CN112799242A - Processing method of LCD (liquid crystal display) liquid crystal screen attaching crystal grains - Google Patents
Processing method of LCD (liquid crystal display) liquid crystal screen attaching crystal grains Download PDFInfo
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- CN112799242A CN112799242A CN202110230297.0A CN202110230297A CN112799242A CN 112799242 A CN112799242 A CN 112799242A CN 202110230297 A CN202110230297 A CN 202110230297A CN 112799242 A CN112799242 A CN 112799242A
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- 239000013078 crystal Substances 0.000 title claims abstract description 39
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 12
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 189
- 238000012545 processing Methods 0.000 claims abstract description 35
- 238000012937 correction Methods 0.000 claims abstract description 22
- 230000007547 defect Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000001514 detection method Methods 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 13
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 5
- 238000011056 performance test Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 230000007306 turnover Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000005022 packaging material Substances 0.000 abstract description 4
- 238000005056 compaction Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 238000013507 mapping Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a processing method of LCD (liquid crystal display) liquid crystal screen bonded crystal grains, which comprises loading positioning processing, liquid crystal screen loading processing and positioning bonding processing, wherein the wafer loading processing is sequentially provided with a wafer feeding process, an IC picking process, an IC overturning process and an IC positioning correction process; LCD pay-off assembly line process, LCD vision correction process and ACF pad pasting process have been set gradually in LCD screen material loading processing, and location laminating processing has set gradually IC & LCD vision alignment process, and pre-compaction process, this press process and ejection of compact assembly line process or FOG material loading assembly line process, IC & LCD vision alignment process front end all is connected with IC location correction process and ACF pad pasting process, and can increase IC AOI and detect at the process between the material loading location processing, is convenient for select the use to the IC crystalline grain of defect. The invention can be suitable for processing products with different requirements, reduces production links, and reduces production cost, packaging material cost and transportation cost.
Description
Technical Field
The invention relates to the field of LCD (liquid crystal display) production, in particular to a processing method of an LCD screen attaching crystal grain.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer substrate, is formed. Then, a wafer foundry uses a series of processes such as a photolithography machine to form the required functional circuit on the wafer.
Most COG automated production equipment in the market at present uses the mode material loading that has chosen the crystalline grain box, through IC pay-off to equipment, and then through IC location correction and IC & LCD vision counterpoint, wherein the anterior segment manufacturing procedure of IC pay-off is: and cutting the whole wafer into single IC crystal grains, selecting the crystal grains, placing the crystal grains into a crystal grain box, performing AOI defect detection, selecting defective products, and packaging the good products to a downstream manufacturer. However, to prevent damage to the IC die during transportation, multiple packaging and protection of the die are required before transportation. There are more intermediate stages from the IC to the front end of the die box loading, where the costs of production, packaging materials and transportation are higher. For this reason, it is necessary to reduce the cost and thereby increase the profit.
Disclosure of Invention
The invention aims to provide a processing method for attaching an IC crystal grain to an LCD screen, which has the advantages of reducing production links, production cost, packaging material cost and transportation cost and solves the problems in the background art.
In order to achieve the above object, the present invention provides the following technical solution, a method for processing an LCD liquid crystal panel to attach an IC die, comprising:
the method comprises the steps of wafer feeding, IC picking, IC turning and IC positioning correction;
the LCD screen feeding processing comprises an LCD feeding assembly line process, an LCD vision correction process and an ACF film pasting process in sequence;
positioning, laminating and processing, wherein an IC & LCD vision alignment procedure, a prepressing procedure, a local pressing procedure, a discharging assembly line procedure or an FOG feeding assembly line procedure are sequentially arranged;
the front end of the IC and LCD visual alignment procedure is connected with the IC positioning correction procedure and the ACF film sticking procedure.
Preferably, an IC AOI detection process can be arranged between the IC picking process and the IC overturning process, appearance flaws on the back of the IC crystal grains are detected through the IC AOI detection process, detected good products are transmitted to the IC overturning process for overturning processing, and defective products are removed.
Preferably, an IC AOI detection process can be arranged between the IC overturning process and the IC positioning correction process, the appearance flaws on the front side of the IC crystal grains are detected through the IC AOI detection process, detected good products are transmitted to the IC overturning process for overturning processing, and defective products are removed.
Preferably, an IC AOI detection process can be arranged between the IC picking process and the IC overturning process and between the IC overturning process and the IC positioning correction process, the defects of the reverse and front appearances of the IC crystal grains are detected respectively, the detected good products are transmitted to the IC overturning process for overturning processing, and the defective products are removed.
Preferably, the loading positioning processing is implemented by firstly conveying the cut wafer to an IC picking process through a wafer feeding process, the IC picking process is implemented by picking up functional good ICs at corresponding positions from a carrier according to electrical performance test data detected by a wafer processing front-stage process, the functional good ICs are left on the carrier, the functional bad ICs are left on the carrier, the good ICs are conveyed to an IC overturning process after the IC picking process is completed, the IC overturning process overturns the IC dies to the front side downwards and conveys the IC dies to an IC positioning correction process, and the IC positioning correction process is used for accurately positioning the IC dies and then conveys the IC dies to an IC & LCD vision alignment process.
Preferably, the LCD screen feeding processing comprises the steps of firstly feeding the LCD screen through an LCD feeding assembly line process, parallelly transmitting the LCD screen to an LCD vision correction process, positioning the LCD screen, and then transmitting to an ACF film pasting process, wherein the ACF film pasting process is to paste a conductive dielectric film on a circuit interface of the LCD screen, and then transmitting the LCD screen pasted with the conductive dielectric film to an IC and LCD vision alignment process
Preferably, the positioning, attaching and processing, the IC & LCD visual alignment process is used for aligning each port of the IC crystal grain with a port of the LCD liquid crystal screen, and then the IC & LCD visual alignment process is sent to the prepressing process for preliminary pressing, namely, the prepressing process, and then the product is sent to the pressing process, the pressing process presses the ports of the IC crystal grain and the LCD liquid crystal screen, the ACF film clamp is a conductive medium in the middle, the circuit between the IC and the LCD is connected, the COG process is completed, and finally the next processing is performed through the discharging production line process or the FOG feeding production line process.
Compared with the prior art, the invention has the advantages that,
1. according to the invention, through setting a wafer feeding process, an IC picking process and an IC overturning process, the wafer feeding process is used for conveying the cut wafer to the IC picking process, the IC picking process sucks good products from an adhesive film according to electrical performance test data detected by the wafer processing front-stage process, then the IC overturning process overturns the IC crystal grains to the front side downwards, and finally the IC crystal grains and the LCD are positioned and butted on the pre-pressing process through the IC positioning correction process and the IC & LCD vision alignment process and are pressed into COG semi-finished products, so that the process of packaging and transporting the IC crystal grains is reduced, and the cost of packaging materials and the transportation cost are reduced.
2. By arranging the IC AOI detection process, the IC AOI detection process can respectively detect the flaws on the front and back sides of the IC crystal grain, and the reject ratio of products with strict requirements on the surfaces of the IC crystal grain can be reduced.
Drawings
FIG. 1 is a block diagram of a first embodiment of the present invention;
FIG. 2 is a block schematic diagram of the prior art of the present invention;
FIG. 3 is a block diagram of a second embodiment of the present invention;
FIG. 4 is a block schematic diagram of a third embodiment of the present invention;
fig. 5 is a block schematic diagram of a fourth embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The wafer loading described in this patent refers to a state that the whole wafer after being cut, including the stainless steel ring carrier and the fixed adhesive film, is not yet separated from the adhesive film, and the IC crystal grain is an internal core component of an integrated circuit, also called a chip.
Referring to fig. 1, an embodiment of the present invention provides a method for processing a bonded die of an LCD panel, which is used for a cut wafer (i.e., die) and includes a loading positioning process and a positioning bonding process, wherein,
the method comprises the steps of feeding, positioning and processing, wherein a wafer feeding process, an IC picking process, an IC overturning process, an IC positioning and correcting process and an IC & LCD vision aligning process are sequentially arranged; firstly, conveying the cut wafer to an IC picking procedure through a wafer feeding procedure, wherein the IC picking procedure is to pick up functional good ICs at corresponding positions from a carrier according to electrical performance test data (Mapping or Ink) detected by a wafer processing front-stage procedure and send the functional good ICs to a next station; defective products are left on the carrier if the defective products are not found out; and when all good ICs on the wafer are sucked, replacing the next wafer or finishing the operation.
The IC picking procedure transfers the functional good products to an IC overturning procedure, the IC overturning procedure overturns the IC crystal grains to the front side downwards and transfers the IC crystal grains to an IC positioning and correcting procedure, and the IC positioning and correcting procedure accurately positions the IC crystal grains and then transfers the IC crystal grains to an IC & LCD vision alignment procedure.
LCD screen material loading processing, through LCD pay-off assembly line process with LCD screen material loading transmit LCD vision correction process side by side earlier, fix a position the LCD screen, and then transmit ACF pad pasting process, ACF pad pasting process is to paste the conducting film on LCD screen circuit interface, and the LCD screen that will paste the conducting film again transmits IC & LCD vision alignment process.
Positioning and attaching, aligning the IC crystal grain port and the LCD screen port, then sending to a pre-pressing procedure, performing preliminary pressing, namely the pre-pressing procedure, and then sending the product to the local pressing procedure, wherein the IC crystal grain port and the LCD screen are pressed in the local pressing procedure. The ACF film is sandwiched between conductive media, the circuit between the IC and the LCD is connected, the COG (chip On glass) process is completed, and finally the next processing is carried out through the discharging production line process or the FOG feeding production line process.
When the surface and the quality of the product are not high, the first scheme is selected, compared with other schemes, the processing cost is lowest, the space occupation ratio of the processing method is minimum, and the profit can be further improved.
Referring to fig. 2, which is a schematic diagram of a processing in the prior art, the IC die after being cut and detected is packed and sent to a remote location, and is placed in a die box, the IC die is sent to a device by IC feeding, the IC die is accurately located by an IC location correction process, and then is sent to an IC & LCD visual alignment process, the IC & LCD visual alignment process is used for sending the IC die and the LCD to a pre-pressing process after being aligned to a position, and then is finally pressed to obtain an LCD COG semi-finished product. However, the die needs to be cut, inspected, packaged and shipped, and the wafer must be protected from damage during shipping, requiring multiple packaging protections, thereby increasing costs.
Referring to fig. 3, in a second embodiment of the present invention, based on the first embodiment, an IC AOI detection process is added between the IC selection process and the IC flip process, the IC AOI detection process detects appearance defects on the back of the IC die, and the detected good products are transmitted to the IC flip process for flip processing, so as to remove the defective products.
And for the product with high requirement on the back surface appearance of the IC crystal grain, selecting the second scheme to detect the flaws on the back surface of the IC crystal grain, and improving the appearance quality of the product.
Referring to fig. 4, a third embodiment of the present invention is that, on the basis of the first embodiment, an IC AOI detection process is added between the IC flipping process and the IC positioning correction process, the IC AOI detection process detects the appearance defects on the front side of the IC die, and the detected good products are transmitted to the IC flipping process for flipping processing, and the defective products are removed.
And for the product which needs to have the requirement on the front surface of the IC crystal grain, detecting the flaws on the front surface of the IC crystal grain by the third scheme, wherein the step of detecting the front surface of the IC is a step really related to the functions and the performances of the product.
Referring to fig. 5, in a fourth embodiment of the present invention, based on the first embodiment, IC AOI detection processes may be set between the IC selecting process and the IC flipping process and between the IC flipping process and the IC positioning and correcting process, respectively, to detect defects on the back (back) and front side of the wafer, and the detected good products are transmitted to the IC flipping process for flipping and removing the bad products. In the picking process section, the whole wafer is right side up, and the suction nozzle sucks the right side when the crystal grains are sucked, so that the back side (back side) of the IC can be only firstly detected by AOI, and the back side of the IC can be sucked to detect the right side of the IC after the next step of overturning.
For products requiring high quality requirements, a scheme four can be selected to detect the surface of the IC crystal grain, and compared with other schemes, the scheme four has the largest manufacturing cost and the largest space occupation ratio, but has higher product process and can be implemented on products requiring high quality requirements.
In the IC AOI detection process, a camera mounted on a machine automatically photographs or scans the surface of an IC die, performs image processing, compares the image with qualified or unqualified parameters in a customized database, sets an appropriate matching value (threshold), determines the inspection result as a good product and a defective product, rejects the defective product, and sends the good product to the next station. The IC picking is to pick up the functional good IC at the corresponding position from the carrier according to the electrical performance test data (Mapping or Ink) detected by the front stage of wafer processing, and then to put the functional good IC on the connecting mechanism of the next station for sending to the next station. Defective products are left on the carrier if they are not found. And when all good ICs on the wafer are sucked, replacing the next wafer or finishing the operation.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. A processing method for LCD liquid crystal screen attaching crystal grains is characterized by comprising the following steps:
the method comprises the steps of wafer feeding, IC picking, IC turning and IC positioning correction;
the LCD screen feeding processing comprises an LCD feeding assembly line process, an LCD vision correction process and an ACF film pasting process in sequence;
positioning, laminating and processing, wherein an IC & LCD vision alignment procedure, a prepressing procedure, a local pressing procedure, a discharging assembly line procedure or an FOG feeding assembly line procedure are sequentially arranged;
the front end of the IC and LCD visual alignment procedure is connected with the IC positioning correction procedure and the ACF film sticking procedure.
2. The method as claimed in claim 1, wherein an IC AOI detection process is provided between the IC picking process and the IC flipping process, the IC AOI detection process is used to detect appearance defects on the back of the die, and the detected good products are transferred to the IC flipping process for removing the defective products.
3. The method as claimed in claim 1, wherein an IC AOI detection process is provided between the IC flipping process and the IC alignment correction process, the appearance defects of the front surface of the die are detected by the IC AOI detection process, and the detected good die is transferred to the IC flipping process for flipping and removing the defective die.
4. The method as claimed in claim 1, wherein an IC AOI detection process is provided between the IC picking process and the IC flipping process and between the IC flipping process and the IC positioning and correcting process, and is used for detecting defects on the front and back surfaces of the wafer, respectively, and the detected good products are transferred to the IC flipping process for flipping and rejecting the bad products.
5. The method as claimed in claim 1, wherein the loading positioning process comprises a wafer feeding process for transferring the wafer after cutting to an IC picking process, the IC picking process for picking up functional good products from the carrier and placing the functional good products on the turnover mechanism according to the data of the electrical performance test of the wafer processing front-stage process, the functional bad products are left on the carrier, and the IC turnover process for turning over the IC dies to the front sideFace downwardsTransferring to IC positioning correction process for accurately positioning IC die, and transferring to IC&And (5) LCD visual alignment.
6. The processing method of LCD screen attaching crystal grain according to claim 1, characterized in that the LCD screen feeding processing comprises the steps of feeding LCD screen material in parallel through LCD feeding assembly line process to vision correction LCD process, positioning LCD screen, and then transferring to ACF film attaching process, wherein the ACF film attaching process is to attach conductive film on LCD screen circuit interface, and then transfer LCD screen attached with conductive film to IC & LCD vision alignment process.
7. The method as claimed in claim 1, wherein the positioning, bonding and IC & LCD visual alignment process is used to align the ports of the IC die with the ports of the LCD screen, and then the IC & LCD visual alignment process is sent to a pre-pressing process for preliminary pressing, and then the product is sent to a local pressing process for pressing the ports of the IC die and the LCD screen, wherein the ACF film is sandwiched between conductive media to connect the circuits between the IC and the LCD, and finally the product is processed by a discharging line process or a FOG feeding line process.
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| CN202110230297.0A CN112799242A (en) | 2021-03-02 | 2021-03-02 | Processing method of LCD (liquid crystal display) liquid crystal screen attaching crystal grains |
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| CN101807371A (en) * | 2010-04-07 | 2010-08-18 | 苏州凯蒂亚半导体制造设备有限公司 | Position precorrection device in ACF attaching equipment of flat-panel display |
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| CN107899744A (en) * | 2017-12-10 | 2018-04-13 | 扬州扬杰电子科技股份有限公司 | A kind of full-automatic crystal grain selector and its method of work |
| CN108319043A (en) * | 2018-02-26 | 2018-07-24 | 深圳市比亚迪电子部品件有限公司 | A kind of method for sticking and covering based on COG techniques touch panel and liquid crystal display panel |
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2021
- 2021-03-02 CN CN202110230297.0A patent/CN112799242A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807371A (en) * | 2010-04-07 | 2010-08-18 | 苏州凯蒂亚半导体制造设备有限公司 | Position precorrection device in ACF attaching equipment of flat-panel display |
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| CN105923377A (en) * | 2016-05-24 | 2016-09-07 | 深圳市联得自动化装备股份有限公司 | Bonding machine |
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| CN107899744A (en) * | 2017-12-10 | 2018-04-13 | 扬州扬杰电子科技股份有限公司 | A kind of full-automatic crystal grain selector and its method of work |
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Application publication date: 20210514 |