CN112825411A

CN112825411A - Laser device

Info

Publication number: CN112825411A
Application number: CN201911134456.6A
Authority: CN
Inventors: 田新团; 李建军
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2021-05-21

Abstract

The application discloses laser belongs to the technical field of photoelectricity. The laser includes: a base plate; a pipe shell; the tube shell and the bottom plate form an accommodating space, and a plurality of laser chips and reflecting prisms are attached to the bottom plate in the accommodating space; the surface of the outer side area of the upper cover, which is close to the bottom plate, is fixed on the pipe shell, and the surface of the inner side area of the upper cover, which is close to the bottom plate, is a plane; the laser also comprises a collimating lens structure, and the surface of the inner side area of the upper cover, which is close to the bottom plate, is used for bearing the collimating lens structure; or the laser further comprises a collimating lens structure, a supporting frame and a light-transmitting sealing layer, wherein the surface, close to the bottom plate, in the inner side area of the upper cover is used for being attached to the peripheral edge of the surface, far away from the bottom plate, of the supporting frame, or the surface is used for bearing the collimating lens structure. The application solves the problem that the laminating effect of the upper cover of the laser and the supporting frame is poor. The application is used for light emission.

Description

Laser device

Technical Field

The application relates to the field of photoelectric technology, in particular to a laser.

Background

With the development of the optoelectronic technology, the laser is widely used.

The laser comprises a base plate, a tube shell, a plurality of laser chips, a plurality of prisms, an annular upper cover, a supporting frame, sealing glass and a collimating lens structure. The tube shell, the plurality of laser chips and the plurality of prisms are all positioned on the bottom plate, and the tube shell is annular and surrounds the plurality of laser chips and the plurality of prisms; the plurality of laser chips correspond to the plurality of prisms one by one, each prism is positioned on the light-emitting side of the corresponding laser chip, and the prisms are used for reflecting light rays emitted by the corresponding laser chips; the inner side area of the upper cover is sunken towards the direction close to the bottom plate relative to the outer side area, the surface of the outer side area close to the bottom plate is attached to the surface of the tube shell far away from the bottom plate, the support frame and the sealing glass are sequentially superposed on the surface of the inner side area far away from the bottom plate, and the collimating lens structure is located on one side of the upper cover far away from the bottom plate. In the related art, the upper cover is a special-shaped stamping part, and the upper cover is obtained by stamping an annular thin plate to make an inner side area concave relative to an outer side

However, when the annular thin plate is punched, wrinkles are easily generated in the thin plate, and the flatness of the inner area of the upper cover is poor, so that the bonding effect between the upper cover and the support frame is poor.

Disclosure of Invention

The application provides a laser, can solve the lower problem of the luminance of laser. The technical scheme is as follows:

the laser includes:

a base plate;

a pipe shell;

the pipe shell and the bottom plate form an accommodating space,

in the accommodating space, a plurality of laser chips and a reflecting prism are attached on the bottom plate,

the reflecting prism is used for emitting the light rays emitted by the laser chip along the direction far away from the bottom plate;

the surface of the outer side area of the upper cover, which is close to the bottom plate, is fixed on the pipe shell, and the surface of the inner side area of the upper cover, which is close to the bottom plate, is a plane;

the laser also comprises a collimating lens structure, the collimating lens structure is used for collimating and emitting light rays emitted by the laser chip reflected by the reflecting prism, and the surface, close to the bottom plate, in the inner side area of the upper cover is used for bearing the collimating lens structure; or, the laser instrument still includes collimating lens structure, carriage and printing opacity sealing layer, the middle zone of carriage has a n first fretwork area, and n is the positive integer, the printing opacity sealing layer covers first fretwork area is kept away from one side of bottom plate, collimating lens structure is located the carriage with between the bottom plate, or collimating lens structure is located the printing opacity sealing layer is kept away from one side of bottom plate, be close to in the inside region of upper cover the surface of bottom plate be used for with the carriage is kept away from the laminating of the edge all around of the surface of bottom plate, perhaps be used for bearing the collimating lens structure.

The beneficial effect that technical scheme that this application provided brought includes at least:

in the laser instrument that this application provided, the surface that is close to the bottom plate in the inboard region of upper cover is used for bearing collimation lens structure or keeps away from the peripheral edge laminating on the surface of bottom plate with the carriage, and the surface that is close to the bottom plate in the inboard region of upper cover is the plane, consequently, the upper cover is aimed at collimation lens structure and is born the effect better, and the laminating effect of upper cover and carriage is better.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an upper cover according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 4 is a schematic partial structural diagram of a laser provided in an embodiment of the present application;

FIG. 5 is a schematic diagram of a portion of another laser according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a target axisymmetric pattern provided by an embodiment of the present application;

fig. 7 is a schematic structural diagram of another laser provided in an embodiment of the present application;

FIG. 8 is a schematic structural diagram of another laser provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of a laser according to another embodiment of the present application;

FIG. 10 is a schematic diagram of another laser structure provided in another embodiment of the present application;

FIG. 11 is a schematic diagram of another laser according to another embodiment of the present application;

FIG. 12 is a schematic diagram of a portion of another laser according to an embodiment of the present disclosure;

FIG. 13 is a schematic diagram of a portion of another laser according to an embodiment of the present disclosure;

fig. 14 is a schematic diagram of a partial structure of a laser according to another embodiment of the present application;

FIG. 15 is a schematic diagram of a portion of another laser according to another embodiment of the present application;

FIG. 16 is a schematic diagram of another laser structure provided in another embodiment of the present application;

fig. 17 is a schematic structural diagram of another laser provided in another embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

With the development of the optoelectronic technology, the application of the laser is wider and wider, for example, the laser can be applied to the aspects of welding process, cutting process, laser projection and the like, and the welding effect on each part in the laser is higher and higher at present. The following embodiment of this application provides a laser instrument, can improve the welding effect of carriage and upper cover in the laser instrument, perhaps the welding effect of support component and upper cover.

Fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application, where the laser 10 includes: a base plate 101, a package 102, a plurality of laser chips 103, at least one reflective prism (not shown). The package 102 and the bottom plate 101 form an accommodating space, the plurality of laser chips 103 and the at least one reflection prism are attached to the bottom plate 101, and the package 102 is annular and surrounds the plurality of laser chips 103 and the at least one reflection prism.

The reflecting prism in the laser 10 is used to emit the light emitted from the laser chip 103 in a direction away from the base plate 101. Illustratively, each of the reflection prisms corresponds to one or more laser chips 103, and the reflection prisms are located on the light exit side of the corresponding laser chip 103, and are configured to reflect the light emitted from the corresponding laser chip 103 to a direction away from the base plate 101.

The laser 10 may further include an annular upper cover 106, the surface of the outer region q1 of the upper cover 106 adjacent to the base plate 101 being fixed to the package 102, and the surface of the inner region q2 of the upper cover 106 adjacent to the base plate 101 being flat.

It should be noted that the laser 10 may have a variety of configurations. Illustratively, as shown in fig. 1, the laser 10 further includes a collimating lens structure 1071, the collimating lens structure 1071 is configured to collimate the light emitted from the laser chip 103 reflected by the reflecting prism 104, and the inner region q2 of the upper cover 106 is close to the surface of the base plate 101 for carrying the collimating lens structure 1071. It should be noted that, collimating the light, that is, converging the light, makes the divergence angle of the light smaller, and is closer to the parallel light.

In other structures of the laser 10, the laser 10 may further include a collimating lens structure, a supporting frame, and a light-transmitting sealing layer, where a middle region of the supporting frame has n first hollow regions, where n is a positive integer; the first hollow area is used for transmitting light emitted by at least one laser chip. The light-transmitting sealing layer covers one side, far away from the bottom plate, of the first hollow-out area, and the collimating lens structure is located between the supporting frame and the bottom plate or located on one side, far away from the bottom plate, of the light-transmitting sealing layer. The surface of the inner side area of the upper cover close to the bottom plate is used for being attached to the peripheral edge of the surface of the support frame far away from the bottom plate or used for bearing the collimating lens structure.

To sum up, in the laser instrument that this application embodiment provided, the surface that is close to the bottom plate in the inboard region of upper cover is used for bearing the weight of collimating lens structure or keeps away from the peripheral edge laminating on the surface of bottom plate with the carriage, and the surface that is close to the bottom plate in the inboard region of upper cover is the plane, and consequently, the upper cover is aimed at the collimating lens structure and is born the weight of the effect better, and the laminating effect of upper cover and carriage is better.

Alternatively, the laser chip 103 may be disposed on the bottom plate 101 through a heat sink, which is not labeled in this embodiment. The heat sink may be made of a material having a large thermal conductivity, and the heat sink may allow heat generated when the laser chip 103 emits light to be more rapidly dissipated.

It should be noted that, in order to avoid the erosion of the laser chip, the reflecting prism, and other structures from the water and oxygen in the outside air and ensure the service life of the laser, the laser chip, the reflecting prism, and other structures need to be disposed in the sealed accommodating space. In the first type of laser, the laser may include a collimating lens structure, but does not include a supporting frame and a light-transmitting sealing layer, and a closed accommodating space is defined by at least the bottom plate, the tube shell, and the collimating lens structure. In the second type of laser, the laser may include a collimating lens structure, a support frame, and a light-transmitting sealing layer, and a closed accommodating space is defined by at least the bottom plate, the tube shell, the support frame, and the light-transmitting sealing layer.

One laser 10 of the first type of laser described above may include only one collimating lens structure 1071. For example, with continued reference to fig. 1, for such a laser 10, the surface of the outer region q1 of the upper cover 106 near the base 101 may conform to the surface of the package 102 away from the base 101, and the surface of the inner region q2 of the upper cover 106 near the base 101 may conform to the peripheral edge of the surface of the collimating lens structure 1071 away from the base 101. The base plate 101, the package 102, the upper cover 106 and the collimating lens structure 1071 may enclose a closed accommodation space.

Fig. 2 is a schematic structural diagram of an upper cover according to an embodiment of the present disclosure, and fig. 2 is a bottom view of the upper cover 106 shown in fig. 1. Referring to fig. 1 and fig. 2, the outer region q1 of the top cover 106 is recessed from the inner region q2 of the top cover 106 toward the side away from the bottom plate 101. Optionally, the surface of the upper cover 106 away from the base plate 101 is planar. Illustratively, the etching may be performed by etching an outer region on one surface of an annular plate-like structure, and the thickness of the annular plate-like structure may be the same as that of the inner region q2 in the upper cover 106.

It should be noted that, in the embodiment of the present application, since the inner region q2 of the upper cover 106 does not need to be processed, the flatness of the inner region q2 may be high, so that the surface of the inner region q2 close to the bottom plate 101 can be better attached to other structures (such as a collimator lens structure).

Alternatively, the thickness of the inner side region q2 of the upper cover 106 may range from 0.2 mm to 0.5 mm, and may be 0.4 mm, for example. The thickness of the outer region q1 of the upper cover 106 is less than or equal to 0.15 mm, for example, the thickness may be 0.12 mm.

It should be noted that, in the embodiment of the present application, the surface of the upper cover 106 away from the bottom plate 101 is taken as a plane, and optionally, the surface of the upper cover 106 away from the bottom plate 101 may not be a plane. For example, the outer region of the surface of the upper cover 106 facing away from the base plate 101 may be recessed relative to the inner region, or the inner region of the surface of the upper cover 106 facing away from the base plate 101 may be recessed relative to the outer region.

Please refer to fig. 1, the side of the collimating lens structure 1071 away from the bottom plate 101 may have at least one convex arc surface bending toward the side away from the bottom plate 101, and a portion of each convex arc surface in the collimating lens structure 1071 may be regarded as a collimating lens a, and the collimating lens structure 1071 may further include at least one collimating lens a. The collimating lens a may be a convex lens in a plano-convex form, the collimating lens a may have a convex arc surface and a plane, the plane may be parallel to the plate surface of the bottom plate 101 and disposed near the bottom plate 101, and the convex arc surface and the plane may be two opposite surfaces. The side of the collimating lens structure 1071 facing away from the base plate 101 may have each convex curve surface as a convex curve surface in one collimating lens a.

Optionally, as shown in fig. 1, the collimating lens structure 1071 may include a plurality of collimating lenses a and a supporting member Z supporting the plurality of collimating lenses a, the collimating lenses a are located on a side of the supporting member Z far away from the bottom plate 101, the plurality of collimating lenses a may be integrally formed with the supporting member Z, and the supporting member Z may be made of a light-transmissive material. Illustratively, the collimating lens structure 1071 may be prepared by means of mold pressing.

Optionally, a plurality of collimating lenses a in the collimating lens structure 1071 correspond to a plurality of laser chips 103 (i.e., all laser chips in the laser) in the laser 10 one by one, and the reflecting prism 104 is configured to reflect light emitted from the corresponding laser chip 103 to the collimating lenses a corresponding to the laser chips 103. In the laser 10 shown in fig. 1, the light emitted from each laser chip 103 may be emitted to the corresponding reflection prism 104, and then reflected on the surface of the reflection prism 104 close to the laser chip 103, and then emitted to the corresponding collimating lens a of the laser chip 103.

Fig. 3 shows another laser 10 of the first type of laser described above, which laser 10 may comprise a plurality of collimating lens structures 1071 and a carrier structure 1072. The periphery of the carrying structure 1072 may be fixed on the upper cover 106, the middle area of the carrying structure 1072 has a plurality of second hollow areas K, and the plurality of collimating lens structures 1071 are correspondingly covered on one side of the plurality of second hollow areas K away from the bottom plate 101. The collimating lens structure 1071 is used for collimating and emitting the light emitted from the at least one laser chip 103 reflected by the reflecting prism.

Fig. 4 is a partial structural schematic diagram of a laser according to an embodiment of the present disclosure, and fig. 4 is an exploded structural schematic diagram of the laser 10 shown in fig. 3 after the upper cover 106, the carrying structure 1072, and the collimating lens structure 1071 are turned over by 180 degrees. As shown in fig. 4, it should be noted that fig. 3 and 4 show a case where each of the collimator lens structures 1071 includes one collimator lens. Alternatively, fig. 5 is a schematic partial structural diagram of another laser provided in an embodiment of the present application, and fig. 5 only shows the collimating lens structure 1071 and the carrying structure 1072 in the laser 10. As shown in fig. 5, the collimator lens structure 1071 includes a plurality of collimator lenses a and a carrier Z carrying the plurality of collimator lenses a. Optionally, the second hollow-out areas K in the carrying structure 1072 may be in a shape of a strip, and the plurality of second hollow-out areas K in the carrying structure 1072 may be sequentially arranged along a width direction of the second hollow-out areas K.

Alternatively, the collimator lens structure may only include a plurality of collimator lenses, and not include the bearing, and the plurality of collimator lenses may be connected to each other as an integral structure (this is not illustrated in the embodiments of the present application).

Alternatively, the plurality of laser chips 103 in the laser 10 may include a plurality of rows and a plurality of columns of laser chips 103, and each collimating lens structure may correspond to at least one row of laser chips 103. That is, each collimating lens structure 1071 may be configured to collimate light emitted from at least one row of laser chips 103 reflected by the reflecting prism 104.

Alternatively, the second hollow-out region K may be rectangular, oval or in a target axisymmetric shape shown in fig. 6, the target axisymmetric shape is surrounded by two opposite straight sides and two opposite arc sides, and the target axisymmetric shape is a convex figure. The target axis symmetry shape may be a racetrack shape. Fig. 4 illustrates the second hollow area K as a rectangle. For example, the length of the rectangle may be 5 mm, the width may be 3 mm, and the length and the width of the rectangle may also be other values, which is not limited in this embodiment of the application. It should be noted that the shape of the second hollow-out area K may be designed according to the light type of the light emitted by the laser chip 103 after being reflected by the corresponding reflection prism 104, and it is only necessary to ensure that the light emitted by the laser chip 103 can be reflected by the corresponding reflection prism 104 and then can penetrate through the second hollow-out area K.

Alternatively, when the laser includes a plurality of collimating lens structures 1071, each collimating lens structure 1071 may be independently disposed over the second hollowed-out area K that needs to be covered by the collimating lens structure 1071. Therefore, when the collimator lens structure 1071 is provided, the position where the collimator lens structure 1071 is provided can be adjusted according to the light beam emitted from the laser chip 103 corresponding to the collimator lens in the collimator lens structure 1071. The setting position of the collimating lens structure 1071 can be adjusted, so that the light rays emitted from the laser chip 103 at the central position pass through the vertex of the collimating lens in the collimating lens structure 1071, the collimating effect of the collimating lens structure 1071 on the light beams is better, and the parallelism of the emergent light rays is better.

Optionally, the perimeter edge of the load bearing structure 1072 may be conformed to the surface of the inner region of the lid 106 proximate the base plate 101. Next, the collimating lens structures 1071 are seal-welded to the carrying structure 1072 from the side of the upper cover 106 away from the carrying structure 1072, and each collimating lens structure 1071 covers one second hollowed-out area K. Alternatively, each collimating lens structure 1071 may be welded to the carrier structure 1072 by a sealing material, and each collimating lens structure 1071 covers one second hollow area K. The peripheral edge of the surface of the carrier structure 1072 to which the collimating lens structure 1071 is welded may then be conformed to the surface of the inner region of the upper cover 106 near the base plate 101.

In the embodiment of the present invention, the upper cover 106 and the carrying structure 1072 are illustrated as two separate structures, and optionally, the upper cover 106 and the carrying structure 1072 may be integrally formed. Illustratively, a plate-like structure may be etched to obtain the integrated upper cover 106 and the carrier structure 1072.

It should be further noted that, in the embodiment of the present application, the laser does not include the support frame and the light-transmitting sealing layer, but the laser chip and the reflection prism are sealed by the collimating lens structure, the distance from the collimating lens structure to the laser chip may be smaller, and then the curvature of the collimating lens in the collimating lens structure may also be correspondingly reduced, and the curvature of the collimating lens is also the curvature of the convex arc surface that the collimating lens has. Alternatively, the curvature radius of the collimating lens (i.e. the curvature radius of the convex cambered surface in the collimating lens) may range from 1 mm to 4.5 mm.

The second type of laser provided by the embodiments of the present application is described below. Referring to fig. 7 or 8, the laser 10 may include a collimating lens structure 1071, a support frame 1051, and a light transmissive sealing layer 1052. The middle area of the supporting frame 1051 has n first hollow areas W, where n is a positive integer, and the first hollow areas W are used for transmitting light emitted from at least one laser chip 103. The light-transmitting sealing layer 1052 covers a side of the first hollow area W away from the bottom plate 101. For example, each first hollow area W corresponds to one or more laser chips 103, and the reflective prism may be configured to reflect the light emitted from the corresponding laser chip 103 to the first hollow area W corresponding to the laser chip 103. Furthermore, each first hollow area W can transmit the light emitted from the laser chip 103 corresponding to the first hollow area W.

It should be noted that fig. 7 shows a case where the collimating lens structure 1071 is located between the support frame 1051 and the bottom plate 101, fig. 8 shows a case where the collimating lens structure 1071 is located on a side of the light transmissive sealing layer 1072 away from the bottom plate 101, and fig. 7 and 8 both illustrate an example where the laser 10 includes a plurality of collimating lens structures 1071 and a carrying structure 1072. In the second type of laser the laser 10 may comprise two covers, one for carrying the support frame 1051 and the other for carrying the collimating lens structure 1071. For ease of description and partitioning of the two covers, the cover carrying the support frame 1051 will be referred to hereinafter as the first cover 1061 and the cover carrying the collimating lens structure 1071 will be referred to hereinafter as the second cover 1062.

As shown in fig. 7 and 8, a surface of the inside area of the first upper cover 1061 close to the base plate 101 is adapted to be fitted around the peripheral edge of the surface of the support frame 1051 away from the base plate 101; the surface of the inside area of the second cover 1062 near the bottom plate 101 is used to carry the collimating lens structure 1071, e.g., the surface of the inside area of the second cover 1062 near the bottom plate 101 is used to abut the peripheral edge of the surface of the carrying structure 1072 away from the bottom plate 101.

Alternatively, with continued reference to fig. 7 and 8, the inner annular surface of the cartridge 102 may have a boss T, the outer side areas of the first upper cover 1061 and the second upper cover 1062 close to the upper cover of the base plate 101 may overlap the boss T, and the outer side areas of the first upper cover 1061 and the second upper cover 1062 far from the upper cover of the base plate 101 may be attached to the surface of the cartridge 102 far from the base plate 101. Illustratively, in fig. 7, the surface of second upper cover 1062 near base plate 101 in the outer region overlaps boss T, and the surface of first upper cover 1061 near base plate 101 in the outer region abuts the surface of case 102 away from base plate 101. In fig. 8, the surface of first upper cover 1061 close to base plate 101 in the outer area thereof abuts against the surface of boss T away from base plate 101, and the surface of second upper cover 1062 close to base plate 101 in the outer area thereof abuts against the surface of case 102 away from base plate 101.

Illustratively, the inner annular surface of the shell 102 may have only one boss T, which may be annular, that may be coaxial with the shell 102. The orthographic projection of this boss T on the base plate 101 may surround the laser chip 103 and the reflection prism 104 on the base plate 101. Optionally, when the second upper cover is overlapped on the boss, the inner annular surface of the tube shell may also have a plurality of bosses, and the plurality of bosses may be at least distributed on two opposite surfaces in the inner annular surface of the tube shell to support at least two opposite side edges of the second upper cover, which is not illustrated in this embodiment of the present application. In the embodiment of the present application, a closed accommodating space is defined by the bottom plate 101, the case 102, the first upper cover 1061, the supporting frame 1051, and the light-transmitting sealing layer 1052.

Alternatively, fig. 9 to 11 respectively show three structures of the laser, and as shown in any one of fig. 9 to 11, the second type of laser may also include only one collimating lens structure 1071. In this case, the laser 10 may include only one upper cover, which may be the first upper cover 1061 for carrying the support frame 1051. It should be noted that fig. 9 shows a case where the collimating lens structure 1071 is located between the support frame 1051 and the bottom plate 101, fig. 10 shows a case where the collimating lens structure 1071 is located on a side of the light transmissive sealing layer 1072 away from the bottom plate 101, fig. 11 is an exploded structural schematic diagram of the laser shown in fig. 10, and fig. 10 is a schematic diagram of a section b-b' in the laser shown in fig. 11. The surface of the outer side area of first upper cover 1061 close to bottom plate 101 is attached to the surface of case 102 far from bottom plate 101. As shown in fig. 9, the edge region of the collimating lens structure 1071 may overlap a boss T provided on the inner circumferential surface of the envelope 102, and as shown in fig. 10, the collimating lens structure 1071 may be directly adhered to the surface of the first upper cover 1061 away from the base plate 101.

It should be noted that the upper cover may have other shapes. For example, the upper cover may be a square frame with an inner area recessed toward the bottom plate, and the upper cover may be formed by a stamping process using an annular plate-shaped structure. The thickness of each position of the upper cover is the same, and for example, the thickness can be 0.2 mm. Alternatively, the thickness may also be less than 0.15 mm, such as 0.12 mm.

For example, when the upper cover, the carrying structure 1072 and the collimating lens structure 1071 are formed, the collimating lens structure 1071 may be welded to the carrying structure 1072, and then the combined structure of the carrying structure 1072 and the collimating lens structure 1071 may be placed in the inner area of the recess of the upper cover, and the combined structure and the upper cover may be welded by using a sealing material. Optionally, in this embodiment of the application, the carrying structure 1072 may be welded to the upper cover, and then the collimating lens structure 1071 and the carrying structure 1072 may be welded.

The following describes the support frame 1051 in the second type of laser:

fig. 12 to 14 are schematic partial structural diagrams of three lasers provided in an embodiment of the present application, and each of fig. 12 to 14 only shows a support frame 1051 and a light-transmissive sealing layer 1051 in the laser 10, and fig. 14 may be a schematic diagram of a section b-b' of the structure shown in fig. 12 or fig. 13, and fig. 12 and fig. 13 may be an exploded schematic diagram of the structure shown in fig. 14. The laser shown in any of fig. 7 to 11 may include the structure shown in any of fig. 12 to 14.

As shown in FIG. 12, the middle region of the supporting frame 1051 has n first hollow-out regions W, where n is a positive integer and n ≧ 2. The first hollow area W is used for transmitting light emitted by at least two laser chips 103. Optionally, the first hollow areas W may be in a shape of a strip, and the n first hollow areas W may be sequentially arranged along a width direction of the first hollow areas W. The support frame 1051 having such a structure can be called a herringbone support frame.

In fig. 12, n is equal to 4, that is, the middle area of the support frame 1051 has 4 first hollow areas W. Referring to fig. 12 or any one of fig. 7 to 11, each of the first hollow areas W corresponds to 5 laser chips 103, that is, each of the first hollow areas W is used for illustrating the light emitted from the 5 laser chips. The light emitted from each laser chip 103 may be emitted to the corresponding reflection prism 104, and reflected on the surface of the reflection prism 104 close to the laser chip 103, and further emitted to the first hollow area W corresponding to the laser chip 103.

As shown in fig. 13, n is 1, that is, the middle region of the support frame 1051 has only one first hollow region W. The first hollow area W may correspond to all the laser chips 103 in the laser 10, and the first hollow area W is used for transmitting the light emitted by all the laser chips 103 in the laser 10. The support frame 1051 having only one first hollow area W shown in fig. 13 may be referred to as a square-shaped support frame.

Optionally, the number of n in this embodiment of the application may also be 2 or 3 or even more, and each hollow-out region W may also correspond to 2, 3, or 4 laser chips, which is not limited in this embodiment of the application.

It should be noted that, in the supporting frame 1051 shaped like a Chinese character 'mu', the un-hollowed-out region between the adjacent first hollowed-out regions W can support the light-transmitting sealing layer 1052 thereon, so as to prevent the middle portion of the light-transmitting sealing layer 1052 from collapsing, ensure the firmness of the light-transmitting sealing layer 1052, and further ensure the sealing effect of the accommodating space in the laser.

Alternatively, as shown in fig. 11, the plurality of laser chips 103 in the laser 10 may include a plurality of rows and a plurality of columns of laser chips 103, that is, the plurality of laser chips 103 may be arranged in a plurality of rows and a plurality of columns. Each first hollow area W in the supporting frame 1051 may correspond to at least one row of laser chips 103, that is, each first hollow area W may be used for transmitting light emitted from at least one row of laser chips 103. It should be noted that, in fig. 11, each first hollow area W corresponds to only one row of laser chips, and further, the light emitted through the row of laser chips 103 is taken as an example. Optionally, the first hollow-out region W may also exist in the support frame 1051, and may correspond to two rows or three rows of laser chips, or each first hollow-out region W in the support frame 1051 may also correspond to two rows or three rows of laser chips, which is not limited in this embodiment of the application.

Optionally, in this embodiment, the material of the support frame 1051 may be kovar, such as iron-nickel-cobalt alloy, stainless steel, or other alloys. The light-transmitting sealing layer 1052 may be made of sealing glass, or may be made of other light-transmitting and highly reliable materials, such as a resin material, which is not limited in this embodiment of the present application.

In the laser provided by the embodiment of the application, each first hollow-out region in the supporting frame can correspond to at least two laser chips, and the first hollow-out region can transmit light emitted by the corresponding laser chip. The area that does not fretwork is less in the carriage, and then has reduced the light that laser chip jetted out because blockked and the loss by the carriage for the light that laser chip jetted out is utilized more, has improved the luminous luminance and the luminous effect of laser instrument.

It should be noted that there is no portion shielding the light emitted from the laser chip 103 in the square supporting frame, and the light emitted from the laser chip 103 can be fully utilized, so as to further improve the brightness of the light emitted from the laser and improve the light emitting effect of the laser.

It should be further noted that in the embodiment of the present application, the shielding of the light emitted from the laser chip by the non-hollowed-out region in the supporting frame can be considered less, so that the setting density of the laser chip in the laser device is higher, the size of the laser device can be reduced, and the miniaturization of the laser device is facilitated. Compared with lasers with the same volume in the related art, as more laser chips can be arranged in the laser provided in the embodiment of the application, the laser can emit more light rays, and the light rays emitted by the laser have higher brightness and stronger intensity.

In addition, in the embodiment of the application, since only a small number of hollow areas need to be arranged on the supporting frame, the flatness of the surface of the supporting frame away from the bottom plate can be ensured, and the flatness can be smaller than 0.3 mm. Further, the inclination angle when the light-transmitting sealing layer is provided on the support frame is small, and may be, for example, less than or equal to 0.5 degrees. Because the inclination angle of the light-transmitting sealing layer is smaller, the optical path of light emitted by the laser chip in the light-transmitting sealing layer can be reduced, the absorption of the light-transmitting sealing layer to the light is reduced, and the utilization rate of the light is improved.

Optionally, a brightness enhancement film may be attached to at least one of the surface of the light transmissive sealing layer 1052 close to the bottom plate 101 and the surface far from the bottom plate 101 to improve the light output brightness of the laser.

With continued reference to fig. 7 to 10 and fig. 12 to 14, the peripheral edge of the light-transmissive sealing layer 1052 may be soldered to the surface of the supporting frame 1051 away from the bottom plate 101 by the low-temperature glass solder H. For example, the low-temperature glass solder H may be enclosed in a ring shape and enclose the light-transmissive sealing layer 1052, so that the side surface of the light-transmissive sealing layer 1052 is soldered to the surface of the support frame 1051 away from the bottom plate 101.

It should be noted that the light-transmissive sealing layer 1052 may be a plate-shaped structure, and the light-transmissive sealing layer 1052 has two larger surfaces and a plurality of smaller surfaces, wherein the plurality of smaller surfaces are a plurality of sides of the light-transmissive sealing layer 1052. Alternatively, the two larger surfaces may be parallel. Alternatively, the two larger surfaces may be parallel to the plane of the base plate 101.

The middle region of the support frame 1051 is recessed toward the bottom plate 101 with respect to the peripheral edge of the support frame 1051. At least two steps J1 are formed at the connection position of the middle area of the support frame 1051 and the peripheral edge of the support frame 1051 at the side of the support frame 1051 far away from the bottom plate 101, that is, the connection position has at least two steps J1. It should be noted that fig. 7 to 10 and fig. 12 to 14 all illustrate that the connection has three steps J1, and optionally, the number of the steps J1 may also be 4, 5 or more. Optionally, the number of the steps may also be less than 3, for example, the number of the steps may also be 2 or 1.

In the embodiment of the present application, due to the existence of the step J1 at the connection portion between the middle region of the support frame 1051 and the peripheral edge of the support frame 1051, the contact area between the low-temperature glass solder H and the surface of the support frame 1051 away from the bottom plate 101 is relatively large, so that the adhesion firmness of the light-transmitting sealing layer 1052 and the support frame 1051 can be improved, and the sealing effect of the accommodating space surrounded by the bottom plate 101, the tube case 102, the upper cover 106, the support frame 1051 and the light-transmitting sealing layer 1052 is further improved.

In the embodiment of the present application, the material of the low-temperature glass solder H includes low-temperature glass, that is, low-melting glass. Optionally, the low temperature glass has a melting temperature of less than 450 degrees, which may be 400 degrees. Alternatively, the low temperature glass may be a lead-free low melting point glass; the low-temperature glass can be D40. Optionally, the low-temperature glass may also be a lead-containing low-melting-point glass, which is not limited in the embodiments of the present application. In the present embodiment, the unit "degree" used to indicate the temperature is all referred to as "degree centigrade".

When the support frame 1051 and the light-transmitting sealing layer 1052 are welded by using the low-temperature glass solder H, the low-temperature glass powder may be first placed in a mold with a desired shape (such as a ring shape) to be compacted, and then the structure composed of the compacted low-temperature glass powder is placed in a low-temperature furnace to be sintered, so as to obtain the low-temperature glass solder H with a desired shape. In the embodiment of the present application, after the annular low-temperature glass solder H is obtained, the low-temperature glass solder H may be placed on the support frame 1051 and surround the light-transmitting sealing layer 1052. Further, the structure composed of the support frame 1051, the translucent sealing layer 1052, and the low-temperature glass solder H is collectively placed in a low-temperature furnace and sintered, so that the low-temperature glass solder H melts and fills the gap between the edge of the translucent sealing layer 1052 and the support frame 1051, thereby welding the support frame 1051 and the translucent sealing layer 1052. The edge of the light-transmitting sealing layer 1052 and the supporting frame 1051 can be tightly attached by low-temperature glass solder H, so that the tightness of the accommodating space enclosed by the bottom plate 101, the tube shell 102, the upper cover 106, the supporting frame 1051 and the light-transmitting sealing layer 1052 is ensured.

In the embodiment of the application, the annular low-temperature glass solder H surrounds the light-transmitting sealing layer 1052 during welding, and can also limit the light-transmitting sealing layer 1052, so that the light-transmitting sealing layer 1052 is prevented from shifting during welding with the supporting frame 1051, and the welding precision of the light-transmitting sealing layer 1052 is ensured. It should be noted that the melting point of the brightness enhancement film attached to the surface of the light-transmissive sealing layer 1052 is usually higher than 450 ℃, and the low-temperature glass solder is used to solder the light-transmissive sealing layer 1052 to avoid damage to the brightness enhancement film.

Optionally, for the support frame 1051 in the shape of the Chinese character 'mu', before the light-transmitting sealing layer 1052 is placed on the support frame 1051, an adhesive material may be further coated on the un-hollowed-out area between the adjacent first hollowed-out areas W in the middle area of the support frame 1051, so as to further improve the adhesive strength between the support frame 1051 and the light-transmitting sealing layer 1052. The un-hollowed-out areas between adjacent first hollowed-out areas W may be referred to as support crossbars, and the adhesive material may include glass adhesive or epoxy sealant. Optionally, the low-temperature glass solder in the embodiment of the present application may also be replaced by other sealing materials, such as epoxy sealant or other sealing glues, which is not limited in the embodiment of the present application.

It should be noted that, in the related art, the support frame has a plurality of small grid-shaped panes, and a separate small glass needs to be correspondingly adhered to each small pane, so that the adhering process is complex, the adhering efficiency is low, and the adhering effect is difficult to control. In the embodiment of the application, the bonding is only carried out at the peripheral edge of the supporting frame and the position of the supporting transverse bar, or the bonding is only carried out at the peripheral edge of the supporting frame, so that the bonding process is simplified, the bonding efficiency is improved, and the bonding effect is easier to control. Adopt low temperature glass solder to seal support frame 1051 and printing opacity sealing layer 1052 in this application embodiment, this sealed effect is better, can improve the gas tightness of laser instrument, further prolongs the life of laser instrument.

It should be noted that, in the embodiment of the present application, the assembling or welding manner of the supporting frame 1051 and the first upper cover 1061 may refer to the description of the assembling or welding manner of the bearing structure 1072 and the second upper cover 1062; when the second hollow area K in the carrying structure 1072 is used for transmitting light emitted from the plurality of laser chips, the structures of the carrying structure 1072 and the support frame 1051 in the shape of Chinese character 'mu' may be the same, and the structures of the carrying structure 1072 and the support frame 1051 in the shape of Chinese character 'mu' may also be referred to each other, which is not described herein in detail in this embodiment of the present application.

It should be noted that, in the embodiment of the present application, the first upper cover 1061, the support frame 1051, the second upper cover 1062, and the carrying structure 1072 are taken as an example of independent structures, alternatively, the first upper cover 1061 and the support frame 1051 may also be integrally formed, and the second upper cover 1062 and the carrying structure 1072 may also be integrally formed. For example, a plate-shaped structure may be etched, so as to obtain the first upper cover 1061 and the supporting frame 1051 which are integrally formed; or a plate-shaped structure may be etched, so as to obtain the integrally formed second upper cover 1062 and the carrying structure 1072.

The base 101 and package 102 of laser 10 are described below:

fig. 15 is a schematic view of a partial structure of another laser provided in another embodiment of the present application, the partial structure includes a substrate 101 and a package 102 of the laser, and the substrate 101 and the package 102 shown in fig. 3 and any one of fig. 7 to 10 may be schematic views of a section b-b' of the substrate 101 and the package 102 shown in fig. 15.

Referring to fig. 15 and fig. 3 or any one of fig. 7 to 10, the laser 10 may further include: a conductive pin 108 penetrating through a sidewall of the package 102, an orthographic projection of the package 102 and the conductive pin 108 on the bottom plate 101 may be located at a peripheral edge Q2 of the bottom plate 101, and an orthographic projection of the laser chip 103 and the reflective prism 104 on the bottom plate 101 is located in a middle area C of the bottom plate 101; the peripheral edge Q2 of base plate 101 is recessed with respect to the central region C of base plate 101 toward the side away from package 102. In the embodiment of the present application, the orthographic projections of the conductive pins 108 on the bottom plate 101 are all located outside the middle area C of the bottom plate 101.

It should be noted that the conductive pin is electrically connected to an electrode of the laser chip to transmit an external power to the laser chip, so as to excite the laser chip to emit light.

Optionally, at least one step J2 is formed at the connection between the peripheral edge Q2 of the bottom plate 101 and the middle area C of the bottom plate 101 at the side of the bottom plate 101 close to the case 102, that is, the connection has at least one step J2. At least a partial orthographic projection of conductive lead 108 on base 101 is located on step J2, e.g., an orthographic projection of one of the two ends of conductive lead 108 extending into package 102 on base 101 is located on step J2.

Optionally, laser 10 includes a plurality of conductive leads 108, the plurality of conductive leads 108 being located on opposite sides of the central region C of base 101, and the junction of the peripheral edge Q2 of base 101 and the central region C of base 101 on the side of base 101 proximate package 102 having a plurality of steps J2 located on the opposite sides. Illustratively, the opposite sides are both sides of the middle region C of the base plate 101 in the row direction in which the laser chips are arranged.

Fig. 3, 7 to 10, and 15 illustrate an example in which the junction between the peripheral edge Q2 of the bottom plate 101 and the middle region C of the bottom plate 101 has only two steps J2 located on opposite sides of the middle region C.

Alternatively, the material of the bottom plate 101 may be a conductive material. For example, the material of the base plate may include copper or aluminum. The chassis 101 allows heat generated from the laser chip 103 when emitting light to be more quickly dissipated to prevent damage to the laser chip 103 by the heat.

It should be noted that, in the embodiment of the present application, the peripheral edge Q2 of the bottom plate 101 where the orthographic projection of the conductive pin 108 on the bottom plate 101 is located is recessed towards the side away from the package 102 relative to the middle area C of the bottom plate 101, so that the situation that the conductive pin 108 is contacted with the bottom plate 101 to affect the conductive performance of the conductive pin is avoided, and the normal power supply to the laser chip is ensured. In addition, the connecting part of the peripheral edge of the bottom plate and the middle area of the bottom plate is provided with steps, so that the strength of the bottom plate can be ensured on the premise of ensuring the conductivity of the conductive pins.

In the embodiment of the application, the machining process is performed on the bottom plate twice, and then the preparation of the bottom plate is completed. Three platforms with different heights are formed in the first machining process, and the heights of the three platforms are sequentially from high to low, namely a middle area of the bottom plate, a step at the joint of the peripheral edge of the bottom plate and the middle area, and the peripheral edge of the bottom plate. At this time, the thickness of the middle region of the base plate is higher than that of the prepared base plate. And after the pipe shell is welded on the bottom plate, a milling cutter is adopted to perform secondary machining on the middle area of the bottom plate so as to finish the preparation of the bottom plate. For example, after the first machining process, the height difference between the step in the bottom plate and the peripheral edge of the bottom plate may be 0.13 mm, the height difference between the middle area of the bottom plate and the step in the peripheral edge may be 0.4 mm, and the height difference between the middle area of the finished bottom plate and the step in the peripheral edge may be 0.2 mm. It should be noted that the above-mentioned height difference is only an example, alternatively, the height difference between the step in the bottom plate and the peripheral edge of the bottom plate may have other values, and the height difference between the middle area and the step in the peripheral edge may also have other values, such as 0.12 mm, 0.15 mm, or 0.3 mm.

Because the pipe shell and the bottom plate can be heated in the process of welding the pipe shell on the bottom plate, the high-temperature expansion coefficients of the pipe shell and the bottom plate are different generally, and the stresses in the pipe shell and the bottom plate can be pulled mutually, so that the middle area of the bottom plate is deformed. And then, the middle area of the bottom plate is machined for the second time, so that the middle area of the bottom plate becomes relatively flat, the accuracy and the reliability of the pasting position of the laser chip and the reflecting prism in the middle area of the bottom plate are further ensured, and the light collimation degree emitted by the laser is improved. Illustratively, the flatness of the middle region of the base plate in the embodiments of the present application may be less than 0.02 mm.

In addition, because the orthographic projection of the conductive pin on the bottom plate is positioned outside the middle area of the bottom plate in the embodiment of the application, the area of the middle area of the bottom plate is smaller, the flatness of the middle area of the bottom plate can be ensured more easily, and the middle area of the bottom plate can be flatter.

It should be noted that the sidewall of the package 102 has an opening, for example, the opening may have an aperture of 1.2 mm, and the conductive pin 108 may extend through the opening into the package 102. Alternatively, the diameter of the conductive pin 108 may be 0.55 millimeters; the shell 102 may be made of kovar.

In the embodiment of the present application, when assembling the laser, a ring-shaped solder structure (e.g., a ring-shaped glass bead) may be first placed in the opening on the sidewall of the package, and the conductive pin may be inserted through the solder structure and the opening where the solder structure is located. Then, the package is placed on the periphery of the base plate, annular silver-copper solder is placed between the base plate and the package, and then the base plate, the package and the structure of the conductive pins are placed in a high-temperature furnace for sealing and sintering. Because the glass can have the same physical new energy with kovar materials at the temperature of more than 800 ℃, the glass beads and the tube shell can be integrated after being sealed, sintered and solidified, and further the airtightness of the opening on the side wall of the tube shell is realized. After the sealing and sintering, the middle area of the bottom plate is machined for the second time, so that the flatness of the middle area is improved. And then arranging the laser chip and the reflecting prism in the middle area of the bottom plate, and finally fixing the upper cover and the collimating lens structure on the tube shell, or fixing the upper cover, the collimating lens structure, the support frame and the light-transmitting sealing layer on the tube shell, so as to finish the assembly of the laser.

It should be noted that the above-mentioned assembling process is only an exemplary process provided in the embodiment of the present application, the welding process adopted in each step may also be replaced by another process, and the sequence of each step may also be adapted to be adjusted, which is not limited in the embodiment of the present application.

In the above embodiments of the present invention, the base plate 101 and the case 102 are two separate structures that need to be assembled. Alternatively, base 101 and housing 102 may be integrally formed. Therefore, the situation that the bottom plate and the tube shell are wrinkled due to the fact that the bottom plate and the tube shell are different in thermal expansion coefficient when welded at high temperature can be avoided, the flatness of the bottom plate can be guaranteed, the reliability of the laser chip and the arrangement of the reflection prism on the bottom plate is guaranteed, and light emitted by the laser chip is emitted according to a preset light emitting angle.

Fig. 16 is a schematic structural diagram of another laser provided in another embodiment of the present application, fig. 17 is a schematic structural diagram of another laser provided in another embodiment of the present application, fig. 16 is an exploded structural diagram of the laser shown in fig. 17, and fig. 17 is a schematic diagram of a section b-b' in the laser shown in fig. 16. Fig. 16 is a view showing a laser device shown in fig. 17 in which a base plate 101 and a package 102 are integrally formed. As shown in fig. 16 and 17, the laser 10 may further include a ring-shaped bracket 109 welded to the side of the package 102 remote from the base 101. Alternatively, the surface of the cartridge 102 remote from the base plate 101 may be coated with a layer of kovar material (not shown) and the bracket 109 may be welded to the surface of the kovar material remote from the base plate 101.

Alternatively, the thermal conductivity of the base plate 101 and the package 102 is large, and thus heat generated by the laser chip 103 when emitting light can be dissipated through the base plate 101 relatively quickly. Illustratively, the material of the base 101 and the envelope 102 may comprise copper, such as copper oxide or copper oxide-free.

Optionally, the rigidity of the bracket 109 is higher, so that the rigidity of the whole laser can be increased, and the risk of damage to the laser can be reduced. Illustratively, the material of the support 109 includes one or more of stainless steel and kovar. Alternatively, the thickness of the holder 109 in the axial direction of the holder 109 ranges from 0.5 mm to 1.5 mm. For example, the thickness of the support 109 may be 0.5 mm or 1 mm.

It should be noted that the structure disposed on the side of the housing 102 away from the base 101 is made of kovar material or stainless steel, and the structure may be the upper cover 106. Because the kovar material and the stainless steel cannot be welded with the copper material by the parallel sealing technique, that is, when the base plate 101 and the case 102 are integrally formed and the material for manufacturing is copper, the upper cover 106 cannot be directly welded on the case 102 by the parallel sealing technique. The kovar material layer has been plated on the surface that the bottom plate 101 was kept away from to pipe shell 102 in this application embodiment, welds support 109 on the surface that the bottom plate 101 was kept away from on the kovar material layer, and the material of support 109 includes one or more in stainless steel and the kovar material, and then can adopt parallel seal welding technique to weld the surface that the bottom plate 101 was kept away from to support 109 with upper cover 106, has guaranteed that upper cover 106 is effectively fixed on pipe shell 102.

In the embodiment of the present application, since the base plate 101 and the case 102 are integrally formed, the process steps of welding the case 102 to the base plate 101 can be reduced, thereby simplifying the manufacturing process of the laser and reducing the manufacturing cost of the laser. And the fold of the bottom plate 101 when the pipe shell 102 is welded on the bottom plate 101 is avoided, the influence of high-temperature welding on the flatness of the bottom plate is reduced, and the flatness of the bottom plate is higher.

Fig. 16 and 17 are only for describing a case where the package 102 and the base plate 101 are integrally formed, and do not limit other structures in the laser or the positional relationship between the other structures. For example, fig. 16 and 17 exemplify a laser 10 including a plurality of collimating lens structures 1071 and a carrier structure 1072; alternatively, the laser 10 may include only one collimating lens structure, or the laser 10 may further include a supporting frame and a light-transmitting sealing layer, and the supporting frame may be any one of the supporting frames described above.

The laser provided by the embodiments of the present application is described below with respect to an exemplary set of parameters in the laser.

In the related art, the overall thickness of the laser is 10.9 mm, the distance between the top surface of the laser chip and the light-transmitting sealing layer is 2.42 mm, the distance between the top surface of the laser chip and the collimating lens layer is 4.1 mm, and the thickness of the bottom plate is 3.45 mm.

In the embodiment of the present application, the collimating lens structure is located on the side of the sealing structure far away from the bottom plate. When the light-transmitting sealing layer is supported by the support frame in the shape of the Chinese character mu, the whole thickness of the laser can be 9.3 millimeters, the distance between the top surface of the laser chip and the light-transmitting sealing layer is greater than or equal to 1.72 millimeters, the distance between the top surface of the laser chip and the collimating lens structure can be 2.42 millimeters, and the thickness of the bottom plate can be 3.45 millimeters. Wherein, the distance of the top surface of laser chip apart from collimating lens structure specifically indicates: and after the light emitted by the laser chip irradiates the corresponding reflecting prism, the distance from the central point of the light spot formed on the reflecting prism to the bottom surface of the collimating lens structure. When the light-transmitting sealing layer is supported by the square supporting frame, the whole thickness of the laser can be 8.8 mm, the distance between the top surface of the laser chip and the light-transmitting sealing layer can be 0.92 mm, the distance between the top surface of the laser chip and the collimating lens layer can be 2.62 mm, and the thickness of the bottom plate can be 3.45 mm.

Therefore, the laser provided by the embodiment of the application has the advantages that the whole thickness is small, the distance between the laser chip and the collimating lens is small, and the thinning and the miniaturization of the laser are facilitated.

In the laser provided by the embodiment of the application, the laser comprises a plurality of rows and columns of laser chips. The distance between adjacent laser chips in the first direction may be 2-4 mm, for example, 3 mm, and the first direction may be a light emitting direction of the laser chips. In a second direction perpendicular to the first direction, the distance between adjacent laser chips may be in a range of 3 to 6 mm, for example, may be 4 mm. Therefore, the laser chips in the laser device can be arranged more compactly, and the arrangement density of the laser chips is higher.

It should be noted that, the foregoing embodiments of the present application only illustrate several optional laser structures, and each component in the laser provided by the present application may be combined at will, so as to obtain lasers with different structures, and the present application does not limit the combination manner of each component. The components refer to a bottom plate, a tube shell, an upper cover, a supporting frame, a light-transmitting sealing layer, a bearing structure, a collimating lens structure and the like in the laser.

The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser, characterized in that the laser comprises:

a base plate;

a pipe shell;

the pipe shell and the bottom plate form an accommodating space,

2. The laser of claim 1, wherein an outer region of the upper cover is recessed toward a side away from the base plate relative to an inner region of the upper cover.

3. The laser of claim 2, wherein the thickness of the inner region of the upper cover is in the range of 0.2 mm to 0.5 mm.

4. A laser as claimed in claim 2 or 3, wherein the thickness of the outer region of the upper cover is less than or equal to 0.15 mm.

5. A laser device as claimed in any one of claims 1 to 4, wherein the surface of the upper cover remote from the base plate is planar.

6. The laser device according to any one of claims 1 to 5, wherein n is greater than or equal to 2, the first hollow areas are in a shape of a strip, the n first hollow areas are sequentially arranged along a width direction of the first hollow areas, and the first hollow areas are used for transmitting light emitted by at least two laser chips.

7. The laser as claimed in any one of claims 1 to 6, wherein the plurality of laser chips includes a plurality of rows and a plurality of columns of the laser chips, and each of the first hollow regions is configured to transmit light emitted from at least one row of the laser chips.

8. The laser device according to any one of claims 1 to 5, wherein n is 1, and the first hollow area is used for transmitting light emitted from the plurality of laser chips.

9. The laser of any one of claims 1 to 8, wherein the base plate is integrally formed with the envelope.

10. The laser of any one of claims 1 to 9, further comprising:

the periphery of the bearing structure is fixed on the surface, close to the bottom plate, in the inner side area of the upper cover, the middle area of the bearing structure is provided with a plurality of second hollowed-out areas, and the collimating lens structure covers one side, far away from the bottom plate, of the second hollowed-out areas;

the collimating lens structure is used for collimating and emitting light rays emitted by at least one laser chip reflected by the reflecting prism.