CN112815428A - Heat pump air conditioner - Google Patents
Heat pump air conditioner Download PDFInfo
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- CN112815428A CN112815428A CN202110185934.7A CN202110185934A CN112815428A CN 112815428 A CN112815428 A CN 112815428A CN 202110185934 A CN202110185934 A CN 202110185934A CN 112815428 A CN112815428 A CN 112815428A
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- Prior art keywords
- semiconductor cooling
- module
- heating
- air
- semiconductor
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
- F24F5/001—Compression cycle type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00007—Combined heating, ventilating, or cooling devices
- B60H1/00021—Air flow details of HVAC devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/52—Indication arrangements, e.g. displays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/88—Electrical aspects, e.g. circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00007—Combined heating, ventilating, or cooling devices
- B60H1/00021—Air flow details of HVAC devices
- B60H2001/0015—Temperature regulation
Abstract
The invention discloses a heat pump air conditioner, which comprises a main air channel module, a semiconductor cooling and heating module and a fan module, wherein the main air channel module comprises an outer sleeve, the outer sleeve is provided with an inner sleeve, an air channel I is formed between the outer sleeve and the inner sleeve, an air channel II is formed in the inner sleeve, one end of the outer sleeve and one end of the inner sleeve are provided with a common air inlet I, the other end of the outer sleeve and the other end of the inner sleeve are respectively provided with an air outlet I and an air outlet II, the semiconductor cooling and heating module comprises a semiconductor cooling and heating sheet. Compared with the prior art, the invention has the following beneficial effects: controlling the positive and negative electricity input into the semiconductor cooling and heating module to ensure that the entering air flow exchanges heat with the semiconductor cooling and heating module to form hot air flow which is discharged from the first air outlet to carry out heating; exchanging the positive and negative, so that the entering air flow exchanges heat with the semiconductor cooling and heating module to form cold air flow which is discharged from the first air outlet, and cooling; simple installation, low manufacturing cost and no use of cooling liquid.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat pump air conditioner.
Background
People often need to carry out regulation control to the temperature of target place in the real life, big environment is like at home space, the railway carriage is inside, the office space, the cinema etc, little environment is like computer CPU heat dissipation, the heat dissipation of LED light source etc, new energy car battery temperature in addition will control and just can normally work in certain scope, the refrigeration mode of current heat pump air conditioner is mostly through the compressor, the refrigerant circulation refrigeration, heat then through the heating wire heating, the structure is complicated, it is big to occupy the space, the cost is higher, it is big not energy-conserving to consume the electricity, and the refrigerant has certain harm to the environment, damage to ozone like freon. In order to solve the problem, people develop a heat pump air conditioner, the related prior art has CN110469931A, the technology uses a semiconductor refrigeration sheet to refrigerate and heat, the defects of complex structure and environmental pollution of the traditional refrigerant equipment are overcome, the waste energy is timely led out through a temperature guide module, and the refrigeration and heating efficiency is improved.
Disclosure of Invention
In view of the above-mentioned drawbacks, the present inventors have made active research and innovation to create a heat pump air conditioner with a new structure, so that the heat pump air conditioner has a higher industrial utility value.
The invention realizes the purpose through the following technical scheme:
the utility model provides a heat pump air conditioner, including main wind channel module, the semiconductor changes in temperature module, the fan module, wherein main wind channel module includes the outer tube, the outer tube the inside is with the fixed interior sleeve pipe that is equipped with of axial, the outer tube, passageway between the inner tube constitutes the air flue one, interior sleeve pipe in the passageway constitutes the air flue two, the outer tube, interior sheathed tube one end is equipped with common air inlet one, the outer tube, the inner tube other end is equipped with gas outlet one respectively, gas outlet two, the semiconductor changes in temperature module includes the semiconductor changes in temperature piece, including be equipped with 1 or more than 1 mounting hole on the sleeve pipe, the size of mounting hole, the shape is the same with the semiconductor changes in temperature piece, the embedding of semiconductor changes in temperature piece is fixed in each mounting hole, a surface of semiconductor changes in temperature.
Further, the two surfaces of each semiconductor cold and warm piece are provided with radiators.
Furthermore, a wedge-shaped protrusion or a corrugated protrusion is fixedly arranged on the inner side wall of the outer sleeve corresponding to the position of the semiconductor cooling and heating sheet.
The integrated controller is electrically connected with the fan module, the semiconductor cooling and heating module and the touch display respectively.
The semiconductor cooling and heating module is in a working state, and the circuit is powered on in an electric mode that the semiconductor cooling and heating sheet faces to the first air passage to refrigerate and heat; when the critical temperature is monitored to be between a and b ℃, the integrated controller controls the driving power supply to disconnect the circuit, and the semiconductor cooling and heating module is in a power-off state; when the critical temperature is monitored to be lower than a critical value b ℃, the integrated controller controls the driving power supply to switch on the circuit, so that the semiconductor cooling and heating module is in a working state, and the circuit is switched on in such a way that the semiconductor cooling and heating sheet heats towards the first surface of the air passage and supplies power to the semiconductor cooling and heating sheet in an electrical mode of cooling towards the first surface of the air passage; a. the value range of b is as follows: a is more than or equal to 25, and b is less than or equal to 25.
Further measures, a = 28 ℃ and b =24 ℃.
Compared with the prior art, the invention has the following beneficial effects:
1. a specific main air duct module is designed, air flow enters from an air inlet I and then is divided into two parts by an outer sleeve and an inner sleeve under the driving of a fan, then enters through an air duct I and an air duct II, the positive and negative of direct current of a semiconductor cooling and heating module on the inner sleeve of the main air duct module are controlled, the air flow entering the air duct I is subjected to heat exchange with the semiconductor cooling and heating module to obtain heat, the heat is heated, hot air flow is formed to flow out and is discharged from an air outlet I, the air flow entering the air duct II is subjected to heat exchange with the semiconductor cooling and heating module, the temperature is reduced, cold air flow is; controlling the positive and negative of the direct current supplied by the semiconductor cooling and heating module to be exchanged, so that the temperature of the air flow entering the air passage I is reduced with the heat exchange temperature of the semiconductor cooling and heating module to form cold air flow to flow out of the air outlet I and be discharged, the temperature of the air flow entering the air passage II is increased with the heat exchange of the semiconductor cooling and heating module to form hot air flow to flow out of the air outlet II and be discharged, and the target environment is cooled and refrigerated; the wedge-shaped protrusions or the corrugated protrusions of the outer sleeve are set to disturb the air flow, so that the heat exchange effect of the air flow and the semiconductor cooling and heating module is enhanced.
2. The refrigerating and heating mode is realized through the semiconductor cooling and heating module, the structure is simple, the installation is simple, the manufacturing cost is low, cooling liquid is not used, and environmental pollution caused by the cooling liquid is avoided.
3. The temperature control module is provided with a temperature sensor and can monitor the temperature of the environment, the temperature data monitored by the temperature control module is fed back to the integrated controller, when the critical temperature is monitored to exceed a critical value of a ℃, the integrated controller controls the driving power supply to switch on the circuit, so that the semiconductor cooling and heating module is in a working state, and the circuit is switched on in such a way that the semiconductor cooling and heating sheet is powered in an electrical mode of cooling towards the surface of the air passage I and heating towards the surface of the air passage I; when the critical temperature is monitored to be between a and b ℃, the integrated controller controls the driving power supply to disconnect the circuit, and the semiconductor cooling and heating module is in a power-off state; when the critical temperature is monitored to be lower than the critical value b ℃, the integrated controller controls the driving power supply to enable the circuit to be connected, the semiconductor cooling and heating module is enabled to be in a working state, the circuit is connected in an electric mode that the semiconductor cooling and heating sheet heats towards the first surface of the air passage and cools towards the first surface of the air passage, after a user is installed according to the above mode, the integrated controller can automatically control target places such as automobile carriages and rooms to maintain relatively constant temperature, and the touch display can be used for cooling or heating the target places such as the automobile carriages and the rooms which need temperature control and regulation, so that the target places such as the automobile carriages and the rooms can maintain relatively constant temperature.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view showing a structure of a heat pump air conditioner according to the present invention;
FIG. 2 is a schematic view of a mounting hole structure of a heat pump air conditioner according to the present invention;
FIG. 3 is a schematic circuit diagram of a heat pump air conditioner according to the present invention;
fig. 4 is a structural view of a heat pump for a heat pump air conditioner according to the present invention.
Description of reference numerals: 1. a main air duct module; 2. a semiconductor cooling and heating module; 3. a fan module; 4. a solar panel; 5. a storage battery; 6. a drive power supply; 7. a temperature control module; 8. an integrated controller; 10. an outer wind-dispelling duct; 11. an inner wind-dispelling duct; air diffusing holes 11 a; 12. a touch display; 100, a first air inlet; 101. an outer sleeve; 102. an inner sleeve; 101a, airway one; 102a, an air passage II; 102b, a mounting hole, 103, a first air outlet; 104. a second air outlet; 105. a heat-insulating layer; 200. a semiconductor cold and warm sheet; 201. heat sink 202, bumps; 300. a fan.
Detailed Description
The invention is further illustrated by the following examples and figures:
as shown in fig. 1-3, a heat pump air conditioner comprises a main air duct module (1), a semiconductor cooling and heating module (2), a fan module (3), a solar panel (4), a storage battery (5), a driving power supply (6), a temperature control module (7), an integrated controller (8), an outer wind dispelling pipe (10), an inner wind dispelling pipe (11) and a touch display (12), wherein the main air duct module (1) comprises an outer sleeve (101), an inner sleeve (102) is coaxially and fixedly arranged inside the outer sleeve (101), a first air passage (101 a) is formed by a passage between the outer sleeve (101) and the inner sleeve (102), a second air passage (102 a) is formed by a passage inside the inner sleeve (102), one end of the outer sleeve (101) and one end of the inner sleeve (102) are provided with a common first air inlet (100), and the other end of the outer sleeve (101) and the inner, A second air outlet (104), wherein air flow enters from the first air inlet (100) and then is divided into two parts by the outer sleeve (101) and the inner sleeve (102) and then enters through the first air passage (101 a) and the second air passage (102 a), the air flow entering the first air passage (101 a) is discharged from the first air outlet (103), the air flow entering the second air passage (102 a) is discharged through the second air outlet (104), dust removing filter screens are respectively arranged at outlets of the first air outlet (103) and the second air outlet (104), the first air outlet (103) is communicated with the inner air distribution duct (11), the second air outlet (104) is communicated with the outer air distribution duct (10), the semiconductor cooling and heating module (2) comprises semiconductor cooling and heating sheets (200), 1 or more than 1 mounting hole (102 b) is formed in the inner sleeve (102), the size and the shape of each mounting hole (102 b) are the same as those of the semiconductor cooling and heating sheets (200), and the semiconductor cooling and heating sheets (200) are embedded and fixed, gaps of the semiconductor cold and warm sheets (200) on the mounting hole (102 b) are sealed by glue, the semiconductor cold and warm sheets (200) are embedded and fixed in the mounting hole (102 b) and become a part of a tube body of the inner sleeve (102), one surface of each semiconductor cold and warm sheet (200) faces to the first air channel (101 a), the other surface of each semiconductor cold and warm sheet faces to the second air channel (102 a), 1 or more than 1 semiconductor cold and warm sheet (200) is installed on the inner sleeve (102), the position of the inner sleeve (102) where the semiconductor cold and warm sheets (200) are installed is set to be square or regular polygon in cross section, each surface of the inner sleeve (102) is embedded with the semiconductor cold and warm sheet (200), the heating or cooling functional surface of each semiconductor cold and warm sheet (200) is set to be uniformly oriented, the semiconductor cold and warm sheets (200) are connected in a parallel circuit mode, so as to ensure that when a direct current power supply is connected to the same side, each surface of each semiconductor cold and or the air conditioner is cooled simultaneously, each surface of the other same side surface of each semiconductor cooling and heating sheet (200) corresponding to the inner sleeve (102) is cooled simultaneously or heated simultaneously, two surfaces of each semiconductor cooling and heating sheet (200) are respectively provided with a radiator (201), a wedge-shaped protrusion or a corrugated protrusion (202) is fixedly arranged on the inner side wall of the outer sleeve (101) corresponding to the position of the semiconductor cooling and heating sheet, the wedge-shaped protrusion or the corrugated protrusion (202) disturbs air flow and strengthens the heat exchange effect, a foam material heat insulation layer (105) is arranged on the outer side of the outer sleeve (101), the fan module (3) comprises a fan (300) which is fixedly arranged in the air inlet I (100), and the fan (300) provides air inlet driving; the storage battery (5) is connected with the solar panel (4), the storage battery (5) can be charged by utilizing the solar panel (4), the storage battery (5) is provided with a connecting terminal for charging, the storage battery (5) is connected with the driving power supply (6), an external direct current power supply can also directly supply power to the driving power supply (6), the driving power supply (6) is electrically connected with the integrated controller (8), the integrated controller (8) is respectively coupled with the fan module (3), the semiconductor cooling and heating module (2), the temperature control module (7) and the touch display (12), the storage battery (5) respectively supplies power to the fan module (3), the semiconductor cooling and heating module (2), the temperature control module (7) and the touch display (12) through the driving power supply (6) and the integrated controller (8), and the driving power supply (6) is controlled by the integrated controller (8) to supply direct current to the semiconductor cooling and heating module (2), The negative polarity is exchanged, the start and stop of the fan (300) can be controlled, the temperature control module (7) is provided with a temperature sensor and can monitor the temperature of the environment, the temperature data monitored by the temperature control module (7) is fed back to the integrated controller (8), when the critical temperature is monitored to exceed a critical value a ℃, the integrated controller (8) controls the driving power supply (6) to switch on the circuit, the semiconductor cooling and heating module (2) is in a working state, and the circuit is switched on in such a way that the semiconductor cooling and heating sheet (200) supplies power in an electrical mode that the surface facing the air passage one (101 a) is cooled and the surface facing the air passage one (102 a) is heated; when the critical temperature is monitored to be between a and b ℃, the integrated controller (8) controls the driving power supply (6) to disconnect the circuit, and the semiconductor cooling and heating module (2) is in a power-off state; when the critical temperature is monitored to be lower than a critical value b ℃, the integrated controller (8) controls the driving power supply (6) to switch on the circuit, so that the semiconductor cooling and heating module (2) is in a working state, and the electric mode that the circuit is switched on supplies power in an electric mode that the semiconductor cooling and heating sheet (200) heats towards the surface of the air passage I (101 a) and cools towards the surface of the air passage I (102 a); a. the value range of b is as follows: a is more than or equal to 25, b is less than or equal to 25, the optimal values of a and b are that a is 28 ℃ and b is 24 ℃; the touch display (12) is used for displaying the working state and the function buttons of each module and setting values of a and b, and can send an operation instruction to the integrated controller (8), the integrated controller (8) receives the operation instruction and then controls and operates the fan module (3), the driving power supply (6) and the semiconductor cooling and heating module (2), the inner wind-dispelling duct (11) is made of soft materials such as plastics and rubber, the inner wind-dispelling duct (11) is provided with a gas diffusion hole (11 a) for gas diffusion, when the device is placed, the inner wind-dispelling duct (11) is arranged in the environment needing temperature control such as a compartment, a room and a cabin, the outer wind-dispelling duct (10) is communicated with the environment needing no temperature control, in order to enhance convection, the inner wind-dispelling duct (11) is placed at a relative distance as far as possible in the environment needing temperature control, and the outer wind-dispelling duct (10) is also placed at a relative distance as far as possible in the environment needing no temperature control, after the user installs the device according to the method, the device can automatically control target places such as automobile carriages, rooms and the like to maintain relatively constant temperature through the integrated controller (8), the target places needing temperature control and regulation such as automobile carriages, rooms and the like can be cooled or heated through operation of the touch display (12), the storage battery is charged uninterruptedly for 24 hours in all weather by solar energy, even under the condition of no external power supply, the heat pump air conditioner can perform temperature regulation work for 24 hours in all weather, and the target places such as automobile carriages, rooms and the like can maintain relatively constant temperature in all weather.
The semiconductor cooling and heating sheet (200) in the embodiment is also called a thermoelectric cooling sheet, and is a heat pump (as shown in fig. 4), the semiconductor cooling and heating sheet (200) is a heat transfer tool, and by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the purposes of cooling one surface and heating the other surface can be realized; when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor cold and warm sheet (200) is used as a special cold source and a special heat source, and has the following advantages and characteristics in technical application: 1. the device does not need any refrigerant, can continuously work, has no pollution source and no rotating part, can not generate a rotation effect, has no sliding part, is a solid piece, has no vibration and noise during working, has long service life and is easy to install. 2. The semiconductor cold and warm sheet (200) has two functions, namely refrigeration and heating, and the cold end is changed into the hot end by changing the current direction; thus, the use of a single piece can replace separate heating and cooling systems and interchange the two systems as the direction of current flow changes. 3. The semiconductor cooling and heating sheet (200) is a current transduction type sheet member, can realize high-precision temperature control through the control of input current, and is easy to realize remote control, program control and computer control by adding a temperature detection and control means, thereby being convenient for forming an automatic control system. 4. The semiconductor cold and warm piece (200) has very small thermal inertia, the refrigerating and heating time is very short, and the refrigerating piece can reach the maximum temperature difference when the power is on for less than one minute under the condition that the heat dissipation of the hot end is good and the cold end is idle. 5. The temperature difference range of the semiconductor cold and warm sheet (200) can be realized from the positive temperature of 90 ℃ to the negative temperature of 130 ℃.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (6)
1. A heat pump air conditioner characterized in that: the air conditioner comprises a main air channel module (1), a semiconductor cooling and heating module (2) and a fan module (3), wherein the main air channel module (1) comprises an outer sleeve (101), an inner sleeve (102) is coaxially and fixedly arranged in the outer sleeve (101), a channel between the outer sleeve (101) and the inner sleeve (102) forms an air passage I (101 a), a channel in the inner sleeve (102) forms an air passage II (102 a), one end of the outer sleeve (101) and one end of the inner sleeve (102) are provided with a common air inlet I (100), the other end of the outer sleeve (101) and the other end of the inner sleeve (102) are respectively provided with an air outlet I (103) and an air outlet II (104), the semiconductor cooling and heating module (2) comprises a semiconductor cooling and heating sheet (200), 1 or more than 1 mounting hole (102 b) is arranged on the inner sleeve (102), and the, the semiconductor cooling and heating sheet (200) is embedded and fixed in each mounting hole (102 b), one surface of the semiconductor cooling and heating sheet (200) faces to the first air channel (101 a), the other surface of the semiconductor cooling and heating sheet faces to the second air channel (102 a), and the fan module (3) comprises a fan (300) which is installed and fixed in the first air inlet (100).
2. A heat pump air conditioner according to claim 1, characterized in that: and radiators (201) are arranged on two surfaces of each semiconductor cold-warm fin (200).
3. A heat pump air conditioner according to claim 1 or 2, characterized in that: wedge-shaped protrusions or corrugated protrusions (202) are fixedly arranged on the inner side wall of the outer sleeve (101) and correspond to the positions of the semiconductor cold-warm fins.
4. A heat pump air conditioner according to claim 3, characterized in that: the cooling and heating integrated device is characterized by further comprising a driving power supply (6), an integrated controller (8) and a touch display (12), wherein the driving power supply (6) is electrically connected with the integrated controller (8), and the integrated controller (8) is respectively coupled with the fan module (3), the semiconductor cooling and heating module (2) and the touch display (12).
5. A heat pump air conditioner according to claim 4, characterized in that: the temperature control system is characterized by further comprising a temperature control module (7) which is coupled with the integrated controller (8), the temperature control module (7) comprises a temperature sensor capable of monitoring the temperature of the environment, the temperature data monitored by the temperature control module (7) is fed back to the integrated controller (8), when the critical temperature is monitored to exceed a critical value a ℃, the integrated controller (8) controls the driving power supply (6) to enable the circuit to be switched on, the semiconductor cooling and heating module (2) is in a working state, and the circuit is switched on in such a way that the semiconductor cooling and heating sheet (200) is powered on in an electrical mode that the surface facing the air passage one (101 a) cools and the surface facing the air passage one (102 a) heats; when the critical temperature is monitored to be between a and b ℃, the integrated controller (8) controls the driving power supply (6) to disconnect the circuit, and the semiconductor cooling and heating module (2) is in a power-off state; when the critical temperature is monitored to be lower than a critical value b ℃, the integrated controller (8) controls the driving power supply (6) to switch on the circuit, so that the semiconductor cooling and heating module (2) is in a working state, and the electric mode that the circuit is switched on supplies power in an electric mode that the semiconductor cooling and heating sheet (200) heats towards the surface of the air passage I (101 a) and cools towards the surface of the air passage I (102 a); a. the value range of b is as follows: a is more than or equal to 25, and b is less than or equal to 25.
6. A heat pump air conditioner according to claim 5, characterized in that: a = 28 ℃ and b =24 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110185934.7A CN112815428A (en) | 2021-02-13 | 2021-02-13 | Heat pump air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110185934.7A CN112815428A (en) | 2021-02-13 | 2021-02-13 | Heat pump air conditioner |
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| Publication Number | Publication Date |
|---|---|
| CN112815428A true CN112815428A (en) | 2021-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110185934.7A Pending CN112815428A (en) | 2021-02-13 | 2021-02-13 | Heat pump air conditioner |
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| CN (1) | CN112815428A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1343362A1 (en) * | 2002-03-07 | 2003-09-10 | Hewlett-Packard Company (a Delaware corporation) | Cooling system for elecronic devices |
| CN101885314A (en) * | 2010-07-20 | 2010-11-17 | 林友旺 | Vehicle solar-cell-powered semiconductor air-conditioning system |
| CN108224640A (en) * | 2018-02-04 | 2018-06-29 | 郑州蓝之夜电子科技有限公司 | Integral ceiling cooling fan and its control method based on semiconductor refrigerating |
| CN207955251U (en) * | 2017-11-29 | 2018-10-12 | 卡孚特能源技术（深圳）有限公司 | It is a kind of novel to protect efficient seat-air conditioning system |
| CN109631206A (en) * | 2019-01-14 | 2019-04-16 | 杭州捷帆科技有限公司 | A kind of humidity control system for enclosure space |
| CN110739386A (en) * | 2019-11-15 | 2020-01-31 | 刘小江 | casing type semiconductor assembly, air conditioner and thermoelectric power generation device |
-
2021
- 2021-02-13 CN CN202110185934.7A patent/CN112815428A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1343362A1 (en) * | 2002-03-07 | 2003-09-10 | Hewlett-Packard Company (a Delaware corporation) | Cooling system for elecronic devices |
| CN101885314A (en) * | 2010-07-20 | 2010-11-17 | 林友旺 | Vehicle solar-cell-powered semiconductor air-conditioning system |
| CN207955251U (en) * | 2017-11-29 | 2018-10-12 | 卡孚特能源技术（深圳）有限公司 | It is a kind of novel to protect efficient seat-air conditioning system |
| CN108224640A (en) * | 2018-02-04 | 2018-06-29 | 郑州蓝之夜电子科技有限公司 | Integral ceiling cooling fan and its control method based on semiconductor refrigerating |
| CN109631206A (en) * | 2019-01-14 | 2019-04-16 | 杭州捷帆科技有限公司 | A kind of humidity control system for enclosure space |
| CN110739386A (en) * | 2019-11-15 | 2020-01-31 | 刘小江 | casing type semiconductor assembly, air conditioner and thermoelectric power generation device |
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Application publication date: 20210518 |