CN112880448A - Temperature equalizing plate and manufacturing method thereof - Google Patents
Temperature equalizing plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN112880448A CN112880448A CN201911200098.4A CN201911200098A CN112880448A CN 112880448 A CN112880448 A CN 112880448A CN 201911200098 A CN201911200098 A CN 201911200098A CN 112880448 A CN112880448 A CN 112880448A
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- China
- Prior art keywords
- liquid
- degassing
- injecting
- plate
- housing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000007872 degassing Methods 0.000 claims abstract description 56
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 238000002347 injection Methods 0.000 claims abstract description 40
- 239000007924 injection Substances 0.000 claims abstract description 40
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a temperature-uniforming plate and a manufacturing method thereof, wherein the temperature-uniforming plate comprises: the device comprises a shell, a capillary structure, at least two liquid injection and air removal pipes and working fluid, wherein the shell comprises a lower shell plate and an upper shell plate sealed and sealed correspondingly to the lower shell plate, and a single cavity is formed between the upper shell plate and the lower shell plate; the capillary structure is arranged in the single cavity; each liquid injection degassing pipe is respectively connected with the shell in a penetrating way and communicated with the single chamber; the working fluid is disposed in the single chamber. Therefore, the working fluid can be uniformly and widely distributed in the single chamber.
Description
Technical Field
The present invention relates to a heat dissipation technology, and more particularly, to a temperature equalization plate and a method for manufacturing the same.
Background
As the command cycle of electronic components is continuously increased, the generated heat is also increased, and in order to effectively solve the problem of high heat generation, the industry has widely used a Vapor Chamber (Vapor Chamber) with good heat conduction characteristics, but the existing Vapor Chamber has room for improvement in heat conduction efficiency, manufacturing cost, and manufacturing easiness.
The common temperature equalizing plate mainly comprises an upper shell and a lower shell, wherein capillary tissues are respectively arranged in the inner spaces of the upper shell and the lower shell, then the upper shell and the lower shell are correspondingly welded, working fluid is filled into the upper shell and the lower shell, and finally the process of degassing, sealing and the like is carried out.
As the heat source of electronic devices is continuously developed, the shape of the temperature equalization plate applied to the heat source is changed, and the amount of the working fluid affects the limited space in which the vapor and liquid change is performed, i.e., too much working fluid greatly reduces the space for vaporization, and too little working fluid causes the interior to generate bad conditions such as idle burning, so that the filled working fluid is often distributed in the interior space of each shell in large contact surface area or special shape, and the heat conduction and heat dissipation effects are not good.
Disclosure of Invention
The main object of the present invention is to provide a vapor chamber and a method for manufacturing the same, which can uniformly and widely distribute a working fluid in a single chamber by arranging each liquid-injecting and degassing tube.
In order to achieve the above object, the present invention provides a vapor chamber, comprising a housing, a capillary structure, at least two liquid-injecting and degassing pipes, and a working fluid, wherein the housing comprises a lower shell plate and an upper shell plate hermetically sealed with respect to the lower shell plate, and a single chamber is formed between the upper shell plate and the lower shell plate; the capillary structure is arranged in the single cavity; each liquid injection and degassing pipe is respectively connected with the shell in a penetrating way and communicated with the single cavity; the working fluid is disposed in the single chamber.
Optionally, the liquid injection and degassing pipes are respectively located on the same side of the casing and are arranged at intervals.
Optionally, the casing is rectangular, and the liquid injection and degassing pipes are respectively located on two opposite sides of the casing and are arranged in a staggered manner.
Optionally, the housing is U-shaped, the number of the liquid injection and degassing pipes is three, two of the liquid injection and degassing pipes are respectively located at the middle position of the opening side of the housing, and the other liquid injection and degassing pipe is located at the middle position of the closing side of the housing.
Optionally, the casing includes a first rectangular body, a second rectangular body and a third rectangular body, the second rectangular body and the first rectangular body are arranged in a staggered manner to form a ladder shape, one of the liquid injection and air removal pipes is located on one side of the first rectangular body, and the other liquid injection and air removal pipe is located on one side of the third rectangular body.
In order to achieve the above object, the present invention provides a method for manufacturing a vapor chamber, comprising the steps of a) providing a housing having a single chamber and at least two liquid-injection degassing pipes; b) filling a working fluid from each liquid injection and degassing pipe into the single chamber respectively; c) applying a heating process to the shell to discharge the gas in the single chamber from each liquid injection and gas removal pipe; and d) sealing each liquid injection and degassing pipe subjected to the step c).
Optionally, in the step b), one of the liquid injection and degassing pipes is used for injecting liquid first, and the other liquid injection and degassing pipe is used for exhausting gas.
Optionally, the step b) is performed simultaneously for each of the liquid injection and degassing pipes.
Optionally, in the step c), one of the liquid injection and degassing pipes is used for blocking, and the other liquid injection and degassing pipe is used for degassing.
Optionally, the step c) simultaneously exhausts the gas from each of the liquid injection and gas removal pipes.
The invention also has the following effects that the heat conduction and heat dissipation efficiency of the temperature equalizing plate can be improved by uniformly distributing the working fluid, and the adverse conditions of internal idle burning and the like can be effectively prevented. Through the average arrangement of each liquid injection and air removal pipe, the filling of the working fluid is simpler, and the manufacturing process is easier.
Drawings
FIG. 1 is an exploded view of a first embodiment of the vapor-dispensing plate of the present invention.
FIG. 2 is a top view of a first embodiment of the vapor chamber of the present invention.
FIG. 3 is a top view of a second embodiment of the vapor chamber of the present invention.
FIG. 4 is a top view of a combination of a vapor chamber according to a third embodiment of the present invention.
FIG. 5 is a top view of a fourth embodiment of the vapor chamber of the present invention.
FIG. 6 is a flowchart of a method for fabricating a vapor chamber.
In the figure:
10. 10A, 10B, 10C … housing; 11 … lower shell plate; 111 … bottom panel; 112 … coaming; 113, 113 … flange plates; 114 … grooves; 12 … upper shell plate; 121 … concave groove; a … single chamber; 101C … a first cuboid; 102C … second cuboid; 103C … third cuboid; 20 … capillary structure; 30 … injecting liquid and removing air tube; 40 … working fluid; a to d … steps.
Detailed Description
The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.
Referring to fig. 1 and 2, the present invention provides a temperature equalization plate, which mainly comprises a housing 10, a capillary structure 20, at least two liquid injection and degassing pipes 30, and a working fluid 40.
The casing 10 of the present embodiment is substantially rectangular, and mainly includes a lower casing plate 11 and an upper casing plate 12, the lower casing plate 11 can be made of aluminum, copper or alloy thereof with good thermal conductivity, the lower casing plate 11 of the present embodiment mainly includes a bottom plate 111, a surrounding plate 112 and a flange plate 113, the surrounding plate 112 is formed by bending from the periphery of the bottom plate 111, the flange plate 113 is formed by bending from the edge of the surrounding plate 112 outwards, and two grooves 114 are formed at intervals on the flange plate 113.
The upper shell 12 may also be made of aluminum, copper or alloy thereof with good thermal conductivity, which is sealed by welding corresponding to the lower shell 11, and a single chamber a is enclosed inside the upper shell 12 and the lower shell 11, and a concave groove 121 is punched on the upper shell 12 corresponding to each of the grooves 114.
The capillary structure 20 is disposed on the inner surfaces of the lower shell plate 11 and the upper shell plate 12 and formed in the single chamber a, and may be an object having capillary attraction force, such as a woven mesh, a metal powder sintered body, or a fiber bundle.
Each liquid injection and degassing tube 30 is connected to the side of the housing 10 corresponding to the groove 114 and the recessed groove 121, and communicates with the single chamber a, and the liquid injection and degassing tubes 30 of the present embodiment are respectively located on the same side of the housing 10 and are arranged at equal intervals.
The working fluid 40 may be pure water, which is filled into the single chamber a through each of the liquid injection and degassing pipes 30.
Referring to fig. 3, the housing 10A of the present embodiment is also substantially rectangular, which is different from the above embodiments in that the liquid injection and air removal pipes 30 are respectively located at two opposite sides of the housing 10A and are arranged in a staggered manner.
Referring to fig. 4, the housing 10B of the present embodiment is U-shaped, the number of the liquid-injecting and degassing pipes 30 is three, two of the liquid-injecting and degassing pipes 30 are respectively located at the middle position of the opening side of the housing 10B, and the other liquid-injecting and degassing pipe 30 is located at the middle position of the closing side of the housing 10B.
Referring to fig. 5, the housing 10C of the present embodiment mainly includes a first rectangular body 101C, a second rectangular body 102C, and a third rectangular body 103C, wherein the third rectangular body 103C, the second rectangular body 102C, and the first rectangular body 101C are arranged in a staggered manner to form a ladder shape, one of the liquid injection and degassing pipes 30 is located on one side of the first rectangular body 101C, and the other liquid injection and degassing pipe 30 is located on one side of the third rectangular body 103C.
Referring to fig. 6, the present invention further provides a method for manufacturing a vapor chamber, which comprises the following steps:
a) providing a shell 10, wherein the shell 10 is provided with a single chamber A and at least two liquid injection and degassing pipes 30;
b) filling a working fluid 40 from each of the liquid injection and degassing pipes 30 into the single chamber a; to explain, the filling manner of the working fluid 40 may be to fill one of the liquid-filling and degassing pipes 30 first, and the other liquid-filling and degassing pipe 30 is used for degassing, so that the gas in the single-chamber a can be easily exhausted. Alternatively, the two liquid-injecting and degassing pipes 30 may be filled with the working fluid 40 at the same time.
c) Applying a heating process to the housing 10 to discharge the gas in the single chamber a from each of the liquid-injecting and degassing pipes 30; further, one of the liquid injection and air removal pipes 30 may be blocked, and the other liquid injection and air removal pipe 30 may be used for exhausting air, and then the region of the housing 10 near the blocked liquid injection and air removal pipe 30 may be heated, so as to exhaust the blocked liquid injection and air removal pipe 30. Alternatively, the two liquid-injecting and degassing pipes 30 may be exhausted simultaneously.
d) Sealing each of the liquid-injecting and degassing pipes 30 obtained in step c). Further, after the degassing process is completed, a welding seal can be applied to each of the liquid-injection degassing pipes 30.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. A vapor chamber, comprising:
a shell body, which comprises a lower shell plate and an upper shell plate hermetically sealed corresponding to the lower shell plate, wherein a single chamber is formed between the upper shell plate and the lower shell plate;
a capillary structure arranged in the single chamber;
at least two liquid injection and degassing pipes which are respectively connected with the shell in a penetrating way and communicated with the single cavity; and
a working fluid disposed in the single chamber.
2. The temperature-uniforming plate of claim 1, wherein the housing has a rectangular shape, and the liquid-injecting and degassing tubes are respectively located at the same side of the housing and spaced apart from each other.
3. The temperature-uniforming plate of claim 1, wherein the housing has a rectangular shape, and the liquid-injecting and degassing tubes are respectively located at two opposite sides of the housing and are arranged in a staggered manner.
4. The temperature-equalizing plate as claimed in claim 1, wherein the housing has a U-shape, and the number of the liquid-injecting and degassing pipes is three, two of the liquid-injecting and degassing pipes are respectively located at the middle position of the open side of the housing, and the other liquid-injecting and degassing pipe is located at the middle position of the closed side of the housing.
5. The temperature-equalizing plate of claim 1, wherein the housing comprises a first rectangular body, a second rectangular body and a third rectangular body, the second rectangular body and the first rectangular body are arranged in a staggered manner to form a ladder shape, one of the liquid-injecting and degassing pipes is located on one side of the first rectangular body, and the other liquid-injecting and degassing pipe is located on one side of the third rectangular body.
6. A method for manufacturing a vapor chamber, comprising the steps of:
a) providing a shell, wherein the shell is provided with a single cavity and at least two liquid injection and degassing pipes;
b) filling a working fluid from each liquid injection and degassing pipe into the single chamber respectively;
c) applying a heating process to the shell to discharge the gas in the single chamber from each liquid injection and gas removal pipe; and
d) and c) sealing each liquid injection and degassing pipe.
7. The method according to claim 6, wherein one of the liquid-injecting and degassing tubes is used for injecting liquid first, and the other liquid-injecting and degassing tube is used for exhausting gas in step b).
8. The method of claim 6, wherein step b) is performed simultaneously with each of said liquid-filled degassing tubes.
9. The method according to claim 6, wherein one of the liquid-filled degassing tubes is used for plugging in step c), and the other liquid-filled degassing tube is used for exhausting gas.
10. The method of claim 6, wherein step c) simultaneously evacuates each of said liquid-filled degassing tubes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200098.4A CN112880448A (en) | 2019-11-29 | 2019-11-29 | Temperature equalizing plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200098.4A CN112880448A (en) | 2019-11-29 | 2019-11-29 | Temperature equalizing plate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112880448A true CN112880448A (en) | 2021-06-01 |
Family
ID=76038482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911200098.4A Pending CN112880448A (en) | 2019-11-29 | 2019-11-29 | Temperature equalizing plate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112880448A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060150647A1 (en) * | 2004-12-28 | 2006-07-13 | Jia-Hao Li | Gas removing apparatus for removing non-condensate gas from a heat pipe and method for the same |
| US20080080133A1 (en) * | 2006-10-02 | 2008-04-03 | Hsiu-Wei Yang | Flat type heat pipe device and method of fabrication thereof |
| US20080087405A1 (en) * | 2006-10-11 | 2008-04-17 | Foxconn Technology Co., Ltd. | Heat spreader with vapor chamber and method of manufacturing the same |
| US20160088769A1 (en) * | 2014-09-21 | 2016-03-24 | Htc Corporation | Electronic device and heat dissipation plate |
| CN206847445U (en) * | 2017-04-11 | 2018-01-05 | 迈萪科技股份有限公司 | Conductive structure with liquid gas separation mechanism |
| CN211346468U (en) * | 2019-11-29 | 2020-08-25 | 惠州惠立勤电子科技有限公司 | Temperature equalizing plate |
-
2019
- 2019-11-29 CN CN201911200098.4A patent/CN112880448A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060150647A1 (en) * | 2004-12-28 | 2006-07-13 | Jia-Hao Li | Gas removing apparatus for removing non-condensate gas from a heat pipe and method for the same |
| US20080080133A1 (en) * | 2006-10-02 | 2008-04-03 | Hsiu-Wei Yang | Flat type heat pipe device and method of fabrication thereof |
| US20080087405A1 (en) * | 2006-10-11 | 2008-04-17 | Foxconn Technology Co., Ltd. | Heat spreader with vapor chamber and method of manufacturing the same |
| US20160088769A1 (en) * | 2014-09-21 | 2016-03-24 | Htc Corporation | Electronic device and heat dissipation plate |
| CN206847445U (en) * | 2017-04-11 | 2018-01-05 | 迈萪科技股份有限公司 | Conductive structure with liquid gas separation mechanism |
| CN211346468U (en) * | 2019-11-29 | 2020-08-25 | 惠州惠立勤电子科技有限公司 | Temperature equalizing plate |
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