CN112599465A - Wafer adsorption equipment with anticreep function - Google Patents
Wafer adsorption equipment with anticreep function Download PDFInfo
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- CN112599465A CN112599465A CN202011417686.6A CN202011417686A CN112599465A CN 112599465 A CN112599465 A CN 112599465A CN 202011417686 A CN202011417686 A CN 202011417686A CN 112599465 A CN112599465 A CN 112599465A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer adsorption device with an anti-drop function, which comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is arranged at the bottom end of the connecting pipe, an executing mechanism and an auxiliary mechanism are arranged on the connecting pipe, the executing mechanism comprises an executing component and two locking components, the executing component is arranged in the connecting pipe, the locking components are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe as the center, the executing component comprises a magnet disc, a first electromagnet, a connecting rod, a supporting ring, an auxiliary block and two first springs, the locking components comprise a guide hole, a movable rod, a second spring, a roller and at least two second electromagnets, the wafer adsorption device with the anti-drop function realizes the function of the suction nozzle for adsorbing a wafer through the executing mechanism, and can also prevent the wafer from falling off the suction nozzle due to overlarge wind resistance in the process of driving the wafer to move by the suction, the stability is improved.
Description
Technical Field
The invention relates to the field of integrated circuit production and processing, in particular to a wafer adsorption device with an anti-drop function.
Background
Integrated circuits, or microcircuits, microchips, and chips, are a way to miniaturize circuits in electronics, and are typically fabricated on the surface of a semiconductor wafer, and a chip suction apparatus, which is one of chip packaging apparatuses, sucks a chip on a wafer by a suction nozzle and moves the chip onto a substrate.
The existing wafer adsorption equipment is in the working process, the function that the suction nozzle adsorbs the wafer is realized by reducing the air pressure in the suction nozzle through an electric vacuum system, when the electric vacuum adsorption has a power failure, the air pressure in the suction nozzle can be recovered to the atmospheric pressure, the suction nozzle cannot adsorb the wafer and the wafer drops, the loss is caused, the practicability is reduced, and in addition, in order to improve the working efficiency, the translation speed of the suction nozzle adsorbing the wafer is higher, the wafer is easy to fall off from the suction nozzle under the action of wind resistance, and the stability is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the wafer adsorption device with the anti-drop function is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a wafer adsorption device with an anti-drop function comprises a connecting pipe and a suction nozzle, wherein the connecting pipe is vertically arranged, the suction nozzle is installed at the bottom end of the connecting pipe, and an execution mechanism and an auxiliary mechanism are arranged on the connecting pipe;
the actuating mechanism comprises an actuating assembly and two locking assemblies, the actuating assembly is arranged in the connecting pipe, and the locking assemblies are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe as the center;
the execution assembly comprises a magnet disc, a first electromagnet, a connecting rod, a supporting ring, an auxiliary block and two first springs, the auxiliary block is in a round table shape, the auxiliary block, the connecting rod, the supporting ring and the magnet disc are coaxially arranged with the connecting pipe, the diameter of the magnet disc is equal to the inner diameter of the connecting pipe and is larger than the maximum diameter of the auxiliary block, the maximum diameter of the auxiliary block is larger than the outer diameter of the connecting ring, the magnet disc is positioned above the suction nozzle, the magnet disc is in sliding and sealing connection with the inner wall of the connecting pipe, the first electromagnet is positioned below the magnet disc, the first electromagnet and the magnet disc are oppositely arranged and are fixedly connected with the inner wall of the connecting pipe, the first springs are circumferentially and uniformly distributed at the bottom of the magnet disc by taking the axis of the connecting pipe as the center, the magnet disc is connected with the inner wall of the connecting pipe through the first springs, and the bottom end, the maximum diameter of the auxiliary block is fixed at the top end of the connecting rod in a moving mode, the supporting ring is located between the auxiliary block and the magnet disc and fixedly connected with the inner wall of the connecting pipe, the connecting rod penetrates through the supporting ring and is in sliding connection with the supporting ring, the auxiliary block abuts against the supporting ring, and the distance between the supporting ring and the magnet disc is larger than the height of the auxiliary block;
the locking assembly comprises a guide hole, a moving rod, a second spring, a roller and at least two second electromagnets, the guide hole is arranged on a connecting view, the axis of the moving rod is perpendicular to and intersected with the axis of the connecting pipe, the moving rod penetrates through the guide hole and is in sliding connection with the inner wall of the guide hole, the roller is positioned in the connecting pipe and is fixed at one end, close to the axis of the connecting pipe, of the moving rod, the roller is abutted against the periphery of the auxiliary block, one end, close to the axis of the connecting pipe, of the moving rod is connected with the inner wall of the connecting pipe through the second spring, the second electromagnets are circumferentially and uniformly distributed in the connecting pipe by taking the axis of the moving rod as the center and are fixedly connected with the moving rod, a gap is arranged between the second electromagnets and the inner wall of the connecting pipe, the connecting pipe is made of iron, the distance between the top of the roller and the bottom of, the diameter of the roller is larger than that of the movable rod and smaller than the height of the support ring;
the auxiliary mechanism comprises a moving pipe, a sealing ring and at least two auxiliary components, wherein the moving pipe and the sealing ring are coaxially arranged with a connecting pipe, the connecting pipe penetrates through the sealing ring, the connecting pipe is in sliding and sealing connection with the sealing ring, the sealing ring and a suction nozzle are both positioned in the moving pipe, a gap is formed between the suction nozzle and the plane where the bottom of the moving pipe is located, the sealing ring is in sealing and fixed connection with the inner wall of the moving pipe, and the auxiliary components are circumferentially and uniformly distributed by taking the axis of the connecting pipe as a center;
the auxiliary assembly comprises an air outlet, an air inlet, a through hole, a first check valve, a second check valve, a filter screen, an air pipe, a support rod, a third spring and a support block, wherein the air outlet is arranged on the connecting pipe and located below the suction nozzle, the first check valve is arranged in the air outlet, the air inlet and the through hole are arranged on the sealing ring, the air pipe penetrates through the air inlet, the air pipe is sealed and fixedly connected with the inner wall of the air inlet, the second check valve and the filter screen are arranged in the air pipe, the support rod is parallel to the connecting pipe and penetrates through the through hole, the support rod slides and is connected with the inner wall of the through hole, the support block is fixed at the bottom end of the support rod, the support block abuts against and is fixedly connected with the connecting pipe, and the top of the sealing ring is.
Preferably, the support ring is made of rubber for realizing buffering and vibration reduction.
Preferably, in order to facilitate the movement of the moving rod through the guide hole, both ends of the moving rod are provided with chamfers.
Preferably, the connecting rods are coated with a lubricating oil in order to reduce the friction between the connecting rods and the support ring.
Preferably, in order to reduce a gap between the inner wall of the through-hole and the support rod, the inner wall of the through-hole is coated with a sealing grease.
Preferably, the moving pipe and the seal ring are integrally formed to improve the reliability of the connection between the moving pipe and the seal ring.
Preferably, in order to prolong the service life of the connecting pipe, an anti-corrosion zinc coating is arranged on the connecting pipe.
Preferably, in order to reduce noise, the outer wall of the moving pipe is provided with a sound absorption plate.
Preferably, in order to improve the heat dissipation effect of the connecting pipe, the outer wall of the connecting pipe is coated with heat-conducting silica gel.
Preferably, for energy conservation, the outer wall of the connecting pipe is provided with a photovoltaic panel.
The wafer adsorption device with the anti-drop function has the advantages that the function of the suction nozzle adsorbing the wafer is realized through the execution mechanism, compared with the existing execution mechanism, the execution mechanism can prevent the wafer from dropping off the suction nozzle due to power failure, the practicability is higher, in addition, the auxiliary mechanism can also prevent the wafer from dropping off the suction nozzle due to overlarge wind resistance in the process of driving the wafer to move by the suction nozzle, the stability is improved, compared with the existing auxiliary mechanism, the auxiliary mechanism can also separate impurities on the wafer from the wafer through the flowing of air, and the practicability is higher.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of a wafer adsorbing device with a retaining function according to the present invention;
FIG. 2 is a cross-sectional view of a wafer suction apparatus with a detachment prevention function according to the present invention;
FIG. 3 is a schematic structural diagram of a locking assembly of the wafer chuck device with anti-slip function according to the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 2;
in the figure: 1. the air suction device comprises a connecting pipe, 2 suction nozzles, 3 magnet discs, 4 first electromagnets, 5 connecting rods, 6 supporting rings, 7 auxiliary blocks, 8 first springs, 9 moving rods, 10 second springs, 11 rollers, 12 second electromagnets, 13 moving pipes, 14 sealing rings, 15 first check valves, 16 second check valves, 17 filter screens, 18 air pipes, 19 supporting rods, 20 third springs, 21 supporting blocks, 22 sound absorption plates and 23 photovoltaic panels.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1-3, a wafer adsorption device with an anti-drop function comprises a connecting pipe 1 and a suction nozzle 2, wherein the connecting pipe 1 is vertically arranged, the suction nozzle 2 is installed at the bottom end of the connecting pipe 1, and an execution mechanism and an auxiliary mechanism are arranged on the connecting pipe 1;
the actuating mechanism comprises an actuating assembly and two locking assemblies, the actuating assembly is arranged in the connecting pipe 1, and the locking assemblies are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe 1 as the center;
the execution assembly comprises a magnet disc 3, a first electromagnet 4, a connecting rod 5, a supporting ring 6, an auxiliary block 7 and two first springs 8, wherein the auxiliary block 7 is in a circular truncated cone shape, the auxiliary block 7, the connecting rod 5, the supporting ring 6 and the magnet disc 3 are coaxially arranged with the connecting pipe 1, the diameter of the magnet disc 3 is equal to the inner diameter of the connecting pipe 1 and is larger than the maximum diameter of the auxiliary block 7, the maximum diameter of the auxiliary block 7 is larger than the outer diameter of the connecting ring, the magnet disc 3 is positioned above the suction nozzle 2, the magnet disc 3 is in sliding and sealing connection with the inner wall of the connecting pipe 1, the first electromagnet 4 is positioned below the magnet disc 3, the first electromagnet 4 and the magnet disc 3 are just opposite to be arranged and are fixedly connected with the inner wall of the connecting pipe 1, the first springs 8 are circumferentially and uniformly distributed at the bottom of the magnet disc 3 by taking the axis of the connecting pipe, the magnet disc 3 is connected with the inner wall of the connecting pipe 1 through a first spring 8, the bottom end of the connecting rod 5 is fixed at the top of the magnet disc 3, the maximum diameter of the auxiliary block 7 is fixed at the top end of the connecting rod 5, the support ring 6 is positioned between the auxiliary block 7 and the magnet disc 3 and is fixedly connected with the inner wall of the connecting pipe 1, the connecting rod 5 penetrates through the support ring 6 and is in sliding connection with the support ring 6, the auxiliary block 7 is abutted against the support ring 6, and the distance between the support ring 6 and the magnet disc 3 is greater than the height of the auxiliary block 7;
the locking assembly comprises a guide hole, a moving rod 9, a second spring 10, a roller 11 and at least two second electromagnets 12, the guide hole is arranged on a connecting view, the axis of the moving rod 9 is perpendicular to and intersected with the axis of the connecting pipe 1, the moving rod 9 penetrates through the guide hole and is in sliding connection with the inner wall of the guide hole, the roller 11 is positioned in the connecting pipe 1 and is fixed at one end, close to the axis of the connecting pipe 1, of the moving rod 9, the roller 11 is abutted against the periphery of the auxiliary block 7, one end, close to the axis of the connecting pipe 1, of the moving rod 9 is connected with the inner wall of the connecting pipe 1 through the second spring 10, the second electromagnets 12 are circumferentially and uniformly distributed in the connecting pipe 1 by taking the axis of the moving rod 9 as a center and are fixedly connected with the moving rod 9, a gap is arranged between the second electromagnets 12 and the inner wall of the connecting pipe 1, the distance between the top of the roller 11 and the bottom of the auxiliary block 7 is equal to the distance between the support ring 6 and the magnet disc 3, and the diameter of the roller 11 is larger than the diameter of the moving rod 9 and smaller than the height of the support ring 6;
during the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, the connecting pipe 1 drives the suction nozzle 2 to move to a wafer through the moving device, then the first electromagnet 4 is electrified, so that mutually repulsive acting force is generated between the first electromagnet 4 and the magnet disc 3, namely, the magnet disc 3 can move upwards, the upward movement of the magnet disc 3 drives the auxiliary block 7 to realize synchronous movement through the connecting rod 5, and during the movement of the auxiliary block 7, the roller 11 can be pushed to move towards the direction away from the axis of the connecting pipe 1, the movement of the roller 11 drives the moving rod 9 to realize synchronous movement, and the second spring 10 is compressed, when the auxiliary block 7 moves to the upper part of the roller 11, the roller 11 is reset under the elastic action of the second spring 10 and is abutted against the bottom of the auxiliary block 7, through the movement of the magnet disc 3, the air pressure in the suction nozzle 2 can be reduced, that is, the suction nozzle 2 can be made to adsorb the wafer, here, the contact between the roller 11 and the bottom of the auxiliary block 7 can prevent the magnet disc 3 from moving downward and increasing the air pressure in the suction nozzle 2, and prevent the wafer from falling off due to the change of the air pressure in the suction nozzle 2, when the wafer moves to the substrate, the second electromagnet 12 is powered on, so that the mutual attraction acting force is generated between the second electromagnet 12 and the inner wall of the iron connecting pipe 1, that is, the second electromagnet 12 can move in the direction away from the axis of the connecting pipe 1, so that the roller 11 is separated from the auxiliary block 7, and the magnet disc 3 is reset through the elastic action of the spring, so that the suction nozzle 2 can stop adsorbing the wafer, the wafer is attached to the substrate plate, and then the second electromagnet 12 is powered off, so that the roller 11 is reset through the elastic action of the second spring 10 and is contacted with the.
As shown in fig. 4, the auxiliary mechanism includes a moving pipe 13, a sealing ring 14 and at least two auxiliary components, the moving pipe 13 and the sealing ring 14 are both arranged coaxially with the connecting pipe 1, the connecting pipe 1 penetrates through the sealing ring 14, the connecting pipe 1 and the sealing ring 14 are connected in a sliding and sealing manner, the sealing ring 14 and the suction nozzle 2 are both located in the moving pipe 13, a gap is formed between the suction nozzle 2 and a plane where the bottom of the moving pipe 13 is located, the sealing ring 14 is fixedly connected with the inner wall of the moving pipe 13 in a sealing manner, and the auxiliary components are uniformly distributed circumferentially with the axis of the connecting pipe 1 as the center;
the auxiliary component comprises an air outlet hole, an air inlet hole, a through hole, a first one-way valve 15, a second one-way valve 16, a filter screen 17, an air pipe 18, a support rod 19, a third spring 20 and a support block 21, the air outlet is arranged on the connecting pipe 1 and is positioned below the suction nozzle 2, the first one-way valve 15 is arranged in the air outlet, the air inlet hole and the through hole are both arranged on the sealing ring 14, the air pipe 18 passes through the air inlet hole, the air pipe 18 is sealed and fixedly connected with the inner wall of the air inlet hole, the second one-way valve 16 and the filter screen 17 are both arranged in the air pipe 18, the support rod 19 is parallel to the connecting pipe 1 and passes through the through hole, the support rod 19 is connected with the inner wall of the through hole in a sliding and sealing way, the supporting block 21 is fixed at the bottom end of the supporting rod 19, the supporting block 21 is abutted against the sealing ring 14 and is fixedly connected with the connecting pipe 1, the top of the sealing ring 14 is connected to the top end of a support rod 19 by a third spring 20.
When the suction nozzle 2 moves downwards and abuts against the chip, the moving pipe 13 is made to abut against the wafer preferentially and the bottom end of the moving pipe 13 is in a sealed state, along with the decrease of the distance between the suction nozzle 2 and the chip, the distance between the supporting block 21 and the sealing ring 14 is increased, the third spring 20 is compressed, the air pressure in the connecting pipe 1 is increased through the increase of the volume of the connecting pipe 1 in the moving pipe 13, and through the one-way characteristic of the second one-way valve 16, the air in the moving pipe 13 cannot be discharged from the air pipe 18, and only the air in the moving pipe 13 can be discharged from the air outlet hole, under the action of the air flow, the impurities on the chip can be discharged out of the moving pipe 13 along with the air flow, the function of removing the impurities on the chip is realized, the influence of the impurities on the chip on the sealing between the suction nozzle 2 and the chip is prevented, and when the suction nozzle 2 sucks the chip to move upwards, the distance between the supporting block 21 and the sealing ring 14 can be reduced under the elastic action, and make the atmospheric pressure in the removal pipe 13 reduce, through the one-way characteristic of first check valve 15, make the air carry to in the connecting pipe 1 from trachea 18, and realize the entrapment of impurity in the air through filter screen 17, and suction nozzle 2 adsorbs the wafer removal in-process, makes the wafer be located the removal pipe 13, can reduce the air resistance that the wafer received at the removal in-process to can prevent that wafer and suction nozzle 2 from droing, improve stability.
Preferably, the support ring 6 is made of rubber for achieving buffering and vibration reduction.
The rubber texture is softer, can reduce the impact force that produces when auxiliary block 7 and support ring 6 support and lean on, has realized buffering and damping.
Preferably, in order to facilitate the movement of the moving rod 9 through the guide hole, both ends of the moving rod 9 are chamfered.
The chamfer angle is used for reducing the caliber of the movable rod 9 when the movable rod passes through the guide hole, and the effect of convenient installation is achieved.
Preferably, in order to reduce the friction between the connecting rod 5 and the support ring 6, said connecting rod 5 is coated with a lubricating oil.
The lubricating oil has the function of reducing the friction force between the connecting rod 5 and the support ring 6, and the moving fluency of the connecting rod 5 is improved.
Preferably, in order to reduce the gap between the inner wall of the through-hole and the support rod 19, the inner wall of the through-hole is coated with a sealing grease.
The sealing grease has the function of reducing the gap between the inner wall of the through hole and the support rod 19, and the sealing performance is improved.
Preferably, the moving pipe 13 and the sealing ring 14 are integrally formed in order to improve the reliability of the connection between the moving pipe 13 and the sealing ring 14.
The integrally formed structure has a high strength, so that the reliability of the connection of the moving pipe 13 and the sealing ring 14 can be improved.
Preferably, in order to prolong the service life of the connecting pipe 1, the connecting pipe 1 is provided with an anti-corrosion zinc coating.
The function of anticorrosive galvanizing coat is to promote the rust-resistant ability of connecting pipe 1, prolongs the life of connecting pipe 1.
Preferably, to reduce noise, the outer wall of the moving pipe 13 is provided with a sound absorbing plate 22.
The sound-absorbing panel 22 can absorb noise, achieving noise reduction.
Preferably, in order to improve the heat dissipation effect of the connection pipe 1, the outer wall of the connection pipe 1 is coated with heat conductive silica gel.
When the movable rod 9 moves in the guide hole, the temperature of the connecting pipe 1 can be increased through the principle of heat generation by friction, and the heat dissipation capacity of the connecting pipe 1 can be improved through the heat-conducting silica gel, so that the heat dissipation effect of the connecting pipe 1 is improved.
Preferably, for energy saving, the outer wall of the connecting pipe 1 is provided with a photovoltaic panel 23.
The photovoltaic panel 23 can absorb light rays to perform photovoltaic power generation, and energy conservation is realized.
During the use of the device, the top end of the connecting pipe 1 is connected with an external moving device, and the connecting pipe 1 drives the suction nozzle 2 to move to the wafer through the moving device, wherein the moving pipe 13 is preferentially abutted against the wafer and the bottom end of the moving pipe 13 is in a sealing state, the distance between the supporting block 21 and the sealing ring 14 is increased along with the reduction of the distance between the suction nozzle 2 and the wafer, the third spring 20 is compressed, the air pressure in the connecting pipe 1 is increased through the increase of the volume of the connecting pipe 1 in the moving pipe 13, and the air in the moving pipe 13 cannot be discharged from the air pipe 18 through the one-way characteristic of the second one-way valve 16, and only the air in the moving pipe 13 can be discharged from the air outlet, under the action of the air flow, the impurities on the wafer can be discharged from the moving pipe 13 along with the air flow, the function of removing the impurities on the wafer is realized, and the influence of the impurities on the sealing performance between the suction nozzle 2 and the wafer is, then, the first electromagnet 4 is energized to generate a mutually repulsive force between the first electromagnet 4 and the magnet disc 3, so that the magnet disc 3 can move upwards, the upward movement of the magnet disc 3 drives the auxiliary block 7 to move synchronously through the connecting rod 5, and during the movement of the auxiliary block 7, the roller 11 can be pushed to move away from the axis of the connecting pipe 1, the movement of the roller 11 drives the moving rod 9 to move synchronously and the second spring 10 is compressed, and when the auxiliary block 7 moves to the upper side of the roller 11, the roller 11 is reset under the elastic action of the second spring 10 and abuts against the bottom of the auxiliary block 7, the air pressure in the suction nozzle 2 can be reduced through the movement of the magnet disc 3, so that the suction nozzle 2 can absorb a wafer, here, the air pressure in the suction nozzle 2 can be prevented from increasing due to the downward movement of the disc 3 through the abutment of the roller 11 and the bottom of the auxiliary block 7, when the suction nozzle 2 adsorbs a chip to move upwards, the distance between the supporting block 21 and the sealing ring 14 can be reduced under the elastic action of the third spring 20, the air pressure in the moving pipe 13 can be reduced, the air is conveyed into the connecting pipe 1 from the air pipe 18 through the one-way characteristic of the first one-way valve 15, the impurity in the air is intercepted through the filter screen 17, and the wafer is positioned in the moving pipe 13 in the moving process of the suction nozzle 2 adsorbing the wafer, so that the air resistance of the wafer in the moving process can be reduced, the wafer and the suction nozzle 2 can be prevented from falling off, the stability is improved, when the wafer moves to a substrate, the second electromagnet 12 is electrified, so that the mutual attraction acting force is generated between the second electromagnet 12 and the inner wall of the iron connecting pipe 1, so that the second electromagnet 12 can move towards the direction far away from the axis of the connecting pipe 1, make gyro wheel 11 and supplementary piece 7 separation, and make magnet dish 3 reset through the elastic action of spring, can realize that suction nozzle 2 stops to adsorb the wafer, make the wafer dress at the base plate board, later, second electro-magnet 12 outage makes gyro wheel 11 reset and supports with supplementary piece 7 through the elastic action of second spring 10 and lean on.
Compared with the prior art, this wafer adsorption equipment with anticreep function has realized the function that suction nozzle 2 adsorbs the wafer through actuating mechanism, compare with current actuating mechanism, this actuating mechanism can prevent to cut off the power supply and make the wafer drop from suction nozzle 2, the practicality is stronger, moreover, still can prevent through complementary unit that suction nozzle 2 from driving the wafer and remove the in-process and make the wafer drop from suction nozzle 2 because of the windage is too big, stability is improved, compare with current complementary unit, this complementary unit can also make impurity on the wafer separate with the wafer through the flow of air, the practicality is stronger.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A wafer adsorption device with an anti-drop function comprises a connecting pipe (1) and a suction nozzle (2), wherein the connecting pipe (1) is vertically arranged, and the suction nozzle (2) is installed at the bottom end of the connecting pipe (1), and is characterized in that an execution mechanism and an auxiliary mechanism are arranged on the connecting pipe (1);
the actuating mechanism comprises an actuating assembly and two locking assemblies, the actuating assembly is arranged in the connecting pipe (1), and the locking assemblies are uniformly distributed in the circumferential direction by taking the axis of the connecting pipe (1) as the center;
the execution assembly comprises a magnet disc (3), a first electromagnet (4), a connecting rod (5), a supporting ring (6), an auxiliary block (7) and two first springs (8), wherein the auxiliary block (7) is in a round table shape, the auxiliary block (7), the connecting rod (5), the supporting ring (6) and the magnet disc (3) are coaxially arranged with the connecting pipe (1), the diameter of the magnet disc (3) is equal to the inner diameter of the connecting pipe (1) and larger than the maximum diameter of the auxiliary block (7), the maximum diameter of the auxiliary block (7) is larger than the outer diameter of the connecting ring, the magnet disc (3) is positioned above the suction nozzle (2), the magnet disc (3) is in sliding and sealing connection with the inner wall of the connecting pipe (1), the first electromagnet (4) is positioned below the magnet disc (3), the first electromagnet (4) is directly opposite to the arrangement with the magnet disc (3) and is fixedly connected with the inner wall of the connecting pipe (1), the first springs (8) are circumferentially and uniformly distributed at the bottom of the magnet disc (3) by taking the axis of the connecting pipe (1) as a center, the magnet disc (3) is connected with the inner wall of the connecting pipe (1) through the first springs (8), the bottom end of the connecting rod (5) is fixed at the top of the magnet disc (3), the maximum diameter of the auxiliary block (7) is fixed at the top end of the connecting rod (5), the support ring (6) is positioned between the auxiliary block (7) and the magnet disc (3) and fixedly connected with the inner wall of the connecting pipe (1), the connecting rod (5) penetrates through the support ring (6) and is in sliding connection with the support ring (6), the auxiliary block (7) is abutted against the support ring (6), and the distance between the support ring (6) and the magnet disc (3) is greater than the height of the auxiliary block (7);
the locking assembly comprises a guide hole, a moving rod (9), a second spring (10), a roller (11) and at least two second electromagnets (12), the guide hole is arranged on a connecting view, the axis of the moving rod (9) is perpendicular to and intersected with the axis of the connecting pipe (1), the moving rod (9) penetrates through the guide hole and is in sliding connection with the inner wall of the guide hole, the roller (11) is positioned in the connecting pipe (1) and fixed at one end, close to the axis of the connecting pipe (1), of the moving rod (9), the roller (11) is abutted against the periphery of the auxiliary block (7), one end, close to the axis of the connecting pipe (1), of the moving rod (9) is connected with the inner wall of the connecting pipe (1) through the second spring (10), the second electromagnets (12) are circumferentially and uniformly distributed in the connecting pipe (1) by taking the axis of the moving rod (9) as a center and are fixedly connected with the moving rod (9), a gap is formed between the second electromagnet (12) and the inner wall of the connecting pipe (1), the connecting pipe (1) is made of iron, the distance between the top of the roller (11) and the bottom of the auxiliary block (7) is equal to the distance between the support ring (6) and the magnet disc (3), and the diameter of the roller (11) is larger than the diameter of the moving rod (9) and smaller than the height of the support ring (6);
the auxiliary mechanism comprises a movable pipe (13), a sealing ring (14) and at least two auxiliary components, wherein the movable pipe (13) and the sealing ring (14) are coaxially arranged with a connecting pipe (1), the connecting pipe (1) penetrates through the sealing ring (14), the connecting pipe (1) is in sliding and sealing connection with the sealing ring (14), the sealing ring (14) and a suction nozzle (2) are both positioned in the movable pipe (13), a gap is formed between the suction nozzle (2) and the plane where the bottom of the movable pipe (13) is located, the sealing ring (14) is in sealing and fixed connection with the inner wall of the movable pipe (13), and the auxiliary components are circumferentially and uniformly distributed by taking the axis of the connecting pipe (1) as a center;
the auxiliary assembly comprises an air outlet, an air inlet, a through hole, a first check valve (15), a second check valve (16), a filter screen (17), an air pipe (18), a support rod (19), a third spring (20) and a support block (21), the air outlet is arranged on the connecting pipe (1) and is positioned below the suction nozzle (2), the first check valve (15) is arranged in the air outlet, the air inlet and the through hole are arranged on the sealing ring (14), the air pipe (18) penetrates through the air inlet, the air pipe (18) is hermetically and fixedly connected with the inner wall of the air inlet, the second check valve (16) and the filter screen (17) are both arranged in the air pipe (18), the support rod (19) is parallel to the connecting pipe (1) and penetrates through the through hole, the support rod (19) is slidably and hermetically connected with the inner wall of the through hole, and the support block (21) is fixed at the bottom end of the support rod (, the supporting block (21) is abutted against the sealing ring (14) and fixedly connected with the connecting pipe (1), and the top of the sealing ring (14) is connected with the top end of the supporting rod (19) through a third spring (20).
2. The wafer adsorption device with the anti-drop function of claim 1, wherein the material of the support ring (6) is rubber.
3. The wafer adsorption device with the anti-drop function as claimed in claim 1, wherein both ends of the moving rod (9) are provided with chamfers.
4. The wafer adsorption device with the anti-drop function according to claim 1, wherein the connection rod (5) is coated with a lubricating oil.
5. The wafer adsorption device with anti-drop function of claim 1, wherein the inner wall of said through hole is coated with sealing grease.
6. The wafer suction device with the anti-drop function as claimed in claim 1, wherein the moving pipe (13) and the sealing ring (14) are of an integral structure.
7. The wafer adsorption device with the anti-drop function according to claim 1, wherein an anti-corrosion zinc coating is provided on the connection pipe (1).
8. The wafer suction apparatus with the coming-off preventing function as claimed in claim 1, wherein an acoustic panel (22) is provided on an outer wall of the moving pipe (13).
9. The wafer adsorption device with the anti-drop function of claim 1, wherein the outer wall of the connecting pipe (1) is coated with heat conductive silica gel.
10. The wafer adsorption device with the anti-drop function of claim 1, wherein the outer wall of the connecting pipe (1) is provided with a photovoltaic plate (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011417686.6A CN112599465A (en) | 2020-12-07 | 2020-12-07 | Wafer adsorption equipment with anticreep function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011417686.6A CN112599465A (en) | 2020-12-07 | 2020-12-07 | Wafer adsorption equipment with anticreep function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112599465A true CN112599465A (en) | 2021-04-02 |
Family
ID=75188616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011417686.6A Withdrawn CN112599465A (en) | 2020-12-07 | 2020-12-07 | Wafer adsorption equipment with anticreep function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112599465A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113428652A (en) * | 2021-05-25 | 2021-09-24 | 广州纵横同舟科技有限公司 | Protective glass plate processing and manufacturing equipment |
-
2020
- 2020-12-07 CN CN202011417686.6A patent/CN112599465A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113428652A (en) * | 2021-05-25 | 2021-09-24 | 广州纵横同舟科技有限公司 | Protective glass plate processing and manufacturing equipment |
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Application publication date: 20210402 |
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