CN112885769A - 一种二极管加工用夹持设备及其工作方法 - Google Patents
一种二极管加工用夹持设备及其工作方法 Download PDFInfo
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- CN112885769A CN112885769A CN202110149642.8A CN202110149642A CN112885769A CN 112885769 A CN112885769 A CN 112885769A CN 202110149642 A CN202110149642 A CN 202110149642A CN 112885769 A CN112885769 A CN 112885769A
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- clamping
- plate
- diode
- positioning
- push
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Jigs For Machine Tools (AREA)
Abstract
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Priority Applications (1)
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CN202110149642.8A CN112885769B (zh) | 2021-02-02 | 2021-02-02 | 一种二极管加工用夹持设备及其工作方法 |
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CN202110149642.8A CN112885769B (zh) | 2021-02-02 | 2021-02-02 | 一种二极管加工用夹持设备及其工作方法 |
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CN112885769A true CN112885769A (zh) | 2021-06-01 |
CN112885769B CN112885769B (zh) | 2022-12-06 |
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CN202110149642.8A Active CN112885769B (zh) | 2021-02-02 | 2021-02-02 | 一种二极管加工用夹持设备及其工作方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113560909A (zh) * | 2021-08-05 | 2021-10-29 | 桑尼泰克精密工业股份有限公司 | 一种汽车金属管件加工用夹持装置及其使用方法 |
CN115528092A (zh) * | 2021-08-25 | 2022-12-27 | 黄山市瑞宏电器有限公司 | 一种耐高温的整流芯片及其加工工艺 |
CN116810270A (zh) * | 2023-08-02 | 2023-09-29 | 湖南迈克森伟电子科技有限公司 | 一种电子引信装配同轴度及高度控制工装及方法 |
Citations (8)
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CH602302A5 (zh) * | 1975-08-20 | 1978-07-31 | Siemens Ag | |
CN205969539U (zh) * | 2016-08-27 | 2017-02-22 | 福建晶安光电有限公司 | 一种蓝宝石led图形衬底的切割打磨设备 |
CN107010402A (zh) * | 2017-04-27 | 2017-08-04 | 歌尔股份有限公司 | 夹持翻转组装工装及夹持翻转组装方法 |
WO2019033742A1 (zh) * | 2017-08-14 | 2019-02-21 | 昆山科森科技股份有限公司 | 加工夹具 |
CN111015553A (zh) * | 2019-12-27 | 2020-04-17 | 阜南县顺昌塑业有限公司 | 一种用于吸管加工的夹紧装置 |
CN211387355U (zh) * | 2019-11-29 | 2020-09-01 | 江苏胜帆电子科技有限公司 | 一种5g通信天线生产用镭雕装置 |
CN211939936U (zh) * | 2020-03-10 | 2020-11-17 | 徐州金丰金属加工厂 | 一种数控车床用材料固定装置 |
CN112063846A (zh) * | 2020-09-15 | 2020-12-11 | 太和县大华能源科技有限公司 | 一种废旧铅酸蓄电池回收用铅膏熔炼加工工艺 |
-
2021
- 2021-02-02 CN CN202110149642.8A patent/CN112885769B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH602302A5 (zh) * | 1975-08-20 | 1978-07-31 | Siemens Ag | |
CN205969539U (zh) * | 2016-08-27 | 2017-02-22 | 福建晶安光电有限公司 | 一种蓝宝石led图形衬底的切割打磨设备 |
CN107010402A (zh) * | 2017-04-27 | 2017-08-04 | 歌尔股份有限公司 | 夹持翻转组装工装及夹持翻转组装方法 |
WO2019033742A1 (zh) * | 2017-08-14 | 2019-02-21 | 昆山科森科技股份有限公司 | 加工夹具 |
CN211387355U (zh) * | 2019-11-29 | 2020-09-01 | 江苏胜帆电子科技有限公司 | 一种5g通信天线生产用镭雕装置 |
CN111015553A (zh) * | 2019-12-27 | 2020-04-17 | 阜南县顺昌塑业有限公司 | 一种用于吸管加工的夹紧装置 |
CN211939936U (zh) * | 2020-03-10 | 2020-11-17 | 徐州金丰金属加工厂 | 一种数控车床用材料固定装置 |
CN112063846A (zh) * | 2020-09-15 | 2020-12-11 | 太和县大华能源科技有限公司 | 一种废旧铅酸蓄电池回收用铅膏熔炼加工工艺 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113560909A (zh) * | 2021-08-05 | 2021-10-29 | 桑尼泰克精密工业股份有限公司 | 一种汽车金属管件加工用夹持装置及其使用方法 |
CN115528092A (zh) * | 2021-08-25 | 2022-12-27 | 黄山市瑞宏电器有限公司 | 一种耐高温的整流芯片及其加工工艺 |
CN115528092B (zh) * | 2021-08-25 | 2023-06-09 | 黄山市瑞宏电器股份有限公司 | 一种耐高温的整流芯片及其加工工艺 |
CN116810270A (zh) * | 2023-08-02 | 2023-09-29 | 湖南迈克森伟电子科技有限公司 | 一种电子引信装配同轴度及高度控制工装及方法 |
CN116810270B (zh) * | 2023-08-02 | 2024-02-27 | 湖南迈克森伟电子科技有限公司 | 一种电子引信装配同轴度及高度控制工装及方法 |
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CN112885769B (zh) | 2022-12-06 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A clamping device for diode processing and its working method Effective date of registration: 20230516 Granted publication date: 20221206 Pledgee: Sixian small and medium-sized enterprises financing Company Limited by Guarantee Pledgor: ANHUI MINGYANG ELECTRONICS Co.,Ltd. Registration number: Y2023980040799 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20221206 Pledgee: Sixian small and medium-sized enterprises financing Company Limited by Guarantee Pledgor: ANHUI MINGYANG ELECTRONICS Co.,Ltd. Registration number: Y2023980040799 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A clamping device for diode processing and its working method Granted publication date: 20221206 Pledgee: Sixian small and medium-sized enterprises financing Company Limited by Guarantee Pledgor: ANHUI MINGYANG ELECTRONICS Co.,Ltd. Registration number: Y2024980048419 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |