CN112898535A - 一种环氧树脂用低温固化剂及其制备方法 - Google Patents
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 25
- 238000013035 low temperature curing Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title abstract description 7
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 33
- 238000001723 curing Methods 0.000 claims description 26
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 18
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 16
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- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 6
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 6
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 6
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 6
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
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- 239000000919 ceramic Substances 0.000 abstract description 3
- 239000004575 stone Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
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- -1 polyetheramine 220 Chemical compound 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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Abstract
本发明提供了一种环氧树脂用低温固化剂及其制备方法,属于低温固化剂领域,该低温固化剂包括基础胺固化剂、硫脲和促进剂。本发明可在低温环境下快速固化环氧树脂,能较快的固化并具有强度,便于施工提高效率,适用于混凝土、石板、陶瓷等粘接加固和建筑物防水修补加固工程等领域。
Description
技术领域
本发明属于低温固化剂技术领域,尤其涉及一种环氧树脂用低温固化剂及其制备方法。
背景技术
环氧树脂是一种高分子聚合物,分子式为(C11H12O3)n,是指分子中含有两个以上环氧基团的一类聚合物的总称。它是环氧氯丙烷与双酚A或多元醇的缩聚产物。由于环氧基的化学活性,可用多种含有活泼氢的化合物使其开环,固化交联生成网状结构,因此它是一种热固性树脂。在混凝土、石板、陶瓷等粘接加固和建筑物防水修补加固工程等领域施工时,常常处于低温环境,环氧树脂固化效果差,甚至不固化。
为此,提供一种环氧树脂用低温固化剂及其制备方法,以解决目前市场上的环氧树脂固化剂在低温环境中不易固化的问题。
发明内容
本发明实施例提供一种环氧树脂用低温固化剂及其制备方法,旨在解决背景技术中提出的问题。
本发明实施例是这样实现的,一种环氧树脂用低温固化剂,该低温固化剂包括如下以质量份数计的组分:
基础胺固化剂 68-80份;
硫脲 15-24份;
促进剂 5-9份。
优选的,所述基础胺固化剂包括乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中的任意一种或乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中至少两种组分的组合物。
优选的,所述硫脲为工业级硫脲。
优选的,所述促进剂包括DMP-30、壬基酚和苯甲醇中的任意一种或DMP-30、壬基酚和苯甲醇中至少两种组分的组合物。
一种环氧树脂用低温固化剂的制备方法,该方法用于制备上述的低温固化剂,包括如下步骤:
S1、将基础胺固化剂置于带搅拌器的三口烧瓶,升温至72-80℃进行搅拌;
S2、保持在72-80℃温度下,分3-4次向三口烧瓶内添加硫脲,时间控制在2.5-3h;
S3、硫脲加毕后,保持温度为85-88℃继续反应2h;
S4、反应完成后,调节温度至60-65℃,向三口烧瓶内加入促进剂,搅拌混合30min;
S5、降温后出料得到成品固化剂。
优选的,所述搅拌器的转速为85-95r/min。
优选的,所述出料的固化剂的温度为35-40℃。
本发明可在低温环境下快速固化环氧树脂,能较快的固化并具有强度,便于施工提高效率,适用于混凝土、石板、陶瓷等粘接加固和建筑物防水修补加固工程等领域。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
实施例1
将69克基础胺固化剂加入到带搅拌的三口烧瓶中,调节温度在72-80℃,开启搅拌,控制转速约85-95转/分;调节温度在72-80℃,分4次加入23克硫脲,时间在2.5-3小时,后调节温度在85-88℃,继续反应2小时;调节温度在60-65℃,一次性加入8克促进剂,搅拌混合30分钟,降温到35-40℃,出料即制得固化剂。
将该固化剂与环氧树脂配合在5℃环境下使用,90分钟固化,160分钟具有一定的粘结强度。
实施例2
将79克基础胺固化剂加入到带搅拌的三口烧瓶中,调节温度在72-80℃,开启搅拌,控制转速约85-95转/分;调节温度在72-80℃,分4次加入15克硫脲,时间在2.5-3小时,后调节温度在85-88℃,继续反应2小时;调节温度在60-65℃,一次性加入6克促进剂,搅拌混合30分钟,降温到35-40℃,出料即制得固化剂。
将该固化剂与环氧树脂配合在10℃环境下使用,76分钟固化,185分钟具有一定的粘结强度。
实施例3
将73克基础胺固化剂加入到带搅拌的三口烧瓶中,调节温度在72-80℃,开启搅拌,控制转速约85-95转/分;调节温度在72-80℃,分4次加入20克硫脲,时间在2.5-3小时,后调节温度在85-88℃,继续反应2小时;调节温度在60-65℃,一次性加入7克促进剂,搅拌混合30分钟,降温到35-40℃,出料即制得固化剂。
将该固化剂与环氧树脂配合在1℃环境下使用,115分钟固化,180分钟具有一定的粘接强度。
需要说明的是,在实施例1、实施例2和实施例3中,基础胺固化剂包括乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中的任意一种或乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中至少两种组分的组合物;硫脲为工业级硫脲;促进剂包括DMP-30、壬基酚和苯甲醇中的任意一种或DMP-30、壬基酚和苯甲醇中至少两种组分的组合物。
实施例1 | 实施例2 | 实施例3 | |
基础胺固化剂(g) | 69 | 79 | 73 |
硫脲(g) | 23 | 15 | 20 |
促进剂(g) | 8 | 6 | 7 |
使用环境温度(℃) | 5 | 10 | 1 |
固化时间(min) | 90 | 76 | 115 |
具有粘度时间(min) | 160 | 185 | 180 |
由上表可知,本发明与环氧树脂配合后,在低温环境下作业,能较快的固化并具有强度,便于施工提高效率。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (7)
1.一种环氧树脂用低温固化剂,其特征在于,所述低温固化剂包括如下以质量份数计的组分:
基础胺固化剂68-80份;
硫脲15-24份;
促进剂5-9份。
2.如权利要求1所述的环氧树脂用低温固化剂,其特征在于,所述基础胺固化剂包括乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中的任意一种或乙二胺、二乙烯三胺、三乙烯四胺、聚醚胺220和异佛尔酮二胺中至少两种组分的组合物。
3.如权利要求1所述的环氧树脂用低温固化剂,其特征在于,所述硫脲为工业级硫脲。
4.如权利要求1所述的环氧树脂用低温固化剂,其特征在于,所述促进剂包括DMP-30、壬基酚和苯甲醇中的任意一种或DMP-30、壬基酚和苯甲醇中至少两种组分的组合物。
5.一种环氧树脂用低温固化剂的制备方法,其特征在于,所述方法用于制备权利要求1-5任意一项所述的低温固化剂,包括如下步骤:
S1、将基础胺固化剂置于带搅拌器的三口烧瓶,升温至72-80℃进行搅拌;
S2、保持在72-80℃温度下,分3-4次向三口烧瓶内添加硫脲,时间控制在2.5-3h;
S3、硫脲加毕后,保持温度为85-88℃继续反应2h;
S4、反应完成后,调节温度至60-65℃,向三口烧瓶内加入促进剂,搅拌混合30min;
S5、降温后出料得到成品固化剂。
6.如权利要求5所述的环氧树脂用低温固化剂的制备方法,其特征在于,所述搅拌器的转速为85-95r/min。
7.如权利要求5所述的环氧树脂用低温固化剂的制备方法,其特征在于,所述出料的固化剂的温度为35-40℃。
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CN115028805A (zh) * | 2022-05-10 | 2022-09-09 | 西安工业大学 | 一种快速固化的环氧室温固化剂及制备方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114163614A (zh) * | 2021-11-22 | 2022-03-11 | 瑞奇新材料(广州)有限公司 | 环氧固化剂及其制备方法和应用 |
CN114163614B (zh) * | 2021-11-22 | 2024-05-14 | 瑞奇(广东)技术有限公司 | 环氧固化剂及其制备方法和应用 |
CN115028805A (zh) * | 2022-05-10 | 2022-09-09 | 西安工业大学 | 一种快速固化的环氧室温固化剂及制备方法 |
CN115028805B (zh) * | 2022-05-10 | 2023-12-22 | 西安工业大学 | 一种快速固化的环氧室温固化剂及制备方法 |
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