CN112802783B - 基于往复升缩的半导体晶圆外壁清洗装置和方法 - Google Patents
基于往复升缩的半导体晶圆外壁清洗装置和方法 Download PDFInfo
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- CN112802783B CN112802783B CN202110365952.3A CN202110365952A CN112802783B CN 112802783 B CN112802783 B CN 112802783B CN 202110365952 A CN202110365952 A CN 202110365952A CN 112802783 B CN112802783 B CN 112802783B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 89
- 238000009434 installation Methods 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 68
- 238000009423 ventilation Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000011010 flushing procedure Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 7
- 238000000746 purification Methods 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract 8
- 230000006872 improvement Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
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- 238000004519 manufacturing process Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
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- 230000002035 prolonged effect Effects 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B08B1/143—
-
- B08B1/20—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110365952.3A CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
Applications Claiming Priority (1)
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CN202110365952.3A CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
Publications (2)
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CN112802783A CN112802783A (zh) | 2021-05-14 |
CN112802783B true CN112802783B (zh) | 2021-06-18 |
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CN202110365952.3A Active CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113333989B (zh) * | 2021-05-29 | 2023-06-06 | 安徽佳之合新材料科技有限公司 | 基于水冷散热的铝合金栏杆焊接用快速冷却设备 |
CN114589182B (zh) * | 2022-01-30 | 2023-02-28 | 江苏亚电科技有限公司 | 一种晶圆水平清洗装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105957821A (zh) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | 一种晶圆刷洗摆臂装置 |
CN206573606U (zh) * | 2017-03-17 | 2017-10-20 | 中芯国际集成电路制造(天津)有限公司 | 旋转检测装置和基板清洗设备 |
US20200243351A1 (en) * | 2019-01-30 | 2020-07-30 | Ebara Corporation | Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool |
CN111744836A (zh) * | 2019-03-29 | 2020-10-09 | 中芯集成电路(宁波)有限公司 | 晶圆清洗装置及控制系统 |
WO2020251908A1 (en) * | 2019-06-10 | 2020-12-17 | Kla Corporation | In-situ process chamber chuck cleaning by cleaning substrate |
CN112588665A (zh) * | 2020-11-20 | 2021-04-02 | 临漳县澳皇网络科技有限公司 | 一种晶圆加工用湿法清洗设备 |
-
2021
- 2021-04-06 CN CN202110365952.3A patent/CN112802783B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105957821A (zh) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | 一种晶圆刷洗摆臂装置 |
CN206573606U (zh) * | 2017-03-17 | 2017-10-20 | 中芯国际集成电路制造(天津)有限公司 | 旋转检测装置和基板清洗设备 |
US20200243351A1 (en) * | 2019-01-30 | 2020-07-30 | Ebara Corporation | Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool |
CN111744836A (zh) * | 2019-03-29 | 2020-10-09 | 中芯集成电路(宁波)有限公司 | 晶圆清洗装置及控制系统 |
WO2020251908A1 (en) * | 2019-06-10 | 2020-12-17 | Kla Corporation | In-situ process chamber chuck cleaning by cleaning substrate |
CN112588665A (zh) * | 2020-11-20 | 2021-04-02 | 临漳县澳皇网络科技有限公司 | 一种晶圆加工用湿法清洗设备 |
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Effective date of registration: 20220805 Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 210000 room 605-7, Tongxi building, 1347 Shuanglong Avenue, Jiangning District, Nanjing City, Jiangsu Province (Jiangning Development Zone) Patentee before: Yadian Technology Nanjing Co.,Ltd. Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |