CN111916388A - Adsorption equipment that wafer subsides dress precision is high - Google Patents

Adsorption equipment that wafer subsides dress precision is high Download PDF

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Publication number
CN111916388A
CN111916388A CN202010842401.7A CN202010842401A CN111916388A CN 111916388 A CN111916388 A CN 111916388A CN 202010842401 A CN202010842401 A CN 202010842401A CN 111916388 A CN111916388 A CN 111916388A
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China
Prior art keywords
pipe
connecting pipe
fixed
wafer
rotary drum
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CN202010842401.7A
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Chinese (zh)
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董赵卜
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Shenzhen Jundatong Office Intelligence Technology Co ltd
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Shenzhen Jundatong Office Intelligence Technology Co ltd
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Priority to CN202010842401.7A priority Critical patent/CN111916388A/en
Publication of CN111916388A publication Critical patent/CN111916388A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to an adsorption device with high chip mounting precision, which comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is arranged at the bottom end of the connecting pipe, an adsorption mechanism is arranged in the connecting pipe, an auxiliary mechanism is arranged on the connecting pipe, the adsorption mechanism comprises a fixed tube, a magnet disc, a moving rod, a supporting block, a limiting block, a return spring and an electromagnet, the auxiliary assembly comprises a movable pipe, a sealing ring and two transmission assemblies, the transmission assemblies comprise a first rotary drum, a second rotary drum, a first connecting line, a second connecting line, a rotating shaft, a torsion spring and a round hole, this adsorption equipment that wafer subsides dress precision is high has realized the function of adsorbing the wafer through adsorption mechanism, and so, still improved the stability that the suction nozzle adsorbs the wafer and removes through complementary unit, prevent to produce relative movement and reduce the accuracy that the wafer pasted the dress between wafer and the suction nozzle.

Description

Adsorption equipment that wafer subsides dress precision is high
Technical Field
The invention relates to the field of semiconductor packaging, in particular to an adsorption device with high chip mounting precision.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips through a scribing process, then the cut chips are attached to corresponding islands of a substrate frame in a glue or heating film mode, and bonding pads of the chips are connected to corresponding pins of the substrate through superfine metal wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out procedures such as inspection, Test, packaging and the like, and finally warehousing and shipping.
The chip mounting machine is one of semiconductor packaging equipment, mainly equipment which is attached to a substrate after a chip is adsorbed by a suction nozzle, when the suction nozzle adsorbs the chip, when impurities exist on the surface of the chip, the reliability of the chip adsorbed by the suction nozzle can be influenced, the chip is easy to crush, furthermore, the suction nozzle adsorbs the chip in the translation process, in order to improve the working efficiency, the moving speed is high, the wind resistance of the chip is high, the chip is easy to move relative to the suction nozzle, the chip attachment accuracy is influenced, and the practicability is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the adsorption device with high wafer mounting precision is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: an adsorption device with high chip mounting precision comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is arranged at the bottom end of the connecting pipe, an adsorption mechanism is arranged in the connecting pipe, and an auxiliary mechanism is arranged on the connecting pipe;
the adsorption mechanism comprises a fixed pipe, a magnet disc, a moving rod, a supporting block, a limiting block, a reset spring and an electromagnet, the fixed pipe, the magnet disc and the moving rod are coaxially arranged with the connecting pipe, the fixed pipe is hermetically and fixedly connected with the inner wall of the connecting pipe, the magnet disc is arranged in the fixed pipe, the magnet disc is slidably and hermetically connected with the inner wall of the fixed pipe, the top end of the moving rod is fixed at the bottom of the magnet disc, the limiting block is fixed at the bottom end of the moving rod, the supporting block is fixed on the inner wall of the connecting pipe, the through hole is arranged on the supporting block, the moving rod penetrates through the through hole and is slidably connected with the inner wall of the through hole, the limiting block is abutted against the bottom of the supporting block, the reset spring is positioned between the magnet disc and the supporting block, the magnet disc is connected with the supporting block through the reset, the magnet disc is positioned between the electromagnet and the moving rod, and a gap is formed between the electromagnet and the magnet disc;
the auxiliary assembly comprises a moving pipe, a sealing ring and two transmission assemblies, wherein the moving pipe and the sealing ring are coaxially arranged with a connecting pipe, the connecting pipe penetrates through the sealing ring, the connecting pipe is in sliding and sealing connection with the sealing ring, the top end of the moving pipe is in sealing and fixed connection with the bottom of the sealing ring, the suction nozzle is positioned in the moving pipe, a gap is formed between the connecting pipe and the inner wall of the moving pipe, and the transmission assemblies are uniformly distributed above the sealing ring by taking the axis of the connecting pipe as a central axis;
the transmission assembly comprises a first rotary drum, a second rotary drum, a first connecting wire, a second connecting wire, a rotary shaft, a torsion spring and a round hole, wherein the round hole is formed in the connecting pipe, the axis of the rotary shaft is perpendicular to and intersected with the axis of the connecting pipe, the rotary shaft penetrates through the round hole and is positioned above the fixed pipe, the rotary shaft is in sliding and sealing connection with the inner wall of the round hole, the first rotary drum and the second rotary drum are coaxially arranged with the rotary shaft, the first rotary drum is arranged in the connecting pipe and fixed at one end of the rotary shaft, the second rotary drum is fixed at the other end of the rotary shaft, the torsion spring is positioned between the second rotary drum and the connecting pipe, the second rotary drum is connected with the connecting pipe through the torsion spring, one end of the first connecting wire is fixed at the top of the magnet disc, the other end of the second connecting wire is fixed on the first, one end of the second connecting wire is fixed on the top of the sealing ring, the other end of the second connecting wire is fixed on the second rotary drum, the second connecting wire is wound on the second rotary drum, and the winding direction of the first connecting wire is opposite to that of the second connecting wire.
Preferably, the first connection line is a wire rope in order to improve reliability of the first connection line.
Preferably, in order to reduce the gap between the rotating shaft and the inner wall of the circular hole, the inner wall of the circular hole is coated with sealing grease.
Preferably, in order to facilitate the installation of the moving rod, both ends of the moving rod are provided with chamfers.
Preferably, the moving rod is coated with a lubricating oil in order to reduce friction between the moving rod and the inner wall of the through hole.
Preferably, in order to prolong the service life of the fixing pipe, the fixing pipe is provided with an anti-corrosion zinc coating.
Preferably, in order to reduce noise, two sound-absorbing plates are arranged on the inner wall of the moving pipe, and the sound-absorbing plates correspond to the rotating shafts one by one.
Preferably, the moving pipe is made of rubber to achieve buffering and vibration reduction.
Preferably, in order to save energy, two photovoltaic panels are arranged at the top of the sealing ring, and the photovoltaic panels correspond to the rotating shafts one by one.
Preferably, in order to improve the heat dissipation effect of the suction nozzle, a refrigeration rod is arranged on the inner wall of the connecting pipe and is positioned between the fixed pipe and the suction nozzle.
The invention has the advantages that the adsorption device with high wafer mounting precision realizes the function of adsorbing the wafer through the adsorption mechanism, compared with the prior adsorption mechanism, the adsorption mechanism acts on the wafer through the air discharged from the suction nozzle 2, so that the impurities on the wafer can be separated from the wafer under the action of the air flow, moreover, the adsorption acting force of the suction nozzle on the wafer can be limited through the abutting of the limiting block and the supporting block, the wafer is prevented from being broken due to the overlarge adsorption force of the suction nozzle, the practicability is stronger, moreover, the stability of the wafer adsorption of the suction nozzle is improved through the auxiliary mechanism, the relative movement between the wafer and the suction nozzle is prevented from being generated, so that the wafer mounting precision is reduced, compared with the prior auxiliary mechanism, the auxiliary mechanism can separate the impurities on the substrate from the substrate through discharging the air in the moving pipe from the bottom end of the moving pipe, so that the impurities can not influence the wafer mounting effect, and the movement of the magnet disc is used as a driving force to move the sealing ring and the moving pipe, so that the auxiliary mechanism and the adsorption mechanism realize an integrated linkage structure, and the practicability is higher.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a suction device with high precision for mounting a wafer according to the present invention;
FIG. 2 is a cross-sectional view of the suction device with high precision for mounting a wafer according to the present invention;
FIG. 3 is a schematic structural diagram of a suction mechanism of the high-precision suction apparatus for wafer mounting according to the present invention;
FIG. 4 is a schematic structural diagram of a driving assembly of the high-precision wafer mounting adsorption device of the present invention;
in the figure: 1. the refrigerator comprises a connecting pipe, 2 suction nozzles, 3 fixed pipes, 4 magnet discs, 5 moving rods, 6 supporting blocks, 7 limiting blocks, 8 return springs, 9 electromagnets, 10 moving pipes, 11 sealing rings, 12 first rotary drums, 13 second rotary drums, 14 first connecting wires, 15 second connecting wires, 16 rotating shafts, 17 torsion springs, 18 sound absorbing plates, 19 photovoltaic plates and 20 refrigeration rods.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1-3, an adsorption device with high chip mounting precision comprises a connecting pipe 1 and a suction nozzle 2, wherein the connecting pipe 1 is vertically arranged, the suction nozzle 2 is installed at the bottom end of the connecting pipe 1, an adsorption mechanism is arranged in the connecting pipe 1, and an auxiliary mechanism is arranged on the connecting pipe 1;
the adsorption mechanism comprises a fixed pipe 3, a magnet disc 4, a moving rod 5, a supporting block 6, a limiting block 7, a reset spring 8 and an electromagnet 9, wherein the fixed pipe 3, the magnet disc 4 and the moving rod 5 are coaxially arranged with the connecting pipe 1, the fixed pipe 3 is fixedly connected with the inner wall of the connecting pipe 1 in a sealing manner, the magnet disc 4 is arranged in the fixed pipe 3, the magnet disc 4 is connected with the inner wall of the fixed pipe 3 in a sliding manner in a sealing manner, the top end of the moving rod 5 is fixed at the bottom of the magnet disc 4, the limiting block 7 is fixed at the bottom end of the moving rod 5, the supporting block 6 is fixed on the inner wall of the connecting pipe 1, a through hole is arranged on the supporting block 6, the moving rod 5 penetrates through the through hole and is connected with the inner wall of the through hole in a sliding manner, the limiting block 7 is abutted against the bottom, the magnet disc 4 is connected with the supporting block 6 through a return spring 8, the electromagnet 9 is arranged in the fixed tube 3 and is fixedly connected with the inner wall of the fixed tube 3, the magnet disc 4 is positioned between the electromagnet 9 and the moving rod 5, and a gap is formed between the electromagnet 9 and the magnet disc 4;
during the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, the connecting pipe 1 drives the suction nozzle 2 to move to the upper part of the wafer through the moving device, then the electromagnet 9 is electrified, so that mutually repulsive acting force is generated between the electromagnet 9 and the magnet disc 4, the magnet disc 4 moves in the fixed pipe 3 and finally moves to the position between the fixed pipe 3 and the suction nozzle 2, meanwhile, a gap is generated between the magnet disc 4 and the fixed pipe 3, the movement of the magnet disc 4 drives the moving rod 5 to synchronously move on the supporting block 6, and the return spring 8 is compressed, through the movement of the magnet disc 4 in the fixed pipe 3 towards the direction close to the suction nozzle 2, the air in the connecting pipe 1 can be discharged from the suction nozzle 2 and act on the wafer, the impurities on the wafer can be separated from the wafer under the action of air flow, and the function of removing the impurities on the wafer is realized, then, make suction nozzle 2 and wafer support and realize sealing through the mobile device, subsequently, electro-magnet 9 cuts off the power supply, make magnet disc 4 towards keeping away from suction nozzle 2 direction and realize resetting under the elastic action of reset spring 8, through the magnet disc 4 in fixed tube 3 towards keeping away from the removal of suction nozzle 2 direction, can make the atmospheric pressure in the suction nozzle 2 reduce, can make suction nozzle 2 adsorb the wafer under the effect of atmospheric pressure, afterwards, make connecting pipe 1 drive suction nozzle 2 through the mobile device and remove, can drive the wafer with suction nozzle 2 and remove to the base plate, subsequently, electro-magnet 9 is switched on again, can make suction nozzle 2 stop adsorbing the wafer, afterwards, make suction nozzle 2 and wafer separate and make electro-magnet 9 cut off the power supply again through the mobile device, can accomplish the subsides of wafer and paste.
As shown in fig. 4, the auxiliary assembly includes a moving pipe 10, a sealing ring 11 and two transmission assemblies, the moving pipe 10 and the sealing ring 11 are both arranged coaxially with the connecting pipe 1, the connecting pipe 1 passes through the sealing ring 11, the connecting pipe 1 is connected with the sealing ring 11 in a sliding and sealing manner, the top end of the moving pipe 10 is fixedly connected with the bottom of the sealing ring 11 in a sealing manner, the suction nozzle 2 is located in the moving pipe 10, a gap is formed between the inner walls of the connecting pipe 1 and the moving pipe 10, and the transmission assemblies are uniformly distributed above the sealing ring 11 by using the axis of the connecting pipe 1 as a central axis;
the transmission assembly comprises a first rotating drum 12, a second rotating drum 13, a first connecting line 14, a second connecting line 15, a rotating shaft 16, a torsion spring 17 and a round hole, wherein the round hole is formed in the connecting pipe 1, the axis of the rotating shaft 16 is perpendicular to and intersects with the axis of the connecting pipe 1, the rotating shaft 16 passes through the round hole and is positioned above the fixed pipe 3, the rotating shaft 16 is connected with the inner wall of the round hole in a sliding and sealing manner, the first rotating drum 12 and the second rotating drum 13 are both coaxially arranged with the rotating shaft 16, the first rotating drum 12 is arranged in the connecting pipe 1 and is fixed at one end of the rotating shaft 16, the second rotating drum 13 is fixed at the other end of the rotating shaft 16, the torsion spring 17 is positioned between the second rotating drum 13 and the connecting pipe 1, the second rotating drum 13 is connected with the connecting pipe 1 through the torsion spring 17, and one end of the first connecting, the other end of the second connecting line 15 is fixed on the first drum 12, the first connecting line 14 is wound on the first drum 12, one end of the second connecting line 15 is fixed on the top of the sealing ring 11, the other end of the second connecting line 15 is fixed on the second drum 13, the second connecting line 15 is wound on the second drum 13, and the winding direction of the first connecting line 14 is opposite to that of the second connecting line 15.
When the magnet disc 4 moves towards the direction close to the suction nozzle 2, the first connecting wire 14 pulls the first rotary drum 12 to rotate, the rotation of the first rotary drum 12 drives the second rotary drum 13 to rotate through the rotating shaft 16, meanwhile, the second connecting wire 15 pulls the sealing ring 11 to move towards the direction close to the second rotary drum 13, and the torsion spring 17 is deformed, the movement of the sealing ring 11 drives the moving pipe 10 to realize synchronous movement, when the magnet disc 4 moves towards the direction far away from the suction nozzle 2, the first connecting wire 14 can be loosened, the second rotary drum 13 rotates reversely through the elastic action of the torsion spring 17, the reverse rotation of the second rotary drum 13 loosens the second connecting wire 15, so that the sealing ring 11 and the moving pipe 10 can be reset, namely, the wafer on the suction nozzle 2 is positioned in the moving pipe 10, and the reverse rotation of the second rotary drum 13 drives the first rotary drum 12 to rotate reversely through the rotating shaft 16, realize first cylinder 12 and coil first connecting line 14, here, can reduce the windage that the wafer received in the removal process through removing pipe 10, reduce the relative movement that the wafer takes place with suction nozzle 2 in the removal process, the accuracy of wafer subsides dress has been improved, and when suction nozzle 2 pasted the wafer on the base plate, make and remove pipe 10 and lean on with the base plate preferentially, along with the reduction of the distance between wafer and the base plate, can make the volume increase in the connecting pipe 1 in removing pipe 10, thereby can make the air in removing pipe 10 receive the extrusion and discharge from the bottom of removing pipe 10, can make impurity and the base plate separation on the base plate under the effect of air current, realized the function of cleaing away impurity on the base plate, prevent that impurity from influencing the wafer and paste the dress effect.
Preferably, the first connection line 14 is a wire rope in order to improve the reliability of the first connection line 14.
The steel wire rope has the characteristics of high strength, difficulty in breaking and the like, and the reliability of the first connecting line 14 is improved.
Preferably, in order to reduce the gap between the rotating shaft 16 and the inner wall of the circular hole, the inner wall of the circular hole is coated with sealing grease.
The sealing grease has the function of reducing the gap between the rotating shaft 16 and the inner wall of the circular hole, and the sealing performance is improved.
Preferably, in order to facilitate the installation of the moving rod 5, both ends of the moving rod 5 are provided with chamfers.
The chamfer angle is used for reducing the caliber of the moving rod 5 when the moving rod passes through the through hole, and the effect of convenient installation is achieved.
Preferably, the moving rod 5 is coated with a lubricating oil in order to reduce the frictional force between the moving rod 5 and the inner wall of the through-hole.
The lubricating oil has the function of reducing the friction force between the moving rod 5 and the inner wall of the through hole, and the moving fluency of the moving rod 5 is improved.
Preferably, in order to prolong the service life of the fixing pipe 3, the fixing pipe 3 is provided with an anti-corrosion zinc coating.
The function of anticorrosive galvanizing coat is to promote the rust-resistant ability of fixed pipe 3, prolongs the life of fixed pipe 3.
Preferably, in order to reduce noise, two sound-absorbing plates 18 are arranged on the inner wall of the moving pipe 10, and the sound-absorbing plates 18 correspond to the rotating shafts 16 one by one.
The sound-absorbing plate 18 can absorb noise to reduce noise.
Preferably, the material of the moving pipe 10 is rubber for achieving cushioning and vibration reduction.
The rubber is soft, so that the impact force generated when the moving pipe 10 abuts against the base plate can be reduced, and buffering and vibration reduction are realized.
Preferably, for energy saving, two photovoltaic panels 19 are arranged on the top of the sealing ring 11, and the photovoltaic panels 19 correspond to the rotating shafts 16 one by one.
The photovoltaic panel 19 can absorb light rays to perform photovoltaic power generation, and energy conservation is realized.
Preferably, in order to improve the heat dissipation effect of the suction nozzle 2, a refrigeration stick 20 is arranged on the inner wall of the connection pipe 1, and the refrigeration stick 20 is located between the fixed pipe 3 and the suction nozzle 2.
The cooling stick 20 can reduce the temperature of the air in the connecting pipe 1, and when the wafer is attached to the substrate in a heating film mode, the suction nozzle 2 can absorb the heat on the substrate, and at the moment, the cooling effect of the suction nozzle 2 can be improved through the cooling stick 20.
During the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, the connecting pipe 1 drives the suction nozzle 2 to move to the upper part of the wafer through the moving device, then the electromagnet 9 is electrified, so that mutually repulsive acting force is generated between the electromagnet 9 and the magnet disc 4, the magnet disc 4 moves in the fixed pipe 3 and finally moves to the position between the fixed pipe 3 and the suction nozzle 2, meanwhile, a gap is generated between the magnet disc 4 and the fixed pipe 3, the movement of the magnet disc 4 drives the moving rod 5 to synchronously move on the supporting block 6, and the return spring 8 is compressed, through the movement of the magnet disc 4 in the fixed pipe 3 towards the direction close to the suction nozzle 2, the air in the connecting pipe 1 can be discharged from the suction nozzle 2 and act on the wafer, the impurities on the wafer can be separated from the wafer under the action of air flow, and the function of removing the impurities on the wafer is realized, then, the suction nozzle 2 is abutted against the wafer and sealed by the moving device, wherein, by the movement of the magnet disc 4 toward the direction close to the suction nozzle 2, the first connecting wire 14 is pulled to rotate the first rotary drum 12, the rotation of the first rotary drum 12 drives the second rotary drum 13 to rotate through the rotating shaft 16, and simultaneously the second connecting wire 15 pulls the sealing ring 11 to move toward the direction close to the second rotary drum 13, and the torsion spring 17 is deformed, the movement of the sealing ring 11 drives the moving pipe 10 to move synchronously, then, the electromagnet 9 is powered off, the magnet disc 4 is moved toward the direction away from the suction nozzle 2 and reset is realized under the elastic action of the reset spring 8, by the movement of the magnet disc 4 toward the direction away from the suction nozzle 2 in the fixed pipe 3, the air pressure in the suction nozzle 2 can be reduced, namely, the suction nozzle 2 can absorb the wafer under the action of the air pressure, and, along with the movement of the magnet disc 4 toward the direction away, the first connecting line 14 can be loosened, the second drum 13 reversely rotates by the elastic action of the torsion spring 17, the second drum 13 reversely rotates to loosen the second connecting line 15, so that the sealing ring 11 and the moving tube 10 can be reset, that is, the wafer on the suction nozzle 2 can be positioned in the moving tube 10, and the reverse rotation of the second drum 13 drives the first drum 12 to reversely rotate by the rotating shaft 16, so that the first drum 12 winds the first connecting line 14, then the connecting tube 1 drives the suction nozzle 2 to move by the moving device, that is, the suction nozzle 2 drives the wafer to move to the substrate, then the electromagnet 9 is energized again, that is, the suction nozzle 2 stops adsorbing the wafer, then the electromagnet 9 is de-energized after the suction nozzle 2 is separated from the wafer by the moving device, that is, the mounting of the wafer can be completed, here, the wind resistance of the wafer in the moving process can be reduced by the moving tube 10, reduce the wafer and remove the relative movement that the in-process takes place with suction nozzle 2, the accuracy of wafer subsides dress has been improved, and when suction nozzle 2 pastes the wafer dress on the base plate, make removal pipe 10 to lean on with the base plate preferentially, along with the reduction of the distance between wafer and the base plate, can make the volume increase in the connecting pipe 1 in the removal pipe 10, thereby can make the air in the removal pipe 10 receive the extrusion and discharge from the bottom of removing pipe 10, can make impurity and the base plate separation on the base plate under the effect of air current, the function of impurity on the base plate has been realized cleaing away, prevent that impurity from influencing wafer dress effect.
Compared with the prior art, the adsorption device with high wafer mounting precision realizes the function of adsorbing the wafer through the adsorption mechanism, compared with the prior adsorption mechanism, the adsorption mechanism acts on the wafer through the air discharged from the suction nozzle 2, so that the impurities on the wafer can be separated from the wafer under the action of the air flow, moreover, the adsorption acting force of the suction nozzle 2 on the wafer can be limited through the abutting of the limiting block 7 and the supporting block 6, the wafer is prevented from being broken due to the overlarge adsorption force of the suction nozzle 2, the practicability is stronger, moreover, the stability of the wafer adsorption movement of the suction nozzle 2 is improved through the auxiliary mechanism, the relative movement between the wafer and the suction nozzle 2 is prevented, so that the accuracy of wafer mounting is reduced, compared with the prior auxiliary mechanism, the auxiliary mechanism can separate the impurities on the substrate from the substrate through discharging the air in the moving pipe 10 from the bottom end of the moving pipe 10, prevent that impurity from influencing the wafer and paste dress effect to, the removal through magnet dish 4 makes sealing ring 11 and removal pipe 10 remove as drive power, makes complementary unit and adsorption apparatus construct and has realized integral type linkage structure, and the practicality is stronger.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (10)

1. An adsorption device with high chip mounting precision comprises a connecting pipe (2) and a suction nozzle (2), wherein the connecting pipe (2) is vertically arranged, and the suction nozzle (2) is installed at the bottom end of the connecting pipe (2), and is characterized in that an adsorption mechanism is arranged in the connecting pipe (2), and an auxiliary mechanism is arranged on the connecting pipe (2);
the adsorption mechanism comprises a fixed pipe (3), a magnet disc (4), a moving rod (5), a supporting block (6), a limiting block (7), a reset spring (8) and an electromagnet (9), wherein the fixed pipe (3), the magnet disc (4) and the moving rod (5) are coaxially arranged with the connecting pipe (2), the fixed pipe (3) is hermetically and fixedly connected with the inner wall of the connecting pipe (2), the magnet disc (4) is arranged in the fixed pipe (3), the magnet disc (4) is slidably and hermetically connected with the inner wall of the fixed pipe (3), the top end of the moving rod (5) is fixed at the bottom of the magnet disc (4), the limiting block (7) is fixed at the bottom end of the moving rod (5), the supporting block (6) is fixed on the inner wall of the connecting pipe (2), a through hole is formed in the supporting block (6), and the moving rod (5) penetrates through the through hole and is slidably connected with the inner wall of the through hole, the limiting block (7) is abutted against the bottom of the supporting block (6), the reset spring (8) is located between the magnet disc (4) and the supporting block (6), the magnet disc (4) is connected with the supporting block (6) through the reset spring (8), the electromagnet (9) is arranged in the fixed pipe (3) and fixedly connected with the inner wall of the fixed pipe (3), the magnet disc (4) is located between the electromagnet (9) and the moving rod (5), and a gap is formed between the electromagnet (9) and the magnet disc (4);
the auxiliary assembly comprises a moving pipe (10), a sealing ring (11) and two transmission assemblies, wherein the moving pipe (10) and the sealing ring (11) are coaxially arranged with a connecting pipe (2), the connecting pipe (2) penetrates through the sealing ring (11), the connecting pipe (2) is in sliding and sealing connection with the sealing ring (11), the top end of the moving pipe (10) is in sealing and fixed connection with the bottom of the sealing ring (11), a suction nozzle (2) is located in the moving pipe (10), a gap is formed between the connecting pipe (2) and the inner wall of the moving pipe (10), and the transmission assemblies are uniformly distributed above the sealing ring (11) by taking the axis of the connecting pipe (2) as a central axis;
the transmission assembly comprises a first rotary drum (12), a second rotary drum (13), a first connecting line (14), a second connecting line (15), a rotating shaft (16), a torsion spring (17) and a round hole, the round hole is formed in the connecting pipe (2), the axis of the rotating shaft (16) is perpendicular to and intersected with the axis of the connecting pipe (2), the rotating shaft (16) penetrates through the round hole and is located above the fixed pipe (3), the rotating shaft (16) is connected with the inner wall of the round hole in a sliding and sealing mode, the first rotary drum (12) and the second rotary drum (13) are arranged coaxially with the rotating shaft (16), the first rotary drum (12) is arranged in the connecting pipe (2) and is fixed at one end of the rotating shaft (16), the second rotary drum (13) is fixed at the other end of the rotating shaft (16), and the torsion spring (17) is located between the second rotary drum (13) and the connecting pipe (2), the second rotary drum (13) is connected with the connecting pipe (2) through a torsion spring (17), one end of the first connecting wire (14) is fixed on the top of the magnet disc (4), the other end of the second connecting wire (15) is fixed on the first rotary drum (12), the first connecting wire (14) is wound on the first rotary drum (12), one end of the second connecting wire (15) is fixed on the top of the sealing ring (11), the other end of the second connecting wire (15) is fixed on the second rotary drum (13), the second connecting wire (15) is wound on the second rotary drum (13), and the winding direction of the first connecting wire (14) is opposite to that of the second connecting wire (15).
2. The suction device with high die attachment accuracy as set forth in claim 1, wherein the first connection line (14) is a wire rope.
3. The suction device with high mounting accuracy for chips as defined in claim 1, wherein the inner wall of said circular hole is coated with a sealing grease.
4. The suction device with high wafer mounting accuracy as set forth in claim 1, wherein the movable rod (5) is provided with chamfers at both ends.
5. The suction device with high wafer mounting accuracy as set forth in claim 1, wherein the moving rod (5) is coated with a lubricant.
6. The suction device with high wafer mounting accuracy as set forth in claim 1, wherein the fixing tube (3) is provided with an anti-corrosion zinc coating.
7. The suction device with high wafer mounting accuracy as claimed in claim 1, wherein two sound-absorbing plates (18) are arranged on the inner wall of the moving tube (10), and the sound-absorbing plates (18) correspond to the rotating shafts (16) one by one.
8. The suction device with high wafer mounting accuracy as set forth in claim 1, wherein the moving tube (10) is made of rubber.
9. The suction device with high wafer mounting accuracy as recited in claim 1, wherein two photovoltaic panels (19) are arranged on the top of the sealing ring (11), and the photovoltaic panels (19) correspond to the rotating shafts (16) one by one.
10. The suction device with high wafer mounting accuracy as claimed in claim 1, wherein a refrigeration rod (20) is disposed on an inner wall of the connection pipe (2), and the refrigeration rod (20) is located between the fixed pipe (3) and the suction nozzle (2).
CN202010842401.7A 2020-08-20 2020-08-20 Adsorption equipment that wafer subsides dress precision is high Withdrawn CN111916388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010842401.7A CN111916388A (en) 2020-08-20 2020-08-20 Adsorption equipment that wafer subsides dress precision is high

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010842401.7A CN111916388A (en) 2020-08-20 2020-08-20 Adsorption equipment that wafer subsides dress precision is high

Publications (1)

Publication Number Publication Date
CN111916388A true CN111916388A (en) 2020-11-10

Family

ID=73279229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010842401.7A Withdrawn CN111916388A (en) 2020-08-20 2020-08-20 Adsorption equipment that wafer subsides dress precision is high

Country Status (1)

Country Link
CN (1) CN111916388A (en)

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Application publication date: 20201110

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