CN112802783A - 基于往复升缩的半导体晶圆外壁清洗装置和方法 - Google Patents
基于往复升缩的半导体晶圆外壁清洗装置和方法 Download PDFInfo
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- CN112802783A CN112802783A CN202110365952.3A CN202110365952A CN112802783A CN 112802783 A CN112802783 A CN 112802783A CN 202110365952 A CN202110365952 A CN 202110365952A CN 112802783 A CN112802783 A CN 112802783A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 89
- 238000009434 installation Methods 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 68
- 238000009423 ventilation Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000011010 flushing procedure Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 7
- 238000000746 purification Methods 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract 8
- 230000006872 improvement Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
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- 238000009713 electroplating Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110365952.3A CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110365952.3A CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
Publications (2)
Publication Number | Publication Date |
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CN112802783A true CN112802783A (zh) | 2021-05-14 |
CN112802783B CN112802783B (zh) | 2021-06-18 |
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Family Applications (1)
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CN202110365952.3A Active CN112802783B (zh) | 2021-04-06 | 2021-04-06 | 基于往复升缩的半导体晶圆外壁清洗装置和方法 |
Country Status (1)
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CN (1) | CN112802783B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113333989A (zh) * | 2021-05-29 | 2021-09-03 | 安徽佳之合新材料科技有限公司 | 基于水冷散热的铝合金栏杆焊接用快速冷却设备 |
CN115716065A (zh) * | 2022-12-03 | 2023-02-28 | 深圳市超快激光科技有限公司 | 一种多晶硅表面清洁装置 |
CN115732313A (zh) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | 一种晶圆水平清洗装置的清洗方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105957821A (zh) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | 一种晶圆刷洗摆臂装置 |
CN206573606U (zh) * | 2017-03-17 | 2017-10-20 | 中芯国际集成电路制造(天津)有限公司 | 旋转检测装置和基板清洗设备 |
US20200243351A1 (en) * | 2019-01-30 | 2020-07-30 | Ebara Corporation | Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool |
CN111744836A (zh) * | 2019-03-29 | 2020-10-09 | 中芯集成电路(宁波)有限公司 | 晶圆清洗装置及控制系统 |
WO2020251908A1 (en) * | 2019-06-10 | 2020-12-17 | Kla Corporation | In-situ process chamber chuck cleaning by cleaning substrate |
CN112588665A (zh) * | 2020-11-20 | 2021-04-02 | 临漳县澳皇网络科技有限公司 | 一种晶圆加工用湿法清洗设备 |
-
2021
- 2021-04-06 CN CN202110365952.3A patent/CN112802783B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105957821A (zh) * | 2016-04-28 | 2016-09-21 | 中国电子科技集团公司第四十五研究所 | 一种晶圆刷洗摆臂装置 |
CN206573606U (zh) * | 2017-03-17 | 2017-10-20 | 中芯国际集成电路制造(天津)有限公司 | 旋转检测装置和基板清洗设备 |
US20200243351A1 (en) * | 2019-01-30 | 2020-07-30 | Ebara Corporation | Cleaning apparatus of cleaning tool, substrate processing apparatus, and cleaning method of cleaning tool |
CN111744836A (zh) * | 2019-03-29 | 2020-10-09 | 中芯集成电路(宁波)有限公司 | 晶圆清洗装置及控制系统 |
WO2020251908A1 (en) * | 2019-06-10 | 2020-12-17 | Kla Corporation | In-situ process chamber chuck cleaning by cleaning substrate |
CN112588665A (zh) * | 2020-11-20 | 2021-04-02 | 临漳县澳皇网络科技有限公司 | 一种晶圆加工用湿法清洗设备 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113333989A (zh) * | 2021-05-29 | 2021-09-03 | 安徽佳之合新材料科技有限公司 | 基于水冷散热的铝合金栏杆焊接用快速冷却设备 |
CN115732313A (zh) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | 一种晶圆水平清洗装置的清洗方法 |
CN115732313B (zh) * | 2022-01-30 | 2024-04-05 | 江苏亚电科技股份有限公司 | 一种晶圆水平清洗装置的清洗方法 |
CN115716065A (zh) * | 2022-12-03 | 2023-02-28 | 深圳市超快激光科技有限公司 | 一种多晶硅表面清洁装置 |
Also Published As
Publication number | Publication date |
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CN112802783B (zh) | 2021-06-18 |
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Effective date of registration: 20220805 Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 210000 room 605-7, Tongxi building, 1347 Shuanglong Avenue, Jiangning District, Nanjing City, Jiangsu Province (Jiangning Development Zone) Patentee before: Yadian Technology Nanjing Co.,Ltd. Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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CP03 | Change of name, title or address | ||
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |