CN112867246A

CN112867246A - PCB (printed circuit board) welding pad assembly and PCB

Info

Publication number: CN112867246A
Application number: CN202110271731.XA
Authority: CN
Inventors: 汪换名
Original assignee: Hunan Ouzhitong Technology Co ltd
Current assignee: Hunan Ouzhitong Technology Co ltd
Priority date: 2021-03-12
Filing date: 2021-03-12
Publication date: 2021-05-28

Abstract

Compared with the prior art, the PCB welding pad assembly comprises a welding pad arranged on an insulating bottom plate, a connecting lead connected with the welding pad, and a through hole arranged on the welding pad; the through hole penetrates through the insulating bottom plate; the PCB board including the pad assembly discussed above; and an insulating base plate connected with the pad assembly. Compared with the prior art, the method can eliminate bubbles generated in the process of patch welding, enables the welding pads to be connected seamlessly, and enhances the sealing performance and mechanical strength of welding.

Description

PCB (printed circuit board) welding pad assembly and PCB

Technical Field

The application relates to the technical field of PCB welding disc assemblies, in particular to a PCB welding disc assembly and a PCB.

Background

SMT paster processing production is a comprehensive system engineering technique, has intelligent paster operation, and characteristics such as more accurate discernment location has more the durability. With the generation and development of technology, SMT patches have rapidly gained popularity in the 90 s and become the mainstream of electronic assembly technology. The method is characterized in that the SMC/SMD components can be quickly and accurately mounted on the appointed pad positions of the PCB under the condition of not damaging the components and the PCB by operations of suction-displacement-positioning-placement and the like. The characteristics of density, high speed, standardization and the like occupy absolute advantages in the technical field of circuit assembly, play an important role in promoting the development of the modern information industry, and become one of the indispensable technologies for manufacturing modern electronic products.

At present, the variety of SMT paster is many, and to LGA encapsulation WIFI module PAD, because its pin PAD size that is suitable for is bigger, can produce the bubble on the mainboard PAD is welded to the paster, influences welding performance. Although the circuit can be conducted temporarily when the printed circuit board has a bubble defect, and no electrical failure occurs, the solder joints are deteriorated due to the use environment, the problem of poor circuit conduction caused by solder cracking is caused, the mechanical strength of the solder joints is also deteriorated, and the solder joints are easy to be detached. However, in the prior art, the method for eliminating bubbles includes: changing the steel mesh opening mode; replacing the new solder paste without using secondary temperature-returning solder paste; baking the PCB and the device respectively to remove moisture in the parts; controlling the humidity of the workshop, and collecting the solder paste for more than 30 minutes; the constant temperature zone time is suitably increased. The method can solve most of bubbles, but has strict requirements on solder paste, temperature and furnace passing time, is not well controlled slightly, and has certain probability of bubble generation.

Therefore, it is a technical problem to be solved by those skilled in the art how to provide a PCB pad assembly and a PCB, which can eliminate air bubbles generated during the process of die bonding, enable the pads to be connected seamlessly, and enhance the sealing performance and mechanical strength of the bonding.

Disclosure of Invention

In order to solve the technical problem, the application provides a PCB welding disc assembly and a PCB, which can eliminate bubbles generated in the process of welding a patch, so that welding discs can be connected seamlessly, and the sealing performance and the mechanical strength of welding are enhanced.

The first technical scheme provided by the application is as follows:

the application provides a welding pad assembly of a PCB (printed circuit board), which comprises a welding pad arranged on an insulating bottom plate and a connecting wire connected with the welding pad, wherein the welding pad is provided with a through hole; the through hole penetrates through the insulating bottom plate.

Further, in a preferable mode of the invention, the inner diameter of the through hole is 0.3-0.4 mm.

Further, in a preferred mode of the invention, one or more through holes are provided in the pad.

Further, in a preferred aspect of the present invention, the pad is provided with one through hole, and the through hole is provided at the center of the pad.

Further, in a preferred mode of the invention, the pad is provided with a plurality of through holes, and the through holes are uniformly distributed on the pad.

Further, in a preferred mode of the invention, the through hole is a metal through hole.

Further, in a preferred mode of the invention, the metal through hole is a metal through hole whose inner wall contains copper.

Further, in a preferred embodiment of the present invention, the through hole provided in the pad is opened on both sides and is windowed on both sides.

Further, in a preferable mode of the invention, a single-side hole ring is arranged on the back surface of the through hole.

The second technical scheme provided by the application is as follows:

the application provides a PCB board, includes: a pad assembly according to any of the preceding features; and an insulating base plate connected with the pad assembly.

Compared with the prior art, the welding pad assembly of the PCB comprises a welding pad arranged on an insulating bottom plate, a connecting lead connected with the welding pad, and a through hole arranged on the welding pad; the through hole penetrates through the insulating bottom plate; the invention also provides a PCB board, which comprises the welding disc component with any technical characteristic; and an insulating base plate connected with the pad assembly. The through hole penetrating through the bonding pad and the insulating bottom plate is formed in the bonding pad, when the chip module is welded to the bonding pad through a machine chip, solder paste is melted to flow into the through hole, and bubbles generated on the bonding pad penetrate through the through hole along with the solder paste to be discharged, so that the bubbles generated in the welding process are eliminated. Compared with the prior art, the technical scheme of the invention can eliminate bubbles generated in the process of patch welding, so that the bonding pads can be connected seamlessly, and the sealing performance and the mechanical strength of welding are enhanced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a pad assembly of a PCB according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating a process of removing bubbles from a PAD of a LGA package WIFI module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of the single-sided hole ring on the back surface of the through hole according to the embodiment of the present invention.

Description of reference numerals:

a pad 1; an insulating base plate 2; a connecting wire 3; a through hole 4; a metal via hole 5; a unilateral hole ring 6; LGA package WIFI module PAD 7; air bubbles.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or be indirectly disposed on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "first," "second," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "plurality" or "a plurality" means two or more unless specifically limited otherwise.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings are only used for matching the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the practical limit conditions of the present application, so that the modifications of the structures, the changes of the ratio relationships, or the adjustment of the sizes, do not have the technical essence, and the modifications, the changes of the ratio relationships, or the adjustment of the sizes, are all within the scope of the technical contents disclosed in the present application without affecting the efficacy and the achievable purpose of the present application.

As shown in fig. 1 to 4, a pad assembly of a PCB according to an embodiment of the present invention includes a pad 1 disposed on an insulating base plate 2, a connecting wire 3 connected to the pad 1, and a through hole 4 disposed on the pad 1; the through hole 4 penetrates through the insulating bottom plate 2; the PCB provided by the embodiment of the invention comprises the welding disc component with any technical characteristic; and an insulating base plate 2 connected to the pad assembly.

The embodiment of the invention provides a welding pad assembly of a PCB (printed circuit board), which comprises a welding pad 1 arranged on an insulating bottom plate 2, a connecting lead 3 connected with the welding pad 1, and a through hole 4 arranged on the welding pad 1; the through hole 4 penetrates through the insulating bottom plate 2; the PCB provided by the embodiment of the invention has the advantages that the welding disc component is characterized in any technical characteristics; and an insulating base plate 2 connected to the pad assembly. The through hole 4 penetrating through the bonding pad 1 and the insulating base plate 2 is formed in the bonding pad 1, when a chip module is bonded to the bonding pad 1 through machine chip bonding, solder paste is melted and flows into the through hole 4, and air bubbles 8 generated on the bonding pad 1 penetrate through the through hole 4 along with the solder paste and are discharged out, so that the air bubbles 8 generated in the bonding process are eliminated. Compared with the prior art, the technical scheme of the invention can eliminate the bubbles 8 generated in the process of patch welding, so that the bonding pads 1 can be connected seamlessly, and the sealing performance and the mechanical strength of welding are enhanced.

Specifically, in the embodiment of the invention, the inner diameter of the through hole 4 is 0.3-0.4 mm.

Specifically, in the embodiment of the present invention, one or more through holes 4 are provided on the pad 1.

Specifically, in the embodiment of the present invention, one through hole 4 is provided in the pad 1, and the through hole 4 is provided in the center of the pad 1.

Specifically, in the embodiment of the present invention, the pad 1 is provided with a plurality of through holes 4, and the through holes 4 are uniformly distributed on the pad 1.

Specifically, in the embodiment of the present invention, the through hole 4 is a metal through hole 5.

Specifically, in the embodiment of the present invention, the metal via 5 is a metal via 5 whose inner wall contains copper.

Specifically, in the embodiment of the present invention, the through hole 4 disposed on the pad 1 is through-connected on both sides and is windowed on both sides.

Specifically, in the embodiment of the present invention, a single-sided hole ring 6 is disposed on the back of the through hole 4.

Specifically, in an embodiment of the present invention, there is provided a PCB board including: a pad assembly according to any of the preceding features; and an insulating base plate 2 connected to the pad assembly.

More specifically, currently, the kinds of SMT patches are many, and for LGA package WIFI module PAD7, because the size of pin PAD 1 that it is suitable for is bigger, air bubble 8 can be generated on the patch welds mainboard PAD 1, and the welding performance is influenced. Although the circuit can be conducted temporarily when the printed circuit board has a defect of the bubble 8, and no electrical failure occurs, the solder joint is deteriorated by the use environment, the problem of poor circuit conduction caused by the crack of the solder is caused, the mechanical strength of the solder joint is also deteriorated, and the solder joint is easy to be detached. However, in the prior art, the method for eliminating the bubbles 8 includes: changing the steel mesh opening mode; replacing the new solder paste without using secondary temperature-returning solder paste; baking the PCB and the device respectively to remove moisture in the parts; controlling the humidity of the workshop, and collecting the solder paste for more than 30 minutes; the constant temperature zone time is suitably increased. The method can solve most of the bubbles 8, but the requirements on the solder paste, the temperature and the furnace passing time are very strict, the control is not good, and the bubbles 8 are generated with a certain probability.

According to the PCB welding disc assembly, the through hole 4 penetrating through the welding disc 1 and the insulating bottom plate 2 is arranged on the welding disc 1, when the LGA package WIFI module PAD7 patch is welded on the welding disc 1 through a machine, solder paste is melted and flows into the through hole 4, and air bubbles 8 generated on the welding disc 1 are discharged through the through hole 4 along with the solder paste, so that the air bubbles 8 generated in the welding process are eliminated.

From the above, the pad assembly of the PCB according to the embodiment of the present invention includes a pad 1 disposed on an insulating base plate 2, a connecting wire 3 connected to the pad 1, and a through hole disposed on the pad 1; the through hole penetrates through the insulating bottom plate 2; the PCB board related to the invention comprises the welding disc component with any technical characteristic; and an insulating base plate 2 connected to the pad assembly. Utilize to be in set up on the PAD 1 and run through the PAD 1 and the metal through-hole 5 of insulating bottom plate 2, LGA encapsulation WIFI module PAD7 passes through SMT machine paster and welds when on the PAD 1, under the extruded effect of machine paster, the solder paste melts and can flow in the metal through-hole 5, bubble 8 that produces on the PAD 1 can see through along with the solder paste metal through-hole 5 discharges to eliminate bubble 8 that produces in the welding process. Compared with the prior art, the technical scheme of the invention can eliminate the bubbles 8 generated in the process of patch welding, so that the bonding pads 1 can be connected seamlessly, and the sealing performance and the mechanical strength of welding are enhanced.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A welding disc assembly of a PCB board comprises a welding disc arranged on an insulating bottom plate and a connecting lead connected with the welding disc, and is characterized in that a through hole is formed in the welding disc; the through hole penetrates through the insulating bottom plate.

2. The PCB pad assembly of claim 1, wherein the inner diameter of the through hole is 0.3-0.4 mm.

3. A pad assembly of a PCB board according to claim 1, wherein one or more through holes are provided on the pad.

4. A bonding pad assembly of PCB board according to claim 3, wherein said bonding pad is provided with one said through hole, and said through hole is arranged at the center of said bonding pad.

5. A bonding pad assembly of PCB board according to claim 4, wherein a plurality of said through holes are arranged on said bonding pad, and are uniformly distributed on said bonding pad.

6. The land pad assembly of the PCB of claim 1, wherein the through hole is a metal through hole.

7. The land pad assembly of PCB board of claim 6, wherein said metal through hole is a metal through hole with copper on inner wall.

8. The PCB board pad assembly of claim 1, wherein the through holes disposed on the pads are double-sided conductive and double-sided windowed.

9. The land pad assembly of PCB board of claim 8, wherein said through hole is provided with a single edge hole ring at the back side.

10. A PCB board comprising the pad assembly of any one of claims 1 to 9; and an insulating base plate connected with the pad assembly.