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chip mounting device with an impurity removing function comprises a connecting pipe and a suction nozzle, wherein the suction nozzle is arranged at one end of the connecting pipe, an adsorption mechanism is arranged in the connecting pipe, two heat dissipation mechanisms are arranged on the connecting pipe, and the heat dissipation mechanisms are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe as a center;
the adsorption mechanism comprises a sealing disc, an extrusion disc, a rubber ring, an electromagnet, a magnet block, a moving rod, a supporting block, a first spring and two limiting blocks, wherein the sealing disc, the rubber ring, the extrusion disc and the moving rod are coaxially arranged with a connecting pipe, the diameter of the sealing disc is equal to the inner diameter of the connecting pipe and is larger than that of the extrusion disc, the sealing disc is in sliding and sealing connection with the inner wall of the connecting pipe, a through hole is formed in the sealing disc, the moving rod penetrates through the through hole, the moving rod is in sliding and sealing connection with the inner wall of the through hole, the magnet block is fixed at one end of the moving rod, the extrusion disc is fixed at the other end of the moving rod and is provided with a gap between the other end of the moving rod and the sealing disc, the supporting block is fixed on the inner wall of the connecting pipe and is positioned between, the rubber ring is positioned between the sealing disc and the extrusion disc, the sealing disc and the extrusion disc are both fixedly connected with the rubber ring, a gap is arranged between the rubber ring and the inner wall of the connecting pipe, the first spring is positioned between the supporting block and the sealing disc, the sealing disc is connected with the supporting block through a first spring, the electromagnet is positioned on one side of the magnet block far away from the moving rod and is fixed on the inner wall of the connecting pipe, a gap is arranged between the electromagnet and the magnet block and is arranged oppositely, the limiting blocks are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe as the center, the limiting block is fixed on the inner wall of the connecting pipe and is positioned on one side of the sealing disc close to the magnet block, a gap is formed between the limiting block and the sealing disc and is smaller than the distance between the electromagnet and the magnet block, and the distance between the limiting block and the sealing disc is smaller than the distance between the supporting block and the sealing disc;
the heat dissipation mechanism comprises a mounting hole, an air pipe, a sealing block, a guide pipe, a magnet disc, a wind power assembly and two reset assemblies, the air pipe is parallel to the connecting pipe and is fixed on the outer wall of the connecting pipe, the sealing block is hermetically and fixedly connected with one end of the air pipe far away from the suction nozzle, the axial line of the air pipe and the axial line of the connecting pipe are both vertical to and intersected with the axial line of the catheter, the mounting hole is arranged on the connecting pipe, the guide tube penetrates through the mounting hole, the guide tube is hermetically and fixedly connected with the inner wall of the mounting hole, the air tube is communicated with the connecting tube through the guide tube, the magnet disc is arranged in the connecting pipe and is coaxial with the guide pipe, the diameter of the magnet disc is larger than the outer diameter of the guide pipe, the magnet disc is abutted against and hermetically connected with one end of the guide pipe close to the axis of the connecting pipe, the wind power assembly is arranged in the guide pipe and connected with the magnet block, and the reset assemblies are uniformly distributed on the magnet disc in the circumferential direction by taking the axis of the guide pipe as a center;
the wind-force subassembly includes flabellum, transmission shaft, bearing, rack and rolling gear, be equipped with the round hole on the sealed dish, the transmission shaft just passes the round hole with the coaxial setting of pipe, the inner wall slip and the sealing connection of transmission shaft and round hole, rack and rolling gear all are located the connecting tube, rack and magnet piece fixed connection, rolling gear install the transmission shaft be close to the connecting tube axis one end and with rack toothing, the other end at the transmission shaft is installed to the flabellum, the inner circle of bearing is installed on the transmission shaft, the outer lane of bearing and the inner wall fixed connection of pipe.
As preferred, for the convenience of magnet dish removes towards keeping away from connecting tube axis direction, the subassembly that resets includes fixed block, second spring, bracing piece and auxiliary hole, the auxiliary hole sets up on the magnet dish, the bracing piece is parallel with the pipe and passes the auxiliary hole, the inner wall sliding connection of bracing piece and auxiliary hole, the one end that is close to the connecting tube axis at the bracing piece is fixed to the fixed block, the other end of bracing piece is fixed on the inner wall of connecting tube, the second spring is located between fixed block and the magnet dish, the fixed block passes through the second spring and is connected with the magnet dish.
Preferably, in order to facilitate the installation of the support rod, chamfers are arranged at both ends of the support rod.
Preferably, the material of the conduit is rubber for achieving cushioning and vibration reduction.
Preferably, in order to reduce the gap between the inner wall of the connecting tube and the sealing disk, the inner wall of the connecting tube is coated with a sealing grease.
Preferably, for dust protection, a filter screen is mounted in each of the two air ducts, the filter screen being located on a side of the duct adjacent to the mouthpiece.
Preferably, in order to prolong the service life of the sealing disc, the sealing disc is provided with an anti-corrosion zinc coating.
Preferably, the moving rod is coated with a lubricating oil in order to reduce friction between the moving rod and the inner wall of the fitting hole.
Preferably, in order to improve the heat dissipation capacity of the suction nozzle, the connecting pipe is coated with heat-conducting silica gel.
Preferably, in order to reduce noise, two sound-absorbing plates are arranged in the connecting pipe, correspond to the air pipe one by one and are fixed on the inner wall of the connecting pipe.
The chip mounting equipment with the impurity removing function has the advantages that the chip adsorbing function is realized through the adsorption mechanism, compared with the existing adsorption mechanism, the adsorption mechanism can realize the function of removing impurities on the chip, meanwhile, the suction nozzle can conveniently dissipate heat through the air in the connecting pipe, in addition, the suction nozzle chip adsorbing effect can be improved through the abutting between the rubber ring and the inner wall of the connecting pipe, the practicability is stronger, not only is the suction nozzle heat dissipating function realized through the heat dissipating mechanism, compared with the existing heat dissipating mechanism, the heat dissipating mechanism can also improve the distance of the impurities on the chip moving towards the direction far away from the axis of the connecting pipe, and the impurity removing effect is better.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural view of a chip mounting apparatus having an impurity removing function according to the present invention;
fig. 2 is a schematic structural view of an adsorption mechanism of the chip mounting apparatus having the impurity removing function of the present invention;
fig. 3 is a schematic structural view of a heat dissipation mechanism of a chip mounting apparatus having a foreign substance removal function according to the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 3;
in the figure: 1. the air suction device comprises a connecting pipe, 2 suction nozzles, 3 sealing discs, 4 extrusion discs, 5 rubber rings, 6 electromagnets, 7 magnet blocks, 8 moving rods, 9 supporting blocks, 10 first springs, 11 limiting blocks, 12 air pipes, 13 sealing blocks, 14 guide pipes, 15 magnet discs, 16 fan blades, 17 transmission shafts, 18 bearings, 19 racks, 20 rotating gears, 21 fixing blocks, 22 second springs, 23 supporting rods, 24 filter screens and 25 sound absorption plates.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1-2, a chip mounting device with an impurity removing function includes a connection tube 1 and a suction nozzle 2, wherein the suction nozzle 2 is installed at one end of the connection tube 1, an adsorption mechanism is arranged in the connection tube 1, two heat dissipation mechanisms are arranged on the connection tube 1, and the heat dissipation mechanisms are circumferentially and uniformly distributed with an axis of the connection tube 1 as a center;
the adsorption device comprises a sealing disc 3, an extrusion disc 4, a rubber ring 5, an electromagnet 6, a magnet block 7, a moving rod 8, a supporting block 9, a first spring 10 and two limiting blocks 11, the sealing disc 3, the rubber ring 5, the extrusion disc 4 and the moving rod 8 are coaxially arranged with a connecting pipe 1, the diameter of the sealing disc 3 is equal to the inner diameter of the connecting pipe 1 and is larger than that of the extrusion disc 4, the sealing disc 3 is in sliding and sealing connection with the inner wall of the connecting pipe 1, a through hole is formed in the sealing disc 3, the moving rod 8 penetrates through the through hole, the moving rod 8 is in sliding and sealing connection with the inner wall of the through hole, the magnet block 7 is fixed at one end of the moving rod 8, the extrusion disc 4 is fixed at the other end of the moving rod 8 and is provided with a gap between the sealing disc 3, the supporting block 9 is fixed on the inner, the supporting block 9 is provided with an assembly hole, the moving rod 8 penetrates through the assembly hole and is in sliding connection with the inner wall of the assembly hole, the rubber ring 5 is located between the sealing disc 3 and the extrusion disc 4, the sealing disc 3 and the extrusion disc 4 are both fixedly connected with the rubber ring 5, a gap is formed between the inner wall of the rubber ring 5 and the inner wall of the connecting pipe 1, the first spring 10 is located between the supporting block 9 and the sealing disc 3, the sealing disc 3 is connected with the supporting block 9 through the first spring 10, the electromagnet 6 is located on one side, far away from the moving rod 8, of the magnet block 7 and fixed on the inner wall of the connecting pipe 1, a gap is formed between the electromagnet 6 and the magnet block 7 and is just opposite to the gap, the limiting blocks 11 are uniformly distributed by taking the axis of the connecting pipe 1 as the central circumferential direction, the limiting blocks 11 are fixed on the inner wall, a gap is formed between the limiting block 11 and the sealing disc 3 and is smaller than the distance between the electromagnet 6 and the magnet block 7, and the distance between the limiting block 11 and the sealing disc 3 is smaller than the distance between the supporting block 9 and the sealing disc 3;
one end of the connecting pipe 1 far away from the suction nozzle 2 is connected with an external execution device, the connecting pipe 1 can be moved by the execution device, when the connecting pipe 1 drives the suction nozzle 2 to move to the upper part of a target chip, the electromagnet 6 is electrified with current, so that mutually repulsive acting force is generated between the electromagnet 6 and the magnet block 7, the magnet block 7 moves towards the direction far away from the electromagnet 6, the movement of the magnet block 7 drives the moving rod 8 to realize synchronous movement on the supporting block 9, the first spring 10 is compressed, the movement of the moving rod 8 drives the extrusion disc 4 to realize synchronous movement, the movement of the extrusion disc 4 drives the sealing disc 3 to realize synchronous movement through the rubber ring 5, so that air in the connecting pipe 1 is discharged from one end of the connecting pipe 1 close to the nozzle and acts on the chip, impurities on the chip move towards the direction far away from the axis of the connecting pipe 1, and the function of removing the, meanwhile, under the action of air flow, the heat dissipation effect of the suction nozzle 2 can be improved, then, the connecting pipe 1 drives the suction nozzle 2 to abut against the chip, and the electromagnet 6 is energized with reverse current, so that the mutual attraction acting force is generated between the electromagnet 6 and the magnet block 7, the magnet block 7 moves towards the direction close to the electromagnet 6 under the elastic acting force of the first spring 10 and the attraction acting force of the electromagnet 6, the movement of the magnet block 7 sequentially passes through the moving rod 8, the extrusion disc 4 and the rubber ring 5 to drive the sealing disc 3 to move towards the direction close to the electromagnet 6, so that the air pressure between the sealing disc 3 and the chip in the connecting pipe 1 is reduced, the chip can be adsorbed on the suction nozzle 2 through the air pressure, and when the sealing disc 3 abuts against the limiting block 11, a gap still exists between the magnet block 7 and the electromagnet 6, and the extrusion disc 4 continues to move towards the, can make the distance between extrusion dish 4 and the sealed dish 3 reduce and realize the extrusion to rubber ring 5, make rubber ring 5 produce deformation and support with the inner wall of connecting pipe 1 and lean on, support with the inner wall of connecting pipe 1 through rubber ring 5 and support, can further promote sealed effect, can be in order to promote 2 absorption chip effects of suction nozzle, when the chip removes to the crystalline grain seat on, make 6 logical electric currents of electro-magnet again, can resume to atmospheric pressure with the atmospheric pressure between sealed dish 3 and the chip, make the chip can the adhesion on the crystalline grain seat, accomplish the paster promptly.
As shown in fig. 3, the heat dissipation mechanism includes a mounting hole, an air pipe 12, a sealing block 13, a guide pipe 14, a magnet disc 15, a wind power assembly and two reset assemblies, the air pipe 12 is parallel to the connection pipe 1 and fixed on the outer wall of the connection pipe 1, the sealing block 13 is hermetically and fixedly connected with one end of the air pipe 12 away from the suction nozzle 2, the axis of the air pipe 12 and the axis of the connection pipe 1 are perpendicular to and intersect with the axis of the guide pipe 14, the mounting hole is disposed on the connection pipe 1, the guide pipe 14 passes through the mounting hole, the guide pipe 14 is hermetically and fixedly connected with the inner wall of the mounting hole, the air pipe 12 is communicated with the connection pipe 1 through the guide pipe 14, the magnet disc 15 is disposed in the connection pipe 1 and coaxial with the guide pipe 14, the diameter of the magnet disc 15 is greater than the outer diameter of the guide pipe 14, the magnet disc 15 is abutted against and hermetically connected, the wind power assembly is arranged in the guide pipe 14 and connected with the magnet block 7, and the reset assemblies are uniformly distributed on the magnet disc 15 in the circumferential direction by taking the axis of the guide pipe 14 as the center;
wind-force subassembly includes flabellum 16, transmission shaft 17, bearing 18, rack 19 and rotating gear 20, be equipped with the round hole on the sealed dish 3, transmission shaft 17 and the coaxial setting of pipe 14 just pass the round hole, transmission shaft 17 slides and sealing connection with the inner wall of round hole, rack 19 and rotating gear 20 all are located connecting pipe 1, rack 19 and magnet piece 7 fixed connection, rotating gear 20 installs the one end that is close to connecting pipe 1 axis at transmission shaft 17 and meshes with rack 19, the other end at transmission shaft 17 is installed to flabellum 16, the inner circle of bearing 18 is installed on transmission shaft 17, the outer lane of bearing 18 and the inner wall fixed connection of pipe 14.
When the electromagnet 6 is electrified with current, the magnet block 7 moves towards the direction far away from the electromagnet 6, the movement of the magnet block 7 drives the rack 19 to move, so that the rotating gear 20 can rotate, the rotating gear 20 rotates to drive the transmission shaft 17 to rotate under the supporting action of the bearing 18, the rotation of the transmission shaft 17 drives the fan blades 16 to rotate, meanwhile, the electromagnet 6 is electrified with current, so that the interaction attraction acting force is generated between the electromagnet 6 and the magnet disc 15, the magnet disc 15 moves towards the direction close to the electromagnet 6, a gap is generated between the magnet disc 15 and the guide pipe 14, air in the connecting pipe 1 can be conveyed into the air pipe 12 from the guide pipe 14 through the rotation of the fan blades 16 and is discharged from one end of the air pipe 12 close to the suction nozzle 2, the heat dissipation of the suction nozzle 2 can be realized through the action of air flow, and impurities on a chip can also further move towards the direction far away from the axis of the connecting pipe, promote impurity and clear away the effect, when electro-magnet 6 leads to with the reverse current, make magnet piece 7 reset, and make rack 19 antiport, can make flabellum 16 antiport, make simultaneously produce the effort of mutual repulsion between electro-magnet 6 and the magnet dish 15, the magnet dish 15 combines together through the discharge effort that electro-magnet 6 produced and reset the subassembly, make the magnet dish 15 reset and support with pipe 14 and lean on, realized the function of plugging up pipe 14, at this moment, can't make the outside air of trachea 12 get into trachea 12 and drive impurity and move towards being close to connecting pipe 1 axis direction from the one end that is close to suction nozzle 2 of trachea 12 through the rotation of flabellum 16.
As shown in fig. 4, the reset assembly includes a fixing block 21, a second spring 22, a support rod 23 and an auxiliary hole, the auxiliary hole is disposed on the magnet disc 15, the support rod 23 is parallel to the guide tube 14 and passes through the auxiliary hole, the support rod 23 is slidably connected to the inner wall of the auxiliary hole, the fixing block 21 is fixed at one end of the support rod 23 close to the axis of the connection tube 1, the other end of the support rod 23 is fixed on the inner wall of the connection tube 1, the second spring 22 is disposed between the fixing block 21 and the magnet disc 15, and the fixing block 21 is connected to the magnet disc 15 through the second spring 22.
When the electromagnet 6 is energized, the magnet disc 15 is moved on the support bar 23 in the direction of approaching the electromagnet 6 and the second spring 22 is compressed, and when the electromagnet 6 is energized with a reverse current, the elastic action of the second spring 22 is combined with the repulsive force generated by the electromagnet 6, so that the magnet disc 15 is restored and abuts against the guide tube 14.
Preferably, in order to facilitate the installation of the support rod 23, both ends of the support rod 23 are provided with chamfers.
The chamfer angle is used for reducing the caliber of the support rod 23 when passing through the auxiliary hole, and the effect of convenient installation is achieved.
Preferably, the conduit 14 is made of rubber for cushioning and vibration reduction.
The rubber is soft, so that the impact force generated when the magnet disc 15 abuts against the guide pipe 14 can be reduced, and the buffer and the vibration reduction are realized.
Preferably, in order to reduce the gap between the inner wall of the connection pipe 1 and the seal disk 3, the inner wall of the connection pipe 1 is coated with a sealing grease.
The sealing grease has the function of reducing the gap between the inner wall of the connecting pipe 1 and the sealing disc 3, and the sealing performance is improved.
Preferably, a filter screen 24 is installed in each of the two air tubes 12 for dust prevention, and the filter screen 24 is located on one side of the guide tube 14 close to the mouthpiece 2.
The filter screen 24 is used for preventing dust in the air pipe 12 from falling on the chip along with air, and dust prevention is achieved.
Preferably, in order to prolong the service life of the sealing plate 3, the sealing plate 3 is provided with an anti-corrosion zinc coating.
The function of anticorrosive galvanizing coat is to promote sealed dish 3's antirust capacity, prolongs sealed dish 3's life.
Preferably, in order to reduce the friction between the moving rod 8 and the inner wall of the fitting hole, the moving rod 8 is coated with a lubricating oil.
The lubricating oil has the function of reducing the friction force between the moving rod 8 and the inner wall of the assembling hole, and the moving fluency of the moving rod 8 is improved.
Preferably, in order to improve the heat dissipation capability of the suction nozzle 2, the connecting pipe 1 is coated with heat conductive silica gel.
The connecting pipe 1 can absorb heat on the suction nozzle 2, and the heat dissipation capacity of the connecting pipe 1 can be improved through the heat conduction silica gel, so that the heat dissipation effect of the suction nozzle 2 can be improved.
Preferably, two sound-absorbing plates 25 are arranged in the connecting pipe 1 for noise reduction, and the sound-absorbing plates 25 correspond to the air pipes 12 one by one and are fixed on the inner wall of the connecting pipe 1.
The sound-absorbing plate 25 is used for absorbing noise in the connecting pipe 1 and reducing noise.
One end of the connecting pipe 1 far away from the suction nozzle 2 is connected with an external execution device, the connecting pipe 1 can be moved by the execution device, when the connecting pipe 1 drives the suction nozzle 2 to move to the upper part of a target chip, the electromagnet 6 is electrified with current, so that mutually repulsive acting force is generated between the electromagnet 6 and the magnet block 7, the magnet block 7 moves towards the direction far away from the electromagnet 6, the movement of the magnet block 7 drives the moving rod 8 to realize synchronous movement on the supporting block 9, the first spring 10 is compressed, the movement of the moving rod 8 drives the extrusion disc 4 to realize synchronous movement, the movement of the extrusion disc 4 drives the sealing disc 3 to realize synchronous movement through the rubber ring 5, so that air in the connecting pipe 1 is discharged from one end of the connecting pipe 1 close to the nozzle and acts on the chip, impurities on the chip move towards the direction far away from the axis of the connecting pipe 1, and the function of removing the, meanwhile, under the action of air flow, the heat dissipation effect of the suction nozzle 2 can be improved, in addition, the movement of the iron block towards the direction far away from the electromagnet 6 drives the rack 19 to move, so that the rotating gear 20 can rotate, the rotation of the rotating gear 20 drives the transmission shaft 17 to rotate under the supporting action of the bearing 18, the rotation of the transmission shaft 17 drives the fan blades 16 to rotate, meanwhile, during the current is supplied to the electromagnet 6, the mutual attraction acting force is generated between the electromagnet 6 and the magnet disc 15, so that the magnet disc 15 moves towards the direction close to the electromagnet 6 on the supporting rod 23, a gap is generated between the magnet disc 15 and the guide pipe 14, meanwhile, the second spring 22 is compressed, the air in the connecting pipe 1 can be conveyed into the air pipe 12 from the guide pipe 14 and discharged from one end of the air pipe 12 close to the suction nozzle 2, and the heat dissipation of the suction nozzle 2 can be realized through the action of air flow, meanwhile, impurities on the chip can further move towards the direction far away from the axis of the connecting pipe 1, so that the impurity removing effect is improved;
then, the connecting pipe 1 drives the suction nozzle 2 to abut against the chip, the electromagnet 6 is energized with reverse current, and interaction attraction force is generated between the electromagnet 6 and the magnet block 7, so that the magnet block 7 moves towards the direction close to the electromagnet 6 under the elastic action force of the first spring 10 and the attraction action force of the electromagnet 6, the movement of the magnet block 7 sequentially passes through the moving rod 8, the extrusion disc 4 and the rubber ring 5 to drive the sealing disc 3 to move towards the direction close to the electromagnet 6, so that the air pressure between the sealing disc 3 and the chip in the connecting pipe 1 is reduced, the chip can be adsorbed on the suction nozzle 2 by the air pressure, and when the sealing disc 3 abuts against the limiting block 11, a gap still exists between the magnet block 7 and the electromagnet 6, and the distance between the extrusion disc 4 and the sealing disc 3 can be reduced and the rubber ring 5 can be extruded by the extrusion disc 4 continuing to move towards the direction close to the magnet, the rubber ring 5 is deformed and is abutted against the inner wall of the connecting pipe 1, the sealing effect can be further improved by abutting the rubber ring 5 against the inner wall of the connecting pipe 1, namely, the chip adsorption effect of the suction nozzle 2 can be improved, meanwhile, the rack 19 is moved reversely, the fan blade 16 can be rotated reversely, the electromagnet 6 and the magnet disc 15 generate mutually repulsive acting force, the magnet disc 15 is combined with the elastic action of the second spring 22 through the discharge acting force generated by the electromagnet 6, the magnet disc 15 is reset and is abutted against the guide pipe 14, the function of blocking the guide pipe 14 is realized, at the moment, air outside the air pipe 12 cannot enter the air pipe 12 from one end of the air pipe 12, close to the suction nozzle 2, through the rotation of the fan blade 16, and impurities are driven to move towards the direction close to the axis of the connecting pipe 1;
when the chip moves to the crystal grain seat, the electromagnet 6 is electrified, so that the air pressure between the sealing disc 3 and the chip can be restored to the atmospheric pressure, and the chip can be adhered to the crystal grain seat, thus completing the chip mounting;
here, when the seal disk 3 is moved in a direction away from the electromagnet 6, a gap is formed between the rubber ring 5 and the inner wall of the connection pipe 1, so that the frictional force of the movement of the seal disk 3 can be reduced to facilitate the movement of the seal disk 3.
Compared with the prior art, this chip pastes dress equipment with impurity removal function has realized the function of adsorbing the chip through adsorption mechanism, compare with current adsorption mechanism, this adsorption mechanism can realize the function of clearing away impurity on the chip, and simultaneously, through the air escape in connecting pipe 1, the suction nozzle 2 heat dissipation of can being convenient for, and, support through between rubber ring 5 and the 1 inner wall of connecting pipe and lean on, can promote suction nozzle 2 and adsorb the chip effect, the practicality is stronger, moreover, still realized the radiating function of suction nozzle 2 through heat dissipation mechanism, compare with current heat dissipation mechanism, this heat dissipation mechanism can also improve the impurity on the chip towards the distance of keeping away from 1 axis direction removal of connecting pipe, impurity removal effect is better.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A chip mounting device with an impurity removing function comprises a connecting pipe (1) and a suction nozzle (2), wherein the suction nozzle (2) is installed at one end of the connecting pipe (1), and is characterized in that an adsorption mechanism is arranged in the connecting pipe (1), two heat dissipation mechanisms are arranged on the connecting pipe (1), and the heat dissipation mechanisms are circumferentially and uniformly distributed by taking the axis of the connecting pipe (1) as a center;
the adsorption mechanism comprises a sealing disc (3), an extrusion disc (4), a rubber ring (5), an electromagnet (6), a magnet block (7), a moving rod (8), a supporting block (9), a first spring (10) and two limiting blocks (11), wherein the sealing disc (3), the rubber ring (5), the extrusion disc (4) and the moving rod (8) are coaxially arranged with a connecting pipe (1), the diameter of the sealing disc (3) is equal to the inner diameter of the connecting pipe (1) and is larger than that of the extrusion disc (4), the sealing disc (3) is in sliding and sealing connection with the inner wall of the connecting pipe (1), a through hole is formed in the sealing disc (3), the moving rod (8) penetrates through the through hole, the moving rod (8) is in sliding and sealing connection with the inner wall of the through hole, the magnet block (7) is fixed at one end of the moving rod (8), the extrusion disc (4) is fixed at the other end of the moving rod (8) and is provided with a gap between the sealing, the utility model discloses a rubber sealing device, including connecting pipe (1), supporting shoe (9), rubber ring (5), rubber ring (3) and extrusion disc (4), be equipped with the pilot hole on supporting shoe (9), carriage release lever (8) pass the pilot hole and with the inner wall sliding connection of pilot hole, rubber ring (5) are located between sealed dish (3) and extrusion disc (4), sealed dish (3) and extrusion disc (4) all with rubber ring (5) fixed connection, be equipped with the clearance between the inner wall of rubber ring (5) and connecting pipe (1), first spring (10) are located between supporting shoe (9) and sealed dish (3), sealed dish (3) are connected with supporting shoe (9) through first spring (10), electromagnet (6) are located one side of keeping away from carriage release lever (8) of magnet piece (7) and fix on the inner wall of connecting pipe (1), a gap is formed between the electromagnet (6) and the magnet block (7) and is arranged right opposite to the electromagnet, the limiting block (11) is circumferentially and uniformly distributed by taking the axis of the connecting pipe (1) as a center, the limiting block (11) is fixed on the inner wall of the connecting pipe (1) and is positioned on one side, close to the magnet block (7), of the sealing disc (3), a gap is formed between the limiting block (11) and the sealing disc (3) and is smaller than the distance between the electromagnet (6) and the magnet block (7), and the distance between the limiting block (11) and the sealing disc (3) is smaller than the distance between the supporting block (9) and the sealing disc (3);
the heat dissipation mechanism comprises a mounting hole, an air pipe (12), a sealing block (13), a guide pipe (14), a magnet disc (15), a wind power assembly and two reset assemblies, wherein the air pipe (12) is parallel to the connecting pipe (1) and fixed on the outer wall of the connecting pipe (1), the sealing block (13) is sealed and fixedly connected with one end of the air pipe (12), which is far away from the suction nozzle (2), the axis of the air pipe (12) and the axis of the connecting pipe (1) are perpendicular to and intersected with the axis of the guide pipe (14), the mounting hole is formed in the connecting pipe (1), the guide pipe (14) penetrates through the mounting hole, the guide pipe (14) is sealed and fixedly connected with the inner wall of the mounting hole, the air pipe (12) is communicated with the connecting pipe (1) through the guide pipe (14), the magnet disc (15) is arranged in the connecting pipe (1) and is coaxial with the guide pipe (14), and the diameter of the magnet disc (15) is larger than the outer, the magnet disc (15) is abutted and hermetically connected with one end, close to the axis of the connecting pipe (1), of the guide pipe (14), the wind power assembly is arranged in the guide pipe (14) and connected with the magnet block (7), and the resetting assemblies are circumferentially and uniformly distributed on the magnet disc (15) by taking the axis of the guide pipe (14) as a center;
wind-force subassembly includes flabellum (16), transmission shaft (17), bearing (18), rack (19) and rotating gear (20), be equipped with the round hole on sealed dish (3), transmission shaft (17) and pipe (14) coaxial setting just pass the round hole, transmission shaft (17) slide and sealing connection with the inner wall of round hole, rack (19) and rotating gear (20) all are located connecting pipe (1), rack (19) and magnet piece (7) fixed connection, rotating gear (20) are installed in the one end that is close to connecting pipe (1) axis of transmission shaft (17) and are meshed with rack (19), the other end in transmission shaft (17) is installed in flabellum (16), the inner circle of bearing (18) is installed on transmission shaft (17), the outer lane of bearing (18) and the inner wall fixed connection of pipe (14).
2. The chip mounting apparatus with the impurity removing function according to claim 1, wherein the reset assembly includes a fixing block (21), a second spring (22), a support rod (23) and an auxiliary hole, the auxiliary hole is disposed on the magnet disc (15), the support rod (23) is parallel to the guide tube (14) and passes through the auxiliary hole, the support rod (23) is slidably connected to an inner wall of the auxiliary hole, the fixing block (21) is fixed to one end of the support rod (23) close to an axis of the connecting tube (1), the other end of the support rod (23) is fixed to the inner wall of the connecting tube (1), the second spring (22) is located between the fixing block (21) and the magnet disc (15), and the fixing block (21) is connected to the magnet disc (15) through the second spring (22).
3. The chip mounting apparatus with impurity removing function according to claim 2, wherein both ends of the supporting rod (23) are provided with chamfers.
4. The chip mounter having the function of removing impurities according to claim 1, wherein said duct (14) is made of rubber.
5. The chip mounter having the function of removing foreign substances according to claim 1, wherein the inner wall of said connection pipe (1) is coated with a sealing grease.
6. The chip mounter having the function of removing foreign substances according to claim 1, wherein a filter screen (24) is installed in each of the two air pipes (12), and the filter screen (24) is located on one side of the guide pipe (14) close to the suction nozzle (2).
7. The chip mounting apparatus with impurity removing function according to claim 1, wherein said sealing disk (3) is provided with an anti-corrosion zinc plating layer.
8. The chip mounter having the function of removing foreign substances according to claim 1, wherein said moving bar (8) is coated with a lubricating oil.
9. The chip mounting apparatus with the impurity removing function according to claim 1, wherein the connection tube (1) is coated with a heat conductive silica gel.
10. The chip mounting apparatus with the impurity removing function according to claim 1, wherein two sound-absorbing plates (25) are provided in the connecting pipe (1), and the sound-absorbing plates (25) correspond to the air pipes (12) one by one and are fixed on the inner wall of the connecting pipe (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010432526.2A CN111554605A (en) | 2020-05-20 | 2020-05-20 | Chip mounting equipment with impurity removal function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010432526.2A CN111554605A (en) | 2020-05-20 | 2020-05-20 | Chip mounting equipment with impurity removal function |
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| Publication Number | Publication Date |
|---|---|
| CN111554605A true CN111554605A (en) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010432526.2A Withdrawn CN111554605A (en) | 2020-05-20 | 2020-05-20 | Chip mounting equipment with impurity removal function |
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| CN (1) | CN111554605A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
-
2020
- 2020-05-20 CN CN202010432526.2A patent/CN111554605A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707578A (en) * | 2021-08-30 | 2021-11-26 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and use method thereof |
| CN113707578B (en) * | 2021-08-30 | 2023-07-04 | 重庆电子工程职业学院 | Packaging device convenient for packaging integrated circuit chip and application method thereof |
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Application publication date: 20200818 |